JP6178488B2 - 電子デバイス製造における基板の処理に適合される処理システム、装置、及び方法 - Google Patents

電子デバイス製造における基板の処理に適合される処理システム、装置、及び方法 Download PDF

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JP6178488B2
JP6178488B2 JP2016501030A JP2016501030A JP6178488B2 JP 6178488 B2 JP6178488 B2 JP 6178488B2 JP 2016501030 A JP2016501030 A JP 2016501030A JP 2016501030 A JP2016501030 A JP 2016501030A JP 6178488 B2 JP6178488 B2 JP 6178488B2
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chamber
pass
electronic device
processing
processing system
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JP2016512925A (ja
JP2016512925A5 (enExample
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スティーヴ エス． ホンカム，
スティーヴ エス． ホンカム，
ポール ビー． ロイター，
ポール ビー． ロイター，
エリック エー． エングルハート，
エリック エー． エングルハート，
ガネーシュ バラスブラマニアン，
ガネーシュ バラスブラマニアン，
シンロン チェン，
シンロン チェン，
フアンカルロス ロチャ−アルバレス，
フアンカルロス ロチャ−アルバレス，
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/86187—Plural tanks or compartments connected for serial flow

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
JP2016501030A 2013-03-15 2014-03-10 電子デバイス製造における基板の処理に適合される処理システム、装置、及び方法 Active JP6178488B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361788825P 2013-03-15 2013-03-15
US61/788,825 2013-03-15
PCT/US2014/022656 WO2014150234A1 (en) 2013-03-15 2014-03-10 Processing systems, apparatus, and methods adapted to process substrates in electronic device manufacturing

Publications (3)

Publication Number Publication Date
JP2016512925A JP2016512925A (ja) 2016-05-09
JP2016512925A5 JP2016512925A5 (enExample) 2017-04-13
JP6178488B2 true JP6178488B2 (ja) 2017-08-09

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JP2016501030A Active JP6178488B2 (ja) 2013-03-15 2014-03-10 電子デバイス製造における基板の処理に適合される処理システム、装置、及び方法

Country Status (6)

Country Link
US (1) US9524889B2 (enExample)
JP (1) JP6178488B2 (enExample)
KR (1) KR101734821B1 (enExample)
CN (1) CN105051861B (enExample)
TW (1) TWI623055B (enExample)
WO (1) WO2014150234A1 (enExample)

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US9435025B2 (en) 2013-09-25 2016-09-06 Applied Materials, Inc. Gas apparatus, systems, and methods for chamber ports
US9717147B2 (en) 2013-09-26 2017-07-25 Applied Materials, Inc. Electronic device manufacturing system
US20150090295A1 (en) 2013-09-28 2015-04-02 Applied Materials, Inc. Apparatus and methods for a mask inverter
KR101770970B1 (ko) 2013-09-30 2017-08-24 어플라이드 머티어리얼스, 인코포레이티드 이송 챔버 가스 퍼지 장치, 전자 디바이스 프로세싱 시스템들, 및 퍼지 방법들
JP6466955B2 (ja) 2013-11-04 2019-02-06 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 側面数増強対応移送チャンバ、半導体デバイスの製造処理ツール及び処理方法
US10520371B2 (en) 2015-10-22 2019-12-31 Applied Materials, Inc. Optical fiber temperature sensors, temperature monitoring apparatus, and manufacturing methods
US10741428B2 (en) * 2016-04-11 2020-08-11 Applied Materials, Inc. Semiconductor processing chamber
US10119191B2 (en) 2016-06-08 2018-11-06 Applied Materials, Inc. High flow gas diffuser assemblies, systems, and methods
US10684159B2 (en) 2016-06-27 2020-06-16 Applied Materials, Inc. Methods, systems, and apparatus for mass flow verification based on choked flow
KR102650824B1 (ko) * 2016-10-18 2024-03-26 매슨 테크놀로지 인크 워크피스 처리를 위한 시스템 및 방법
US10541165B2 (en) * 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
US10361099B2 (en) 2017-06-23 2019-07-23 Applied Materials, Inc. Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems
JP6991325B2 (ja) * 2017-10-16 2022-01-12 アプライド マテリアルズ インコーポレイテッド デュアルロードロック構成による高温加熱支持ペデスタル
US11107709B2 (en) 2019-01-30 2021-08-31 Applied Materials, Inc. Temperature-controllable process chambers, electronic device processing systems, and manufacturing methods
JP7316121B2 (ja) * 2019-07-05 2023-07-27 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
KR20240167943A (ko) * 2019-07-12 2024-11-28 어플라이드 머티어리얼스, 인코포레이티드 동시 기판 이송을 위한 로봇
JP7240980B2 (ja) * 2019-07-29 2023-03-16 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
JP7402658B2 (ja) * 2019-11-01 2023-12-21 東京エレクトロン株式会社 基板収容ユニット及び基板搬送装置における真空搬送ユニットのメンテナンス方法
TWI867219B (zh) * 2020-05-12 2024-12-21 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 半導體處理系統

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US6468353B1 (en) 1997-06-04 2002-10-22 Applied Materials, Inc. Method and apparatus for improved substrate handling
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JP2004510221A (ja) 2000-06-14 2004-04-02 アプライド　マテリアルズ　インコーポレイテッド 環境が制御されたチャンバ内で圧力を維持するための装置及び方法
CN100435269C (zh) 2001-07-15 2008-11-19 应用材料有限公司 处理系统
US8110489B2 (en) * 2001-07-25 2012-02-07 Applied Materials, Inc. Process for forming cobalt-containing materials
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KR101432562B1 (ko) * 2007-12-31 2014-08-21 (주)소슬 기판 처리 장치 및 기판 처리 방법
CN103337453B (zh) 2008-10-07 2017-10-24 应用材料公司 用于从蚀刻基板有效地移除卤素残余物的设备
CN203205393U (zh) * 2011-03-01 2013-09-18 应用材料公司 用于转移基板及限制自由基的箍组件
KR101390900B1 (ko) * 2011-05-31 2014-04-30 세메스 주식회사 기판처리장치
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CN106847737B (zh) * 2012-02-29 2020-11-13 应用材料公司 配置中的除污及剥除处理腔室

Also Published As

Publication number Publication date
KR101734821B1 (ko) 2017-05-12
US20140263165A1 (en) 2014-09-18
US9524889B2 (en) 2016-12-20
KR20150132416A (ko) 2015-11-25
CN105051861B (zh) 2017-11-14
JP2016512925A (ja) 2016-05-09
WO2014150234A1 (en) 2014-09-25
CN105051861A (zh) 2015-11-11
TW201442138A (zh) 2014-11-01
TWI623055B (zh) 2018-05-01

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