JP6138603B2 - 冷却装置、冷却装置の製造方法及び半導体装置 - Google Patents

冷却装置、冷却装置の製造方法及び半導体装置 Download PDF

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Publication number
JP6138603B2
JP6138603B2 JP2013131816A JP2013131816A JP6138603B2 JP 6138603 B2 JP6138603 B2 JP 6138603B2 JP 2013131816 A JP2013131816 A JP 2013131816A JP 2013131816 A JP2013131816 A JP 2013131816A JP 6138603 B2 JP6138603 B2 JP 6138603B2
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Japan
Prior art keywords
substrate
pipe
flow path
cooling device
metal layer
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JP2013131816A
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English (en)
Japanese (ja)
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JP2015008169A (ja
JP2015008169A5 (https=
Inventor
坂口　秀明
秀明 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2013131816A priority Critical patent/JP6138603B2/ja
Priority to US14/311,416 priority patent/US9646924B2/en
Publication of JP2015008169A publication Critical patent/JP2015008169A/ja
Publication of JP2015008169A5 publication Critical patent/JP2015008169A5/ja
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2013131816A 2013-06-24 2013-06-24 冷却装置、冷却装置の製造方法及び半導体装置 Active JP6138603B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013131816A JP6138603B2 (ja) 2013-06-24 2013-06-24 冷却装置、冷却装置の製造方法及び半導体装置
US14/311,416 US9646924B2 (en) 2013-06-24 2014-06-23 Interposer, method for manufacturing interposer, and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013131816A JP6138603B2 (ja) 2013-06-24 2013-06-24 冷却装置、冷却装置の製造方法及び半導体装置

Publications (3)

Publication Number Publication Date
JP2015008169A JP2015008169A (ja) 2015-01-15
JP2015008169A5 JP2015008169A5 (https=) 2016-03-10
JP6138603B2 true JP6138603B2 (ja) 2017-05-31

Family

ID=52110773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013131816A Active JP6138603B2 (ja) 2013-06-24 2013-06-24 冷却装置、冷却装置の製造方法及び半導体装置

Country Status (2)

Country Link
US (1) US9646924B2 (https=)
JP (1) JP6138603B2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6274058B2 (ja) * 2014-09-22 2018-02-07 株式会社デンソー 電子装置、及び電子装置を備えた電子構造体
US10694641B2 (en) 2016-04-29 2020-06-23 Intel Corporation Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms
JP7159620B2 (ja) * 2018-05-30 2022-10-25 富士電機株式会社 半導体装置、冷却モジュール、電力変換装置及び電動車両
US10763186B2 (en) * 2018-12-31 2020-09-01 Micron Technology, Inc. Package cooling by coil cavity
US11735495B2 (en) * 2019-02-27 2023-08-22 Intel Corporation Active package cooling structures using molded substrate packaging technology
US10872835B1 (en) * 2019-07-03 2020-12-22 Micron Technology, Inc. Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same
JP7396461B2 (ja) * 2020-03-18 2023-12-12 株式会社村田製作所 回路基板モジュール
US12300579B2 (en) * 2021-06-14 2025-05-13 Intel Corporation Liquid cooled interposer for integrated circuit stack
US20240036278A1 (en) * 2022-07-29 2024-02-01 Google Llc 3D High Bandwidth Memory and Optical Connectivity Stacking

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5119890B2 (https=) 1971-11-29 1976-06-21
FR2578099B1 (fr) * 1985-02-26 1987-12-04 Eurofarad Substrat monolithique pour composant electronique de puissance, et procede pour sa fabrication
US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
US6219237B1 (en) 1998-08-31 2001-04-17 Micron Technology, Inc. Structure and method for an electronic assembly
JP4859520B2 (ja) 2006-04-28 2012-01-25 株式会社カネカ 血圧降下性ペプチドの吸着材、吸着方法および吸着装置
JP2008159619A (ja) * 2006-12-20 2008-07-10 Shinko Electric Ind Co Ltd 半導体装置
JP2010161184A (ja) * 2009-01-08 2010-07-22 Hitachi Ltd 半導体装置
US20120103575A1 (en) * 2010-11-03 2012-05-03 Hon Hai Precision Industry Co., Ltd. Cooling device
KR101739939B1 (ko) * 2011-03-16 2017-05-26 삼성전자주식회사 반도체 장치의 제조 방법
US8987891B2 (en) * 2012-03-05 2015-03-24 Centipede Systems, Inc. Heat sink apparatus for microelectronic devices
US8860212B1 (en) * 2013-04-15 2014-10-14 Freescale Semiconductor, Inc. Fluid cooled semiconductor die package

Also Published As

Publication number Publication date
US9646924B2 (en) 2017-05-09
JP2015008169A (ja) 2015-01-15
US20140376189A1 (en) 2014-12-25

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