JP6077836B2 - 半導体装置、液体吐出ヘッド、液体吐出カートリッジ及び液体吐出装置 - Google Patents

半導体装置、液体吐出ヘッド、液体吐出カートリッジ及び液体吐出装置 Download PDF

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Publication number
JP6077836B2
JP6077836B2 JP2012254627A JP2012254627A JP6077836B2 JP 6077836 B2 JP6077836 B2 JP 6077836B2 JP 2012254627 A JP2012254627 A JP 2012254627A JP 2012254627 A JP2012254627 A JP 2012254627A JP 6077836 B2 JP6077836 B2 JP 6077836B2
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Japan
Prior art keywords
conductive patterns
semiconductor device
bonding pad
conductive
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012254627A
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English (en)
Japanese (ja)
Other versions
JP2014100856A (ja
JP2014100856A5 (enExample
Inventor
鈴木　達也
達也 鈴木
一成 藤井
一成 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2012254627A priority Critical patent/JP6077836B2/ja
Priority to US14/067,029 priority patent/US9302478B2/en
Priority to CN201310573912.3A priority patent/CN103832074B/zh
Publication of JP2014100856A publication Critical patent/JP2014100856A/ja
Publication of JP2014100856A5 publication Critical patent/JP2014100856A5/ja
Application granted granted Critical
Publication of JP6077836B2 publication Critical patent/JP6077836B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04506—Control methods or devices therefor, e.g. driver circuits, control circuits aiming at correcting manufacturing tolerances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0458—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on heating elements forming bubbles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2012254627A 2012-11-20 2012-11-20 半導体装置、液体吐出ヘッド、液体吐出カートリッジ及び液体吐出装置 Expired - Fee Related JP6077836B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012254627A JP6077836B2 (ja) 2012-11-20 2012-11-20 半導体装置、液体吐出ヘッド、液体吐出カートリッジ及び液体吐出装置
US14/067,029 US9302478B2 (en) 2012-11-20 2013-10-30 Semiconductor device, liquid discharge head, liquid discharge cartridge, and liquid discharge apparatus
CN201310573912.3A CN103832074B (zh) 2012-11-20 2013-11-15 半导体装置、液体排出头、液体排出盒和液体排出设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012254627A JP6077836B2 (ja) 2012-11-20 2012-11-20 半導体装置、液体吐出ヘッド、液体吐出カートリッジ及び液体吐出装置

Publications (3)

Publication Number Publication Date
JP2014100856A JP2014100856A (ja) 2014-06-05
JP2014100856A5 JP2014100856A5 (enExample) 2015-10-08
JP6077836B2 true JP6077836B2 (ja) 2017-02-08

Family

ID=50727532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012254627A Expired - Fee Related JP6077836B2 (ja) 2012-11-20 2012-11-20 半導体装置、液体吐出ヘッド、液体吐出カートリッジ及び液体吐出装置

Country Status (3)

Country Link
US (1) US9302478B2 (enExample)
JP (1) JP6077836B2 (enExample)
CN (1) CN103832074B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9248648B2 (en) 2014-06-20 2016-02-02 Stmicroelectronics S.R.L. Microfluidic die with multiple heaters in a chamber
US9358567B2 (en) 2014-06-20 2016-06-07 Stmicroelectronics, Inc. Microfluidic system with single drive signal for multiple nozzles
JP2016221902A (ja) 2015-06-02 2016-12-28 キヤノン株式会社 半導体装置、液体吐出ヘッド、液体吐出カートリッジ及び液体吐出装置
JP6664261B2 (ja) 2016-04-07 2020-03-13 キヤノン株式会社 半導体装置及び液体吐出ヘッド用基板
JP6948167B2 (ja) * 2017-06-15 2021-10-13 キヤノン株式会社 半導体装置、液体吐出ヘッド及び液体吐出装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5762043U (enExample) * 1980-09-30 1982-04-13
JPS63183863A (ja) * 1987-01-26 1988-07-29 Nec Corp サ−マルヘツド
JPH0834133A (ja) * 1994-07-22 1996-02-06 Rohm Co Ltd サーマルヘッドおよびこれを用いたプリンタ
JP4350408B2 (ja) * 2003-04-10 2009-10-21 キヤノン株式会社 記録ヘッド用基板、記録ヘッド、及び記録装置
JP4537159B2 (ja) 2003-09-08 2010-09-01 キヤノン株式会社 液体吐出ヘッド用半導体装置、液体吐出へッド及び液体吐出装置
TWI267446B (en) * 2003-11-06 2006-12-01 Canon Kk Printhead substrate, printhead using the substrate, head cartridge including the printhead, method of driving the printhead, and printing apparatus using the printhead
CN101117047B (zh) * 2003-12-18 2011-08-10 佳能株式会社 记录头的元件基体和具有该元件基体的记录头
JP4537166B2 (ja) * 2004-10-06 2010-09-01 キヤノン株式会社 液体吐出ヘッド
JP2007250649A (ja) * 2006-03-14 2007-09-27 Canon Inc 記録素子駆動回路および記録素子駆動回路のレイアウト方法
US7758141B2 (en) * 2006-06-23 2010-07-20 Canon Kabushiki Kaisha Printing apparatus for selectively driving heaters using a reduced number of data signal lines
JP5225132B2 (ja) * 2009-02-06 2013-07-03 キヤノン株式会社 液体吐出ヘッドおよびインクジェット記録装置
JP5539030B2 (ja) * 2010-05-28 2014-07-02 キヤノン株式会社 半導体装置、液体吐出ヘッド、液体吐出ヘッドカートリッジ及び液体吐出装置
JP2011254801A (ja) 2010-06-10 2011-12-22 Akuto Kk 鳥類忌避追い払い装置

Also Published As

Publication number Publication date
CN103832074A (zh) 2014-06-04
JP2014100856A (ja) 2014-06-05
US9302478B2 (en) 2016-04-05
US20140139590A1 (en) 2014-05-22
CN103832074B (zh) 2015-06-03

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