TWI565778B - 電子組件用黏著劑 - Google Patents

電子組件用黏著劑 Download PDF

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Publication number
TWI565778B
TWI565778B TW101140402A TW101140402A TWI565778B TW I565778 B TWI565778 B TW I565778B TW 101140402 A TW101140402 A TW 101140402A TW 101140402 A TW101140402 A TW 101140402A TW I565778 B TWI565778 B TW I565778B
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TW
Taiwan
Prior art keywords
adhesive composition
wafer
adhesive
adhesive layer
wiring board
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TW101140402A
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English (en)
Chinese (zh)
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TW201323558A (zh
Inventor
村田容子
堀口有亮
佐野美惠子
吉娜 洪
Original Assignee
亨克爾股份有限及兩合公司
漢高智慧財產控股公司
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=48192591&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI565778(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 亨克爾股份有限及兩合公司, 漢高智慧財產控股公司 filed Critical 亨克爾股份有限及兩合公司
Publication of TW201323558A publication Critical patent/TW201323558A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
TW101140402A 2011-11-02 2012-10-31 電子組件用黏著劑 TWI565778B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161554698P 2011-11-02 2011-11-02

Publications (2)

Publication Number Publication Date
TW201323558A TW201323558A (zh) 2013-06-16
TWI565778B true TWI565778B (zh) 2017-01-11

Family

ID=48192591

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101140402A TWI565778B (zh) 2011-11-02 2012-10-31 電子組件用黏著劑

Country Status (6)

Country Link
US (2) US9305892B2 (enExample)
JP (1) JP6165754B2 (enExample)
KR (1) KR101924049B1 (enExample)
CN (1) CN104039913B (enExample)
TW (1) TWI565778B (enExample)
WO (1) WO2013066597A1 (enExample)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013035205A1 (ja) * 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン アンダーフィル用組成物
WO2013035204A1 (ja) * 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 電子装置用組成物
JP5435520B1 (ja) * 2013-03-29 2014-03-05 古河電気工業株式会社 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置
CN105934478B (zh) 2014-01-29 2020-01-14 日立化成株式会社 树脂组合物、使用了树脂组合物的半导体装置的制造方法、以及固体摄像元件
CN105934491B (zh) 2014-01-29 2018-04-24 日立化成株式会社 粘接剂组合物、使用了粘接剂组合物的半导体装置的制造方法、以及固体摄像元件
CN105934488A (zh) * 2014-01-29 2016-09-07 日立化成株式会社 粘接剂组合物、由粘接剂组合物得到的树脂固化物、使用了粘接剂组合物的半导体装置的制造方法、以及固体摄像元件
CN106062075B (zh) * 2014-02-19 2019-11-01 汉高股份有限及两合公司 用于密封液晶的可固化树脂组合物
KR101828644B1 (ko) * 2014-03-25 2018-02-14 주식회사 엘지화학 방열 점착 테이프용 점착제 조성물 및 방열 점착 테이프
CN104134615A (zh) * 2014-07-31 2014-11-05 华进半导体封装先导技术研发中心有限公司 铜铜键合的方法
EP3187555B1 (en) * 2014-08-29 2023-08-23 Furukawa Electric Co., Ltd. Maleimide film
CN104232014B (zh) * 2014-09-15 2016-02-03 东莞市新懿电子材料技术有限公司 一种底部填充胶
JP6398619B2 (ja) * 2014-10-31 2018-10-03 日立化成株式会社 先供給型アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP6459402B2 (ja) * 2014-10-31 2019-01-30 日立化成株式会社 先供給型アンダーフィル材、電子部品装置及び電子部品装置の製造方法
DE102015000120A1 (de) * 2015-01-07 2016-07-07 Merck Patent Gmbh Elektronisches Bauelement
JP6517588B2 (ja) * 2015-05-27 2019-05-22 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
US20180340056A1 (en) 2015-08-28 2018-11-29 Hitachi Chemical Company, Ltd. Buffer sheet composition and buffer sheet
JP2017103289A (ja) * 2015-11-30 2017-06-08 日立化成株式会社 半導体用接着剤、半導体装置、及び半導体装置の製造方法
JP6791626B2 (ja) * 2015-12-14 2020-11-25 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
JP6631238B2 (ja) * 2015-12-22 2020-01-15 日立化成株式会社 先供給型アンダーフィル材、先供給型アンダーフィル材の硬化物、電子部品装置及び電子部品装置の製造方法
JP6707856B2 (ja) * 2015-12-22 2020-06-10 日立化成株式会社 先供給型アンダーフィル材、電子部品装置の製造方法、及び電子部品装置
JP6638380B2 (ja) * 2015-12-22 2020-01-29 日立化成株式会社 先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法
JP2017179176A (ja) * 2016-03-31 2017-10-05 ナミックス株式会社 フィルム状半導体封止剤、および半導体装置
EP3466992B1 (en) 2016-05-31 2020-07-08 Mitsubishi Gas Chemical Company, Inc. Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
KR102411758B1 (ko) 2016-05-31 2022-06-22 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 적층체, 수지 조성물층이 부착된 반도체 웨이퍼, 수지 조성물층이 부착된 반도체 탑재용 기판 및 반도체 장치
JP6706995B2 (ja) * 2016-08-05 2020-06-10 三井化学東セロ株式会社 アンダーフィル用絶縁フィルム
CN106590502A (zh) * 2016-12-02 2017-04-26 陈佩珊 用于粘结不同材料的粘合剂组合物
CN110191922A (zh) * 2017-01-12 2019-08-30 汉高股份有限及两合公司 辐射固化性密封剂组合物
KR101872375B1 (ko) * 2017-02-13 2018-06-29 주식회사 로보스타 파티클 제거 방법 및 그 장치
US10444101B2 (en) * 2017-03-06 2019-10-15 Seiko Epson Corporation Sensor device, force detection device, and robot
CN110382565A (zh) * 2017-03-07 2019-10-25 松下知识产权经营株式会社 用作底部填充材料的热固性组合物和半导体装置
WO2018170373A1 (en) * 2017-03-17 2018-09-20 Henkel Ag & Co. Kgaa Worklife improvement for multilayer articles and methods for the preparation and use thereof
JP7154037B2 (ja) * 2017-05-16 2022-10-17 デクセリアルズ株式会社 アンダーフィル材、アンダーフィルフィルム、及びこれを用いた半導体装置の製造方法
JP6920723B2 (ja) 2017-07-14 2021-08-18 ナミックス株式会社 加圧実装用ｎｃｆ
JP7066350B2 (ja) * 2017-08-03 2022-05-13 三井化学東セロ株式会社 生産性に優れたギャングボンディングプロセス用アンダーフィル絶縁フィルム
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US20210147680A1 (en) 2018-04-26 2021-05-20 Mitsubishi Gas Chemical Company, Inc. Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
TWI801565B (zh) * 2018-04-26 2023-05-11 日商三菱瓦斯化學股份有限公司 樹脂組成物、疊層體、附樹脂組成物層之半導體晶圓、附樹脂組成物層之半導體搭載用基板、以及半導體裝置
JP6597845B2 (ja) * 2018-06-25 2019-10-30 日立化成株式会社 先供給型アンダーフィル材、電子部品装置及び電子部品装置の製造方法
EP3827060A4 (en) * 2018-07-24 2022-07-27 Henkel AG & Co. KGaA FLAME RETARDANT ADHESIVE COMPOSITION
JP2020107754A (ja) * 2018-12-27 2020-07-09 東京応化工業株式会社 電子部品の製造方法、及びキット
JP7110090B2 (ja) * 2018-12-28 2022-08-01 東京エレクトロン株式会社 基板処理方法および基板処理システム
WO2020262588A1 (ja) 2019-06-28 2020-12-30 三菱瓦斯化学株式会社 フィルム、積層体、フィルム層付き半導体ウェハ、フィルム層付き半導体搭載用基板、及び半導体装置
KR102887439B1 (ko) 2019-06-28 2025-11-18 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 수지 시트, 적층체, 수지 조성물층 부착 반도체 웨이퍼, 수지 조성물층 부착 반도체 탑재용 기판, 및 반도체 장치
CN114127192B (zh) 2019-06-28 2025-02-18 三菱瓦斯化学株式会社 薄膜、层叠体、带薄膜层的半导体晶圆、带薄膜层的半导体搭载用基板、及半导体装置
JP7515787B2 (ja) 2019-06-28 2024-07-16 三菱瓦斯化学株式会社 フィルム、積層体、フィルム層付き半導体ウェハ、フィルム層付き半導体搭載用基板、及び半導体装置
JP7406336B2 (ja) * 2019-10-11 2023-12-27 三星電子株式会社 半導体装置の製造方法
JP6844680B2 (ja) * 2019-12-12 2021-03-17 昭和電工マテリアルズ株式会社 先供給型アンダーフィル材、先供給型アンダーフィル材の硬化物、電子部品装置及び電子部品装置の製造方法
JP6844685B2 (ja) * 2019-12-26 2021-03-17 昭和電工マテリアルズ株式会社 先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法
WO2021152934A1 (ja) 2020-01-29 2021-08-05 株式会社村田製作所 電極付き受動部品及び電極付き受動部品の集合体
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FR3113771B1 (fr) * 2020-08-27 2022-10-21 Commissariat Energie Atomique Procédé de fabrication d'un substrat-poignée destiné au collage temporaire d'un substrat.
CN114316872B (zh) 2020-09-29 2023-09-05 上海飞凯材料科技股份有限公司 一种临时粘合剂及其应用和应用方法
CN113427839A (zh) * 2021-08-26 2021-09-24 金石(天津)科技发展有限公司 复合膜袋及其制备方法
TW202611264A (zh) * 2024-08-26 2026-03-16 德商漢高股份有限及兩合公司 B階段的熱導黏著劑

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1235615A (zh) * 1996-09-02 1999-11-17 Dsm有限公司 液态可固化树脂组合物
WO2011090038A1 (ja) * 2010-01-21 2011-07-28 積水化学工業株式会社 熱硬化性樹脂組成物、フリップチップ実装用接着剤、半導体装置の製造方法、及び、半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7144956B2 (en) * 1998-11-02 2006-12-05 Henkel Corporation Polymerizable compositions in non-flowable forms
JP4883749B2 (ja) * 2005-02-08 2012-02-22 日東電工株式会社 光学部材用粘着剤組成物、光学部材用粘着剤層およびその製造方法、粘着剤付光学部材、ならびに画像表示装置
WO2009048061A1 (ja) * 2007-10-09 2009-04-16 Hitachi Chemical Company, Ltd. 接着フィルム付き半導体チップの製造方法及びこの製造方法に用いられる半導体用接着フィルム、並びに、半導体装置の製造方法
CN101925663A (zh) * 2008-04-17 2010-12-22 日立化成工业株式会社 粘接剂组合物、电路连接用粘接剂、连接体及半导体装置
JP6085076B2 (ja) * 2009-03-16 2017-02-22 リンテック株式会社 粘着シートおよび半導体ウエハの加工方法、半導体チップの製造方法
KR20120068751A (ko) * 2010-07-26 2012-06-27 히다치 가세고교 가부시끼가이샤 접착제 조성물, 접속 구조체, 접속 구조체의 제조 방법 및 접착제 조성물의 용도
US9623660B2 (en) * 2013-05-14 2017-04-18 Xerox Corporation B-stage film adhesive compatible with aqueous ink for printhead structures interstitial bonding in high density piezo printheads fabrication for aqueous inkjet

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1235615A (zh) * 1996-09-02 1999-11-17 Dsm有限公司 液态可固化树脂组合物
WO2011090038A1 (ja) * 2010-01-21 2011-07-28 積水化学工業株式会社 熱硬化性樹脂組成物、フリップチップ実装用接着剤、半導体装置の製造方法、及び、半導体装置

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