JP6110581B2 - 高周波信号伝送回路形成用表面処理銅箔、銅張積層板及びプリント配線板 - Google Patents

高周波信号伝送回路形成用表面処理銅箔、銅張積層板及びプリント配線板 Download PDF

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Publication number
JP6110581B2
JP6110581B2 JP2016562598A JP2016562598A JP6110581B2 JP 6110581 B2 JP6110581 B2 JP 6110581B2 JP 2016562598 A JP2016562598 A JP 2016562598A JP 2016562598 A JP2016562598 A JP 2016562598A JP 6110581 B2 JP6110581 B2 JP 6110581B2
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Japan
Prior art keywords
copper
copper foil
frequency signal
signal transmission
layer
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JP2016562598A
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English (en)
Japanese (ja)
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JPWO2016088884A1 (ja
Inventor
裕昭 津吉
裕昭 津吉
俊宏 細井
俊宏 細井
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Mitsui Mining and Smelting Co Ltd
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Mitsui Mining and Smelting Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Non-Insulated Conductors (AREA)
JP2016562598A 2014-12-05 2015-12-04 高周波信号伝送回路形成用表面処理銅箔、銅張積層板及びプリント配線板 Active JP6110581B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014247460 2014-12-05
JP2014247460 2014-12-05
PCT/JP2015/084186 WO2016088884A1 (ja) 2014-12-05 2015-12-04 高周波信号伝送回路形成用表面処理銅箔、銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
JP6110581B2 true JP6110581B2 (ja) 2017-04-05
JPWO2016088884A1 JPWO2016088884A1 (ja) 2017-04-27

Family

ID=56091819

Family Applications (1)

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JP2016562598A Active JP6110581B2 (ja) 2014-12-05 2015-12-04 高周波信号伝送回路形成用表面処理銅箔、銅張積層板及びプリント配線板

Country Status (5)

Country Link
JP (1) JP6110581B2 (ko)
KR (1) KR101931895B1 (ko)
CN (1) CN107109663B (ko)
TW (1) TWI611738B (ko)
WO (1) WO2016088884A1 (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019187558A1 (ja) * 2018-03-30 2019-10-03 住友大阪セメント株式会社 光導波路素子
US11770904B2 (en) 2019-02-04 2023-09-26 Panasonic Intellectual Property Management Co., Ltd. Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same
US11866536B2 (en) 2019-02-04 2024-01-09 Panasonic Intellectual Property Management Co., Ltd. Copper-clad laminate plate, resin-attached copper foil, and circuit board using same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6832581B2 (ja) * 2016-07-15 2021-02-24 ナミックス株式会社 プリント配線板に用いる銅箔の製造方法
JP7013003B2 (ja) * 2017-11-10 2022-01-31 ナミックス株式会社 粗面化処理された銅表面を有する物体
JP7456578B2 (ja) * 2019-05-09 2024-03-27 ナミックス株式会社 銅表面の加工装置
CN110029336B (zh) * 2019-05-24 2021-05-14 电子科技大学 一种多层印制电路板制造用铜表面处理液及处理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4916154B2 (ja) * 2005-10-12 2012-04-11 Ｊｘ日鉱日石金属株式会社 回路用銅又は銅合金箔
KR20130027484A (ko) * 2010-03-01 2013-03-15 후루카와 덴키 고교 가부시키가이샤 동박의 표면처리방법, 표면처리된 동박, 및 리튬 이온 2차 전지의 음극 컬렉터용 동박
JP5901066B2 (ja) * 2012-04-27 2016-04-06 三井金属鉱業株式会社 樹脂組成物、樹脂層付金属箔、金属張積層板及びプリント配線板
CN105102678B (zh) * 2013-02-14 2018-06-12 三井金属矿业株式会社 表面处理铜箔及用表面处理铜箔得到的覆铜层压板
WO2015040998A1 (ja) * 2013-09-20 2015-03-26 三井金属鉱業株式会社 銅箔、キャリア箔付銅箔及び銅張積層板
KR101734795B1 (ko) * 2014-01-27 2017-05-11 미쓰이금속광업주식회사 조화 처리 구리박, 동장 적층판 및 프린트 배선판

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019187558A1 (ja) * 2018-03-30 2019-10-03 住友大阪セメント株式会社 光導波路素子
JP2019179122A (ja) * 2018-03-30 2019-10-17 住友大阪セメント株式会社 光導波路素子
US11327347B2 (en) 2018-03-30 2022-05-10 Sumitomo Osaka Cement Co., Ltd. Optical waveguide element
JP7135384B2 (ja) 2018-03-30 2022-09-13 住友大阪セメント株式会社 光導波路素子
US11770904B2 (en) 2019-02-04 2023-09-26 Panasonic Intellectual Property Management Co., Ltd. Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same
US11866536B2 (en) 2019-02-04 2024-01-09 Panasonic Intellectual Property Management Co., Ltd. Copper-clad laminate plate, resin-attached copper foil, and circuit board using same

Also Published As

Publication number Publication date
TW201640964A (zh) 2016-11-16
JPWO2016088884A1 (ja) 2017-04-27
WO2016088884A1 (ja) 2016-06-09
CN107109663B (zh) 2020-03-10
KR101931895B1 (ko) 2018-12-21
CN107109663A (zh) 2017-08-29
TWI611738B (zh) 2018-01-11
KR20170078798A (ko) 2017-07-07

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