KR101734821B1 - 전자 디바이스 제조시 기판들을 프로세싱하도록 적응된 프로세싱 시스템들, 장치, 및 방법들 - Google Patents

전자 디바이스 제조시 기판들을 프로세싱하도록 적응된 프로세싱 시스템들, 장치, 및 방법들 Download PDF

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KR101734821B1
KR101734821B1 KR1020157029256A KR20157029256A KR101734821B1 KR 101734821 B1 KR101734821 B1 KR 101734821B1 KR 1020157029256 A KR1020157029256 A KR 1020157029256A KR 20157029256 A KR20157029256 A KR 20157029256A KR 101734821 B1 KR101734821 B1 KR 101734821B1
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chamber
electronic device
main frame
processing system
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KR20150132416A (ko
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스티브 에스. 홍캄
폴 비. 로이터
에릭 에이. 잉글하르트
가네쉬 발라수브라마니안
싱롱 첸
주안카를로스 로카-알바레즈
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어플라이드 머티어리얼스, 인코포레이티드
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    • H01L21/67184—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H01L21/6719—
    • H01L21/67196—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/86187—Plural tanks or compartments connected for serial flow

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
KR1020157029256A 2013-03-15 2014-03-10 전자 디바이스 제조시 기판들을 프로세싱하도록 적응된 프로세싱 시스템들, 장치, 및 방법들 Active KR101734821B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361788825P 2013-03-15 2013-03-15
US61/788,825 2013-03-15
PCT/US2014/022656 WO2014150234A1 (en) 2013-03-15 2014-03-10 Processing systems, apparatus, and methods adapted to process substrates in electronic device manufacturing

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Publication Number Publication Date
KR20150132416A KR20150132416A (ko) 2015-11-25
KR101734821B1 true KR101734821B1 (ko) 2017-05-12

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US (1) US9524889B2 (enExample)
JP (1) JP6178488B2 (enExample)
KR (1) KR101734821B1 (enExample)
CN (1) CN105051861B (enExample)
TW (1) TWI623055B (enExample)
WO (1) WO2014150234A1 (enExample)

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US10199256B2 (en) 2013-09-28 2019-02-05 Applied Materials, Inc. Methods and systems for improved mask processing
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US11107709B2 (en) 2019-01-30 2021-08-31 Applied Materials, Inc. Temperature-controllable process chambers, electronic device processing systems, and manufacturing methods
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JP7402658B2 (ja) * 2019-11-01 2023-12-21 東京エレクトロン株式会社 基板収容ユニット及び基板搬送装置における真空搬送ユニットのメンテナンス方法
TWI867219B (zh) * 2020-05-12 2024-12-21 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 半導體處理系統

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Publication number Publication date
CN105051861A (zh) 2015-11-11
WO2014150234A1 (en) 2014-09-25
TW201442138A (zh) 2014-11-01
KR20150132416A (ko) 2015-11-25
CN105051861B (zh) 2017-11-14
JP2016512925A (ja) 2016-05-09
TWI623055B (zh) 2018-05-01
JP6178488B2 (ja) 2017-08-09
US20140263165A1 (en) 2014-09-18
US9524889B2 (en) 2016-12-20

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