KR101734821B1 - 전자 디바이스 제조시 기판들을 프로세싱하도록 적응된 프로세싱 시스템들, 장치, 및 방법들 - Google Patents
전자 디바이스 제조시 기판들을 프로세싱하도록 적응된 프로세싱 시스템들, 장치, 및 방법들 Download PDFInfo
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- KR101734821B1 KR101734821B1 KR1020157029256A KR20157029256A KR101734821B1 KR 101734821 B1 KR101734821 B1 KR 101734821B1 KR 1020157029256 A KR1020157029256 A KR 1020157029256A KR 20157029256 A KR20157029256 A KR 20157029256A KR 101734821 B1 KR101734821 B1 KR 101734821B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/86187—Plural tanks or compartments connected for serial flow
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361788825P | 2013-03-15 | 2013-03-15 | |
| US61/788,825 | 2013-03-15 | ||
| PCT/US2014/022656 WO2014150234A1 (en) | 2013-03-15 | 2014-03-10 | Processing systems, apparatus, and methods adapted to process substrates in electronic device manufacturing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150132416A KR20150132416A (ko) | 2015-11-25 |
| KR101734821B1 true KR101734821B1 (ko) | 2017-05-12 |
Family
ID=51522852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157029256A Active KR101734821B1 (ko) | 2013-03-15 | 2014-03-10 | 전자 디바이스 제조시 기판들을 프로세싱하도록 적응된 프로세싱 시스템들, 장치, 및 방법들 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9524889B2 (enExample) |
| JP (1) | JP6178488B2 (enExample) |
| KR (1) | KR101734821B1 (enExample) |
| CN (1) | CN105051861B (enExample) |
| TW (1) | TWI623055B (enExample) |
| WO (1) | WO2014150234A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6165518B2 (ja) * | 2013-06-25 | 2017-07-19 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法および真空処理装置 |
| US9435025B2 (en) | 2013-09-25 | 2016-09-06 | Applied Materials, Inc. | Gas apparatus, systems, and methods for chamber ports |
| KR102161685B1 (ko) | 2013-09-26 | 2020-10-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 프로세싱을 위한 혼합형-플랫폼 장치, 시스템들, 및 방법들 |
| US20150090295A1 (en) | 2013-09-28 | 2015-04-02 | Applied Materials, Inc. | Apparatus and methods for a mask inverter |
| JP6573892B2 (ja) | 2013-09-30 | 2019-09-11 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 移送チャンバガスパージ装置、電子デバイス処理システム、及びパージ方法。 |
| TWI699850B (zh) | 2013-11-04 | 2020-07-21 | 美商應用材料股份有限公司 | 半導體裝置處理工具及用於該半導體裝置處理工具的介面單元 |
| US10520371B2 (en) | 2015-10-22 | 2019-12-31 | Applied Materials, Inc. | Optical fiber temperature sensors, temperature monitoring apparatus, and manufacturing methods |
| US10741428B2 (en) * | 2016-04-11 | 2020-08-11 | Applied Materials, Inc. | Semiconductor processing chamber |
| US10119191B2 (en) | 2016-06-08 | 2018-11-06 | Applied Materials, Inc. | High flow gas diffuser assemblies, systems, and methods |
| US10684159B2 (en) | 2016-06-27 | 2020-06-16 | Applied Materials, Inc. | Methods, systems, and apparatus for mass flow verification based on choked flow |
| US10580672B2 (en) * | 2016-10-18 | 2020-03-03 | Mattson Technology, Inc. | Systems and methods for workpiece processing |
| US10541165B2 (en) * | 2016-11-10 | 2020-01-21 | Applied Materials, Inc. | Systems, apparatus, and methods for an improved load port backplane |
| US10361099B2 (en) | 2017-06-23 | 2019-07-23 | Applied Materials, Inc. | Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems |
| SG11202002387RA (en) | 2017-10-16 | 2020-04-29 | Applied Materials Inc | High temperature heated support pedestal in a dual load lock configuration |
| US11107709B2 (en) | 2019-01-30 | 2021-08-31 | Applied Materials, Inc. | Temperature-controllable process chambers, electronic device processing systems, and manufacturing methods |
| JP7316121B2 (ja) * | 2019-07-05 | 2023-07-27 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
| KR20240167943A (ko) * | 2019-07-12 | 2024-11-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 동시 기판 이송을 위한 로봇 |
| JP7240980B2 (ja) * | 2019-07-29 | 2023-03-16 | 東京エレクトロン株式会社 | 基板処理装置及び基板搬送方法 |
| JP7402658B2 (ja) * | 2019-11-01 | 2023-12-21 | 東京エレクトロン株式会社 | 基板収容ユニット及び基板搬送装置における真空搬送ユニットのメンテナンス方法 |
| TWI867219B (zh) * | 2020-05-12 | 2024-12-21 | 荷蘭商Asm Ip私人控股有限公司 | 半導體處理系統 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5855681A (en) | 1996-11-18 | 1999-01-05 | Applied Materials, Inc. | Ultra high throughput wafer vacuum processing system |
| US6575737B1 (en) | 1997-06-04 | 2003-06-10 | Applied Materials, Inc. | Method and apparatus for improved substrate handling |
| US5951770A (en) | 1997-06-04 | 1999-09-14 | Applied Materials, Inc. | Carousel wafer transfer system |
| US6468353B1 (en) | 1997-06-04 | 2002-10-22 | Applied Materials, Inc. | Method and apparatus for improved substrate handling |
| US6182376B1 (en) * | 1997-07-10 | 2001-02-06 | Applied Materials, Inc. | Degassing method and apparatus |
| US6173938B1 (en) | 1998-09-22 | 2001-01-16 | Applied Materials, Inc. | Two speed air cylinder for slit valve motion control |
| US20010049181A1 (en) | 1998-11-17 | 2001-12-06 | Sudha Rathi | Plasma treatment for cooper oxide reduction |
| US6355571B1 (en) | 1998-11-17 | 2002-03-12 | Applied Materials, Inc. | Method and apparatus for reducing copper oxidation and contamination in a semiconductor device |
| US6347918B1 (en) | 1999-01-27 | 2002-02-19 | Applied Materials, Inc. | Inflatable slit/gate valve |
| JP4316752B2 (ja) * | 1999-11-30 | 2009-08-19 | キヤノンアネルバ株式会社 | 真空搬送処理装置 |
| JP2004510221A (ja) | 2000-06-14 | 2004-04-02 | アプライド マテリアルズ インコーポレイテッド | 環境が制御されたチャンバ内で圧力を維持するための装置及び方法 |
| JP2005518655A (ja) | 2001-07-15 | 2005-06-23 | アプライド マテリアルズ インコーポレイテッド | 処理システム |
| US8110489B2 (en) | 2001-07-25 | 2012-02-07 | Applied Materials, Inc. | Process for forming cobalt-containing materials |
| US6764265B2 (en) | 2002-01-07 | 2004-07-20 | Applied Materials Inc. | Erosion resistant slit valve |
| US6656840B2 (en) | 2002-04-29 | 2003-12-02 | Applied Materials Inc. | Method for forming silicon containing layers on a substrate |
| US6896513B2 (en) * | 2002-09-12 | 2005-05-24 | Applied Materials, Inc. | Large area substrate processing system |
| US7007919B2 (en) | 2003-04-17 | 2006-03-07 | Applied Materials, Inc. | Slit valve method and apparatus |
| US20060176928A1 (en) * | 2005-02-08 | 2006-08-10 | Tokyo Electron Limited | Substrate processing apparatus, control method adopted in substrate processing apparatus and program |
| JP4931381B2 (ja) | 2005-02-08 | 2012-05-16 | 東京エレクトロン株式会社 | 基板処理装置,基板処理装置の制御方法,プログラム |
| US20070020890A1 (en) * | 2005-07-19 | 2007-01-25 | Applied Materials, Inc. | Method and apparatus for semiconductor processing |
| US7658802B2 (en) | 2005-11-22 | 2010-02-09 | Applied Materials, Inc. | Apparatus and a method for cleaning a dielectric film |
| CN103021908B (zh) | 2005-12-20 | 2015-09-30 | 应用材料公司 | 用于半导体设备制造装备的延伸主机设计 |
| US8440049B2 (en) * | 2006-05-03 | 2013-05-14 | Applied Materials, Inc. | Apparatus for etching high aspect ratio features |
| US8435379B2 (en) * | 2007-05-08 | 2013-05-07 | Applied Materials, Inc. | Substrate cleaning chamber and cleaning and conditioning methods |
| WO2009055507A1 (en) | 2007-10-26 | 2009-04-30 | Applied Materials, Inc. | Methods and apparatus for sealing a slit valve door |
| KR101432562B1 (ko) * | 2007-12-31 | 2014-08-21 | (주)소슬 | 기판 처리 장치 및 기판 처리 방법 |
| CN103337453B (zh) | 2008-10-07 | 2017-10-24 | 应用材料公司 | 用于从蚀刻基板有效地移除卤素残余物的设备 |
| KR101904146B1 (ko) * | 2011-03-01 | 2018-10-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 이송 및 라디칼 구속을 위한 방법 및 장치 |
| KR101390900B1 (ko) * | 2011-05-31 | 2014-04-30 | 세메스 주식회사 | 기판처리장치 |
| US8974601B2 (en) * | 2011-07-29 | 2015-03-10 | Semes Co., Ltd. | Apparatuses, systems and methods for treating substrate |
| JP6545460B2 (ja) * | 2012-02-29 | 2019-07-17 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | ロードロック構成内の除害・剥離処理チャンバ |
-
2014
- 2014-03-10 JP JP2016501030A patent/JP6178488B2/ja active Active
- 2014-03-10 CN CN201480016045.6A patent/CN105051861B/zh active Active
- 2014-03-10 WO PCT/US2014/022656 patent/WO2014150234A1/en not_active Ceased
- 2014-03-10 US US14/202,763 patent/US9524889B2/en active Active
- 2014-03-10 KR KR1020157029256A patent/KR101734821B1/ko active Active
- 2014-03-12 TW TW103108710A patent/TWI623055B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201442138A (zh) | 2014-11-01 |
| JP2016512925A (ja) | 2016-05-09 |
| WO2014150234A1 (en) | 2014-09-25 |
| KR20150132416A (ko) | 2015-11-25 |
| CN105051861B (zh) | 2017-11-14 |
| US20140263165A1 (en) | 2014-09-18 |
| JP6178488B2 (ja) | 2017-08-09 |
| CN105051861A (zh) | 2015-11-11 |
| TWI623055B (zh) | 2018-05-01 |
| US9524889B2 (en) | 2016-12-20 |
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