JP6180159B2 - 異方性導電フィルム、接続方法、及び接合体 - Google Patents

異方性導電フィルム、接続方法、及び接合体 Download PDF

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Publication number
JP6180159B2
JP6180159B2 JP2013078773A JP2013078773A JP6180159B2 JP 6180159 B2 JP6180159 B2 JP 6180159B2 JP 2013078773 A JP2013078773 A JP 2013078773A JP 2013078773 A JP2013078773 A JP 2013078773A JP 6180159 B2 JP6180159 B2 JP 6180159B2
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JP
Japan
Prior art keywords
anisotropic conductive
resin
conductive film
carboxyl group
acrylic rubber
Prior art date
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Active
Application number
JP2013078773A
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English (en)
Japanese (ja)
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JP2014201657A (ja
Inventor
慎一 林
慎一 林
祐治 田中
祐治 田中
怜司 塚尾
怜司 塚尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2013078773A priority Critical patent/JP6180159B2/ja
Priority to TW103112195A priority patent/TWI588235B/zh
Priority to CN201410133376.XA priority patent/CN104099031B/zh
Priority to KR1020140039935A priority patent/KR101618949B1/ko
Publication of JP2014201657A publication Critical patent/JP2014201657A/ja
Priority to HK14111980A priority patent/HK1198448A1/xx
Priority to KR1020150186833A priority patent/KR20160006641A/ko
Application granted granted Critical
Publication of JP6180159B2 publication Critical patent/JP6180159B2/ja
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14Conductive material dispersed in non-conductive inorganic material
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2013078773A 2013-04-04 2013-04-04 異方性導電フィルム、接続方法、及び接合体 Active JP6180159B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013078773A JP6180159B2 (ja) 2013-04-04 2013-04-04 異方性導電フィルム、接続方法、及び接合体
TW103112195A TWI588235B (zh) 2013-04-04 2014-04-01 各向異性導電薄膜、其連接方法及其接合體
CN201410133376.XA CN104099031B (zh) 2013-04-04 2014-04-03 各向异性导电膜、连接方法及接合体
KR1020140039935A KR101618949B1 (ko) 2013-04-04 2014-04-03 이방성 도전 필름, 접속 방법, 및 접합체
HK14111980A HK1198448A1 (en) 2013-04-04 2014-11-27 Anisotropic conductive film, connecting method and joined structure
KR1020150186833A KR20160006641A (ko) 2013-04-04 2015-12-24 이방성 도전 필름, 접속 방법, 및 접합체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013078773A JP6180159B2 (ja) 2013-04-04 2013-04-04 異方性導電フィルム、接続方法、及び接合体

Publications (2)

Publication Number Publication Date
JP2014201657A JP2014201657A (ja) 2014-10-27
JP6180159B2 true JP6180159B2 (ja) 2017-08-16

Family

ID=51667590

Family Applications (1)

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JP2013078773A Active JP6180159B2 (ja) 2013-04-04 2013-04-04 異方性導電フィルム、接続方法、及び接合体

Country Status (5)

Country Link
JP (1) JP6180159B2 (ko)
KR (2) KR101618949B1 (ko)
CN (1) CN104099031B (ko)
HK (1) HK1198448A1 (ko)
TW (1) TWI588235B (ko)

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KR101941386B1 (ko) * 2014-11-12 2019-01-22 데쿠세리아루즈 가부시키가이샤 열경화성 접착 조성물
JP2017117864A (ja) * 2015-12-22 2017-06-29 日立化成株式会社 先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法
SG11201909029YA (en) * 2017-04-28 2019-10-30 Hitachi Chemical Co Ltd Sealing film, sealed structure, and method for producing sealed structure
CN109651987A (zh) * 2018-12-17 2019-04-19 深圳市华星光电技术有限公司 一种各向异性导电胶黏剂及其导电膜
JP7292225B2 (ja) 2019-07-19 2023-06-16 日本ゼオン株式会社 加工性に優れるアクリルゴムシート
JP7284110B2 (ja) 2019-07-19 2023-05-30 日本ゼオン株式会社 保存安定性と耐水性に優れるアクリルゴムベール
JP7296328B2 (ja) 2019-07-19 2023-06-22 日本ゼオン株式会社 保存安定性と加工性に優れるアクリルゴムベール
JP7296329B2 (ja) 2019-07-19 2023-06-22 日本ゼオン株式会社 保存安定性と加工性に優れるアクリルゴムシート
JP7284109B2 (ja) 2019-07-19 2023-05-30 日本ゼオン株式会社 保存安定性と耐水性に優れるアクリルゴムシート
JP7233388B2 (ja) 2019-07-19 2023-03-06 日本ゼオン株式会社 保存安定性と加工性に優れるアクリルゴムベール
JP2021072375A (ja) * 2019-10-31 2021-05-06 昭和電工マテリアルズ株式会社 基板搬送用サポートテープ及び電子機器装置の製造方法

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
JPH0652715A (ja) * 1992-07-30 1994-02-25 Fuji Kobunshi Kogyo Kk 異方導電性接着剤組成物
JPH10168412A (ja) * 1996-12-10 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP2000129218A (ja) * 1998-10-26 2000-05-09 Nitto Denko Corp シート状接着剤組成物およびそれを用いた電子部品装置ならびにそのリペアー方法
JP2006199824A (ja) 2005-01-20 2006-08-03 Soken Chem & Eng Co Ltd 異方導電性接着テープおよび配線基板異方導電接着体
JP4697194B2 (ja) * 2006-10-13 2011-06-08 日立化成工業株式会社 太陽電池セルの接続方法及び太陽電池モジュール
KR101024467B1 (ko) * 2006-10-17 2011-03-23 히다치 가세고교 가부시끼가이샤 피복 입자와 그의 제조 방법 및 피복 입자를 이용한 이방 도전성 접착제 조성물 및 이방 도전성 접착제 필름
JP4807523B2 (ja) * 2006-10-31 2011-11-02 ソニーケミカル&インフォメーションデバイス株式会社 シート状軟磁性材料及びその製造方法
JP4869915B2 (ja) * 2006-12-28 2012-02-08 京セラケミカル株式会社 複合防弾板
JP2008231287A (ja) * 2007-03-22 2008-10-02 Toray Ind Inc 半導体装置用接着剤組成物、それを用いた接着剤シート、半導体用接着剤付きテープおよび銅張り積層板
JP5222490B2 (ja) * 2007-04-25 2013-06-26 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
JP5226562B2 (ja) 2008-03-27 2013-07-03 デクセリアルズ株式会社 異方性導電フィルム、並びに、接合体及びその製造方法
CN102017816A (zh) * 2008-04-28 2011-04-13 日立化成工业株式会社 电路连接材料、膜状粘接剂、粘接剂卷以及电路连接结构体
JP2010143988A (ja) * 2008-12-17 2010-07-01 Toagosei Co Ltd 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
KR101138799B1 (ko) * 2009-08-20 2012-04-24 제일모직주식회사 이방 도전성 필름용 조성물
JP5293779B2 (ja) * 2010-07-20 2013-09-18 日立化成株式会社 接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール
JP5768454B2 (ja) 2011-04-14 2015-08-26 デクセリアルズ株式会社 異方性導電フィルム
JP2013177564A (ja) * 2012-02-08 2013-09-09 Nitto Denko Corp 熱伝導性シート、熱伝導性シート形成用粒子集合物粉体、および、これらの製造方法
TW201522591A (zh) * 2013-11-28 2015-06-16 Nitto Denko Corp 密封用熱硬化性樹脂薄片及中空封裝(hollow package)之製造方法

Also Published As

Publication number Publication date
KR101618949B1 (ko) 2016-05-09
HK1198448A1 (en) 2015-04-24
CN104099031A (zh) 2014-10-15
JP2014201657A (ja) 2014-10-27
KR20160006641A (ko) 2016-01-19
CN104099031B (zh) 2017-04-12
TW201512364A (zh) 2015-04-01
KR20140120855A (ko) 2014-10-14
TWI588235B (zh) 2017-06-21

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