AU2014234071B2 - Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same - Google Patents

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same Download PDF

Info

Publication number
AU2014234071B2
AU2014234071B2 AU2014234071A AU2014234071A AU2014234071B2 AU 2014234071 B2 AU2014234071 B2 AU 2014234071B2 AU 2014234071 A AU2014234071 A AU 2014234071A AU 2014234071 A AU2014234071 A AU 2014234071A AU 2014234071 B2 AU2014234071 B2 AU 2014234071B2
Authority
AU
Australia
Prior art keywords
conductive
membrane
cavity
pct
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
AU2014234071A
Other languages
English (en)
Other versions
AU2014234071A1 (en
Inventor
Gregory L. Charvat
Keith G. Fife
Tyler S. Ralston
Jonathan M. Rothberg
Nevada J. Sanchez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Butterfly Network Inc
Original Assignee
Butterfly Network Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Butterfly Network Inc filed Critical Butterfly Network Inc
Publication of AU2014234071A1 publication Critical patent/AU2014234071A1/en
Application granted granted Critical
Publication of AU2014234071B2 publication Critical patent/AU2014234071B2/en
Priority to AU2018203942A priority Critical patent/AU2018203942B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
    • B81C2201/0195—Transfer of a layer from a carrier wafer to a device wafer the layer being unstructured
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0735—Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0757—Topology for facilitating the monolithic integration
    • B81C2203/0771—Stacking the electronic processing unit and the micromechanical structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Pressure Sensors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
AU2014234071A 2013-03-15 2014-03-13 Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same Active AU2014234071B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2018203942A AU2018203942B2 (en) 2013-03-15 2018-06-04 Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361794744P 2013-03-15 2013-03-15
US61/794,744 2013-03-15
PCT/US2014/025924 WO2014151525A2 (en) 2013-03-15 2014-03-13 Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
AU2018203942A Division AU2018203942B2 (en) 2013-03-15 2018-06-04 Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

Publications (2)

Publication Number Publication Date
AU2014234071A1 AU2014234071A1 (en) 2015-10-15
AU2014234071B2 true AU2014234071B2 (en) 2018-05-17

Family

ID=50549454

Family Applications (2)

Application Number Title Priority Date Filing Date
AU2014234071A Active AU2014234071B2 (en) 2013-03-15 2014-03-13 Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same
AU2018203942A Active AU2018203942B2 (en) 2013-03-15 2018-06-04 Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
AU2018203942A Active AU2018203942B2 (en) 2013-03-15 2018-06-04 Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

Country Status (9)

Country Link
US (8) US9242275B2 (enExample)
EP (3) EP3639937A1 (enExample)
JP (2) JP6232124B2 (enExample)
KR (1) KR102170559B1 (enExample)
CN (1) CN105307975B (enExample)
AU (2) AU2014234071B2 (enExample)
CA (1) CA2905040C (enExample)
TW (2) TWI663706B (enExample)
WO (1) WO2014151525A2 (enExample)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012123787A1 (en) * 2011-03-14 2012-09-20 Nokia Corporation An echolocation apparatus
US9533873B2 (en) 2013-02-05 2017-01-03 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
KR102170559B1 (ko) 2013-03-15 2020-10-27 버터플라이 네트워크, 인크. 상보성 금속 산화물 반도체(cmos) 초음파 트랜스듀서
EP2972473B1 (en) 2013-03-15 2023-06-07 BFLY Operations, Inc. Monolithic ultrasonic imaging devices, systems and methods
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
EP3024594A2 (en) 2013-07-23 2016-06-01 Butterfly Network Inc. Interconnectable ultrasound transducer probes and related methods and apparatus
JP6546267B2 (ja) 2014-04-18 2019-07-17 バタフライ ネットワーク，インコーポレイテッド 超音波撮像圧縮方法及び装置
CA2946120C (en) * 2014-04-18 2022-10-25 Butterfly Network, Inc. Architecture of single substrate ultrasonic imaging devices, related apparatuses, and methods
AU2015247484B2 (en) 2014-04-18 2020-05-14 Butterfly Network, Inc. Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
KR102373132B1 (ko) * 2014-12-26 2022-03-11 삼성메디슨 주식회사 초음파 프로브 장치 및 초음파 촬영 장치
US10098539B2 (en) 2015-02-10 2018-10-16 The Trustees Of Columbia University In The City Of New York Systems and methods for non-invasive brain stimulation with ultrasound
CN104777483B (zh) * 2015-04-17 2017-09-29 业成光电（深圳）有限公司 高解析触觉感测装置
CN107973267B (zh) * 2015-05-15 2020-08-21 风起科技股份有限公司 Cmos感测组件、cmos单晶片及制造方法
EP3317026B1 (en) 2015-06-30 2023-12-20 Koninklijke Philips N.V. Ultrasound system and ultrasonic pulse transmission method
WO2017004562A1 (en) * 2015-07-01 2017-01-05 The Trustees Of Columbia University In The City Of New York Systems and methods for modulation and mapping of brain tissue using an ultrasound assembly
WO2017040973A1 (en) 2015-09-04 2017-03-09 The Trustees Of Columbia University In The City Of New York Micron-scale ultrasound identification sensing tags
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
WO2017171988A2 (en) 2016-01-21 2017-10-05 The Trustees Of Columbia University In The City Of New York Micron-scale active complementary metal-oxide-semiconductor (cmos) optical tags
US10771043B2 (en) 2016-03-17 2020-09-08 Cornell University Transmit-receive delay element apparatus, method, and applications
US10082565B2 (en) * 2016-03-31 2018-09-25 Butterfly Network, Inc. Multilevel bipolar pulser
US9778348B1 (en) 2016-03-31 2017-10-03 Butterfly Network, Inc. Symmetric receiver switch for bipolar pulser
US11712221B2 (en) 2016-06-20 2023-08-01 Bfly Operations, Inc. Universal ultrasound device and related apparatus and methods
TWI721183B (zh) 2016-06-20 2021-03-11 美商蝴蝶網路公司 用於微製造超音波傳感器的電接點配置
US10856840B2 (en) 2016-06-20 2020-12-08 Butterfly Network, Inc. Universal ultrasound device and related apparatus and methods
US11020617B2 (en) 2016-07-27 2021-06-01 The Trustees Of Columbia University In The City Of New York Methods and systems for peripheral nerve modulation using non ablative focused ultrasound with electromyography (EMG) monitoring
US11013938B2 (en) 2016-07-27 2021-05-25 The Trustees Of Columbia University In The City Of New York Methods and systems for peripheral nerve modulation using non ablative focused ultrasound with electromyography (EMG) monitoring
EP3279630B1 (en) * 2016-08-03 2019-06-26 ams AG Pressure sensor module
SG10201913059PA (en) * 2016-12-05 2020-02-27 Globalwafers Co Ltd High resistivity silicon-on-insulator structure and method of manufacture thereof
EP4289521A3 (en) * 2016-12-22 2024-03-27 Koninklijke Philips N.V. Systems and methods of operation of capacitive radio frequency micro-electromechanical switches
US20180180724A1 (en) * 2016-12-26 2018-06-28 Nxp Usa, Inc. Ultrasonic transducer integrated with supporting electronics
DE102017102545B4 (de) * 2017-02-09 2018-12-20 Infineon Technologies Ag Halbleitervorrichtung, Drucksensor, Mikrofon, Beschleunigungssensor und Verfahren zum Bilden einer Halbleitervorrichtung
AU2018225762A1 (en) 2017-02-27 2019-08-22 Butterfly Network, Inc. Capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
US10196261B2 (en) * 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US11446003B2 (en) 2017-03-27 2022-09-20 Vave Health, Inc. High performance handheld ultrasound
US11531096B2 (en) 2017-03-23 2022-12-20 Vave Health, Inc. High performance handheld ultrasound
US10469846B2 (en) 2017-03-27 2019-11-05 Vave Health, Inc. Dynamic range compression of ultrasound images
US10856843B2 (en) 2017-03-23 2020-12-08 Vave Health, Inc. Flag table based beamforming in a handheld ultrasound device
WO2018178772A2 (en) * 2017-03-28 2018-10-04 Nanofone Ltd. High performance sealed-gap capacitive microphone
WO2018236956A1 (en) 2017-06-21 2018-12-27 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
US10972842B2 (en) 2017-06-23 2021-04-06 Butterfly Network, Inc. Differential ultrasonic transducer element for ultrasound devices
AU2018369882A1 (en) * 2017-11-15 2020-05-21 Butterfly Network, Inc. Ultrasound apparatuses and methods for fabricating ultrasound devices
KR102658983B1 (ko) * 2017-12-21 2024-04-18 제네럴 일렉트릭 컴퍼니 초음파 변환기 및 초음파 프로브 제조 방법
FR3076292B1 (fr) * 2017-12-28 2020-01-03 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de transfert d'une couche utile sur un substrat support
US11389137B2 (en) 2018-01-30 2022-07-19 Bfly Operations, Inc. Methods and apparatuses for packaging an ultrasound-on-a-chip
JP2021516899A (ja) * 2018-03-09 2021-07-08 バタフライ ネットワーク，インコーポレイテッド 超音波トランスデューサデバイス及び超音波トランスデューサデバイスを作製する方法
KR20210005208A (ko) 2018-05-03 2021-01-13 버터플라이 네트워크, 인크. Cmos 센서 상의 초음파 트랜스듀서를 위한 압력 포트
CN112334867B (zh) 2018-05-24 2025-11-11 纽约州立大学研究基金会 电容传感器
WO2020010207A1 (en) 2018-07-06 2020-01-09 Butterfly Network, Inc. Methods and apparatuses for packaging an ultrasound-on-a-chip
IT201800007442A1 (it) * 2018-07-23 2020-01-23 Procedimento di fabbricazione di dispositivi microelettromeccanici, in particolare moduli elettroacustici
WO2020069252A1 (en) 2018-09-28 2020-04-02 Butterfly Network, Inc. Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities
WO2020082256A1 (zh) * 2018-10-24 2020-04-30 深圳市汇顶科技股份有限公司 超声换能器及其制造方法
EP3881065B1 (en) 2018-11-15 2023-07-19 BFLY Operations, Inc. Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices
CN113316486B (zh) 2018-11-16 2022-10-18 维蒙股份公司 电容式微机械超声换能器及其制造方法
US11851325B2 (en) 2018-11-30 2023-12-26 Taiwan Semiconductor Manufacturing Co., Ltd. Methods for wafer bonding
EP3891279A1 (en) 2018-12-07 2021-10-13 Octant, Inc. Systems for protein-protein interaction screening
KR102196437B1 (ko) * 2019-01-29 2020-12-30 한국과학기술연구원 정전용량형 미세가공 초음파 트랜스듀서
US11766696B2 (en) 2019-02-07 2023-09-26 Bfly Operations, Inc. Bi-layer metal electrode for micromachined ultrasonic transducer devices
CN113453807B (zh) * 2019-02-25 2022-09-20 蝴蝶网络有限公司 微加工超声换能器器件的自适应腔体厚度控制
EP3953064B1 (en) * 2019-04-12 2024-09-11 BFLY Operations, Inc. Segmented getter openings for micromachined ultrasound transducer devices
WO2020210470A1 (en) * 2019-04-12 2020-10-15 Butterfly Network, Inc. Bottom electrode via structures for micromachined ultrasonic transducer devices
US11501562B2 (en) 2019-04-30 2022-11-15 Bfly Operations, Inc. Ultrasound face scanning and identification apparatuses and methods
WO2020251915A1 (en) * 2019-06-10 2020-12-17 Butterfly Network, Inc. Curved micromachined ultrasonic transducer membranes
US12588895B2 (en) 2019-06-13 2026-03-31 The Trustees Of Columbia University In The City Of New York System, method, computer-accessible medium and apparatus for flexible two-dimensional ultrasound phased array
US11684951B2 (en) 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities
CN114401798B (zh) * 2019-08-30 2024-03-26 维蒙股份公司 具有止动结构的cmut换能器及cmut换能器形成方法
US11921240B2 (en) 2019-09-19 2024-03-05 Bfly Operations, Inc. Symmetric receiver switch for ultrasound devices
JP2022550129A (ja) 2019-09-27 2022-11-30 ビーエフエルワイ オペレーションズ，インコーポレイテッド 胎児心音及び子宮収縮信号を監視するための方法及び装置
US11145547B2 (en) * 2019-10-01 2021-10-12 Qorvo Us, Inc. Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
US11387919B2 (en) 2019-10-01 2022-07-12 Texas Instruments Incorporated High frequency CMOS ultrasonic transducer
US11988640B2 (en) 2020-03-11 2024-05-21 Bfly Operations, Inc. Bottom electrode material stack for micromachined ultrasonic transducer devices
US20210328564A1 (en) 2020-04-16 2021-10-21 Butterfly Network, Inc. Methods and circuitry for built-in self-testing of circuitry and/or transducers in ultrasound devices
WO2022006099A1 (en) * 2020-06-30 2022-01-06 Bfly Operations, Inc. Formation of self-assembled monolayer for ultrasonic transducers
US11808897B2 (en) 2020-10-05 2023-11-07 Bfly Operations, Inc. Methods and apparatuses for azimuthal summing of ultrasound data
FR3115278B1 (fr) 2020-10-16 2024-02-16 Soitec Silicon On Insulator Procédé de transfert d’une membrane
CN112517361B (zh) * 2020-11-30 2022-06-03 国网山西省电力公司朔州供电公司 一种高灵敏多频段复合式空耦超声换能器及其制备方法
CN112718437B (zh) * 2020-12-16 2022-01-14 武汉大学 基于多振膜耦合的压电微机械超声换能器
TW202239483A (zh) 2021-03-04 2022-10-16 美商蝴蝶營運公司 具有不均勻柱腳的電容式微加工超音波換能器
TW202240165A (zh) 2021-03-04 2022-10-16 美商蝴蝶營運公司 具有柱腳的微加工超音波換能器
US12156762B2 (en) 2021-04-01 2024-12-03 Bfly Operations, Inc. Apparatuses and methods for configuring ultrasound devices
IT202100019718A1 (it) 2021-07-23 2023-01-23 St Microelectronics Srl Procedimento perfezionato di fabbricazione di moduli elettroacustici
US12491536B2 (en) * 2021-07-30 2025-12-09 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method of manufacturing same
CN113560158B (zh) * 2021-08-27 2022-06-10 南京声息芯影科技有限公司 压电微机械超声换能器、阵列芯片及制造方法
EP4406028A4 (en) * 2021-09-23 2025-10-01 Sensonics Transducers Private Ltd LOW VOLTAGE CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCER
US12284480B2 (en) 2022-12-14 2025-04-22 Stmicroelectronics International N.V. Transducer assembly with buried cavities and method of manufacturing the same
US20250100014A1 (en) * 2023-09-27 2025-03-27 GE Precision Healthcare LLC Method and system for providing a reliable isolation stack in capacitive micromachined ultrasonic transducers
WO2026049964A1 (en) * 2024-08-26 2026-03-05 Qorvo Us, Inc. Wafer-level chip-scale packaging capacitive mems sensor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070180916A1 (en) * 2006-02-09 2007-08-09 General Electric Company Capacitive micromachined ultrasound transducer and methods of making the same
US20090122651A1 (en) * 2007-10-18 2009-05-14 Mario Kupnik Direct wafer bonded 2-D CUMT array
US20100225200A1 (en) * 2009-03-05 2010-09-09 Mario Kupnik Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
US8241931B1 (en) * 2009-10-19 2012-08-14 Analog Devices, Inc. Method of forming MEMS device with weakened substrate

Family Cites Families (115)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5286671A (en) 1993-05-07 1994-02-15 Kulite Semiconductor Products, Inc. Fusion bonding technique for use in fabricating semiconductor devices
US6645145B1 (en) 1998-11-19 2003-11-11 Siemens Medical Solutions Usa, Inc. Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components
US6430109B1 (en) 1999-09-30 2002-08-06 The Board Of Trustees Of The Leland Stanford Junior University Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US7541214B2 (en) 1999-12-15 2009-06-02 Chang-Feng Wan Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
US6443901B1 (en) 2000-06-15 2002-09-03 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasonic transducers
US6779387B2 (en) 2001-08-21 2004-08-24 Georgia Tech Research Corporation Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument
US6694817B2 (en) 2001-08-21 2004-02-24 Georgia Tech Research Corporation Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument
US6795374B2 (en) 2001-09-07 2004-09-21 Siemens Medical Solutions Usa, Inc. Bias control of electrostatic transducers
US6659954B2 (en) 2001-12-19 2003-12-09 Koninklijke Philips Electronics Nv Micromachined ultrasound transducer and method for fabricating same
US7429495B2 (en) 2002-08-07 2008-09-30 Chang-Feng Wan System and method of fabricating micro cavities
US6958255B2 (en) 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
US6831394B2 (en) 2002-12-11 2004-12-14 General Electric Company Backing material for micromachined ultrasonic transducer devices
US7312440B2 (en) 2003-01-14 2007-12-25 Georgia Tech Research Corporation Integrated micro fuel processor and flow delivery infrastructure
US7208727B2 (en) 2003-01-14 2007-04-24 Georgia Tech Research Corporation Electrospray systems and methods
US6865140B2 (en) 2003-03-06 2005-03-08 General Electric Company Mosaic arrays using micromachined ultrasound transducers
US7257051B2 (en) 2003-03-06 2007-08-14 General Electric Company Integrated interface electronics for reconfigurable sensor array
US7313053B2 (en) 2003-03-06 2007-12-25 General Electric Company Method and apparatus for controlling scanning of mosaic sensor array
US20050075572A1 (en) 2003-10-01 2005-04-07 Mills David M. Focusing micromachined ultrasonic transducer arrays and related methods of manufacture
US7247246B2 (en) 2003-10-20 2007-07-24 Atmel Corporation Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity
US20050121734A1 (en) 2003-11-07 2005-06-09 Georgia Tech Research Corporation Combination catheter devices, methods, and systems
US7030536B2 (en) 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
US7125383B2 (en) 2003-12-30 2006-10-24 General Electric Company Method and apparatus for ultrasonic continuous, non-invasive blood pressure monitoring
US7285897B2 (en) 2003-12-31 2007-10-23 General Electric Company Curved micromachined ultrasonic transducer arrays and related methods of manufacture
US7052464B2 (en) 2004-01-01 2006-05-30 General Electric Company Alignment method for fabrication of integrated ultrasonic transducer array
US7104129B2 (en) 2004-02-02 2006-09-12 Invensense Inc. Vertically integrated MEMS structure with electronics in a hermetically sealed cavity
US20050177045A1 (en) 2004-02-06 2005-08-11 Georgia Tech Research Corporation cMUT devices and fabrication methods
WO2005084284A2 (en) 2004-02-27 2005-09-15 Georgia Tech Research Corporation Multiple element electrode cmut devices and fabrication methods
JP2007531357A (ja) 2004-02-27 2007-11-01 ジョージア テック リサーチ コーポレイション ハーモニックｃｍｕｔ素子及び製造方法
US7646133B2 (en) 2004-02-27 2010-01-12 Georgia Tech Research Corporation Asymmetric membrane cMUT devices and fabrication methods
US7530952B2 (en) 2004-04-01 2009-05-12 The Board Of Trustees Of The Leland Stanford Junior University Capacitive ultrasonic transducers with isolation posts
JP4280198B2 (ja) 2004-04-30 2009-06-17 株式会社東芝 薄膜圧電共振器
DE102004022838A1 (de) 2004-05-08 2005-12-01 Forschungszentrum Karlsruhe Gmbh Ultraschallwandler sowie Verfahren zur Herstellung desselben
US7888709B2 (en) 2004-09-15 2011-02-15 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer and manufacturing method
US8309428B2 (en) 2004-09-15 2012-11-13 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
US8658453B2 (en) 2004-09-15 2014-02-25 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
US7489593B2 (en) 2004-11-30 2009-02-10 Vermon Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor
US7375420B2 (en) 2004-12-03 2008-05-20 General Electric Company Large area transducer array
US7518251B2 (en) 2004-12-03 2009-04-14 General Electric Company Stacked electronics for sensors
US7037746B1 (en) 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
JP4471856B2 (ja) * 2005-01-27 2010-06-02 株式会社日立製作所 超音波トランスデューサおよびその製造方法
US7449821B2 (en) 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
US7442570B2 (en) 2005-03-18 2008-10-28 Invensence Inc. Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
US7250353B2 (en) 2005-03-29 2007-07-31 Invensense, Inc. Method and system of releasing a MEMS structure
US7704743B2 (en) 2005-03-30 2010-04-27 Georgia Tech Research Corporation Electrosonic cell manipulation device and method of use thereof
US7538401B2 (en) 2005-05-03 2009-05-26 Rosemount Aerospace Inc. Transducer for use in harsh environments
CA2607887A1 (en) 2005-05-18 2006-11-23 Kolo Technologies, Inc. Methods for fabricating micro-electro-mechanical devices
CN101223633A (zh) 2005-05-18 2008-07-16 科隆科技公司 穿过晶片的互连
CA2608164A1 (en) 2005-06-17 2006-12-21 Kolo Technologies, Inc. Micro-electro-mechanical transducer having an insulation extension
US7637149B2 (en) 2005-06-17 2009-12-29 Georgia Tech Research Corporation Integrated displacement sensors for probe microscopy and force spectroscopy
US7880565B2 (en) 2005-08-03 2011-02-01 Kolo Technologies, Inc. Micro-electro-mechanical transducer having a surface plate
US7612635B2 (en) 2005-08-03 2009-11-03 Kolo Technologies, Inc. MEMS acoustic filter and fabrication of the same
US7878977B2 (en) 2005-09-30 2011-02-01 Siemens Medical Solutions Usa, Inc. Flexible ultrasound transducer array
US7441447B2 (en) 2005-10-07 2008-10-28 Georgia Tech Research Corporation Methods of imaging in probe microscopy
US7622848B2 (en) 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
JP2007210083A (ja) 2006-02-13 2007-08-23 Hitachi Ltd Ｍｅｍｓ素子及びその製造方法
US7615834B2 (en) * 2006-02-28 2009-11-10 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
US7764003B2 (en) 2006-04-04 2010-07-27 Kolo Technologies, Inc. Signal control in micromachined ultrasonic transducer
US7910385B2 (en) 2006-05-12 2011-03-22 Micron Technology, Inc. Method of fabricating microelectronic devices
US7451651B2 (en) 2006-12-11 2008-11-18 General Electric Company Modular sensor assembly and methods of fabricating the same
US7687976B2 (en) 2007-01-31 2010-03-30 General Electric Company Ultrasound imaging system
US7892176B2 (en) 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080296708A1 (en) * 2007-05-31 2008-12-04 General Electric Company Integrated sensor arrays and method for making and using such arrays
US8203912B2 (en) 2007-07-31 2012-06-19 Koninklijke Philips Electronics N.V. CMUTs with a high-k dielectric
US8277380B2 (en) 2007-09-11 2012-10-02 Siemens Medical Solutions Usa, Inc. Piezoelectric and CMUT layered ultrasound transducer array
WO2009037655A2 (en) 2007-09-17 2009-03-26 Koninklijke Philips Electronics, N.V. Production of pre-collapsed capacitive micro-machined ultrasonic transducers and applications thereof
US7745248B2 (en) 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
US7786584B2 (en) 2007-11-26 2010-08-31 Infineon Technologies Ag Through substrate via semiconductor components
JP5529749B2 (ja) 2007-12-03 2014-06-25 コロ テクノロジーズ インコーポレイテッド 積層型変換デバイス
JP5337812B2 (ja) 2007-12-03 2013-11-06 コロ テクノロジーズ インコーポレイテッド マイクロマシン加工超音波変換器における可変動作電圧
EP2215855A1 (en) 2007-12-03 2010-08-11 Kolo Technologies, Inc. Capacitive micromachined ultrasonic transducer with voltage feedback
US8483014B2 (en) 2007-12-03 2013-07-09 Kolo Technologies, Inc. Micromachined ultrasonic transducers
WO2009073562A1 (en) * 2007-12-03 2009-06-11 Kolo Technologies, Inc. Dual-mode operation micromachined ultrasonic transducer
JP5269090B2 (ja) 2007-12-03 2013-08-21 コロ テクノロジーズ インコーポレイテッド 静電変換器およびアレイにおけるスルーウエハ相互接続部
US7781238B2 (en) 2007-12-06 2010-08-24 Robert Gideon Wodnicki Methods of making and using integrated and testable sensor array
US8614151B2 (en) 2008-01-04 2013-12-24 Micron Technology, Inc. Method of etching a high aspect ratio contact
KR100878454B1 (ko) 2008-02-28 2009-01-13 (주)실리콘화일 신호처리블록을 구비하는 적층형 마이크로폰과 그 제조방법
WO2009135255A1 (en) 2008-05-07 2009-11-12 Signostics Pty Ltd Docking system for medical diagnostic scanning using a handheld device
JP2009291514A (ja) 2008-06-09 2009-12-17 Canon Inc 静電容量型トランスデューサの製造方法、及び静電容量型トランスデューサ
EP2230497A1 (de) 2008-06-09 2010-09-22 Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V. Diodenbolometer und ein Verfahren zur Herstellung eines Diodenbolometers
US20100075481A1 (en) * 2008-07-08 2010-03-25 Xiao (Charles) Yang Method and structure of monolithically integrated ic-mems oscillator using ic foundry-compatible processes
US8796746B2 (en) 2008-07-08 2014-08-05 MCube Inc. Method and structure of monolithically integrated pressure sensor using IC foundry-compatible processes
US7812418B2 (en) * 2008-07-29 2010-10-12 Fortemedia, Inc Chip-scaled MEMS microphone package
WO2010082519A1 (ja) 2009-01-16 2010-07-22 株式会社日立メディコ 超音波探触子の製造方法および超音波探触子
GB2467776A (en) 2009-02-13 2010-08-18 Wolfson Microelectronics Plc Integrated MEMS transducer and circuitry
US8315125B2 (en) 2009-03-18 2012-11-20 Sonetics Ultrasound, Inc. System and method for biasing CMUT elements
EP2659987A1 (en) 2009-03-26 2013-11-06 Norwegian University of Science and Technology (NTNU) Acoustic backing layer for use in an ultrasound transducer
JP5317826B2 (ja) * 2009-05-19 2013-10-16 キヤノン株式会社 容量型機械電気変換素子の製造方法
US8451693B2 (en) 2009-08-25 2013-05-28 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducer having compliant post structure
US8345508B2 (en) 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
US8563345B2 (en) 2009-10-02 2013-10-22 National Semiconductor Corporated Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements
US8222065B1 (en) 2009-10-02 2012-07-17 National Semiconductor Corporation Method and system for forming a capacitive micromachined ultrasonic transducer
JP5404335B2 (ja) 2009-11-17 2014-01-29 キヤノン株式会社 電気機械変換装置及びその作製方法
US8587078B2 (en) 2010-04-06 2013-11-19 United Microelectronics Corp. Integrated circuit and fabricating method thereof
US8647279B2 (en) 2010-06-10 2014-02-11 Siemens Medical Solutions Usa, Inc. Volume mechanical transducer for medical diagnostic ultrasound
US8957564B1 (en) * 2010-06-29 2015-02-17 Silicon Light Machines Corporation Microelectromechanical system megasonic transducer
JP5702966B2 (ja) 2010-08-02 2015-04-15 キヤノン株式会社 電気機械変換装置及びその作製方法
US8273610B2 (en) 2010-11-18 2012-09-25 Monolithic 3D Inc. Method of constructing a semiconductor device and structure
JP5677016B2 (ja) * 2010-10-15 2015-02-25 キヤノン株式会社 電気機械変換装置及びその作製方法
US8754529B2 (en) 2011-03-28 2014-06-17 Miradia, Inc. MEMS device with simplified electrical conducting paths
US8461655B2 (en) 2011-03-31 2013-06-11 Infineon Technologies Ag Micromechanical sound transducer having a membrane support with tapered surface
US9242273B2 (en) 2011-10-11 2016-01-26 The Board Of Trustees Of The Leland Stanford Junior University Method for operating CMUTs under high and varying pressure
EP2768396A2 (en) 2011-10-17 2014-08-27 Butterfly Network Inc. Transmissive imaging and related apparatus and methods
US20130096433A1 (en) 2011-10-18 2013-04-18 The Regents Of The University Of Michigan System and Method for Unattended Monitoring of Blood Flow
US20130161702A1 (en) 2011-12-25 2013-06-27 Kun-Lung Chen Integrated mems device
KR101894393B1 (ko) 2011-12-28 2018-09-04 삼성전자주식회사 초음파 변환기 구조물, 초음파 변환기 및 초음파 변환기의 제조 방법
KR101388141B1 (ko) 2012-05-31 2014-04-23 전자부품연구원 Ｃｍｏｓ 회로가 집적된 마이크로폰 및 그 제조방법
US10217045B2 (en) 2012-07-16 2019-02-26 Cornell University Computation devices and artificial neurons based on nanoelectromechanical systems
US8735199B2 (en) 2012-08-22 2014-05-27 Honeywell International Inc. Methods for fabricating MEMS structures by etching sacrificial features embedded in glass
US8564076B1 (en) 2013-01-30 2013-10-22 Invensense, Inc. Internal electrical contact for enclosed MEMS devices
US9533873B2 (en) 2013-02-05 2017-01-03 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
KR102170559B1 (ko) 2013-03-15 2020-10-27 버터플라이 네트워크, 인크. 상보성 금속 산화물 반도체(cmos) 초음파 트랜스듀서
AU2015247484B2 (en) 2014-04-18 2020-05-14 Butterfly Network, Inc. Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US20160009544A1 (en) 2015-03-02 2016-01-14 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
WO2018236956A1 (en) 2017-06-21 2018-12-27 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070180916A1 (en) * 2006-02-09 2007-08-09 General Electric Company Capacitive micromachined ultrasound transducer and methods of making the same
US20090122651A1 (en) * 2007-10-18 2009-05-14 Mario Kupnik Direct wafer bonded 2-D CUMT array
US20100225200A1 (en) * 2009-03-05 2010-09-09 Mario Kupnik Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
US8241931B1 (en) * 2009-10-19 2012-08-14 Analog Devices, Inc. Method of forming MEMS device with weakened substrate

Also Published As

Publication number Publication date
US9738514B2 (en) 2017-08-22
US9944514B2 (en) 2018-04-17
JP6232124B2 (ja) 2017-11-15
EP4122609A1 (en) 2023-01-25
US10710873B2 (en) 2020-07-14
AU2018203942B2 (en) 2020-03-12
CN105307975B (zh) 2017-04-26
US9061318B2 (en) 2015-06-23
WO2014151525A2 (en) 2014-09-25
TW201826495A (zh) 2018-07-16
US20150084053A1 (en) 2015-03-26
US10266401B2 (en) 2019-04-23
US20180186628A1 (en) 2018-07-05
JP2016518739A (ja) 2016-06-23
JP2018023165A (ja) 2018-02-08
KR102170559B1 (ko) 2020-10-27
US9242275B2 (en) 2016-01-26
TWI623081B (zh) 2018-05-01
US20140264660A1 (en) 2014-09-18
EP2969914B1 (en) 2020-01-01
US20160207760A1 (en) 2016-07-21
US9290375B2 (en) 2016-03-22
EP4122609B1 (en) 2024-11-06
AU2018203942A1 (en) 2018-06-21
KR20150144750A (ko) 2015-12-28
EP3639937A1 (en) 2020-04-22
US20170283254A1 (en) 2017-10-05
CA2905040C (en) 2021-10-19
EP4122609C0 (en) 2024-11-06
TWI663706B (zh) 2019-06-21
US20170029271A1 (en) 2017-02-02
EP2969914A2 (en) 2016-01-20
AU2014234071A1 (en) 2015-10-15
WO2014151525A3 (en) 2015-04-09
TW201501270A (zh) 2015-01-01
US20190210869A1 (en) 2019-07-11
US20150251896A1 (en) 2015-09-10
US9499395B2 (en) 2016-11-22
CA2905040A1 (en) 2014-09-25
JP6553695B2 (ja) 2019-07-31
CN105307975A (zh) 2016-02-03

Similar Documents

Publication Publication Date Title
US10710873B2 (en) Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same
US11684949B2 (en) CMOS ultrasonic transducers and related apparatus and methods

Legal Events

Date Code Title Description
FGA Letters patent sealed or granted (standard patent)