JP6208411B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

Info

Publication number
JP6208411B2
JP6208411B2 JP2012135592A JP2012135592A JP6208411B2 JP 6208411 B2 JP6208411 B2 JP 6208411B2 JP 2012135592 A JP2012135592 A JP 2012135592A JP 2012135592 A JP2012135592 A JP 2012135592A JP 6208411 B2 JP6208411 B2 JP 6208411B2
Authority
JP
Japan
Prior art keywords
layer
wiring
core substrate
primer
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012135592A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014003054A (ja
JP2014003054A5 (enExample
Inventor
吉昭 本藤
吉昭 本藤
浩文 竹内
浩文 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012135592A priority Critical patent/JP6208411B2/ja
Priority to KR1020130065791A priority patent/KR102049327B1/ko
Priority to CN201310232621.8A priority patent/CN103517548B/zh
Priority to US13/917,818 priority patent/US9252096B2/en
Priority to TW102121131A priority patent/TWI587764B/zh
Publication of JP2014003054A publication Critical patent/JP2014003054A/ja
Publication of JP2014003054A5 publication Critical patent/JP2014003054A5/ja
Application granted granted Critical
Publication of JP6208411B2 publication Critical patent/JP6208411B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/652—Cross-sectional shapes
    • H10W70/6525—Cross-sectional shapes for securing the interconnections to the substrate, e.g. to prevent peeling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2012135592A 2012-06-15 2012-06-15 配線基板及びその製造方法 Active JP6208411B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012135592A JP6208411B2 (ja) 2012-06-15 2012-06-15 配線基板及びその製造方法
KR1020130065791A KR102049327B1 (ko) 2012-06-15 2013-06-10 배선 기판 및 그 제조 방법
CN201310232621.8A CN103517548B (zh) 2012-06-15 2013-06-13 布线基板及其制造方法
US13/917,818 US9252096B2 (en) 2012-06-15 2013-06-14 Wiring substrate and method of manufacturing the same
TW102121131A TWI587764B (zh) 2012-06-15 2013-06-14 佈線基板及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012135592A JP6208411B2 (ja) 2012-06-15 2012-06-15 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014003054A JP2014003054A (ja) 2014-01-09
JP2014003054A5 JP2014003054A5 (enExample) 2015-07-09
JP6208411B2 true JP6208411B2 (ja) 2017-10-04

Family

ID=49755160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012135592A Active JP6208411B2 (ja) 2012-06-15 2012-06-15 配線基板及びその製造方法

Country Status (5)

Country Link
US (1) US9252096B2 (enExample)
JP (1) JP6208411B2 (enExample)
KR (1) KR102049327B1 (enExample)
CN (1) CN103517548B (enExample)
TW (1) TWI587764B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015065322A (ja) * 2013-09-25 2015-04-09 日東電工株式会社 半導体装置の製造方法
JP6075789B2 (ja) * 2014-01-31 2017-02-08 京セラ株式会社 配線基板の製造方法
CN105307386B (zh) * 2015-09-15 2018-07-06 三星半导体(中国)研究开发有限公司 印刷电路板以及包括其的半导体封装件
US10643936B2 (en) * 2017-05-31 2020-05-05 Dyi-chung Hu Package substrate and package structure
KR102679997B1 (ko) * 2018-12-17 2024-07-02 삼성전기주식회사 인쇄회로기판
JP7207192B2 (ja) * 2019-06-19 2023-01-18 Tdk株式会社 センサー用パッケージ基板及びこれを備えるセンサーモジュール、並びに、センサー用パッケージ基板の製造方法
JP7364383B2 (ja) * 2019-07-19 2023-10-18 株式会社 大昌電子 プリント配線板の製造方法
US11439022B2 (en) 2019-09-02 2022-09-06 Samsung Electro-Mechanics Co., Ltd. Printed circuit board
CN111366839B (zh) * 2020-03-28 2022-04-12 深圳中科系统集成技术有限公司 一种晶圆测试用探针转接板及其制作方法
TWI751554B (zh) * 2020-05-12 2022-01-01 台灣愛司帝科技股份有限公司 影像顯示器及其拼接式電路承載與控制模組
KR102909754B1 (ko) * 2020-06-12 2026-01-09 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
TWI844487B (zh) * 2021-08-06 2024-06-01 美商愛玻索立克公司 電子器件封裝用基板、其製造方法及包括其的電子器件封裝

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1117345A (ja) * 1997-06-19 1999-01-22 Ibiden Co Ltd 多層プリント配線板
JP3373406B2 (ja) * 1997-10-14 2003-02-04 イビデン株式会社 プリント配線板およびその製造方法
KR20040088555A (ko) * 2002-02-28 2004-10-16 니폰 제온 가부시키가이샤 부분 도금 방법, 부분 도금 수지 기재, 및 다층 회로기판의 제조방법
JP4488684B2 (ja) * 2002-08-09 2010-06-23 イビデン株式会社 多層プリント配線板
CN102361534A (zh) * 2003-04-07 2012-02-22 揖斐电株式会社 多层印刷电路板
JP2006086233A (ja) * 2004-09-14 2006-03-30 Sumitomo Bakelite Co Ltd 多層配線板およびその製造方法
JP2007150221A (ja) * 2005-10-27 2007-06-14 Fujitsu Ltd 多層回路基板およびその製造方法
JP2008085111A (ja) * 2006-09-28 2008-04-10 Matsushita Electric Ind Co Ltd 配線基板とその製造方法
JP5042762B2 (ja) * 2007-09-27 2012-10-03 株式会社テラミクロス 半導体装置
JP5094323B2 (ja) * 2007-10-15 2012-12-12 新光電気工業株式会社 配線基板の製造方法
JP2010010329A (ja) 2008-06-26 2010-01-14 Kyocer Slc Technologies Corp 配線基板およびその製造方法
JP4844904B2 (ja) 2009-03-27 2011-12-28 Ｔｄｋ株式会社 多層配線板及びその製造方法
US8161637B2 (en) * 2009-07-24 2012-04-24 Ibiden Co., Ltd. Manufacturing method for printed wiring board
TWI471073B (zh) * 2009-12-31 2015-01-21 Unimicron Technology Corp 線路基板及其製作方法
JP5341796B2 (ja) 2010-02-26 2013-11-13 京セラＳｌｃテクノロジー株式会社 配線基板の製造方法
JP6109569B2 (ja) * 2010-05-07 2017-04-05 住友ベークライト株式会社 回路基板用エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板用積層基材、プリント配線板、及び半導体装置
JP2012069926A (ja) * 2010-08-21 2012-04-05 Ibiden Co Ltd プリント配線板及びプリント配線板の製造方法

Also Published As

Publication number Publication date
KR20130141372A (ko) 2013-12-26
US20130334703A1 (en) 2013-12-19
JP2014003054A (ja) 2014-01-09
TW201406240A (zh) 2014-02-01
KR102049327B1 (ko) 2019-11-28
CN103517548B (zh) 2018-03-06
US9252096B2 (en) 2016-02-02
CN103517548A (zh) 2014-01-15
TWI587764B (zh) 2017-06-11

Similar Documents

Publication Publication Date Title
JP2014003054A (ja) 配線基板及びその製造方法
JP6200178B2 (ja) 電子部品内蔵基板及びその製造方法
JP6009228B2 (ja) 電子部品内蔵基板の製造方法
JP5410660B2 (ja) 配線基板及びその製造方法と電子部品装置及びその製造方法
JP5662551B1 (ja) 配線基板、半導体装置及び配線基板の製造方法
KR101906883B1 (ko) 배선 기판 및 그 제조 방법
US10745819B2 (en) Printed wiring board, semiconductor package and method for manufacturing printed wiring board
JP6358431B2 (ja) 電子部品装置及びその製造方法
US10098243B2 (en) Printed wiring board and semiconductor package
WO2010074121A1 (ja) プリント配線板の製造方法
US9392684B2 (en) Wiring substrate and method for manufacturing wiring substrate
TW201448682A (zh) 配線基板及其製造方法
KR20160061293A (ko) 회로 기판, 회로 기판의 제조 방법 및 전자 기기
JP6057641B2 (ja) 配線基板及びその製造方法
JP6092555B2 (ja) 配線基板の製造方法
JP5432354B2 (ja) 配線基板製造用の仮基板及びその製造方法
JP2014090079A (ja) プリント配線板
JP5565953B2 (ja) 配線基板およびその製造方法
JP4892924B2 (ja) 多層プリント配線基板及びその製造方法
TW202616786A (zh) 多層基板、多層基板的製造方法、及電子機器
JP6367902B2 (ja) 配線基板
JP6075789B2 (ja) 配線基板の製造方法
JP2014045018A (ja) プリント配線板

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150526

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150526

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160219

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160301

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160421

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20160524

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160810

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20160819

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20161021

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170515

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170907

R150 Certificate of patent or registration of utility model

Ref document number: 6208411

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150