CN103832074B - 半导体装置、液体排出头、液体排出盒和液体排出设备 - Google Patents

半导体装置、液体排出头、液体排出盒和液体排出设备 Download PDF

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Publication number
CN103832074B
CN103832074B CN201310573912.3A CN201310573912A CN103832074B CN 103832074 B CN103832074 B CN 103832074B CN 201310573912 A CN201310573912 A CN 201310573912A CN 103832074 B CN103832074 B CN 103832074B
Authority
CN
China
Prior art keywords
conductive patterns
semiconductor device
conductive pattern
conductive
bonding pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310573912.3A
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English (en)
Chinese (zh)
Other versions
CN103832074A (zh
Inventor
铃木达也
藤井一成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN103832074A publication Critical patent/CN103832074A/zh
Application granted granted Critical
Publication of CN103832074B publication Critical patent/CN103832074B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04506—Control methods or devices therefor, e.g. driver circuits, control circuits aiming at correcting manufacturing tolerances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0458—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on heating elements forming bubbles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN201310573912.3A 2012-11-20 2013-11-15 半导体装置、液体排出头、液体排出盒和液体排出设备 Expired - Fee Related CN103832074B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-254627 2012-11-20
JP2012254627A JP6077836B2 (ja) 2012-11-20 2012-11-20 半導体装置、液体吐出ヘッド、液体吐出カートリッジ及び液体吐出装置

Publications (2)

Publication Number Publication Date
CN103832074A CN103832074A (zh) 2014-06-04
CN103832074B true CN103832074B (zh) 2015-06-03

Family

ID=50727532

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310573912.3A Expired - Fee Related CN103832074B (zh) 2012-11-20 2013-11-15 半导体装置、液体排出头、液体排出盒和液体排出设备

Country Status (3)

Country Link
US (1) US9302478B2 (enExample)
JP (1) JP6077836B2 (enExample)
CN (1) CN103832074B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9358567B2 (en) 2014-06-20 2016-06-07 Stmicroelectronics, Inc. Microfluidic system with single drive signal for multiple nozzles
US9248648B2 (en) 2014-06-20 2016-02-02 Stmicroelectronics S.R.L. Microfluidic die with multiple heaters in a chamber
JP2016221902A (ja) 2015-06-02 2016-12-28 キヤノン株式会社 半導体装置、液体吐出ヘッド、液体吐出カートリッジ及び液体吐出装置
JP6664261B2 (ja) 2016-04-07 2020-03-13 キヤノン株式会社 半導体装置及び液体吐出ヘッド用基板
JP6948167B2 (ja) * 2017-06-15 2021-10-13 キヤノン株式会社 半導体装置、液体吐出ヘッド及び液体吐出装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1535826A (zh) * 2003-04-10 2004-10-13 佳能株式会社 记录头用基板、记录头和记录装置
CN1613648A (zh) * 2003-11-06 2005-05-11 佳能株式会社 记录头用基板、记录头、头墨盒、记录头的驱动方法和记录装置
JP2007250649A (ja) * 2006-03-14 2007-09-27 Canon Inc 記録素子駆動回路および記録素子駆動回路のレイアウト方法
CN101092076A (zh) * 2006-06-23 2007-12-26 佳能株式会社 用于记录头的器件衬底、记录头和包括记录头的记录设备
CN101117047A (zh) * 2003-12-18 2008-02-06 佳能株式会社 记录头的元件基体和具有该元件基体的记录头
CN102259492A (zh) * 2010-05-28 2011-11-30 佳能株式会社 半导体器件、液体排出头、液体排出盒和液体排出装置
CN102307732A (zh) * 2009-02-06 2012-01-04 佳能株式会社 液体喷射头和喷墨打印装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5762043U (enExample) * 1980-09-30 1982-04-13
JPS63183863A (ja) * 1987-01-26 1988-07-29 Nec Corp サ−マルヘツド
JPH0834133A (ja) * 1994-07-22 1996-02-06 Rohm Co Ltd サーマルヘッドおよびこれを用いたプリンタ
JP4537159B2 (ja) 2003-09-08 2010-09-01 キヤノン株式会社 液体吐出ヘッド用半導体装置、液体吐出へッド及び液体吐出装置
JP4537166B2 (ja) * 2004-10-06 2010-09-01 キヤノン株式会社 液体吐出ヘッド
JP2011254801A (ja) 2010-06-10 2011-12-22 Akuto Kk 鳥類忌避追い払い装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1535826A (zh) * 2003-04-10 2004-10-13 佳能株式会社 记录头用基板、记录头和记录装置
CN1613648A (zh) * 2003-11-06 2005-05-11 佳能株式会社 记录头用基板、记录头、头墨盒、记录头的驱动方法和记录装置
CN101117047A (zh) * 2003-12-18 2008-02-06 佳能株式会社 记录头的元件基体和具有该元件基体的记录头
JP2007250649A (ja) * 2006-03-14 2007-09-27 Canon Inc 記録素子駆動回路および記録素子駆動回路のレイアウト方法
CN101092076A (zh) * 2006-06-23 2007-12-26 佳能株式会社 用于记录头的器件衬底、记录头和包括记录头的记录设备
CN102307732A (zh) * 2009-02-06 2012-01-04 佳能株式会社 液体喷射头和喷墨打印装置
CN102259492A (zh) * 2010-05-28 2011-11-30 佳能株式会社 半导体器件、液体排出头、液体排出盒和液体排出装置

Also Published As

Publication number Publication date
US20140139590A1 (en) 2014-05-22
JP6077836B2 (ja) 2017-02-08
US9302478B2 (en) 2016-04-05
CN103832074A (zh) 2014-06-04
JP2014100856A (ja) 2014-06-05

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