JP6270571B2 - シート樹脂の供給方法と半導体封止方法及び半導体封止装置 - Google Patents

シート樹脂の供給方法と半導体封止方法及び半導体封止装置 Download PDF

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JP6270571B2
JP6270571B2 JP2014056857A JP2014056857A JP6270571B2 JP 6270571 B2 JP6270571 B2 JP 6270571B2 JP 2014056857 A JP2014056857 A JP 2014056857A JP 2014056857 A JP2014056857 A JP 2014056857A JP 6270571 B2 JP6270571 B2 JP 6270571B2
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resin
cavity
mold
cavity bottom
sheet
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JP2015179755A (ja
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高瀬　慎二
慎二 高瀬
田村　孝司
孝司 田村
佳久 川本
佳久 川本
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Towa Corp
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Towa Corp
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Priority to JP2014056857A priority Critical patent/JP6270571B2/ja
Priority to TW104107677A priority patent/TWI642529B/zh
Priority to CN201510117815.2A priority patent/CN104934335B/zh
Priority to KR1020150037414A priority patent/KR101718605B1/ko
Publication of JP2015179755A publication Critical patent/JP2015179755A/ja
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2014056857A 2014-03-19 2014-03-19 シート樹脂の供給方法と半導体封止方法及び半導体封止装置 Active JP6270571B2 (ja)

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Application Number Priority Date Filing Date Title
JP2014056857A JP6270571B2 (ja) 2014-03-19 2014-03-19 シート樹脂の供給方法と半導体封止方法及び半導体封止装置
TW104107677A TWI642529B (zh) 2014-03-19 2015-03-11 Sheet resin supply method, semiconductor sealing method and semiconductor sealing device
CN201510117815.2A CN104934335B (zh) 2014-03-19 2015-03-18 片材树脂供给方法和半导体封装方法及半导体封装装置
KR1020150037414A KR101718605B1 (ko) 2014-03-19 2015-03-18 시트 수지의 공급 방법과 반도체 밀봉 방법 및 반도체 밀봉 장치

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JP2014056857A JP6270571B2 (ja) 2014-03-19 2014-03-19 シート樹脂の供給方法と半導体封止方法及び半導体封止装置

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JP2015179755A JP2015179755A (ja) 2015-10-08
JP6270571B2 true JP6270571B2 (ja) 2018-01-31

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JP (1) JP6270571B2 (zh)
KR (1) KR101718605B1 (zh)
CN (1) CN104934335B (zh)
TW (1) TWI642529B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6654861B2 (ja) * 2015-11-09 2020-02-26 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
TWI575620B (zh) * 2016-03-10 2017-03-21 南茂科技股份有限公司 指紋辨識晶片封裝結構的製作方法及製作設備
US20180117813A1 (en) * 2016-11-02 2018-05-03 Asm Technology Singapore Pte Ltd Molding apparatus including a compressible structure
JP6861506B2 (ja) * 2016-11-29 2021-04-21 Ｔｏｗａ株式会社 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法
CN107038965A (zh) * 2017-05-05 2017-08-11 深圳浩翔光电技术有限公司 Led显示装置、成型模组、及其生产工艺
CN110719836B (zh) * 2017-06-06 2022-09-20 西医药服务有限公司 具有嵌入式电子器件的弹性体制品及其制造方法
JP7406247B2 (ja) * 2020-05-22 2023-12-27 アピックヤマダ株式会社 樹脂モールド装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990063586A (ko) * 1996-07-12 1999-07-26 아끼구사 나오유끼 반도체 장치의 제조 방법 및 반도체 장치 제조용 금형 및 반도체 장치 및 그 실장방법
JP2002151551A (ja) * 2000-11-10 2002-05-24 Hitachi Ltd フリップチップ実装構造、その実装構造を有する半導体装置及び実装方法
JP4268389B2 (ja) * 2002-09-06 2009-05-27 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP4262468B2 (ja) * 2002-10-30 2009-05-13 アピックヤマダ株式会社 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具
JP4326786B2 (ja) 2002-11-26 2009-09-09 Ｔｏｗａ株式会社 樹脂封止装置
JP4052939B2 (ja) * 2002-12-17 2008-02-27 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP2005324341A (ja) * 2004-05-12 2005-11-24 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2007109831A (ja) * 2005-10-13 2007-04-26 Towa Corp 電子部品の樹脂封止成形方法
JP5121238B2 (ja) * 2007-01-29 2013-01-16 住友重機械工業株式会社 樹脂封止方法
JP5143617B2 (ja) * 2008-04-08 2013-02-13 住友重機械工業株式会社 圧縮成形方法
JP5153536B2 (ja) * 2008-09-17 2013-02-27 Ｔｏｗａ株式会社 半導体チップの圧縮成形用金型
JP5774545B2 (ja) * 2012-05-29 2015-09-09 Ｔｏｗａ株式会社 樹脂封止成形装置

Also Published As

Publication number Publication date
KR20150109283A (ko) 2015-10-01
CN104934335B (zh) 2017-10-13
TWI642529B (zh) 2018-12-01
CN104934335A (zh) 2015-09-23
JP2015179755A (ja) 2015-10-08
TW201536510A (zh) 2015-10-01
KR101718605B1 (ko) 2017-03-21

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