JP2011097033A5 - - Google Patents
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- Publication number
- JP2011097033A5 JP2011097033A5 JP2010210489A JP2010210489A JP2011097033A5 JP 2011097033 A5 JP2011097033 A5 JP 2011097033A5 JP 2010210489 A JP2010210489 A JP 2010210489A JP 2010210489 A JP2010210489 A JP 2010210489A JP 2011097033 A5 JP2011097033 A5 JP 2011097033A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive layer
- memory
- resistance
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910021417 amorphous silicon Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010210489A JP5641840B2 (ja) | 2009-10-01 | 2010-09-21 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009229869 | 2009-10-01 | ||
| JP2009229869 | 2009-10-01 | ||
| JP2010210489A JP5641840B2 (ja) | 2009-10-01 | 2010-09-21 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011097033A JP2011097033A (ja) | 2011-05-12 |
| JP2011097033A5 true JP2011097033A5 (enExample) | 2013-10-10 |
| JP5641840B2 JP5641840B2 (ja) | 2014-12-17 |
Family
ID=43823058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010210489A Expired - Fee Related JP5641840B2 (ja) | 2009-10-01 | 2010-09-21 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8264874B2 (enExample) |
| JP (1) | JP5641840B2 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8735863B2 (en) * | 2011-01-28 | 2014-05-27 | Privatran | Integrated nonvolatile resistive memory elements |
| WO2012169449A1 (en) * | 2011-06-08 | 2012-12-13 | Semiconductor Energy Laboratory Co., Ltd. | Sputtering target, method for manufacturing sputtering target, and method for forming thin film |
| EP2538471A1 (en) * | 2011-06-20 | 2012-12-26 | Glatfelter Gernsbach GmbH & Co. KG | Multifunctional web for use in a lead-acid battery |
| US10510070B2 (en) | 2011-10-17 | 2019-12-17 | Capital One Services, Llc | System, method, and apparatus for a dynamic transaction card |
| US10332102B2 (en) | 2011-10-17 | 2019-06-25 | Capital One Services, Llc | System, method, and apparatus for a dynamic transaction card |
| US10489774B2 (en) | 2011-10-17 | 2019-11-26 | Capital One Services, Llc | System, method, and apparatus for updating an existing dynamic transaction card |
| KR101976212B1 (ko) * | 2011-10-24 | 2019-05-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| US8796855B2 (en) * | 2012-01-13 | 2014-08-05 | Freescale Semiconductor, Inc. | Semiconductor devices with nonconductive vias |
| US8969867B2 (en) * | 2012-01-18 | 2015-03-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| EP2713372B1 (en) * | 2012-09-28 | 2017-08-23 | Imec | Non-volatile resistive memory devices with boosting capacitor and methods for baising resistive memory structures thereof |
| US10880741B2 (en) | 2013-07-23 | 2020-12-29 | Capital One Services, Llc | Automated bluetooth pairing |
| US10474941B2 (en) | 2015-04-14 | 2019-11-12 | Capital One Services, Llc | Dynamic transaction card antenna mounting |
| US10482453B2 (en) | 2015-04-14 | 2019-11-19 | Capital One Services, Llc | Dynamic transaction card protected by gesture and voice recognition |
| US10360557B2 (en) | 2015-04-14 | 2019-07-23 | Capital One Services, Llc | Dynamic transaction card protected by dropped card detection |
| EP3284027B1 (en) | 2015-04-14 | 2021-09-22 | Capital One Services, LLC | Tamper-resistant dynamic transaction card and method of providing a tamper-resistant dynamic transaction card |
| EP3567512A1 (en) | 2015-04-14 | 2019-11-13 | Capital One Services, LLC | A system, method, and apparatus for a dynamic transaction card |
| EP3283951B1 (en) | 2015-04-14 | 2020-01-29 | Capital One Services, LLC | System and method for secure firmware validation |
| CN108140138A (zh) | 2015-04-14 | 2018-06-08 | 第资本服务公司 | 具有emv接口的动态交易卡和制造方法 |
| US10997588B2 (en) | 2015-04-14 | 2021-05-04 | Capital One Services, Llc | Dynamic transaction card protected by dropped card detection |
| CA2982766C (en) | 2015-04-14 | 2023-07-04 | Capital One Services, Llc | Automated bluetooth pairing |
| CA2990227A1 (en) * | 2016-12-30 | 2018-06-30 | Capital One Services, Llc | Dynamic transaction card antenna mounting |
| WO2021026530A1 (en) * | 2019-08-08 | 2021-02-11 | The Regents Of The University Of California | Crystallization of two-dimensional structures comprising multiple thin films |
| JP7057400B2 (ja) * | 2020-08-20 | 2022-04-19 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4818082A (en) | 1988-05-27 | 1989-04-04 | Eastman Kodak Company | Compact wide-angle close-focus SLR zoom lens |
| JPH02153552A (ja) * | 1988-08-23 | 1990-06-13 | Seiko Epson Corp | 半導体素子及びその製造方法 |
| JP3501416B2 (ja) * | 1994-04-28 | 2004-03-02 | 忠弘 大見 | 半導体装置 |
| US8114719B2 (en) * | 2004-06-03 | 2012-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and manufacturing method of the same |
| JP4529654B2 (ja) * | 2004-11-15 | 2010-08-25 | ソニー株式会社 | 記憶素子及び記憶装置 |
| TWI411095B (zh) * | 2005-09-29 | 2013-10-01 | Semiconductor Energy Lab | 記憶裝置 |
| CN102646681B (zh) * | 2006-10-04 | 2015-08-05 | 株式会社半导体能源研究所 | 半导体器件 |
| US7782651B2 (en) * | 2006-10-24 | 2010-08-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including storage device and method for driving the same |
| KR101416876B1 (ko) * | 2006-11-17 | 2014-07-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조방법 |
| JP5263757B2 (ja) * | 2007-02-02 | 2013-08-14 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US8283724B2 (en) * | 2007-02-26 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device, and method for manufacturing the same |
| JP5525694B2 (ja) * | 2007-03-14 | 2014-06-18 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の作製方法 |
| JP2009129498A (ja) * | 2007-11-22 | 2009-06-11 | Toshiba Corp | 半導体記憶装置 |
| JP5371400B2 (ja) * | 2007-12-14 | 2013-12-18 | 株式会社半導体エネルギー研究所 | メモリ及び半導体装置 |
| US7872934B2 (en) * | 2007-12-14 | 2011-01-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for writing data into memory |
| JP5301299B2 (ja) * | 2008-01-31 | 2013-09-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8284596B2 (en) * | 2008-06-09 | 2012-10-09 | Qimonda Ag | Integrated circuit including an array of diodes coupled to a layer of resistance changing material |
| JP2010028105A (ja) * | 2008-06-20 | 2010-02-04 | Semiconductor Energy Lab Co Ltd | 記憶素子及び記憶素子の作製方法 |
-
2010
- 2010-09-21 JP JP2010210489A patent/JP5641840B2/ja not_active Expired - Fee Related
- 2010-09-27 US US12/890,856 patent/US8264874B2/en not_active Expired - Fee Related