JP6256178B2 - 脆性材料基板のブレイク装置 - Google Patents

脆性材料基板のブレイク装置 Download PDF

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Publication number
JP6256178B2
JP6256178B2 JP2014092493A JP2014092493A JP6256178B2 JP 6256178 B2 JP6256178 B2 JP 6256178B2 JP 2014092493 A JP2014092493 A JP 2014092493A JP 2014092493 A JP2014092493 A JP 2014092493A JP 6256178 B2 JP6256178 B2 JP 6256178B2
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Japan
Prior art keywords
substrate
stage
brittle material
material substrate
end material
Prior art date
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Active
Application number
JP2014092493A
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English (en)
Japanese (ja)
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JP2015208937A (ja
Inventor
欣也 太田
欣也 太田
直洋 黒田
直洋 黒田
博之 富本
博之 富本
郁祥 中谷
郁祥 中谷
聡 礒嶌
聡 礒嶌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2014092493A priority Critical patent/JP6256178B2/ja
Priority to TW103142982A priority patent/TWI639566B/zh
Priority to KR1020150003344A priority patent/KR20150124376A/ko
Priority to CN201510142652.3A priority patent/CN105034179B/zh
Publication of JP2015208937A publication Critical patent/JP2015208937A/ja
Application granted granted Critical
Publication of JP6256178B2 publication Critical patent/JP6256178B2/ja
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Microscoopes, Condenser (AREA)
  • Sampling And Sample Adjustment (AREA)
JP2014092493A 2014-04-28 2014-04-28 脆性材料基板のブレイク装置 Active JP6256178B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014092493A JP6256178B2 (ja) 2014-04-28 2014-04-28 脆性材料基板のブレイク装置
TW103142982A TWI639566B (zh) 2014-04-28 2014-12-10 Cracking device for brittle material substrate
KR1020150003344A KR20150124376A (ko) 2014-04-28 2015-01-09 취성 재료 기판의 브레이크 장치
CN201510142652.3A CN105034179B (zh) 2014-04-28 2015-03-27 脆性材料基板的裂断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014092493A JP6256178B2 (ja) 2014-04-28 2014-04-28 脆性材料基板のブレイク装置

Publications (2)

Publication Number Publication Date
JP2015208937A JP2015208937A (ja) 2015-11-24
JP6256178B2 true JP6256178B2 (ja) 2018-01-10

Family

ID=54441432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014092493A Active JP6256178B2 (ja) 2014-04-28 2014-04-28 脆性材料基板のブレイク装置

Country Status (4)

Country Link
JP (1) JP6256178B2 (zh)
KR (1) KR20150124376A (zh)
CN (1) CN105034179B (zh)
TW (1) TWI639566B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6282176B2 (ja) * 2014-05-29 2018-02-21 三星ダイヤモンド工業株式会社 脆性材料基板の端材分離装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09136319A (ja) * 1995-11-15 1997-05-27 Fujitsu Ten Ltd 基板の分割装置
JP2001058317A (ja) * 1999-08-20 2001-03-06 Berudekkusu:Kk スクライブ方法および装置
JP3792508B2 (ja) * 2000-12-19 2006-07-05 三星ダイヤモンド工業株式会社 貼り合わせ脆性基板の分断方法
JP4646467B2 (ja) * 2001-09-04 2011-03-09 旭化成せんい株式会社 紡績糸
KR20050102097A (ko) * 2003-02-21 2005-10-25 미쓰보시 다이야몬도 고교 가부시키가이샤 기판 가공용 테이블 및 기판의 가공장치
JP2005225637A (ja) * 2004-02-13 2005-08-25 Toyota Industries Corp パネル反転装置
JP5284725B2 (ja) * 2008-08-29 2013-09-11 三星ダイヤモンド工業株式会社 脆性材料ブレーク装置
JP2011037104A (ja) * 2009-08-10 2011-02-24 Asahi Glass Co Ltd 基板の分割装置および分割方法
JP5170195B2 (ja) * 2010-09-24 2013-03-27 三星ダイヤモンド工業株式会社 樹脂付き脆性材料基板の分割方法
CN103381624A (zh) * 2012-05-03 2013-11-06 江俊昇 易碎片状工作物的裁切方法及装置
JP5981791B2 (ja) * 2012-07-18 2016-08-31 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
JP5744109B2 (ja) * 2013-06-05 2015-07-01 三星ダイヤモンド工業株式会社 脆性基板搬送ユニット

Also Published As

Publication number Publication date
JP2015208937A (ja) 2015-11-24
CN105034179B (zh) 2017-10-20
KR20150124376A (ko) 2015-11-05
TWI639566B (zh) 2018-11-01
TW201540678A (zh) 2015-11-01
CN105034179A (zh) 2015-11-11

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