JP6250999B2 - アライメント方法並びにアライメント装置 - Google Patents

アライメント方法並びにアライメント装置 Download PDF

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Publication number
JP6250999B2
JP6250999B2 JP2013201683A JP2013201683A JP6250999B2 JP 6250999 B2 JP6250999 B2 JP 6250999B2 JP 2013201683 A JP2013201683 A JP 2013201683A JP 2013201683 A JP2013201683 A JP 2013201683A JP 6250999 B2 JP6250999 B2 JP 6250999B2
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Japan
Prior art keywords
imaging
mark
substrate
mask
alignment
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JP2013201683A
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English (en)
Japanese (ja)
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JP2015067845A (ja
Inventor
幸男 山根
幸男 山根
石井 博
博 石井
広樹 田中
広樹 田中
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Canon Tokki Corp
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Canon Tokki Corp
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Publication date
Application filed by Canon Tokki Corp filed Critical Canon Tokki Corp
Priority to JP2013201683A priority Critical patent/JP6250999B2/ja
Priority to PCT/JP2014/062824 priority patent/WO2015045475A1/ja
Priority to CN201480053028.XA priority patent/CN105593396B/zh
Priority to KR1020167010522A priority patent/KR101968807B1/ko
Publication of JP2015067845A publication Critical patent/JP2015067845A/ja
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Publication of JP6250999B2 publication Critical patent/JP6250999B2/ja
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038Alignment for proximity or contact printer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2013201683A 2013-09-27 2013-09-27 アライメント方法並びにアライメント装置 Active JP6250999B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013201683A JP6250999B2 (ja) 2013-09-27 2013-09-27 アライメント方法並びにアライメント装置
PCT/JP2014/062824 WO2015045475A1 (ja) 2013-09-27 2014-05-14 アライメント方法並びにアライメント装置
CN201480053028.XA CN105593396B (zh) 2013-09-27 2014-05-14 对准方法以及对准装置
KR1020167010522A KR101968807B1 (ko) 2013-09-27 2014-05-14 얼라인먼트 방법 및 얼라인먼트 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013201683A JP6250999B2 (ja) 2013-09-27 2013-09-27 アライメント方法並びにアライメント装置

Publications (2)

Publication Number Publication Date
JP2015067845A JP2015067845A (ja) 2015-04-13
JP6250999B2 true JP6250999B2 (ja) 2017-12-20

Family

ID=52742634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013201683A Active JP6250999B2 (ja) 2013-09-27 2013-09-27 アライメント方法並びにアライメント装置

Country Status (4)

Country Link
JP (1) JP6250999B2 (ko)
KR (1) KR101968807B1 (ko)
CN (1) CN105593396B (ko)
WO (1) WO2015045475A1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210021140A (ko) * 2016-06-24 2021-02-24 캐논 톡키 가부시키가이샤 기판 재치 방법, 성막 방법, 전자 디바이스 제조 방법
KR101866139B1 (ko) * 2017-08-25 2018-06-08 캐논 톡키 가부시키가이샤 얼라인먼트 방법, 얼라인먼트 장치, 이를 포함하는 진공증착방법 및 진공증착장치
KR101893309B1 (ko) * 2017-10-31 2018-08-29 캐논 톡키 가부시키가이샤 얼라인먼트 장치, 얼라인먼트 방법, 성막장치, 성막방법, 및 전자 디스바이스 제조방법
JP6662841B2 (ja) * 2017-12-21 2020-03-11 株式会社アルバック 蒸着装置
JP2019119118A (ja) * 2017-12-28 2019-07-22 株式会社リコー 液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置
KR101979149B1 (ko) * 2018-04-27 2019-05-15 캐논 톡키 가부시키가이샤 얼라인먼트 방법, 이를 사용한 증착방법 및 전자디바이스 제조방법
JP7194006B2 (ja) * 2018-12-18 2022-12-21 キヤノントッキ株式会社 基板載置方法、成膜方法、成膜装置、および有機elパネルの製造システム
JP7269000B2 (ja) * 2018-12-26 2023-05-08 キヤノントッキ株式会社 基板載置方法、成膜方法、成膜装置、および有機elパネルの製造システム
JP2021075757A (ja) 2019-11-08 2021-05-20 株式会社ブイ・テクノロジー アライメント装置
KR102445850B1 (ko) * 2019-11-14 2022-09-20 캐논 톡키 가부시키가이샤 얼라인먼트 장치, 얼라인먼트 방법, 성막 장치, 성막 방법 및 전자 디바이스의 제조 방법
JP7202329B2 (ja) * 2020-05-11 2023-01-11 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP2022038099A (ja) * 2020-08-26 2022-03-10 キヤノントッキ株式会社 アライメント装置およびアライメント方法、ならびに成膜装置および成膜方法
WO2023238478A1 (ja) * 2022-06-06 2023-12-14 キヤノントッキ株式会社 成膜装置、成膜方法、アライメント装置及びアライメント方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4562488B2 (ja) * 2004-10-15 2010-10-13 大日本印刷株式会社 メタルマスク位置アラインメント方法及び装置
JP4510609B2 (ja) * 2004-12-21 2010-07-28 株式会社アルバック 基板とマスクのアライメント方法および有機薄膜蒸着方法ならびにアライメント装置
JP4609756B2 (ja) * 2005-02-23 2011-01-12 三井造船株式会社 成膜装置のマスク位置合わせ機構および成膜装置
JP2006249542A (ja) * 2005-03-14 2006-09-21 Dainippon Printing Co Ltd 基準位置指示装置及びメタルマスク位置アラインメント装置
JP4592021B2 (ja) * 2006-06-29 2010-12-01 トッキ株式会社 アライメント装置及び方法
JP5783811B2 (ja) * 2010-07-06 2015-09-24 キヤノン株式会社 成膜装置
JP5639431B2 (ja) * 2010-09-30 2014-12-10 キヤノントッキ株式会社 成膜装置

Also Published As

Publication number Publication date
KR101968807B1 (ko) 2019-04-12
CN105593396A (zh) 2016-05-18
KR20160065128A (ko) 2016-06-08
CN105593396B (zh) 2018-05-01
WO2015045475A1 (ja) 2015-04-02
JP2015067845A (ja) 2015-04-13

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