JP6248532B2 - ３Ｃ−ＳｉＣエピタキシャル層の製造方法、３Ｃ−ＳｉＣエピタキシャル基板および半導体装置 - Google Patents

３Ｃ−ＳｉＣエピタキシャル層の製造方法、３Ｃ−ＳｉＣエピタキシャル基板および半導体装置 Download PDF

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JP6248532B2
JP6248532B2 JP2013216306A JP2013216306A JP6248532B2 JP 6248532 B2 JP6248532 B2 JP 6248532B2 JP 2013216306 A JP2013216306 A JP 2013216306A JP 2013216306 A JP2013216306 A JP 2013216306A JP 6248532 B2 JP6248532 B2 JP 6248532B2
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substrate
sic
sic epitaxial
epitaxial layer
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JP2015078093A (ja
JP2015078093A5 (https=
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幸宗 渡邉
幸宗 渡邉
功泰 川名
功泰 川名
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Seiko Epson Corp
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    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/18—Epitaxial-layer growth characterised by the substrate
    • C30B25/183—Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/18—Epitaxial-layer growth characterised by the substrate
    • C30B25/186—Epitaxial-layer growth characterised by the substrate being specially pre-treated by, e.g. chemical or physical means
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/36—Carbides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2902—Materials being Group IVA materials
    • H10P14/2905—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3204—Materials thereof being Group IVA semiconducting materials
    • H10P14/3208—Silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3408—Silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3451—Structure
    • H10P14/3452—Microstructure
    • H10P14/3458—Monocrystalline
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/36—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done before the formation of the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325—Silicon carbide

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
JP2013216306A 2013-10-17 2013-10-17 ３Ｃ−ＳｉＣエピタキシャル層の製造方法、３Ｃ−ＳｉＣエピタキシャル基板および半導体装置 Expired - Fee Related JP6248532B2 (ja)

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JP2013216306A JP6248532B2 (ja) 2013-10-17 2013-10-17 ３Ｃ−ＳｉＣエピタキシャル層の製造方法、３Ｃ−ＳｉＣエピタキシャル基板および半導体装置
US14/514,993 US9758902B2 (en) 2013-10-17 2014-10-15 Method for producing 3C-SiC epitaxial layer, 3C-SiC epitaxial substrate, and semiconductor device

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JP2013216306A JP6248532B2 (ja) 2013-10-17 2013-10-17 ３Ｃ−ＳｉＣエピタキシャル層の製造方法、３Ｃ−ＳｉＣエピタキシャル基板および半導体装置

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JP2015078093A5 JP2015078093A5 (https=) 2016-10-06
JP6248532B2 true JP6248532B2 (ja) 2017-12-20

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102203025B1 (ko) * 2014-08-06 2021-01-14 엘지이노텍 주식회사 탄화규소 에피 웨이퍼 제조 방법
GB2534357B (en) * 2015-01-14 2020-02-19 Anvil Semiconductors Ltd Wafer bow reduction
JP6592961B2 (ja) 2015-05-19 2019-10-23 セイコーエプソン株式会社 炭化ケイ素基板および炭化ケイ素基板の製造方法
CN107465983B (zh) * 2016-06-03 2021-06-04 无锡华润上华科技有限公司 Mems麦克风及其制备方法
KR102681366B1 (ko) * 2018-11-14 2024-07-05 주식회사 엘엑스세미콘 탄화규소 에피 웨이퍼
CN116525420B (zh) * 2023-06-09 2023-12-19 中电科先进材料技术创新有限公司 在硅片表面生长3C-SiC薄层的方法及3C-SiC层
CN117727614A (zh) * 2023-09-27 2024-03-19 晶丰芯驰(上海)半导体科技有限公司 一种控制缺陷的碳化硅外延结构及其制备方法与应用

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3841352A1 (de) * 1988-12-08 1990-06-21 Philips Patentverwaltung Verfahren zur herstellung eines maskentraegers aus sic fuer strahlungslithographie-masken
JPH0543399A (ja) * 1991-03-08 1993-02-23 Ricoh Co Ltd 薄膜機能部材
JP3230650B2 (ja) * 1996-03-27 2001-11-19 富士電機株式会社 炭化けい素半導体基板とその製造方法およびその基板を用いた炭化けい素半導体素子
US6273950B1 (en) * 1996-04-18 2001-08-14 Matsushita Electric Industrial Co., Ltd. SiC device and method for manufacturing the same
JP3841537B2 (ja) 1997-12-22 2006-11-01 豊田合成株式会社 窒化ガリウム系化合物半導体及びその製造方法
FR2774214B1 (fr) * 1998-01-28 2002-02-08 Commissariat Energie Atomique PROCEDE DE REALISATION D'UNE STRUCTURE DE TYPE SEMI-CONDUCTEUR SUR ISOLANT ET EN PARTICULIER SiCOI
JP3201475B2 (ja) * 1998-09-14 2001-08-20 松下電器産業株式会社 半導体装置およびその製造方法
JP3754294B2 (ja) 2000-12-28 2006-03-08 株式会社東芝 炭化珪素単結晶基板の製造方法及び半導体装置の製造方法
JP3761418B2 (ja) * 2001-05-10 2006-03-29 Ｈｏｙａ株式会社 化合物結晶およびその製造法
US6936490B2 (en) * 2001-09-06 2005-08-30 Toshiba Ceramics Co, Ltd. Semiconductor wafer and its manufacturing method
JP4378950B2 (ja) * 2002-12-24 2009-12-09 セイコーエプソン株式会社 液滴吐出装置および電気光学装置の製造方法
JP4539140B2 (ja) * 2004-03-29 2010-09-08 住友電気工業株式会社 炭化珪素基板およびその製造方法
EP1619276B1 (en) * 2004-07-19 2017-01-11 Norstel AB Homoepitaxial growth of SiC on low off-axis SiC wafers
US7641736B2 (en) 2005-02-22 2010-01-05 Hitachi Metals, Ltd. Method of manufacturing SiC single crystal wafer
US9153645B2 (en) * 2005-05-17 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
JP2008024554A (ja) * 2006-07-21 2008-02-07 Toyota Motor Corp 単結晶の製造方法
KR20110015009A (ko) * 2008-06-10 2011-02-14 에어 워터 가부시키가이샤 질소 화합물 반도체 기판의 제조 방법 및 질소 화합물 반도체 기판, 단결정 ＳｉＣ 기판의 제조 방법 및 단결정 ＳｉＣ 기판
WO2010110123A1 (ja) * 2009-03-26 2010-09-30 キヤノンアネルバ株式会社 基板処理方法および結晶性炭化ケイ素（ＳｉＣ）基板の製造方法
JP5471258B2 (ja) * 2009-10-02 2014-04-16 セイコーエプソン株式会社 半導体基板とその製造方法
JP5739873B2 (ja) * 2010-04-02 2015-06-24 住友電気工業株式会社 マグネシウム基複合部材、放熱部材、および半導体装置
JP5605005B2 (ja) * 2010-06-16 2014-10-15 住友電気工業株式会社 炭化珪素半導体装置の製造方法および炭化珪素半導体装置の製造装置
JP2012004270A (ja) * 2010-06-16 2012-01-05 Sumitomo Electric Ind Ltd 炭化珪素半導体の洗浄方法、炭化珪素半導体および炭化珪素半導体装置
JP5585268B2 (ja) * 2010-07-22 2014-09-10 セイコーエプソン株式会社 単結晶炭化珪素膜付き基材及び単結晶炭化珪素膜の製造方法並びに単結晶炭化珪素膜付き基材の製造方法
JP2012031012A (ja) * 2010-07-30 2012-02-16 Seiko Epson Corp 立方晶炭化珪素膜の製造方法
US20120056194A1 (en) * 2010-09-03 2012-03-08 Qs Semiconductor Australia Pty Ltd Barrier structures and methods of forming same to facilitate silicon carbide epitaxy and silicon carbide-based memory fabrication
GB2484506A (en) * 2010-10-13 2012-04-18 Univ Warwick Heterogrowth
DE112012004193T5 (de) * 2011-10-07 2014-07-03 Asahi Glass Co., Ltd. Siliziumcarbid-Einkristallsubstrat und Polierlösung
GB2495949B (en) * 2011-10-26 2015-03-11 Anvil Semiconductors Ltd Silicon carbide epitaxy

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US9758902B2 (en) 2017-09-12
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