JP2016518739A5 - - Google Patents

Download PDF

Info

Publication number
JP2016518739A5
JP2016518739A5 JP2016501996A JP2016501996A JP2016518739A5 JP 2016518739 A5 JP2016518739 A5 JP 2016518739A5 JP 2016501996 A JP2016501996 A JP 2016501996A JP 2016501996 A JP2016501996 A JP 2016501996A JP 2016518739 A5 JP2016518739 A5 JP 2016518739A5
Authority
JP
Japan
Prior art keywords
conductive layer
cavity
electrode
conductive
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016501996A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016518739A (ja
JP6232124B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2014/025924 external-priority patent/WO2014151525A2/en
Publication of JP2016518739A publication Critical patent/JP2016518739A/ja
Publication of JP2016518739A5 publication Critical patent/JP2016518739A5/ja
Application granted granted Critical
Publication of JP6232124B2 publication Critical patent/JP6232124B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016501996A 2013-03-15 2014-03-13 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法 Active JP6232124B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361794744P 2013-03-15 2013-03-15
US61/794,744 2013-03-15
PCT/US2014/025924 WO2014151525A2 (en) 2013-03-15 2014-03-13 Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017203056A Division JP6553695B2 (ja) 2013-03-15 2017-10-20 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法

Publications (3)

Publication Number Publication Date
JP2016518739A JP2016518739A (ja) 2016-06-23
JP2016518739A5 true JP2016518739A5 (enExample) 2017-04-20
JP6232124B2 JP6232124B2 (ja) 2017-11-15

Family

ID=50549454

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016501996A Active JP6232124B2 (ja) 2013-03-15 2014-03-13 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法
JP2017203056A Active JP6553695B2 (ja) 2013-03-15 2017-10-20 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017203056A Active JP6553695B2 (ja) 2013-03-15 2017-10-20 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法

Country Status (9)

Country Link
US (8) US9242275B2 (enExample)
EP (3) EP4122609B1 (enExample)
JP (2) JP6232124B2 (enExample)
KR (1) KR102170559B1 (enExample)
CN (1) CN105307975B (enExample)
AU (2) AU2014234071B2 (enExample)
CA (1) CA2905040C (enExample)
TW (2) TWI623081B (enExample)
WO (1) WO2014151525A2 (enExample)

Families Citing this family (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012123787A1 (en) * 2011-03-14 2012-09-20 Nokia Corporation An echolocation apparatus
WO2014123922A1 (en) 2013-02-05 2014-08-14 Butterfly Network, Inc. Cmos ultrasonic transducers and related apparatus and methods
KR20220097541A (ko) 2013-03-15 2022-07-07 버터플라이 네트워크, 인크. 모놀리식 초음파 이미징 디바이스, 시스템 및 방법
CN105307975B (zh) 2013-03-15 2017-04-26 蝴蝶网络有限公司 互补金属氧化物半导体(cmos)超声换能器及其形成方法
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
TWI682817B (zh) 2013-07-23 2020-01-21 美商蝴蝶網路公司 可互連的超音波換能器探頭以及相關的方法和設備
TWI687710B (zh) * 2014-04-18 2020-03-11 美商蝴蝶網路公司 單基板超音波成像裝置的架構、相關設備及方法
KR102392966B1 (ko) 2014-04-18 2022-05-02 버터플라이 네트워크, 인크. 초음파 촬영 압축 방법 및 장치
WO2015161147A1 (en) 2014-04-18 2015-10-22 Butterfly Network, Inc. Ultrasonic transducers in complementary metal oxide semiconductor (cmos) wafers and related apparatus and methods
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
KR102373132B1 (ko) * 2014-12-26 2022-03-11 삼성메디슨 주식회사 초음파 프로브 장치 및 초음파 촬영 장치
US10098539B2 (en) 2015-02-10 2018-10-16 The Trustees Of Columbia University In The City Of New York Systems and methods for non-invasive brain stimulation with ultrasound
CN104777483B (zh) * 2015-04-17 2017-09-29 业成光电（深圳）有限公司 高解析触觉感测装置
CN107673303B (zh) * 2015-05-15 2019-08-09 风起科技股份有限公司 支撑柱、微型集音器、cmos麦克风单晶片
EP3317026B1 (en) * 2015-06-30 2023-12-20 Koninklijke Philips N.V. Ultrasound system and ultrasonic pulse transmission method
WO2017004562A1 (en) 2015-07-01 2017-01-05 The Trustees Of Columbia University In The City Of New York Systems and methods for modulation and mapping of brain tissue using an ultrasound assembly
WO2017040973A1 (en) 2015-09-04 2017-03-09 The Trustees Of Columbia University In The City Of New York Micron-scale ultrasound identification sensing tags
US9987661B2 (en) * 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
WO2017171988A2 (en) 2016-01-21 2017-10-05 The Trustees Of Columbia University In The City Of New York Micron-scale active complementary metal-oxide-semiconductor (cmos) optical tags
WO2017161220A1 (en) * 2016-03-17 2017-09-21 Cornell University Transmit-receive delay element apparatus, method, and applications
US9778348B1 (en) 2016-03-31 2017-10-03 Butterfly Network, Inc. Symmetric receiver switch for bipolar pulser
US10082565B2 (en) * 2016-03-31 2018-09-25 Butterfly Network, Inc. Multilevel bipolar pulser
US10497856B2 (en) 2016-06-20 2019-12-03 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
US11712221B2 (en) 2016-06-20 2023-08-01 Bfly Operations, Inc. Universal ultrasound device and related apparatus and methods
US10856840B2 (en) 2016-06-20 2020-12-08 Butterfly Network, Inc. Universal ultrasound device and related apparatus and methods
US11013938B2 (en) 2016-07-27 2021-05-25 The Trustees Of Columbia University In The City Of New York Methods and systems for peripheral nerve modulation using non ablative focused ultrasound with electromyography (EMG) monitoring
US11020617B2 (en) 2016-07-27 2021-06-01 The Trustees Of Columbia University In The City Of New York Methods and systems for peripheral nerve modulation using non ablative focused ultrasound with electromyography (EMG) monitoring
EP3279630B1 (en) 2016-08-03 2019-06-26 ams AG Pressure sensor module
JP6801105B2 (ja) * 2016-12-05 2020-12-16 グローバルウェーハズ カンパニー リミテッドＧｌｏｂａｌＷａｆｅｒｓ Ｃｏ．，Ｌｔｄ． 高抵抗シリコンオンインシュレータ構造及びその製造方法
CN110325293B (zh) * 2016-12-22 2021-06-22 皇家飞利浦有限公司 电容式射频微机电开关的系统和操作方法
US20180180724A1 (en) * 2016-12-26 2018-06-28 Nxp Usa, Inc. Ultrasonic transducer integrated with supporting electronics
DE102017102545B4 (de) * 2017-02-09 2018-12-20 Infineon Technologies Ag Halbleitervorrichtung, Drucksensor, Mikrofon, Beschleunigungssensor und Verfahren zum Bilden einer Halbleitervorrichtung
AU2018225762A1 (en) 2017-02-27 2019-08-22 Butterfly Network, Inc. Capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US10856843B2 (en) 2017-03-23 2020-12-08 Vave Health, Inc. Flag table based beamforming in a handheld ultrasound device
US10469846B2 (en) 2017-03-27 2019-11-05 Vave Health, Inc. Dynamic range compression of ultrasound images
US11446003B2 (en) 2017-03-27 2022-09-20 Vave Health, Inc. High performance handheld ultrasound
US11531096B2 (en) 2017-03-23 2022-12-20 Vave Health, Inc. High performance handheld ultrasound
WO2018178772A2 (en) * 2017-03-28 2018-10-04 Nanofone Ltd. High performance sealed-gap capacitive microphone
WO2018236956A1 (en) 2017-06-21 2018-12-27 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
TW201904677A (zh) 2017-06-23 2019-02-01 美商蝴蝶網路公司 用於超音波裝置之差動超音波換能器元件
CN111479514A (zh) * 2017-11-15 2020-07-31 蝴蝶网络有限公司 超声设备和用于制造超声装置的方法
KR102658983B1 (ko) * 2017-12-21 2024-04-18 제네럴 일렉트릭 컴퍼니 초음파 변환기 및 초음파 프로브 제조 방법
FR3076292B1 (fr) * 2017-12-28 2020-01-03 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de transfert d'une couche utile sur un substrat support
TW201935639A (zh) 2018-01-30 2019-09-01 美商蝴蝶網路公司 用於封裝超音波單晶片的方法和設備
CA3092139A1 (en) 2018-03-09 2019-09-12 Butterfly Network, Inc. Ultrasound transducer devices and methods for fabricating ultrasound transducer devices
TW202000137A (zh) 2018-05-03 2020-01-01 美商蝴蝶網路公司 互補式金屬氧化物半導體感測器上超音波換能器的壓力口
JP7410935B2 (ja) 2018-05-24 2024-01-10 ザ リサーチ ファウンデーション フォー ザ ステイト ユニバーシティー オブ ニューヨーク 容量性センサ
US11018068B2 (en) 2018-07-06 2021-05-25 Butterfly Network, Inc. Methods and apparatuses for packaging an ultrasound-on-a-chip
IT201800007442A1 (it) * 2018-07-23 2020-01-23 Procedimento di fabbricazione di dispositivi microelettromeccanici, in particolare moduli elettroacustici
US11655141B2 (en) 2018-09-28 2023-05-23 Bfly Operations, Inc. Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities
WO2020082256A1 (zh) * 2018-10-24 2020-04-30 深圳市汇顶科技股份有限公司 超声换能器及其制造方法
AU2019378878A1 (en) 2018-11-15 2021-06-03 Butterfly Network, Inc. Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices
CN113316486B (zh) 2018-11-16 2022-10-18 维蒙股份公司 电容式微机械超声换能器及其制造方法
US11851325B2 (en) 2018-11-30 2023-12-26 Taiwan Semiconductor Manufacturing Co., Ltd. Methods for wafer bonding
US20220162667A1 (en) 2018-12-07 2022-05-26 Octant, Inc. Systems for protein-protein interaction screening
KR102196437B1 (ko) * 2019-01-29 2020-12-30 한국과학기술연구원 정전용량형 미세가공 초음파 트랜스듀서
US11766696B2 (en) 2019-02-07 2023-09-26 Bfly Operations, Inc. Bi-layer metal electrode for micromachined ultrasonic transducer devices
CN113453807B (zh) * 2019-02-25 2022-09-20 蝴蝶网络有限公司 微加工超声换能器器件的自适应腔体厚度控制
EP3953064B1 (en) * 2019-04-12 2024-09-11 BFLY Operations, Inc. Segmented getter openings for micromachined ultrasound transducer devices
US11484911B2 (en) 2019-04-12 2022-11-01 Bfly Operations, Inc. Bottom electrode via structures for micromachined ultrasonic transducer devices
US11501562B2 (en) 2019-04-30 2022-11-15 Bfly Operations, Inc. Ultrasound face scanning and identification apparatuses and methods
US11383269B2 (en) 2019-06-10 2022-07-12 Bfly Operations, Inc. Curved micromachined ultrasonic transducer membranes
US11684951B2 (en) 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities
EP4021648A1 (en) * 2019-08-30 2022-07-06 Vermon S.A. Cmut transducer with motion-stopping structure and cmut transducer forming method
EP4031903B1 (en) 2019-09-19 2025-11-05 BFLY Operations, Inc. Symmetric receiver switch for ultrasound devices
AU2020351768A1 (en) 2019-09-27 2022-05-12 Bfly Operations, Inc. Methods and apparatuses for monitoring fetal heartbeat and uterine contraction signals
US11387919B2 (en) * 2019-10-01 2022-07-12 Texas Instruments Incorporated High frequency CMOS ultrasonic transducer
US11289377B2 (en) * 2019-10-01 2022-03-29 Qorvo Us, Inc. Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
US11988640B2 (en) 2020-03-11 2024-05-21 Bfly Operations, Inc. Bottom electrode material stack for micromachined ultrasonic transducer devices
TW202210830A (zh) 2020-04-16 2022-03-16 美商蝴蝶網路公司 用於超音波裝置中之電路系統及/或換能器之內建自測試的方法和電路系統
WO2022006099A1 (en) * 2020-06-30 2022-01-06 Bfly Operations, Inc. Formation of self-assembled monolayer for ultrasonic transducers
US11808897B2 (en) 2020-10-05 2023-11-07 Bfly Operations, Inc. Methods and apparatuses for azimuthal summing of ultrasound data
FR3115278B1 (fr) 2020-10-16 2024-02-16 Soitec Silicon On Insulator Procédé de transfert d’une membrane
CN112517361B (zh) * 2020-11-30 2022-06-03 国网山西省电力公司朔州供电公司 一种高灵敏多频段复合式空耦超声换能器及其制备方法
CN112718437B (zh) * 2020-12-16 2022-01-14 武汉大学 基于多振膜耦合的压电微机械超声换能器
US12172188B2 (en) 2021-03-04 2024-12-24 Bfly Operations, Inc. Micromachined ultrasound transducer with pedestal
WO2022187482A1 (en) 2021-03-04 2022-09-09 Butterfly Network, Inc. Capacitive micromachined ultrasonic transducers (cmuts) having non-uniform pedestals
WO2022212671A1 (en) 2021-04-01 2022-10-06 Bfly Operations, Inc. Apparatuses and methods for configuring ultrasound devices
US12491536B2 (en) * 2021-07-30 2025-12-09 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method of manufacturing same
CN113560158B (zh) * 2021-08-27 2022-06-10 南京声息芯影科技有限公司 压电微机械超声换能器、阵列芯片及制造方法
WO2023047417A1 (en) * 2021-09-23 2023-03-30 Sensonics Devices Pvt Ltd Low voltage capacitive micromachined ultrasonic transducer
US12284480B2 (en) 2022-12-14 2025-04-22 Stmicroelectronics International N.V. Transducer assembly with buried cavities and method of manufacturing the same
US20250100014A1 (en) * 2023-09-27 2025-03-27 GE Precision Healthcare LLC Method and system for providing a reliable isolation stack in capacitive micromachined ultrasonic transducers
WO2026049964A1 (en) * 2024-08-26 2026-03-05 Qorvo Us, Inc. Wafer-level chip-scale packaging capacitive mems sensor

Family Cites Families (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5286671A (en) 1993-05-07 1994-02-15 Kulite Semiconductor Products, Inc. Fusion bonding technique for use in fabricating semiconductor devices
US6645145B1 (en) 1998-11-19 2003-11-11 Siemens Medical Solutions Usa, Inc. Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components
US6430109B1 (en) 1999-09-30 2002-08-06 The Board Of Trustees Of The Leland Stanford Junior University Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US7541214B2 (en) 1999-12-15 2009-06-02 Chang-Feng Wan Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
US6443901B1 (en) 2000-06-15 2002-09-03 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasonic transducers
US6694817B2 (en) 2001-08-21 2004-02-24 Georgia Tech Research Corporation Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument
US6779387B2 (en) 2001-08-21 2004-08-24 Georgia Tech Research Corporation Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument
US6795374B2 (en) 2001-09-07 2004-09-21 Siemens Medical Solutions Usa, Inc. Bias control of electrostatic transducers
US6659954B2 (en) 2001-12-19 2003-12-09 Koninklijke Philips Electronics Nv Micromachined ultrasound transducer and method for fabricating same
US7429495B2 (en) 2002-08-07 2008-09-30 Chang-Feng Wan System and method of fabricating micro cavities
US6958255B2 (en) * 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
US6831394B2 (en) 2002-12-11 2004-12-14 General Electric Company Backing material for micromachined ultrasonic transducer devices
US7312440B2 (en) 2003-01-14 2007-12-25 Georgia Tech Research Corporation Integrated micro fuel processor and flow delivery infrastructure
US7208727B2 (en) 2003-01-14 2007-04-24 Georgia Tech Research Corporation Electrospray systems and methods
US7313053B2 (en) 2003-03-06 2007-12-25 General Electric Company Method and apparatus for controlling scanning of mosaic sensor array
US7257051B2 (en) 2003-03-06 2007-08-14 General Electric Company Integrated interface electronics for reconfigurable sensor array
US6865140B2 (en) 2003-03-06 2005-03-08 General Electric Company Mosaic arrays using micromachined ultrasound transducers
US20050075572A1 (en) * 2003-10-01 2005-04-07 Mills David M. Focusing micromachined ultrasonic transducer arrays and related methods of manufacture
US7247246B2 (en) 2003-10-20 2007-07-24 Atmel Corporation Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity
US20050121734A1 (en) 2003-11-07 2005-06-09 Georgia Tech Research Corporation Combination catheter devices, methods, and systems
US7030536B2 (en) 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
US7125383B2 (en) 2003-12-30 2006-10-24 General Electric Company Method and apparatus for ultrasonic continuous, non-invasive blood pressure monitoring
US7285897B2 (en) 2003-12-31 2007-10-23 General Electric Company Curved micromachined ultrasonic transducer arrays and related methods of manufacture
US7052464B2 (en) 2004-01-01 2006-05-30 General Electric Company Alignment method for fabrication of integrated ultrasonic transducer array
US7104129B2 (en) 2004-02-02 2006-09-12 Invensense Inc. Vertically integrated MEMS structure with electronics in a hermetically sealed cavity
WO2005077012A2 (en) 2004-02-06 2005-08-25 Georgia Tech Research Corporation Cmut devices and fabrication methods
US7646133B2 (en) 2004-02-27 2010-01-12 Georgia Tech Research Corporation Asymmetric membrane cMUT devices and fabrication methods
US7612483B2 (en) 2004-02-27 2009-11-03 Georgia Tech Research Corporation Harmonic cMUT devices and fabrication methods
WO2005084284A2 (en) 2004-02-27 2005-09-15 Georgia Tech Research Corporation Multiple element electrode cmut devices and fabrication methods
US7530952B2 (en) 2004-04-01 2009-05-12 The Board Of Trustees Of The Leland Stanford Junior University Capacitive ultrasonic transducers with isolation posts
JP4280198B2 (ja) 2004-04-30 2009-06-17 株式会社東芝 薄膜圧電共振器
DE102004022838A1 (de) 2004-05-08 2005-12-01 Forschungszentrum Karlsruhe Gmbh Ultraschallwandler sowie Verfahren zur Herstellung desselben
US7888709B2 (en) 2004-09-15 2011-02-15 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer and manufacturing method
US8309428B2 (en) 2004-09-15 2012-11-13 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
US8658453B2 (en) 2004-09-15 2014-02-25 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
US7489593B2 (en) 2004-11-30 2009-02-10 Vermon Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor
US7518251B2 (en) 2004-12-03 2009-04-14 General Electric Company Stacked electronics for sensors
US7375420B2 (en) 2004-12-03 2008-05-20 General Electric Company Large area transducer array
US7037746B1 (en) 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
JP4471856B2 (ja) * 2005-01-27 2010-06-02 株式会社日立製作所 超音波トランスデューサおよびその製造方法
US7449821B2 (en) 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
US7442570B2 (en) 2005-03-18 2008-10-28 Invensence Inc. Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
US7250353B2 (en) 2005-03-29 2007-07-31 Invensense, Inc. Method and system of releasing a MEMS structure
US7704743B2 (en) 2005-03-30 2010-04-27 Georgia Tech Research Corporation Electrosonic cell manipulation device and method of use thereof
US7538401B2 (en) * 2005-05-03 2009-05-26 Rosemount Aerospace Inc. Transducer for use in harsh environments
JP2008541473A (ja) 2005-05-18 2008-11-20 コロ テクノロジーズ インコーポレイテッド 貫通ウェーハ相互接続
CA2607916A1 (en) 2005-05-18 2006-11-23 Kolo Technologies, Inc. Micro-electro-mechanical transducers
US8796901B2 (en) 2005-06-17 2014-08-05 Kolo Technologies, Inc. Micro-electro-mechanical transducer having an insulation extension
US7637149B2 (en) 2005-06-17 2009-12-29 Georgia Tech Research Corporation Integrated displacement sensors for probe microscopy and force spectroscopy
US7564172B1 (en) 2005-08-03 2009-07-21 Kolo Technologies, Inc. Micro-electro-mechanical transducer having embedded springs
US7880565B2 (en) 2005-08-03 2011-02-01 Kolo Technologies, Inc. Micro-electro-mechanical transducer having a surface plate
US7878977B2 (en) 2005-09-30 2011-02-01 Siemens Medical Solutions Usa, Inc. Flexible ultrasound transducer array
US7441447B2 (en) 2005-10-07 2008-10-28 Georgia Tech Research Corporation Methods of imaging in probe microscopy
US7622848B2 (en) 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
US20070180916A1 (en) * 2006-02-09 2007-08-09 General Electric Company Capacitive micromachined ultrasound transducer and methods of making the same
JP2007210083A (ja) 2006-02-13 2007-08-23 Hitachi Ltd Ｍｅｍｓ素子及びその製造方法
US7615834B2 (en) * 2006-02-28 2009-11-10 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
US7764003B2 (en) 2006-04-04 2010-07-27 Kolo Technologies, Inc. Signal control in micromachined ultrasonic transducer
US7910385B2 (en) 2006-05-12 2011-03-22 Micron Technology, Inc. Method of fabricating microelectronic devices
US7451651B2 (en) 2006-12-11 2008-11-18 General Electric Company Modular sensor assembly and methods of fabricating the same
US7687976B2 (en) 2007-01-31 2010-03-30 General Electric Company Ultrasound imaging system
US7892176B2 (en) 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080296708A1 (en) * 2007-05-31 2008-12-04 General Electric Company Integrated sensor arrays and method for making and using such arrays
EP2170531A2 (en) 2007-07-31 2010-04-07 Koninklijke Philips Electronics N.V. Cmuts with a high-k dielectric
US8277380B2 (en) 2007-09-11 2012-10-02 Siemens Medical Solutions Usa, Inc. Piezoelectric and CMUT layered ultrasound transducer array
WO2009037655A2 (en) 2007-09-17 2009-03-26 Koninklijke Philips Electronics, N.V. Production of pre-collapsed capacitive micro-machined ultrasonic transducers and applications thereof
US7745248B2 (en) 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
US7843022B2 (en) 2007-10-18 2010-11-30 The Board Of Trustees Of The Leland Stanford Junior University High-temperature electrostatic transducers and fabrication method
US7786584B2 (en) 2007-11-26 2010-08-31 Infineon Technologies Ag Through substrate via semiconductor components
US8483014B2 (en) 2007-12-03 2013-07-09 Kolo Technologies, Inc. Micromachined ultrasonic transducers
EP2215855A1 (en) 2007-12-03 2010-08-11 Kolo Technologies, Inc. Capacitive micromachined ultrasonic transducer with voltage feedback
US8429808B2 (en) 2007-12-03 2013-04-30 Kolo Technologies, Inc. Method for fabrication an electrical transducer
CN101868981B (zh) 2007-12-03 2014-05-07 科隆科技公司 叠层换能设备
WO2009073561A1 (en) 2007-12-03 2009-06-11 Kolo Technologies, Inc. Variable operating voltage in micromachined ultrasonic transducer
JP5337813B2 (ja) * 2007-12-03 2013-11-06 コロ テクノロジーズ インコーポレイテッド デュアルモード動作マイクロマシン超音波トランスデューサ
US7781238B2 (en) 2007-12-06 2010-08-24 Robert Gideon Wodnicki Methods of making and using integrated and testable sensor array
US8614151B2 (en) 2008-01-04 2013-12-24 Micron Technology, Inc. Method of etching a high aspect ratio contact
KR100878454B1 (ko) 2008-02-28 2009-01-13 (주)실리콘화일 신호처리블록을 구비하는 적층형 마이크로폰과 그 제조방법
WO2009135255A1 (en) 2008-05-07 2009-11-12 Signostics Pty Ltd Docking system for medical diagnostic scanning using a handheld device
WO2009149721A1 (de) 2008-06-09 2009-12-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Diodenbolometer und ein verfahren zur herstellung eines diodenbolometers
JP2009291514A (ja) 2008-06-09 2009-12-17 Canon Inc 静電容量型トランスデューサの製造方法、及び静電容量型トランスデューサ
US20100075481A1 (en) * 2008-07-08 2010-03-25 Xiao (Charles) Yang Method and structure of monolithically integrated ic-mems oscillator using ic foundry-compatible processes
US8796746B2 (en) 2008-07-08 2014-08-05 MCube Inc. Method and structure of monolithically integrated pressure sensor using IC foundry-compatible processes
US7812418B2 (en) * 2008-07-29 2010-10-12 Fortemedia, Inc Chip-scaled MEMS microphone package
CN102281818B (zh) 2009-01-16 2013-11-06 株式会社日立医疗器械 超声波探头的制造方法以及超声波探头
GB2467776A (en) 2009-02-13 2010-08-18 Wolfson Microelectronics Plc Integrated MEMS transducer and circuitry
US8402831B2 (en) * 2009-03-05 2013-03-26 The Board Of Trustees Of The Leland Standford Junior University Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
US8315125B2 (en) 2009-03-18 2012-11-20 Sonetics Ultrasound, Inc. System and method for biasing CMUT elements
EP2669019A1 (en) 2009-03-26 2013-12-04 Norwegian University of Science and Technology (NTNU) An acoustic damping structure for use in an ultrasound transducer
JP5317826B2 (ja) * 2009-05-19 2013-10-16 キヤノン株式会社 容量型機械電気変換素子の製造方法
US8451693B2 (en) 2009-08-25 2013-05-28 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducer having compliant post structure
US8345508B2 (en) 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
US8563345B2 (en) 2009-10-02 2013-10-22 National Semiconductor Corporated Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements
US8222065B1 (en) 2009-10-02 2012-07-17 National Semiconductor Corporation Method and system for forming a capacitive micromachined ultrasonic transducer
US8241931B1 (en) * 2009-10-19 2012-08-14 Analog Devices, Inc. Method of forming MEMS device with weakened substrate
JP5404335B2 (ja) 2009-11-17 2014-01-29 キヤノン株式会社 電気機械変換装置及びその作製方法
US8587078B2 (en) 2010-04-06 2013-11-19 United Microelectronics Corp. Integrated circuit and fabricating method thereof
US8647279B2 (en) 2010-06-10 2014-02-11 Siemens Medical Solutions Usa, Inc. Volume mechanical transducer for medical diagnostic ultrasound
US8957564B1 (en) * 2010-06-29 2015-02-17 Silicon Light Machines Corporation Microelectromechanical system megasonic transducer
JP5702966B2 (ja) 2010-08-02 2015-04-15 キヤノン株式会社 電気機械変換装置及びその作製方法
US8273610B2 (en) 2010-11-18 2012-09-25 Monolithic 3D Inc. Method of constructing a semiconductor device and structure
JP5677016B2 (ja) * 2010-10-15 2015-02-25 キヤノン株式会社 電気機械変換装置及びその作製方法
US8754529B2 (en) 2011-03-28 2014-06-17 Miradia, Inc. MEMS device with simplified electrical conducting paths
US8461655B2 (en) 2011-03-31 2013-06-11 Infineon Technologies Ag Micromechanical sound transducer having a membrane support with tapered surface
US9242273B2 (en) 2011-10-11 2016-01-26 The Board Of Trustees Of The Leland Stanford Junior University Method for operating CMUTs under high and varying pressure
HK1201429A1 (en) 2011-10-17 2015-09-04 Butterfly Network Inc. Transmissive imaging and related apparatus and methods
US20130096433A1 (en) 2011-10-18 2013-04-18 The Regents Of The University Of Michigan System and Method for Unattended Monitoring of Blood Flow
US20130161702A1 (en) 2011-12-25 2013-06-27 Kun-Lung Chen Integrated mems device
KR101894393B1 (ko) 2011-12-28 2018-09-04 삼성전자주식회사 초음파 변환기 구조물, 초음파 변환기 및 초음파 변환기의 제조 방법
KR101388141B1 (ko) 2012-05-31 2014-04-23 전자부품연구원 Ｃｍｏｓ 회로가 집적된 마이크로폰 및 그 제조방법
US10217045B2 (en) 2012-07-16 2019-02-26 Cornell University Computation devices and artificial neurons based on nanoelectromechanical systems
US8735199B2 (en) 2012-08-22 2014-05-27 Honeywell International Inc. Methods for fabricating MEMS structures by etching sacrificial features embedded in glass
US8564076B1 (en) 2013-01-30 2013-10-22 Invensense, Inc. Internal electrical contact for enclosed MEMS devices
WO2014123922A1 (en) 2013-02-05 2014-08-14 Butterfly Network, Inc. Cmos ultrasonic transducers and related apparatus and methods
CN105307975B (zh) 2013-03-15 2017-04-26 蝴蝶网络有限公司 互补金属氧化物半导体(cmos)超声换能器及其形成方法
WO2015161147A1 (en) 2014-04-18 2015-10-22 Butterfly Network, Inc. Ultrasonic transducers in complementary metal oxide semiconductor (cmos) wafers and related apparatus and methods
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US20160009544A1 (en) 2015-03-02 2016-01-14 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
WO2018236956A1 (en) 2017-06-21 2018-12-27 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections

Similar Documents

Publication Publication Date Title
JP2016518739A5 (enExample)
JP2017516428A5 (enExample)
JP2016511607A5 (enExample)
JP2012068627A5 (ja) 半導体装置の作製方法
JP2015135953A5 (enExample)
JP2015062079A5 (enExample)
JP2011054949A5 (ja) 半導体装置
JP2016195267A5 (enExample)
WO2012143784A8 (en) Semiconductor device and manufacturing method thereof
JP2012084865A5 (ja) 半導体装置の作製方法
JP2015079949A5 (ja) 半導体装置
JP2014523689A5 (enExample)
JP2010283236A5 (enExample)
JP2017208573A5 (enExample)
JP2014225044A5 (ja) 表示装置、表示モジュール及び電子機器
JP2014178698A5 (ja) 素子基板
JP2013175718A5 (enExample)
JP2013030783A5 (enExample)
JP2011086927A5 (ja) 半導体装置
JP2014099429A5 (enExample)
JP2013236066A5 (enExample)
JP2015111742A5 (ja) 半導体装置の作製方法、及び半導体装置
JP2009033145A5 (enExample)
JP2017212437A5 (ja) 半導体装置の作製方法及び表示装置
JP2015053477A5 (ja) 半導体装置