WO2019017186A1 - 樹脂封止用金型の調整方法及び樹脂封止用金型 - Google Patents

樹脂封止用金型の調整方法及び樹脂封止用金型 Download PDF

Info

Publication number
WO2019017186A1
WO2019017186A1 PCT/JP2018/024875 JP2018024875W WO2019017186A1 WO 2019017186 A1 WO2019017186 A1 WO 2019017186A1 JP 2018024875 W JP2018024875 W JP 2018024875W WO 2019017186 A1 WO2019017186 A1 WO 2019017186A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
resin
resin sealing
cavity
clamping
Prior art date
Application number
PCT/JP2018/024875
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
宏明 宮原
Original Assignee
第一精工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 第一精工株式会社 filed Critical 第一精工株式会社
Priority to CN201880004487.7A priority Critical patent/CN109982821B/zh
Priority to KR1020197014113A priority patent/KR102188767B1/ko
Publication of WO2019017186A1 publication Critical patent/WO2019017186A1/ja

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B29C45/376—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C45/1468—Plants therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

Definitions

  • the present invention relates to a method for adjusting a resin mold and a resin mold.
  • insert molding has been performed in which an electronic component such as a semiconductor is sealed with a resin to produce a resin-sealed package.
  • an electronic component or a substrate with an electronic component or the like is fixed inside the mold, and a cavity is filled with a molten resin and cured to integrate the substrate with an electronic component or the like and the resin molding portion.
  • resin molded portion In addition, depending on the type of the resin-sealed package, there are manufactured products in which the thickness of the portion on the surface of the electronic component on which the resin is formed (hereinafter, referred to as “resin molded portion”) differs.
  • resin molded portion In order to cope with the change in the thickness of the resin molded portion, in the conventional resin sealing device, the work of replacing the complete mold or parts constituting the mold is performed on the pressing device on which the mold is mounted. It has been done.
  • the mold In any operation of such a set of molds or replacement of parts constituting the mold, the mold is once removed from the pressing apparatus, and the mold is newly attached to the pressing apparatus again by bolting or the like. It took time and effort.
  • the mold is removed from the pressing device, the mold is disassembled into almost all component parts, and the parts are reassembled into parts corresponding to different resin molded portions. I had to assemble it again. Therefore, the number of work steps is very large, requiring labor of a worker.
  • Patent Document 1 For the purpose of providing a pressing device capable of sharing a mold even with resin-sealed packages having different thicknesses of the resin molding portion, for example, a pressing device described in Patent Document 1 has been proposed. There is.
  • the present invention has been made in view of the above points, and in a resin-sealed package, a method for adjusting a resin-sealing mold capable of easily coping with a change in thickness of a resin-molded portion, and for resin-sealing
  • the purpose is to provide a mold.
  • one mold is displaceable with respect to the first member and the first member, and the mold is opened And a second member disposed at a position close to the other mold to be paired, and in the case of clamping, in a direction to separate the second member from the other mold.
  • a mold for resin sealing wherein at least a part of a predetermined cavity filled with a sealing resin by the first member and the second member is formed on the surface facing the other mold by moving the first member and the second member.
  • An adjustment method comprising the step of performing adjustment for restricting the movement in a mold open state.
  • one of the molds has a first member and a second member, and at the time of mold clamping, at least one of predetermined cavities filled with the sealing resin by the first member and the second member.
  • the portion on the surface facing the other mold it is possible to fill the cavity with the sealing resin and to provide the resin molded portion on the substrate with electronic components or the like sandwiched between the molds.
  • “at least a part of a predetermined cavity” means to include both the case where the entire cavity filled with the sealing resin is formed and the case where the part is formed.
  • the cavity here is formed between one of the molds and the substrate or the like when the substrate with an electronic component or the like is sandwiched between the one mold and the other.
  • the second member is displaceable with respect to the first member, and is disposed at a position close to the other pair of molds in the mold open state. Therefore, in a state in which one mold and the other mold are opened, the position where the second member is close to the other mold is the initial position of the second member.
  • “displaceable” is sufficient as long as it includes displacement along the mold opening / closing direction.
  • the second member is displaceable relative to the first member, and is disposed at a position close to the other pair of molds in the mold open state, and in the case of mold clamping, the second member
  • the first member and the second member form at least a part of the predetermined cavity, whereby the second member is moved from the initial position to the other metal. It is possible to change the size of the cavity in the mold opening and closing direction by changing the distance moved in the direction away from the mold.
  • “at the time of mold clamping” means that one mold is brought close to the other mold, and one mold and the other mold are combined, and the sealing resin It is meant to include both of the stages being filled.
  • the movement distance from the initial position of the second member is determined.
  • the size of the cavity can be determined.
  • the restriction is performed in the case where the restricting member in contact with the second member by mold clamping is disposed in the area opposite to the other mold of the second member.
  • the movement of the second member can be restricted by bringing the member into contact with the second member. Further, when the mold is opened, the movement of the second member can be easily restricted only by the operation of arranging the restriction member.
  • the regulating member when the regulating member is not disposed in one of the molds, only by disposing the regulating member in the mold-opened state, depending on the thickness of the regulating member in the mold opening and closing direction when clamping. Can form a cavity. Further, when the regulating member is disposed in one of the molds, the size of the cavity at the time of clamping is changed only by replacing the regulating member with a regulating member having a different thickness in the mold opening / closing direction in the mold opened state. be able to. Furthermore, when the restricting member is disposed in one of the molds, the restricting member can be easily removed in the mold-opened state.
  • one of the molds is configured to be displaceable relative to the first member and the first member. And the second member is moved in a direction away from the other pair of molds at the time of mold clamping, whereby the first member and the second member seal the same.
  • a mold for resin sealing wherein at least a part of a predetermined cavity filled with a sealing resin is formed on the surface facing the other mold, wherein the second member is used as the other mold in the mold open state.
  • a third member forming a predetermined space in a region opposite to the other mold of the second member by being disposed at a position close to the second member, and the space formed by the third member Are arranged in the same space so that the second member can be brought into contact with the second member by clamping, and the second member can be placed in front of the second member.
  • the third member arranges the second member at a position close to the other mold in the mold open state, the state in which the second member is mold-opened via the third member It can be placed at the initial position of.
  • the second member is displaceable with respect to the first member, and in clamping, the first member is moved by moving the second member away from the other mold.
  • the second member and the second member form a predetermined cavity, thereby changing the distance by which the second member moves from the initial position in the direction away from the other mold, thereby changing the size of the cavity in the mold opening and closing direction. It is possible to change.
  • the third member arranges the second member in a position close to the other mold in the mold open state, and forms a predetermined space in the region opposite to the other mold of the second member.
  • the regulating member disposed in the predetermined space abuts on the second member by clamping to regulate the movement of the second member, whereby the thickness of the regulating member in the mold opening and closing direction is reduced.
  • the moving distance from the initial position can be determined to determine the size of the cavity.
  • the third member arranges the second member at a position close to the other mold in the mold open state to form a space, and the restriction member can be arranged in the space formed by the third member.
  • the third member is an elastic member, and the second member is biased in the direction of the other mold to place the second member in a position close to the other mold.
  • the biasing force of the elastic member enables the second member to be positioned at the initial position.
  • the second member when the first member and the second member are connected and integrated by an elastic member, the second member can be held by the first member via the elastic member. That is, for example, when one mold is an upper mold and the other mold to be a pair is a lower mold, the second member can be held by the first member via an elastic member so as not to fall off It becomes. Further, when the mold is clamped and the cavity is filled with the sealing resin, the biasing force of the elastic member can be applied to the second member to assist the movement of the second member and the regulating member to abut.
  • the second member in the mold open state, the first member and the second member are fitted, and the second member is configured to be able to be held by the third member in a state where the second member is disposed at a position close to the other mold.
  • the second member when the mold is opened, the second member can be held by fitting the first member to the second member. That is, for example, when one mold is an upper mold and the other mold to be a pair is a lower mold, the fitting of the first member and the second member so that the second member does not fall off Can be held by the first member.
  • the method for adjusting a resin mold and the resin mold according to the present invention can easily cope with a change in thickness of a resin molded portion in a resin-sealed package.
  • the case where the height of the cavity is adjusted by replacing it with another spacer 51 from the state where the spacer 50 is incorporated in the upper mold 1 is taken as an example. is there. Therefore, in the first embodiment, first, the structure (see FIG. 1) of the upper mold 1 in which the spacer 50 is incorporated and the structure at the time of mold clamping using the same (see FIG. 2) will be described. Thereafter, the spacer 50 is changed to the spacer 51, the structure of the upper mold 1 replaced with the spacer 51 (see FIG. 4), and the structure when clamping the upper mold 1 replaced with the spacer 51 (see FIG. 5) Explain.
  • FIG. 2 is a schematic view for explaining an example of a resin sealing mold to which the present invention is applied, and a mold A shown here is composed of an upper mold 1 and a lower mold 2 (see FIG. 2). See Figure 2).
  • the upper mold 1 and the lower mold 2 raise the lower mold 2 with a mold clamping device (not shown), hold the substrate with electronic parts between the molds, fill the thermosetting resin and harden it.
  • This is a mold for manufacturing a resin-sealed package in which a substrate with electronic components and the like and a resin-molded portion are integrated.
  • the position of the lower mold 2 with respect to the upper mold 1 is referred to as “lower” or “lower”, and the position of the upper mold 1 with respect to the lower mold 2 is “upper” or “upper”. I will call it.
  • the upper mold 1 is composed of an upper die set 11 and an upper chess 12.
  • the upper die set 11 is a member for holding the upper chess 12.
  • the upper chess 12 also has a holder base 20, a base plate 30, and a package insert 40 (see FIG. 1).
  • the holder base 20 and the base plate 30 are fixed by a bolt member to form an integrated structure.
  • the holder base 20 also has a cavity bar 23.
  • the holder base 20 is held via the spring member 21 (see FIG. 1) so that the package insert 40 does not fall downward. Also, the spring member 21 applies a force to pull up the package insert 40.
  • the spring member 21 also functions as a member that assists the movement of contact between the upper end surface of the joint 41 described later and the lower end surfaces of the spacers 50 and 51 when clamping.
  • the package insert 40 is configured to be vertically displaceable independently of the holder base 20 as the mold A is opened and closed.
  • the base plate 30 is a member having a region into which the spacers 50 and 51 are incorporated, and is disposed between the upper die set 11 and the holder base 20.
  • the flange receiving portion 31 is provided on the base plate 30.
  • a flange portion 43 at an upper portion of a joint 41 described later is fitted in the flange receiving portion 31.
  • Each joint 41 holds the package insert 40 so as not to fall downward at the time of mold opening.
  • a gap can be formed between the upper end surface of the joint 41 and the lower end surfaces of the spacers 50 and 51 when the mold is opened, and The upper end surface of the joint 41 is positioned close to the lower end surfaces of the spacers 50 and 51 in the vertical direction.
  • the package insert 40 is provided adjacent to the cavity bar 23, and a plurality of joints 41 are fixed to the upper surface of the package insert 40 via bolt members.
  • the package insert 40 and the joint 41 have an integrated structure, and are configured to be vertically displaceable independently of the cavity bar 23.
  • the cavity bar 23 here corresponds to the 1st member of this-application claim.
  • the package insert 40 and the joint 41 mentioned here correspond to a second member in the claims of the present application.
  • a region 44 is provided by the cavity bar 23 and the package insert 40 (see FIG. 1).
  • the size of the region 44 in the vertical direction is changed as the package insert 40 moves up and down.
  • a cavity 13 is formed between the recess 44 and a surface (reference numeral omitted) facing the recess 44 of the lower mold 2 (see FIG. 2).
  • a flange portion 43 formed larger in diameter than the main body of the joint 41 is provided at the upper end portion of the joint 41.
  • the flange portion 43 is a member whose upper end surface abuts on the spacer 50 when the mold is clamped.
  • a through hole 32 is formed in the base plate 30 from the bottom to the top (see the lower left view in FIG. 3), and the upper portion of the joint 41 including the flange portion 43 is inserted through the through hole 32 (see FIG. 1).
  • the upper end face of the flange portion 43 in the joint 41 and the lower end face region of the spacer 50 opposed thereto are in contact, and the depth of the cavity 13 (see FIG. 3)
  • the thickness of the resin molded part of Details of the change of the depth of the cavity 13 will be described later.
  • the spacers 50 and 51 correspond to the restriction member in the claims of the present application.
  • a spring member 60 is disposed between the holder base 20 and the base plate 30, and biases the holder base 20 and the package insert 40 downward (in the direction approaching the lower mold 2).
  • the biasing force of the spring member 60 is larger than the biasing force of the spring member 21 which holds the package insert 40 described above.
  • the spring member 60 here corresponds to the 3rd member of this-application claim.
  • the holder base 20 and the package insert 40 are pushed downward by the biasing force of the spring member 60, whereby the upper end surface of the flange portion 43 in the joint 41 and the spacer incorporated in the base plate 30 A gap is formed between the lower end faces 50 and 51.
  • a gap is formed between the upper end surface of the flange portion 43 and the lower end surfaces of the spacers 50 and 51 in the mold-opened state, so as shown in the lower left view of FIG. It is possible to remove. Further, as described above, when the mold A is clamped, the upper end surface of the flange portion 43 in the joint 41 abuts the region of the lower end surface in the spacer 50 opposed thereto, and the depth of the cavity 13 (See FIG. 2), this gap disappears.
  • a support pillar 22 (see FIGS. 1 and 2) is fixed to the upper end surface of the holder base 20 via a bolt member.
  • the upper end surface of the support pillar 22 abuts on the lower end surface of the base plate 30, and the same portion receives the clamping force at the time of mold clamping and serves as a portion for suppressing resin leakage of the sealing resin filled in the cavity 13.
  • the spacer is replaceable in the mold-opened state, the depth of the cavity to be the resin molded portion of the resin-sealed package can be changed.
  • the groove 50a is provided in a region facing the upper end surface of the flange 43 in the lower end surface of the spacer 50 (see the lower right view and the upper view in FIG. 3)
  • the upper end surface of the flange portion 43 is fitted into the groove portion 50a of the groove portion 50a, and the depth of the cavity 13 is determined.
  • the depth of the cavity can be changed by replacing with a spacer formed so that the depth (length in the vertical direction) of the portion corresponding to the groove portion 50a is different.
  • the spacer 50 shown in the upper side of FIG. 3 shows a state in which the vertical direction is reversed.
  • the change in the depth of the portion corresponding to the groove portion 50a in the spacer includes not only the aspect of changing the depth of the groove portion but also the change to the spacer in which the groove portion is not formed. That is, it is possible to exchange not only the spacers having different depths of the groove but also the spacers having a different presence or absence of the groove.
  • the spacer 50 when the spacer 50 is changed to a spacer 51 (see FIGS. 4 and 5) in which a groove portion deeper than the groove portion 50a is formed, the upper end surface of the flange portion 43 of the joint 41 is clamped. It moves further upward than in the case of abutting on the spacer 50.
  • the cavity 14 corresponding to the spacer 51 is formed (see FIG. 5).
  • the cavity 14 is deeper than the cavity 13. Therefore, the resin-molded portion of the resin-sealed package molded by the cavity 14 is formed thicker than the resin-molded portion of the resin-sealed package molded by the cavity 13.
  • a convex portion 11 a is provided on the upper die set 11, and a concave portion 20 a is provided at a position facing the convex portion 11 a in the holder base 20.
  • the convex portion 11a and the concave portion 20a are engaged with each other, so that the holder base 20 and the package insert 40 can be prevented from moving upward from the same position. Also by the fitting of the convex portion 11a and the concave portion 20a, the formation of the clearance for making the spacer 50 removable from the base plate 30 in the mold-opened state is secured.
  • the biasing force that the spring member 60 applies to the holder base 20 and the package insert 40 forms a gap between the upper end surface of the flange portion 43 in the joint 41 and the lower end surface of the spacer 50, and removes the spacer 50 from the base plate 30. , And can be changed to another spacer 51 (see FIGS. 4 and 5).
  • the package insert 40 is higher than the cavity bar 23 with reference to the lower mold 2 by the force applied by the spring member 21 to the package insert 40. positioned.
  • the package insert 40 interlocks with the ascent of the holder base 20, the upper end surface of the flange portion 43 in the joint 41 ascends to a position where it abuts on the lower end surface of the spacer 51, and the area to be the cavity is large in the vertical direction (See Figure 5). After the upper end surface of the flange portion 43 abuts on the lower end surface of the spacer 51, the package insert 40 is lowered relative to the cavity bar 23, and the package insert 40 is positioned below the cavity bar 23.
  • the cavity 14 is formed at the position where the flange portion 43 and the spacer 51 abut, and the thickness of the resin molded portion of the resin-sealed package is determined (see FIG. 5).
  • the cavity 14 is filled with the thermosetting resin while melting it, and a resin molded portion is formed by holding the pressure of the resin and curing it.
  • the rising distance of the joint 41 at the time of mold clamping changes according to the depth of the groove formed in the spacer 51. Then, the cavity 14 is formed at the position where the flange portion 43 and the spacer 51 abut, and the thickness of the resin molded portion of the resin-sealed package is changed.
  • the holder base is the same as the upper mold 1 described above.
  • Reference numeral 120 is held by a spring member 121 so that the package insert 140 does not fall downward.
  • the difference between the upper mold 101 and the upper mold 1 is that the flange receiving portion is not provided on the base plate 130 and the flange portion is not provided on the joint 141. That is, in the upper mold 101, the spring member 121 supports the holding of the package insert 140 and the support of the contact between the upper end surface of the joint 141 and the lower end surface of the spacer 50 when clamping.
  • the structure of the upper mold 201 is the same as the upper mold 1 described above.
  • the flange receiving portion 231 is provided on the base plate 230.
  • a flange portion 243 is provided on the upper portion of the joint 241.
  • the flange receiving portion 231 is engaged with the flange portion 243, and the package insert 240 is held so as not to drop downward when the mold is opened.
  • the holder base 220 is not provided with a spring member for holding the package insert 240 upward. That is, in the upper mold 201, the flange receiving portion 231 engages the flange portion 243 to support the holding of the package insert 240 and the contact between the upper end surface of the joint 241 and the lower end surface of the spacer 50 when clamping. It has a structure to bear in
  • the structure for holding the package insert is a structure using only the spring member or a structure using only the fitting between the flange receiving portion and the flange portion. It may be
  • the method for adjusting a resin sealing mold according to the present invention is a method that can easily cope with the change in the thickness of the resin molded portion when manufacturing types in which the thickness of the resin molded portion is different. ing. Moreover, the metal mold

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
PCT/JP2018/024875 2017-07-21 2018-06-29 樹脂封止用金型の調整方法及び樹脂封止用金型 WO2019017186A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201880004487.7A CN109982821B (zh) 2017-07-21 2018-06-29 树脂密封用模具的调整方法及树脂密封用模具
KR1020197014113A KR102188767B1 (ko) 2017-07-21 2018-06-29 수지 밀봉 금형의 조정 방법 및 수지 밀봉 금형

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-141916 2017-07-21
JP2017141916A JP6296195B1 (ja) 2017-07-21 2017-07-21 樹脂封止用金型の調整方法及び樹脂封止用金型

Publications (1)

Publication Number Publication Date
WO2019017186A1 true WO2019017186A1 (ja) 2019-01-24

Family

ID=61629186

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/024875 WO2019017186A1 (ja) 2017-07-21 2018-06-29 樹脂封止用金型の調整方法及び樹脂封止用金型

Country Status (5)

Country Link
JP (1) JP6296195B1 (zh)
KR (1) KR102188767B1 (zh)
CN (1) CN109982821B (zh)
TW (1) TWI720327B (zh)
WO (1) WO2019017186A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112976666B (zh) * 2019-12-12 2022-07-26 东莞市天贺电子科技有限公司 一种应用于压缩成形的模具上的动平衡缓冲机构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011011426A (ja) * 2009-07-01 2011-01-20 Apic Yamada Corp 樹脂モールド金型及び樹脂モールド装置
JP2013028087A (ja) * 2011-07-29 2013-02-07 Apic Yamada Corp モールド金型及びこれを用いた樹脂モールド装置
WO2016203779A1 (ja) * 2015-06-19 2016-12-22 第一精工株式会社 電子部品封止金型、トランスファー成形機および電子部品封止方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100196494B1 (ko) * 1996-09-21 1999-06-15 김규현 Bga 반도체패키지용 몰드금형의 pcb 클램프장치
JPH10258445A (ja) * 1997-03-19 1998-09-29 Oki Electric Ind Co Ltd 半導体装置の樹脂封止用金型
JP3859457B2 (ja) * 2001-03-27 2006-12-20 沖電気工業株式会社 半導体装置の製造方法
JP2003053791A (ja) 2001-08-22 2003-02-26 Mitsubishi Electric Corp 半導体製造装置及び該装置により製造された半導体装置
JP4607429B2 (ja) * 2003-03-25 2011-01-05 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
CN101497221B (zh) * 2008-01-31 2012-06-20 鸿富锦精密工业（深圳）有限公司 模具及其调整方法
KR101139261B1 (ko) * 2010-03-10 2012-05-15 티에스테크놀로지 주식회사 반도체 패키지 제조용 금형 장치
CN201745133U (zh) * 2010-06-30 2011-02-16 四川省宜宾普什模具有限公司 可调节产品局部成型厚度的模具
WO2013047753A1 (ja) 2011-09-29 2013-04-04 Ｓｃｉｖａｘ株式会社 成形装置及び成形方法、インプリント用型、並びに当該インプリント用型を用いたインプリント方法
JP5930394B2 (ja) 2012-07-06 2016-06-08 アピックヤマダ株式会社 樹脂モールド装置
JP6560498B2 (ja) * 2015-01-27 2019-08-14 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂成形品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011011426A (ja) * 2009-07-01 2011-01-20 Apic Yamada Corp 樹脂モールド金型及び樹脂モールド装置
JP2013028087A (ja) * 2011-07-29 2013-02-07 Apic Yamada Corp モールド金型及びこれを用いた樹脂モールド装置
WO2016203779A1 (ja) * 2015-06-19 2016-12-22 第一精工株式会社 電子部品封止金型、トランスファー成形機および電子部品封止方法

Also Published As

Publication number Publication date
JP2019018530A (ja) 2019-02-07
TWI720327B (zh) 2021-03-01
TW201908103A (zh) 2019-03-01
KR102188767B1 (ko) 2020-12-08
CN109982821A (zh) 2019-07-05
KR20190070949A (ko) 2019-06-21
CN109982821B (zh) 2021-01-22
JP6296195B1 (ja) 2018-03-20

Similar Documents

Publication Publication Date Title
KR101440218B1 (ko) 수지봉지 성형장치
JP6020667B1 (ja) トランスファー成形機および電子部品を製造する方法
KR100880970B1 (ko) 수지 밀봉 금형
JP2006211865A (ja) 回転子積層鉄心の製造装置及びその製造方法
JPWO2005072892A1 (ja) カウンタプレッシャ鋳造機
WO2019017186A1 (ja) 樹脂封止用金型の調整方法及び樹脂封止用金型
KR101340672B1 (ko) 주조용 주형의 정 위치 안내용 코어 어셈블리 및 이를 이용한 목형
CN212045827U (zh) 一种分步成型的光学镜片注塑模具
JP5218573B2 (ja) 樹脂成形装置
KR101655449B1 (ko) 소재 이중 지지용 가이드가 구비된 홀 클린칭 장치
JP2018086739A (ja) 成形型、樹脂成形装置及び樹脂成形方法
CN109605813B (zh) 一种模具合模精度控制方法及模具
KR20100012383A (ko) 인서트사출용 금형조립체 및 이를 이용한 인서트사출물의제조방법
JP4799128B2 (ja) 樹脂成形用金型および樹脂成形方法
JP6195071B2 (ja) 表皮一体樹脂成形装置
TWI818608B (zh) 樹脂成形用成形模的製造方法、樹脂成形用成形模、樹脂成形裝置、及樹脂成形品的製造方法
JPS63147834A (ja) 光学レンズのプレス成形装置
CN210525706U (zh) 一种异形瓶盖注塑模具
KR101384323B1 (ko) 사출압축성형용 금형장치 및 이를 이용한 사출압축성형 방법
KR20180063996A (ko) 이종 금속간 성형효율이 향상된 다이캐스팅 장치
KR20060134236A (ko) 상형금형의 언더컷 성형장치
JP2017034238A (ja) 電子部品封止装置およびこれを用いた電子部品の封止方法
JP2023083750A (ja) 型締装置
JP2019014102A (ja) 繊維強化樹脂の製造装置及び繊維強化樹脂の製造方法
KR20040017036A (ko) 신발 밑창 성형을 위한 플래시 발생 방지형 밀폐 금형

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18834663

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20197014113

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18834663

Country of ref document: EP

Kind code of ref document: A1