WO2015045475A1 - アライメント方法並びにアライメント装置 - Google Patents

アライメント方法並びにアライメント装置 Download PDF

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Publication number
WO2015045475A1
WO2015045475A1 PCT/JP2014/062824 JP2014062824W WO2015045475A1 WO 2015045475 A1 WO2015045475 A1 WO 2015045475A1 JP 2014062824 W JP2014062824 W JP 2014062824W WO 2015045475 A1 WO2015045475 A1 WO 2015045475A1
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Prior art keywords
imaging
mark
substrate
mask
alignment
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PCT/JP2014/062824
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English (en)
French (fr)
Japanese (ja)
Inventor
幸男 山根
博 石井
広樹 田中
Original Assignee
キヤノントッキ株式会社
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Application filed by キヤノントッキ株式会社 filed Critical キヤノントッキ株式会社
Priority to CN201480053028.XA priority Critical patent/CN105593396B/zh
Priority to KR1020167010522A priority patent/KR101968807B1/ko
Publication of WO2015045475A1 publication Critical patent/WO2015045475A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Definitions

  • the present invention relates to an alignment method and an alignment apparatus.
  • Patent Document 1 As an alignment apparatus for depositing a film forming material on a substrate through a mask opening of a mask and forming a thin film on the substrate and aligning the mask and the substrate, for example, Patent Document 1 As disclosed in US Pat.
  • alignment is performed by imaging a mask mark and a substrate mark using a high-magnification camera.
  • the alignment using the high-magnification camera is performed by the procedure shown in FIG. 1, for example.
  • the mask is carried into the processing chamber (a.), The carried mask is placed on the mask holder (b.), The substrate is carried into the processing chamber by the transfer robot (c.), And the substrate is placed at both ends of the substrate.
  • E. Based on these coordinates, the amount of movement of the XY stage is appropriately controlled to finely position the substrate with respect to the mask (f.), The substrate and the mask are brought into close contact (g.), And finally the camera is used. It is measured whether or not the alignment is performed with a specified accuracy (h.).
  • the position of the mask mark does not match the imaging center of the camera set in advance at a predetermined position during rough positioning, and the alignment accuracy may be reduced.
  • the present invention solves the above-described problems.
  • the mask mark and the substrate mark can be captured in the imaging field of the imaging unit having a high imaging magnification without damaging the substrate, and high-precision alignment is achieved.
  • An object of the present invention is to provide an alignment method and an alignment apparatus that can be performed and have excellent practicality.
  • Position information of the first mark 15 and the third mark 17 is acquired from the imaging data obtained in the second imaging step, and based on the position information of the first mark 15 and the third mark 17
  • Position information of the second mark 16 and the fourth mark 18 is acquired from the imaging data obtained in the third imaging step, and based on the position information of the second
  • a substrate holding step for holding the substrate 12 on the substrate holder A first imaging step of imaging the third mark 17 for position detection provided on the substrate 12 by the first imaging unit 13; Position information of the third mark 17 is acquired from the imaging data obtained in the first imaging step, and the imaging magnification is higher than that of the first imaging unit 13 based on the position information of the third mark 17.
  • Position information of the first mark 15 and the third mark 17 is acquired from the imaging data obtained in the second imaging step, and based on the position information of the first mark 15 and the third mark 17
  • Position information of the second mark 16 and the fourth mark 18 is acquired from the imaging data obtained in the third imaging step, and based on the position information of the second mark
  • the first imaging step and the first moving step, and the second imaging step and the first alignment step are performed before the third imaging step and the second alignment step.
  • the alignment method according to any one of 1 to 8.
  • the first mark 15 for position detection provided on the mask 11 is imaged by the first imaging unit 13, and obtained in the first imaging process in the first moving process.
  • the position information of the first mark 15 is acquired from the captured image data, and the image of the second image capturing section 14 having an image capturing magnification higher than that of the first image capturing section 13 is obtained based on the position information of the first mark 15. 5.
  • the third mark 17 for position detection provided on the substrate 12 is imaged by the first imaging unit 13, and in the first moving step, it is obtained in the first imaging step.
  • the position information of the third mark 17 is obtained from the captured image data, and the image of the second image capturing section 14 having an image capturing magnification higher than that of the first image capturing section 13 is obtained based on the position information of the third mark 17.
  • the second image pickup unit 14 is moved so that the fourth mark 18 for position detection provided on the substrate 12 is positioned within the range. This relates to the alignment method.
  • the position information of the mark is acquired by using two or more of the first imaging unit 13 and the second imaging unit 14, respectively. This relates to the alignment method.
  • the first imaging unit 13 and the second imaging unit 14 each include lens focal length adjusting means for adjusting a focal length of the lens. This relates to the alignment method described in (1).
  • alignment is performed for alignment between the mask 11 and the substrate 12 provided in a film forming apparatus that deposits a film forming material on the substrate 12 through the mask opening of the mask 11 and forms a thin film on the substrate 12.
  • a device A mask moving means for supporting the mask 11 and moving the mask 11 in the X and Y directions or a substrate moving means for supporting the substrate 12 and moving the substrate 12 in the X and Y directions;
  • a first imaging unit 13 for imaging a first mark 15 for position detection provided on the mask 11 and a third mark 17 for position detection provided on the substrate 12;
  • the second imaging for imaging the second mark 16 for position detection provided on the mask 11 and the fourth mark 18 for position detection provided on the substrate 12 have a higher imaging magnification than the first imaging unit 13.
  • the position information of the first mark 15 or the third mark 17 is acquired from the image data captured by the first image pickup unit 13, and the position information of the first mark 15 or the third mark 17 is based on the position information.
  • the second mark 16 for position detection provided on the mask 11 or the fourth mark 18 for position detection provided on the substrate 12 is positioned in the imaging range of the second imaging unit 14.
  • Imaging unit control means for controlling the imaging unit driving means to move the second imaging unit 14; Position information of the first mark 15 and the third mark 17 is acquired from image data obtained by simultaneously imaging the first mark 15 and the third mark 17 by the first imaging unit 13, Based on the positional information of the first mark 15 and the third mark 17, the mask moving means or the substrate moving means is controlled to move the substrate 12 and the mask 11 relative to each other to perform the first alignment, Position information of the second mark 16 and the fourth mark 18 is acquired from image data obtained by simultaneously imaging the second mark 16 and the fourth mark 18 by the second imaging unit 14; Alignment control for performing second alignment by controlling the mask moving means or the substrate moving means to move the substrate 12 and the mask 11 relative to each other based on positional information of the second mark 16 and the fourth mark 18.
  • the present invention relates to an alignment apparatus configured to perform position correction between the substrate 12 and the mask 11 in two stages of the first alignment and the second alignment.
  • the mask mark and the substrate mark can be captured in the imaging field of view of the imaging unit having a high imaging magnification without damaging the substrate, and practicality capable of performing high-precision alignment.
  • the alignment method and the alignment apparatus are excellent.
  • FIG. 1 is a schematic explanatory perspective view illustrating an alignment apparatus according to a first embodiment.
  • FIG. 6 is a flowchart illustrating an alignment procedure according to the first embodiment. It is a flowchart explaining the procedure of the alignment of another example. It is a flowchart explaining the procedure of the alignment of another example.
  • FIG. 10 is a flowchart illustrating an alignment procedure according to the second embodiment.
  • the alignment of the mask 11 and the substrate 12 is performed in a film forming apparatus that deposits a film forming material on the substrate 12 through the mask opening of the mask 11 and forms a thin film on the substrate 12.
  • the first mark 15 of the mask 11 carried into a processing chamber such as a film forming chamber of the film forming apparatus and held on the mask table is picked up by the first image pickup unit 13, and the first data is obtained from the picked up image data.
  • the position information of the mark 15 is acquired, and the second mark 16 of the mask 11 is placed in the imaging range of the second imaging unit 14 having a higher imaging magnification than the first imaging unit 13 based on the position information of the first mark 15.
  • the second imaging unit 14 is moved so that is located.
  • the second imaging is performed on the second mark 16.
  • the amount of movement necessary to match the imaging centers of the unit 14 is calculated, and the second imaging unit 14 is moved.
  • the second imaging unit 14 is moved to a position where the second mark 16 is captured based on the imaging data obtained by imaging the first mark 15 with the first imaging unit 13 having a low imaging magnification and a wide imaging field of view.
  • the coordinate position of the second imaging unit 14 with a high imaging magnification positioned using the imaging data obtained by imaging with the first imaging unit 13 is fixed, and the second imaging unit 14
  • the imaging range as a reference position for position correction between the substrate 12 and the mask 11
  • the second imaging unit 14 with a high imaging magnification and a narrow imaging field of view reliably ensures the mask regardless of the conveyance accuracy of the mask 11 and the substrate 12.
  • 11 and the marks on the substrate 12 can be captured, and the marks on the mask 11 and the substrate 12 can be reliably prevented from being removed from the imaging field of view.
  • the substrate 12 is carried into the processing chamber so that the mark on the mask 11 and the mark on the substrate 12 are positioned within the imaging range of the imaging unit, and the mask 11 and the substrate 12 overlap each other with a gap therebetween.
  • the first mark 15 on the mask 11 and the third mark 17 on the substrate 12 are simultaneously imaged by the first imaging unit 13 while the substrate 12 is held on the substrate 12, and the first mark 15 is obtained from the obtained imaging data.
  • the positional information of the third mark 17 is acquired, and based on the positional information of the first mark 15 and the third mark 17, the substrate 12 and the mask 11 are relatively moved to perform rough positioning, that is, the first alignment. I do.
  • the second mark 16 of the mask 11 and the fourth mark 18 of the substrate 12 are simultaneously imaged by the second imaging unit 14 positioned at the position where the second mark 16 of the mask 11 is imaged.
  • the position information of the second mark 16 and the fourth mark 18 is obtained from the captured image data, and the substrate 12 and the mask 11 are relatively moved based on the position information of the second mark 16 and the fourth mark 18. Then, fine positioning, that is, second alignment is performed, and the substrate 12 and the mask 11 are brought into close contact with each other.
  • the first imaging unit 13 is used not only for positioning the second imaging unit 14 but also for rough positioning of the mask 11 and the substrate 12. Further, the substrate 12 may be carried into a range where the first imaging unit 13 having a wide imaging field of view can capture the mark of the substrate 12. Are not required to fall within the imaging range of the high-precision camera, and damage to the substrate 12 can be prevented.
  • each mark on the substrate 12 is captured by the first imaging unit 13
  • each mark can be reliably captured by the second imaging unit 14 by rough positioning, and the substrate 12 is damaged.
  • the marks on the mask 11 and the substrate 12 can be reliably imaged by the second imaging unit 14 having a high imaging magnification to ensure highly accurate alignment.
  • the second imaging unit 14 may be positioned in the same manner as described above by using the third mark 17 and the fourth mark 18 on the substrate 12 without being limited to the mask 11 side.
  • Example 1 is provided in a film forming apparatus for forming a thin film on a substrate 12 by depositing a film forming material on a substrate 12 through a mask opening of the mask 11, and aligning the mask 11 with the substrate 12. And is provided in a processing chamber of the film forming apparatus, for example, the film forming chamber.
  • a substrate moving means for supporting the substrate 12 and moving the substrate 12 in the X and Y directions, a first mark 15 for position detection provided on the mask 11 and the substrate 12 are provided.
  • the first image pickup unit 13 for picking up the third mark 17 for position detection, the second mark 16 for position detection provided on the mask 11 and the substrate 12 having a higher imaging magnification than the first image pickup unit 13.
  • a second imaging unit 14 that images the fourth mark 18 for position detection provided on the imaging unit, an imaging unit driving unit that moves the second imaging unit 14 in the X and Y directions, and an imaging unit driving unit. It has an imaging unit control means for controlling, and an alignment control means for controlling the substrate moving means.
  • a mask holder mask base for holding the carried-in mask 11 is provided in the processing chamber.
  • the mask 11 is carried into the imaging range where the first mark 15 of the mask 11 is captured by the first imaging unit 13 having a wide imaging field of view.
  • Alignment is performed in the following procedure using the alignment apparatus having the above configuration.
  • a mask holding process for holding the mask 11 on the mask base is performed, a first imaging process for imaging the first mark 15 for position detection provided on the mask 11 by the first imaging unit 13 is performed, and the first imaging is performed.
  • the position information of the first mark 15 is acquired from the image data obtained in the process, and the second image pickup having a higher image pickup magnification than the first image pickup unit 13 based on the position information of the first mark 15.
  • a first moving step of moving the second imaging unit 14 so that the second mark 16 for position detection provided on the mask 11 is positioned in the imaging range of the unit 14 is performed.
  • a substrate holding step for carrying the substrate 12 and holding it on the substrate holder, and an arrangement step for arranging the mask 11 and the substrate 12 so as to overlap each other with a gap are performed.
  • the substrate 12 is carried into the imaging range where the third mark 17 on the substrate 12 is captured by the first imaging unit 13 having a wide imaging field of view.
  • a first alignment process is performed in which the substrate 12 and the mask 11 are relatively moved.
  • the second image 16 and the fourth mark 18 for position detection provided on the substrate 12 are simultaneously imaged by the second imaging unit 14 moved in the first movement process. And the position information of the second mark 16 and the fourth mark 18 is acquired from the imaging data obtained in the third imaging step, and the positions of the second mark 16 and the fourth mark 18 are acquired. Based on the information, a second alignment step of moving the substrate 12 and the mask 11 relative to each other is performed.
  • an adhesion step for bringing the substrate 12 and the mask 11 into close contact is performed.
  • a general XY stage that supports the substrate 12 in a horizontal state with a predetermined distance from the mask 11 and moves in the X and Y directions parallel to the mask surface by a ball screw mechanism, a linear motor mechanism, or the like. Adopted.
  • the substrate 12 is held by the substrate holder so that no external force is applied to the substrate 12.
  • the substrate 12 is aligned by applying an external force to the substrate holder when aligning the substrate 12, so that the substrate 12 is not directly applied to the substrate 12, It can be prevented from being damaged.
  • a substrate moving means may be incorporated in the substrate holder.
  • a low magnification camera 13 and a high magnification camera 14 are employed, respectively.
  • the low-magnification camera 13 and the high-magnification camera 14 are provided vertically downward, and are configured to image the marks on the mask 11 and the substrate 12 from above.
  • the low-power camera 13 and the high-power camera 14 are each provided with lens focal length adjusting means for adjusting the focal length of the lens.
  • the installation positions of the low-magnification first imaging unit 13 and the high-magnification second imaging unit 14 are the design of the first mark 15 and the third mark 17, and the second mark 16 and the fourth mark 18. It is installed appropriately based on the position.
  • the second imaging unit 14 is moved in the X and Y directions.
  • the second mark 16, 16 and the fourth mark 18, 18 are installed within the imaging range of the second imaging unit 14 within the moving range of the imaging unit driving means to be moved.
  • the imaging magnification of the low magnification camera 13 constituting the first imaging unit 13 is about 0.5 to 1.0 times, for example, and the imaging magnification of the high magnification camera 14 constituting the second imaging unit 14 is 1 for example. Set to about 0 to 3.0 times.
  • the sizes of the first marks 15 and 15 of the mask 11 imaged by the first imaging unit 13 and the third marks 17 and 17 of the substrate 12 are the same as those of the mask 11 imaged by the second imaging unit 14. It is larger than the second marks 16 and 16 and the fourth marks 18 and 18 of the substrate 12.
  • the outer shapes of the first marks 15 and 15 of the mask 11 and the third marks 17 and 17 of the substrate 12 are about 500 ⁇ m to 1000 ⁇ m, and the second marks 16 and 16 of the mask 11 and the second marks of the substrate 12 are the same.
  • the outer shape of each of the four marks 18 and 18 is about 125 ⁇ m to 250 ⁇ m.
  • the mark on the mask 11 and the mark on the substrate 12 can be set as appropriate, such as a configuration in which a cross-shaped mark on the substrate 12 side is positioned within an annular mark on the mask 11 side.
  • Two each of the first, second, third and fourth marks 15, 16, 17, and 18 are provided on the mask 11 or the substrate 12, respectively.
  • Two magnification cameras 14 are also provided. Note that three or more of each of the marks 15, 16, 17, and 18 may be provided.
  • each of the marks 15, 16, 17, and 18 is provided at a position where two (a pair) are point-symmetric with respect to the center of the mask 11 or the substrate 12.
  • the first mark 15 and the second mark 16 are provided at the respective diagonal positions of the rectangular mask 11.
  • the third mark 17 and the fourth mark 18 are provided at the respective diagonal positions of the rectangular substrate 12.
  • the imaging unit driving means moves the high-magnification camera 14 in the X and Y directions by a ball screw mechanism or a linear motor mechanism while keeping the vertically downward direction. It should be noted that the high-magnification camera 14 may be configured to be driven in the Z direction orthogonal to the X and Y directions, and in this case, the lens focal length adjusting means may not be provided.
  • the imaging unit driving unit is controlled by an imaging unit control unit that is an arithmetic unit.
  • the imaging unit control means is connected to the low-magnification camera 13, acquires position information (coordinates) of the first mark 15 from the imaging data imaged by the low-magnification camera 13, and this first Based on the amount of deviation of the center of the mark 15 from the imaging center of the low-magnification camera 13, the high-magnification camera 14 moves by an amount necessary for the imaging center of the high-magnification camera 14 to coincide with the center of the second mark 16
  • the imaging unit driving means is controlled to do so.
  • the substrate moving means is controlled by alignment control means that is an arithmetic unit.
  • the alignment control means is connected to the low-magnification camera 13 and the high-magnification camera 14, and the first mark 15 and the third mark 17 are simultaneously captured by the low-magnification camera 13 from the first imaging data.
  • the position information of the mark 15 and the third mark 17 is acquired, and the first mark 15 and the third mark 17 are based on the amount of deviation of the center of the third mark 17 from the center of the first mark 15.
  • the substrate moving means is controlled so that 17 is positioned within an allowable range, and the substrate 12 and the mask 11 are relatively moved to perform the first alignment.
  • the alignment control means obtains positional information of the second mark 16 and the fourth mark 18 from image data obtained by simultaneously imaging the second mark 16 and the fourth mark 18 with the high magnification camera 14. Based on the amount of deviation of the center of the fourth mark 18 from the center of the second mark 16, the substrate moving means is arranged so that the second mark 16 and the fourth mark 18 are located within an allowable range.
  • the second alignment is performed by controlling the relative movement of the substrate 12 and the mask 11.
  • the position correction between the substrate 12 and the mask 11 is performed based on the imaging range of the high-magnification camera 14 positioned using the imaging data obtained by the low-magnification camera 13, and the first alignment and the mask 11 are corrected. This is performed in two stages with the second alignment.
  • the mask 11 is carried into the processing chamber (1.), and the carried mask 11 is placed on the mask holder (2.). Subsequently, the first mark 15 (coarse mark) of the mask 11 is imaged by the low magnification camera 13 to measure the coordinates of the first mark 15 (3.), and the coordinate information of the first mark 15 is obtained. Based on this, the high magnification camera 14 is moved so that the second mark 16 (fine mark) of the mask 11 and the imaging center of the high magnification camera 14 are aligned (4.).
  • the substrate 12 is carried between the mask 11 and the cameras 13 and 14 and supported by the XY stage (5.), and the third mark 17 on the substrate 12 and the first mark 15 on the mask 11 with the low magnification camera 13.
  • the coordinates are measured (6.), and the substrate 12 is moved on the XY stage based on the measured coordinates to perform the first alignment (7.).
  • the fourth mark 18 on the substrate 12 and the second mark 16 on the mask 11 are photographed with the high-magnification camera 14 and the coordinates are measured (8.), and the substrate 12 is moved on the XY stage based on the measured coordinates.
  • the second alignment is performed to match the imaging center of the high-magnification camera 14 (9.).
  • the substrate 12 and the mask 11 are brought into close contact with each other (10.), and finally, it is measured whether or not the alignment is performed with a specified accuracy by the high magnification camera 14 (11.).
  • the mask mark and the substrate mark can be reliably captured within the imaging field of the imaging unit having a high imaging magnification without damaging the substrate 12, and high-precision alignment can be reliably performed. It will be a thing.
  • FIG. 4 shows an example in which the substrate 12 is carried in (substrate holding step) before the first imaging step and the first moving step.
  • FIG. 5 shows that the substrate 12 is carried in (substrate holding process) before the first imaging process and the first moving process, and the second imaging process and the first alignment process are performed in the first imaging process and the first moving process. This is an example performed before.
  • the mask holding step is preferably performed before the first imaging step and the first moving step. Moreover, it is preferable to perform an arrangement
  • the second embodiment is an example in which the high magnification camera 14 is positioned in the same manner as the first embodiment using the third mark 17 and the fourth mark 18 on the substrate 12. Alignment is performed by moving the mask 11 in the X and Y directions using mask moving means having the same configuration as the substrate moving means.
  • Example 2 alignment is performed according to the following procedure.
  • a substrate holding step of holding the substrate 12 on the substrate holder is performed, and a first imaging step of imaging the position detection third mark 17 provided on the substrate 12 by the first imaging unit 13 is performed, and this first imaging
  • the position information of the third mark 17 is acquired from the image data obtained in the process, and the second image pickup having a higher image pickup magnification than the first image pickup unit 13 is obtained based on the position information of the third mark 17.
  • a first moving step is performed in which the second imaging unit 14 is moved so that the fourth mark 18 for position detection provided on the substrate 12 is positioned within the imaging range of the unit 14.
  • a mask holding process for holding the mask 11 on the mask table is performed, and an arrangement process for arranging the substrate 12 and the mask 11 so as to overlap each other at an interval is performed.
  • a first alignment process is performed in which the substrate 12 and the mask 11 are relatively moved.
  • the second image 16 and the fourth mark 18 for position detection provided on the substrate 12 are simultaneously imaged by the second imaging unit 14 moved in the first movement process. And the position information of the second mark 16 and the fourth mark 18 is acquired from the imaging data obtained in the third imaging step, and the positions of the second mark 16 and the fourth mark 18 are acquired. Based on the information, a second alignment step of moving the substrate 12 and the mask 11 relative to each other is performed.
  • an adhesion step for bringing the substrate 12 and the mask 11 into close contact is performed.
  • the mask holding step may be performed at any time before the placement step.
  • the substrate 12 is loaded into the processing chamber in which the mask is loaded in advance (1A.), And the loaded substrate 12 is set on the substrate holder (2A.).
  • the third mark 17 (coarse mark) on the substrate 12 is imaged by the low magnification camera 13 to measure the coordinates of the third mark 17 (3A.), And the coordinate information of the third mark 17 is obtained.
  • the high magnification camera 14 is moved so that the fourth mark 18 (fine mark) on the substrate 12 and the imaging center of the high magnification camera 14 are aligned (4A.).
  • the mask 11 is placed so that the substrate 12 is positioned at a predetermined position between the mask 11 and the cameras 13 and 14 and supported by the XY stage (5A.). 17 and the first mark 15 of the mask 11 are photographed and the coordinates are measured (6A.), And the mask 11 is moved on the XY stage based on the measured coordinates to perform the first alignment (7A.). Subsequently, the fourth mark 18 on the substrate 12 and the second mark 16 on the mask 11 are photographed with the high-magnification camera 14 and the coordinates are measured (8A.), And the mask 11 is moved on the XY stage based on the measured coordinates. The second alignment is performed to match the imaging center of the high-magnification camera 14 (9A.). Subsequently, the substrate 12 and the mask 11 are brought into close contact with each other (10A.), And finally, it is measured whether or not the alignment is performed with a specified accuracy by the high magnification camera 14 (11A.).
  • the process order is not limited to the order shown in FIG.
  • the mask 11 is carried in before the first imaging process and the first movement process.
  • the mask 11 can be carried in before the first imaging step and the first moving step, and the second imaging step and the first alignment step can be performed before the first imaging step and the first moving step. .
  • the substrate holding process is preferably performed before the first imaging process and the first moving process. Moreover, it is preferable to perform an arrangement

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
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  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/JP2014/062824 2013-09-27 2014-05-14 アライメント方法並びにアライメント装置 WO2015045475A1 (ja)

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Application Number Priority Date Filing Date Title
CN201480053028.XA CN105593396B (zh) 2013-09-27 2014-05-14 对准方法以及对准装置
KR1020167010522A KR101968807B1 (ko) 2013-09-27 2014-05-14 얼라인먼트 방법 및 얼라인먼트 장치

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Application Number Priority Date Filing Date Title
JP2013201683A JP6250999B2 (ja) 2013-09-27 2013-09-27 アライメント方法並びにアライメント装置
JP2013-201683 2013-09-27

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JP2021075757A (ja) 2019-11-08 2021-05-20 株式会社ブイ・テクノロジー アライメント装置
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JP2015067845A (ja) 2015-04-13

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