JP6213563B2 - 振動装置 - Google Patents
振動装置 Download PDFInfo
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- JP6213563B2 JP6213563B2 JP2015525270A JP2015525270A JP6213563B2 JP 6213563 B2 JP6213563 B2 JP 6213563B2 JP 2015525270 A JP2015525270 A JP 2015525270A JP 2015525270 A JP2015525270 A JP 2015525270A JP 6213563 B2 JP6213563 B2 JP 6213563B2
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- vibration
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- 238000005452 bending Methods 0.000 claims description 55
- 230000005284 excitation Effects 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
- 101700004678 SLIT3 Proteins 0.000 description 7
- 102100027339 Slit homolog 3 protein Human genes 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 239000002019 doping agent Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/0005—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing non-specific motion; Details common to machines covered by H02N2/02 - H02N2/16
- H02N2/005—Mechanical details, e.g. housings
- H02N2/0055—Supports for driving or driven bodies; Means for pressing driving body against driven body
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2041—Beam type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02338—Suspension means
- H03H2009/02385—Anchors for square resonators, i.e. resonators comprising a square vibrating membrane
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02433—Means for compensation or elimination of undesired effects
- H03H2009/0244—Anchor loss
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02511—Vertical, i.e. perpendicular to the substrate plane
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H2009/2442—Square resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02433—Means for compensation or elimination of undesired effects
- H03H9/02448—Means for compensation or elimination of undesired effects of temperature influence
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
2,2A,2B…振動部
3…基部
3a…スリット
4…支持部
5…屈曲振動部
6,6A…貫通溝
11…Si層
12…酸化ケイ素層
13…励振部
14…圧電薄膜
15,16…第1,第2の電極
21…振動装置
31…振動装置
41…振動装置
Claims (5)
- 振動部と、
第1の端部と前記第1の端部とは反対側の第2の端部とを有し、前記第1の端部が前記振動部に連結されており、前記振動部を支持している支持部と、
前記支持部の前記第2の端部につなげられており、前記振動部を囲むように設けられた枠状の基部とを備え、
前記支持部の前記第1の端部と前記第2の端部とを結ぶ方向に交叉している長さ方向を有し、前記長さ方向の中央において前記支持部の前記第2の端部に連結されており、前記長さ方向両端が固定端とされている屈曲振動部が設けられるように、前記基部に前記長さ方向に延びるスリットが形成されており、
前記屈曲振動部の前記両端が前記基部の残りの部分に連ねられており、該連ねられている部分が前記屈曲振動部の固定端とされており、
前記屈曲振動部の前記支持部の前記第2の端部に連結されている部分のうち、前記長さ方向において近い側の前記固定端側の部分から、該屈曲振動部の前記近い側の前記固定端までの長さが、前記振動部における固有振動の周波数に対応する該屈曲振動の波長をλとしたとき、λ/4とされている、振動装置。 - 全体が板状体であり、前記振動部、前記支持部及び前記基部を構成するように、前記支持部が設けられている部分を除いて前記振動部を囲む、複数の貫通溝が前記板状体に形成されている、請求項1に記載の振動装置。
- 前記振動部が、縮退半導体からなるSi層と、前記Si層上に積層されている励振部とを有し、該励振部が、圧電体層と、前記圧電体層に電圧を印加するための第1,第2の電極とを有する、請求項1または2に記載の振動装置。
- 前記振動部の外周縁と、前記基部との間の距離が、前記振動部の外周縁と前記屈曲振動部との間の距離と同等である、請求項1〜3のいずれか1項に記載の振動装置。
- 前記振動部の外周縁と、前記基部との間の距離が、前記振動部の外周縁と前記屈曲振動部との間の距離よりも小さい、請求項1〜3のいずれか1項に記載の振動装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013141092 | 2013-07-04 | ||
JP2013141092 | 2013-07-04 | ||
PCT/JP2014/067757 WO2015002261A1 (ja) | 2013-07-04 | 2014-07-03 | 振動装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015002261A1 JPWO2015002261A1 (ja) | 2017-02-23 |
JP6213563B2 true JP6213563B2 (ja) | 2017-10-18 |
Family
ID=52143831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015525270A Active JP6213563B2 (ja) | 2013-07-04 | 2014-07-03 | 振動装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10276775B2 (ja) |
JP (1) | JP6213563B2 (ja) |
CN (1) | CN105340177B (ja) |
WO (1) | WO2015002261A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016006433A1 (ja) | 2014-07-10 | 2016-01-14 | 株式会社村田製作所 | 振動装置 |
WO2016158048A1 (ja) * | 2015-03-31 | 2016-10-06 | 株式会社村田製作所 | 共振子 |
US10938375B2 (en) | 2015-03-31 | 2021-03-02 | Murata Manufacturing Co, Ltd. | Resonator |
US10778182B2 (en) | 2015-03-31 | 2020-09-15 | Murata Manufacturing Co., Ltd. | Resonator |
FI126912B (fi) | 2015-09-30 | 2017-07-31 | Ponsse Oyj | Järjestely fluidin siirtämiseksi ketjusahan terälevylle |
FI127787B (en) | 2016-07-01 | 2019-02-28 | Teknologian Tutkimuskeskus Vtt Oy | Micromechanical resonator |
CN106688444B (zh) * | 2016-12-21 | 2019-07-23 | 石河子大学 | 采收装置 |
EP3733312B1 (en) * | 2018-12-27 | 2023-08-23 | Murata Manufacturing Co., Ltd. | Vibrating structure and vibration generating device |
CN114761143B (zh) * | 2019-11-25 | 2023-07-21 | 株式会社村田制作所 | 压电装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08186467A (ja) * | 1994-12-29 | 1996-07-16 | Murata Mfg Co Ltd | 拡がり振動型圧電振動子およびその製造方法 |
JPH08196467A (ja) | 1995-01-24 | 1996-08-06 | Masaichi Arioka | ロール紙等のホルダー |
JPH10117120A (ja) * | 1996-10-08 | 1998-05-06 | Toyo Commun Equip Co Ltd | Gtカット水晶振動子 |
JP2001168675A (ja) * | 1999-12-08 | 2001-06-22 | Mitsubishi Electric Corp | 圧電共振子およびこれを用いた圧電発振器並びに圧電共振子の製造方法 |
JP3697373B2 (ja) | 1999-12-10 | 2005-09-21 | 株式会社東芝 | 無線端末及び情報受信制御方法 |
JP2004281850A (ja) * | 2003-03-18 | 2004-10-07 | Tdk Corp | 積層複合電子部品 |
JP3944161B2 (ja) * | 2003-12-25 | 2007-07-11 | 株式会社東芝 | 薄膜バルク波音響共振器及び薄膜バルク波音響共振器の製造方法 |
US7990232B1 (en) * | 2007-06-06 | 2011-08-02 | Rf Micro Devices, Inc. | Anchor/support design for MEMS resonators |
JP2009290371A (ja) * | 2008-05-27 | 2009-12-10 | Panasonic Electric Works Co Ltd | Baw共振装置 |
JP2010147875A (ja) * | 2008-12-19 | 2010-07-01 | Panasonic Electric Works Co Ltd | Baw共振装置およびその製造方法 |
WO2010110918A1 (en) * | 2009-03-26 | 2010-09-30 | Sand9, Inc. | Mechanical resonating structures and methods |
FR2946479A1 (fr) * | 2009-06-09 | 2010-12-10 | Commissariat Energie Atomique | Resonateur electromecanique a ancrage resonant. |
-
2014
- 2014-07-03 JP JP2015525270A patent/JP6213563B2/ja active Active
- 2014-07-03 CN CN201480031140.3A patent/CN105340177B/zh active Active
- 2014-07-03 WO PCT/JP2014/067757 patent/WO2015002261A1/ja active Application Filing
-
2015
- 2015-12-22 US US14/978,242 patent/US10276775B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN105340177A (zh) | 2016-02-17 |
JPWO2015002261A1 (ja) | 2017-02-23 |
US10276775B2 (en) | 2019-04-30 |
US20160111627A1 (en) | 2016-04-21 |
WO2015002261A1 (ja) | 2015-01-08 |
CN105340177B (zh) | 2018-04-24 |
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