JP6165754B2 - 電子部品用接着剤 - Google Patents

電子部品用接着剤 Download PDF

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Publication number
JP6165754B2
JP6165754B2 JP2014539967A JP2014539967A JP6165754B2 JP 6165754 B2 JP6165754 B2 JP 6165754B2 JP 2014539967 A JP2014539967 A JP 2014539967A JP 2014539967 A JP2014539967 A JP 2014539967A JP 6165754 B2 JP6165754 B2 JP 6165754B2
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group
adhesive composition
adhesive
wafer
polymer
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Japanese (ja)
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JP2015503220A (ja
JP2015503220A5 (enExample
Inventor
容子 杉浦
容子 杉浦
有亮 堀口
有亮 堀口
美恵子 佐野
美恵子 佐野
ジーナ ホアン、
ジーナ ホアン、
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Henkel AG and Co KGaA
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Henkel AG and Co KGaA
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Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
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Publication of JP2015503220A5 publication Critical patent/JP2015503220A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP2014539967A 2011-11-02 2012-10-12 電子部品用接着剤 Active JP6165754B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161554698P 2011-11-02 2011-11-02
US61/554,698 2011-11-02
PCT/US2012/059961 WO2013066597A1 (en) 2011-11-02 2012-10-12 Adhesive for electronic component

Publications (3)

Publication Number Publication Date
JP2015503220A JP2015503220A (ja) 2015-01-29
JP2015503220A5 JP2015503220A5 (enExample) 2016-07-14
JP6165754B2 true JP6165754B2 (ja) 2017-07-19

Family

ID=48192591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014539967A Active JP6165754B2 (ja) 2011-11-02 2012-10-12 電子部品用接着剤

Country Status (6)

Country Link
US (2) US9305892B2 (enExample)
JP (1) JP6165754B2 (enExample)
KR (1) KR101924049B1 (enExample)
CN (1) CN104039913B (enExample)
TW (1) TWI565778B (enExample)
WO (1) WO2013066597A1 (enExample)

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WO2013035204A1 (ja) * 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 電子装置用組成物
JP5435520B1 (ja) * 2013-03-29 2014-03-05 古河電気工業株式会社 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置
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CN104232014B (zh) * 2014-09-15 2016-02-03 东莞市新懿电子材料技术有限公司 一种底部填充胶
JP6398619B2 (ja) * 2014-10-31 2018-10-03 日立化成株式会社 先供給型アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP6459402B2 (ja) * 2014-10-31 2019-01-30 日立化成株式会社 先供給型アンダーフィル材、電子部品装置及び電子部品装置の製造方法
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JP2017103289A (ja) * 2015-11-30 2017-06-08 日立化成株式会社 半導体用接着剤、半導体装置、及び半導体装置の製造方法
JP6791626B2 (ja) * 2015-12-14 2020-11-25 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
JP6638380B2 (ja) * 2015-12-22 2020-01-29 日立化成株式会社 先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法
JP6631238B2 (ja) * 2015-12-22 2020-01-15 日立化成株式会社 先供給型アンダーフィル材、先供給型アンダーフィル材の硬化物、電子部品装置及び電子部品装置の製造方法
JP6707856B2 (ja) * 2015-12-22 2020-06-10 日立化成株式会社 先供給型アンダーフィル材、電子部品装置の製造方法、及び電子部品装置
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JP7154037B2 (ja) * 2017-05-16 2022-10-17 デクセリアルズ株式会社 アンダーフィル材、アンダーフィルフィルム、及びこれを用いた半導体装置の製造方法
JP6920723B2 (ja) 2017-07-14 2021-08-18 ナミックス株式会社 加圧実装用ｎｃｆ
JP7066350B2 (ja) * 2017-08-03 2022-05-13 三井化学東セロ株式会社 生産性に優れたギャングボンディングプロセス用アンダーフィル絶縁フィルム
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JP7344471B2 (ja) 2018-04-26 2023-09-14 三菱瓦斯化学株式会社 樹脂組成物、積層体、樹脂組成物層付き半導体ウェハ、樹脂組成物層付き半導体搭載用基板、及び半導体装置
CN112004889B (zh) * 2018-04-26 2022-12-09 三菱瓦斯化学株式会社 树脂组合物、层叠体、带树脂组合物层的半导体晶圆、带树脂组合物层的半导体搭载用基板和半导体装置
JP6597845B2 (ja) * 2018-06-25 2019-10-30 日立化成株式会社 先供給型アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP7295939B2 (ja) * 2018-07-24 2023-06-21 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 難燃性接着剤組成物
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JP7406336B2 (ja) * 2019-10-11 2023-12-27 三星電子株式会社 半導体装置の製造方法
JP6844680B2 (ja) * 2019-12-12 2021-03-17 昭和電工マテリアルズ株式会社 先供給型アンダーフィル材、先供給型アンダーフィル材の硬化物、電子部品装置及び電子部品装置の製造方法
JP6844685B2 (ja) * 2019-12-26 2021-03-17 昭和電工マテリアルズ株式会社 先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法
CN114051647B (zh) * 2020-01-29 2023-02-03 株式会社村田制作所 带电极的无源部件和带电极的无源部件的集合体
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Also Published As

Publication number Publication date
TW201323558A (zh) 2013-06-16
KR101924049B1 (ko) 2018-12-03
US20140242757A1 (en) 2014-08-28
TWI565778B (zh) 2017-01-11
JP2015503220A (ja) 2015-01-29
US9305892B2 (en) 2016-04-05
US9780068B2 (en) 2017-10-03
CN104039913B (zh) 2017-08-22
US20160190094A1 (en) 2016-06-30
KR20140088543A (ko) 2014-07-10
CN104039913A (zh) 2014-09-10
WO2013066597A1 (en) 2013-05-10

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