JP6077437B2 - 基板処理装置およびノズル洗浄方法 - Google Patents

基板処理装置およびノズル洗浄方法 Download PDF

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Publication number
JP6077437B2
JP6077437B2 JP2013247813A JP2013247813A JP6077437B2 JP 6077437 B2 JP6077437 B2 JP 6077437B2 JP 2013247813 A JP2013247813 A JP 2013247813A JP 2013247813 A JP2013247813 A JP 2013247813A JP 6077437 B2 JP6077437 B2 JP 6077437B2
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Japan
Prior art keywords
nozzle
cleaning
tank
liquid
overflow
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JP2013247813A
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English (en)
Japanese (ja)
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JP2015006652A (ja
JP2015006652A5 (enExample
Inventor
義広 甲斐
義広 甲斐
義謙 池田
義謙 池田
和義 篠原
和義 篠原
小田　哲也
哲也 小田
田中　暁
暁 田中
祐希 吉田
祐希 吉田
明徳 相原
明徳 相原
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2013247813A priority Critical patent/JP6077437B2/ja
Priority to TW103118472A priority patent/TWI569348B/zh
Priority to US14/291,494 priority patent/US9764345B2/en
Priority to KR1020140065736A priority patent/KR102237507B1/ko
Publication of JP2015006652A publication Critical patent/JP2015006652A/ja
Publication of JP2015006652A5 publication Critical patent/JP2015006652A5/ja
Application granted granted Critical
Publication of JP6077437B2 publication Critical patent/JP6077437B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B05B15/555—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids discharged by cleaning nozzles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0075—Cleaning of glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
JP2013247813A 2013-05-31 2013-11-29 基板処理装置およびノズル洗浄方法 Active JP6077437B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013247813A JP6077437B2 (ja) 2013-05-31 2013-11-29 基板処理装置およびノズル洗浄方法
TW103118472A TWI569348B (zh) 2013-05-31 2014-05-27 基板處理裝置及噴嘴清洗方法
US14/291,494 US9764345B2 (en) 2013-05-31 2014-05-30 Substrate processing apparatus and nozzle cleaning method
KR1020140065736A KR102237507B1 (ko) 2013-05-31 2014-05-30 기판 처리 장치 및 노즐 세정 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013115904 2013-05-31
JP2013115904 2013-05-31
JP2013247813A JP6077437B2 (ja) 2013-05-31 2013-11-29 基板処理装置およびノズル洗浄方法

Publications (3)

Publication Number Publication Date
JP2015006652A JP2015006652A (ja) 2015-01-15
JP2015006652A5 JP2015006652A5 (enExample) 2016-01-21
JP6077437B2 true JP6077437B2 (ja) 2017-02-08

Family

ID=51983736

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JP2013247813A Active JP6077437B2 (ja) 2013-05-31 2013-11-29 基板処理装置およびノズル洗浄方法

Country Status (4)

Country Link
US (1) US9764345B2 (enExample)
JP (1) JP6077437B2 (enExample)
KR (1) KR102237507B1 (enExample)
TW (1) TWI569348B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999067802A1 (fr) * 1998-06-25 1999-12-29 Hamamatsu Photonics K.K. Photocathode

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JP6461617B2 (ja) * 2015-01-20 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6527716B2 (ja) * 2015-02-27 2019-06-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置の制御方法
JP6534578B2 (ja) * 2015-08-03 2019-06-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6407829B2 (ja) * 2015-09-30 2018-10-17 東京エレクトロン株式会社 基板液処理装置、基板液処理方法
JP6494536B2 (ja) * 2016-01-12 2019-04-03 東京エレクトロン株式会社 基板処理装置および基板処理装置の洗浄方法
KR101710859B1 (ko) * 2016-06-16 2017-03-02 주식회사 위드텍 웨이퍼 표면의 이온성 오염물 측정 장치 및 방법
CN106449481A (zh) * 2016-10-24 2017-02-22 上海华力微电子有限公司 改善单片清洗机的喷嘴工艺的方法、喷嘴清洗装置
JP6914050B2 (ja) * 2017-02-15 2021-08-04 東京エレクトロン株式会社 基板処理装置
KR102186069B1 (ko) * 2018-05-11 2020-12-07 세메스 주식회사 기판 처리 장치 및 방법
CN112718690A (zh) * 2020-12-31 2021-04-30 上海至纯洁净系统科技股份有限公司 一种自动化晶圆夹手喷淋分离的清洗槽设备
KR102635382B1 (ko) * 2020-12-31 2024-02-14 세메스 주식회사 기판 처리 장치 및 방법
KR102483378B1 (ko) * 2021-03-31 2022-12-30 엘에스이 주식회사 포켓형 노즐 세척장치
KR102629496B1 (ko) * 2021-12-24 2024-01-29 세메스 주식회사 홈 포트 및 기판 처리 장치
CN115101449B (zh) * 2022-07-06 2025-12-02 至微半导体(上海)有限公司 一种用于晶圆表面清洗的装置
CN120727608A (zh) * 2024-03-29 2025-09-30 北京北方华创微电子装备有限公司 用于半导体工艺设备的喷淋结构及半导体工艺设备

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EP0849774B1 (en) * 1996-12-19 2004-12-15 Texas Instruments Incorporated System and method for delivering a spin-on-glass on a substrate
JP3381776B2 (ja) * 1998-05-19 2003-03-04 東京エレクトロン株式会社 処理装置および処理方法
JP3511106B2 (ja) * 1999-04-07 2004-03-29 東京応化工業株式会社 スリットノズルの洗浄装置
JP3824054B2 (ja) * 2000-03-24 2006-09-20 東京エレクトロン株式会社 塗布処理方法および塗布処理装置
KR100396829B1 (ko) * 2000-11-10 2003-09-02 (주)케이.씨.텍 브러시 세정 장치의 브러시 세척 기구
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JP4202934B2 (ja) * 2004-01-23 2008-12-24 東京エレクトロン株式会社 塗布装置
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JP4606234B2 (ja) * 2005-04-15 2011-01-05 東京エレクトロン株式会社 液処理方法及び液処理装置
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JP4582654B2 (ja) * 2006-05-23 2010-11-17 東京エレクトロン株式会社 ノズル洗浄装置、ノズル洗浄方法、ノズル洗浄プログラム、及びそのプログラムを記録したコンピュータ読み取り可能な記録媒体
KR100876377B1 (ko) * 2006-06-16 2008-12-29 세메스 주식회사 노즐 세정 기구 및 이를 포함하는 기판 처리 장치
KR100895030B1 (ko) * 2007-06-14 2009-04-24 세메스 주식회사 기판 처리 장치 및 이에 구비된 노즐의 세정 방법
KR20080112541A (ko) * 2007-06-21 2008-12-26 삼성전자주식회사 프린트헤드 세척장치 및 이를 갖는 잉크젯 화상형성장치
KR100941075B1 (ko) * 2007-12-27 2010-02-09 세메스 주식회사 처리액 공급 유닛과, 이를 이용한 기판 처리 장치 및 방법
JP5036664B2 (ja) * 2008-09-04 2012-09-26 東京エレクトロン株式会社 液処理におけるノズル洗浄、処理液乾燥防止方法及びその装置
TWM354844U (en) * 2008-09-19 2009-04-11 Advanced Wireless Semiconductor Company Equipment for cleaning photoresist nozzle
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KR20110008539A (ko) * 2009-07-20 2011-01-27 세메스 주식회사 노즐 세정 장치 및 이를 포함하는 약액 도포 장치
TWI566311B (zh) * 2011-06-27 2017-01-11 聯華電子股份有限公司 半導體機台與其操作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999067802A1 (fr) * 1998-06-25 1999-12-29 Hamamatsu Photonics K.K. Photocathode

Also Published As

Publication number Publication date
US9764345B2 (en) 2017-09-19
JP2015006652A (ja) 2015-01-15
KR20140141514A (ko) 2014-12-10
TW201519348A (zh) 2015-05-16
US20140352730A1 (en) 2014-12-04
TWI569348B (zh) 2017-02-01
KR102237507B1 (ko) 2021-04-06

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