JP2015032742A5 - - Google Patents
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- JP2015032742A5 JP2015032742A5 JP2013162512A JP2013162512A JP2015032742A5 JP 2015032742 A5 JP2015032742 A5 JP 2015032742A5 JP 2013162512 A JP2013162512 A JP 2013162512A JP 2013162512 A JP2013162512 A JP 2013162512A JP 2015032742 A5 JP2015032742 A5 JP 2015032742A5
- Authority
- JP
- Japan
- Prior art keywords
- comparative example
- voltage
- leakage current
- wafer stage
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 235000012431 wafers Nutrition 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013162512A JP6248458B2 (ja) | 2013-08-05 | 2013-08-05 | 貼り合わせウェーハの製造方法および貼り合わせウェーハ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013162512A JP6248458B2 (ja) | 2013-08-05 | 2013-08-05 | 貼り合わせウェーハの製造方法および貼り合わせウェーハ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015032742A JP2015032742A (ja) | 2015-02-16 |
| JP2015032742A5 true JP2015032742A5 (enExample) | 2015-04-02 |
| JP6248458B2 JP6248458B2 (ja) | 2017-12-20 |
Family
ID=52517811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013162512A Active JP6248458B2 (ja) | 2013-08-05 | 2013-08-05 | 貼り合わせウェーハの製造方法および貼り合わせウェーハ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6248458B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017038030A (ja) * | 2015-08-14 | 2017-02-16 | 株式会社ディスコ | ウエーハの加工方法及び電子デバイス |
| JP6772995B2 (ja) * | 2017-09-25 | 2020-10-21 | 株式会社Sumco | Ｓｏｉウェーハの製造方法およびｓｏｉウェーハ |
| JP7600973B2 (ja) | 2021-12-08 | 2024-12-17 | 株式会社Sumco | 積層ウェーハ及びその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02206118A (ja) * | 1989-02-06 | 1990-08-15 | Hitachi Ltd | 半導体素子 |
| JPH0394416A (ja) * | 1989-09-07 | 1991-04-19 | Sumitomo Metal Mining Co Ltd | Ｓｏｉ基板の製造方法 |
| FR2767605B1 (fr) * | 1997-08-25 | 2001-05-11 | Gec Alsthom Transport Sa | Circuit integre de puissance, procede de fabrication d'un tel circuit et convertisseur incluant un tel circuit |
| JP2001172765A (ja) * | 1999-12-15 | 2001-06-26 | Shimadzu Corp | Ｄｌｃ膜の成膜方法およびｄｌｃ膜成膜装置 |
| FR2858461B1 (fr) * | 2003-07-30 | 2005-11-04 | Soitec Silicon On Insulator | Realisation d'une structure comprenant une couche protegeant contre des traitements chimiques |
| GB0317854D0 (en) * | 2003-07-30 | 2003-09-03 | Element Six Ltd | Method of manufacturing diamond substrates |
| JP4733941B2 (ja) * | 2004-08-20 | 2011-07-27 | 株式会社プラズマイオンアシスト | シール材およびその製造方法 |
-
2013
- 2013-08-05 JP JP2013162512A patent/JP6248458B2/ja active Active
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