JP6248458B2 - 貼り合わせウェーハの製造方法および貼り合わせウェーハ - Google Patents

貼り合わせウェーハの製造方法および貼り合わせウェーハ Download PDF

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JP6248458B2
JP6248458B2 JP2013162512A JP2013162512A JP6248458B2 JP 6248458 B2 JP6248458 B2 JP 6248458B2 JP 2013162512 A JP2013162512 A JP 2013162512A JP 2013162512 A JP2013162512 A JP 2013162512A JP 6248458 B2 JP6248458 B2 JP 6248458B2
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wafer
carbon
active layer
bonded
containing film
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JP2015032742A5 (enExample
JP2015032742A (ja
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祥泰 古賀
祥泰 古賀
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Sumco Corp
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Sumco Corp
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JP2013162512A 2013-08-05 2013-08-05 貼り合わせウェーハの製造方法および貼り合わせウェーハ Active JP6248458B2 (ja)

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JP2013162512A JP6248458B2 (ja) 2013-08-05 2013-08-05 貼り合わせウェーハの製造方法および貼り合わせウェーハ

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JP2013162512A JP6248458B2 (ja) 2013-08-05 2013-08-05 貼り合わせウェーハの製造方法および貼り合わせウェーハ

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JP2015032742A JP2015032742A (ja) 2015-02-16
JP2015032742A5 JP2015032742A5 (enExample) 2015-04-02
JP6248458B2 true JP6248458B2 (ja) 2017-12-20

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017038030A (ja) * 2015-08-14 2017-02-16 株式会社ディスコ ウエーハの加工方法及び電子デバイス
JP6772995B2 (ja) * 2017-09-25 2020-10-21 株式会社Sumco Ｓｏｉウェーハの製造方法およびｓｏｉウェーハ
JP7600973B2 (ja) 2021-12-08 2024-12-17 株式会社Sumco 積層ウェーハ及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02206118A (ja) * 1989-02-06 1990-08-15 Hitachi Ltd 半導体素子
JPH0394416A (ja) * 1989-09-07 1991-04-19 Sumitomo Metal Mining Co Ltd Ｓｏｉ基板の製造方法
FR2767605B1 (fr) * 1997-08-25 2001-05-11 Gec Alsthom Transport Sa Circuit integre de puissance, procede de fabrication d'un tel circuit et convertisseur incluant un tel circuit
JP2001172765A (ja) * 1999-12-15 2001-06-26 Shimadzu Corp Ｄｌｃ膜の成膜方法およびｄｌｃ膜成膜装置
FR2858461B1 (fr) * 2003-07-30 2005-11-04 Soitec Silicon On Insulator Realisation d'une structure comprenant une couche protegeant contre des traitements chimiques
GB0317854D0 (en) * 2003-07-30 2003-09-03 Element Six Ltd Method of manufacturing diamond substrates
JP4733941B2 (ja) * 2004-08-20 2011-07-27 株式会社プラズマイオンアシスト シール材およびその製造方法

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