JP6073041B2 - 熱を放散するための改善された通気を有する電子装置のエンクロージャ - Google Patents

熱を放散するための改善された通気を有する電子装置のエンクロージャ Download PDF

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JP6073041B2
JP6073041B2 JP2010207795A JP2010207795A JP6073041B2 JP 6073041 B2 JP6073041 B2 JP 6073041B2 JP 2010207795 A JP2010207795 A JP 2010207795A JP 2010207795 A JP2010207795 A JP 2010207795A JP 6073041 B2 JP6073041 B2 JP 6073041B2
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circuit board
electronic circuit
baffle
housing
enclosure
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Japanese (ja)
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JP2011066421A5 (enExample
JP2011066421A (ja
Inventor
アール ミラー アーリン
アール ミラー アーリン
ロー ゲアリ
ロー ゲアリ
エー． バー ケント
エー． バー ケント
ノーブル−キャンベル ポール
ノーブル−キャンベル ポール
ラム ヴィンセント
ラム ヴィンセント
エイベリー ローラ
エイベリー ローラ
ルイス ギャレット
ルイス ギャレット
スローン ケビン
スローン ケビン
ウィリアム フーヒー マーク
ウィリアム フーヒー マーク
Original Assignee
フィッシャー−ローズマウント システムズ，インコーポレイテッド
フィッシャー−ローズマウント システムズ，インコーポレイテッド
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Publication of JP2011066421A publication Critical patent/JP2011066421A/ja
Publication of JP2011066421A5 publication Critical patent/JP2011066421A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2010207795A 2009-09-18 2010-09-16 熱を放散するための改善された通気を有する電子装置のエンクロージャ Active JP6073041B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/562,546 US7903405B1 (en) 2009-09-18 2009-09-18 Electronic device enclosures having improved ventilation to dissipate heat
US12/562,546 2009-09-18

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016015192A Division JP6088078B2 (ja) 2009-09-18 2016-01-29 熱を放散するための改善された通気を有する電子装置のエンクロージャ

Publications (3)

Publication Number Publication Date
JP2011066421A JP2011066421A (ja) 2011-03-31
JP2011066421A5 JP2011066421A5 (enExample) 2013-10-31
JP6073041B2 true JP6073041B2 (ja) 2017-02-01

Family

ID=43065390

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010207795A Active JP6073041B2 (ja) 2009-09-18 2010-09-16 熱を放散するための改善された通気を有する電子装置のエンクロージャ
JP2016015192A Active JP6088078B2 (ja) 2009-09-18 2016-01-29 熱を放散するための改善された通気を有する電子装置のエンクロージャ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016015192A Active JP6088078B2 (ja) 2009-09-18 2016-01-29 熱を放散するための改善された通気を有する電子装置のエンクロージャ

Country Status (6)

Country Link
US (1) US7903405B1 (enExample)
JP (2) JP6073041B2 (enExample)
CN (1) CN102026505B (enExample)
DE (1) DE102010037584B4 (enExample)
GB (2) GB2505357B (enExample)
PH (1) PH12010000283A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA145294S (en) * 2011-10-21 2013-03-27 Ellenberger & Poensgen Circuit breaker
USD673509S1 (en) * 2012-01-23 2013-01-01 Emerson Climate Technologies, Inc. Contactor housing
US9101049B2 (en) * 2013-01-02 2015-08-04 Mcafee Inc. Opacity baffle to prevent viewing of internal structures in secure electronic equipment
TWM461348U (zh) * 2013-02-19 2013-09-11 Compal Broadband Networks Inc 用於電子裝置之殼體
US10177070B2 (en) 2014-12-10 2019-01-08 Neograf Solutions, Llc Flexible graphite sheet support structure and thermal management arrangement
US9545030B2 (en) 2015-01-20 2017-01-10 Microsoft Technology Licensing, Llc Flexible thermal conduit for an electronic device
US9609739B2 (en) * 2015-03-10 2017-03-28 Kabushiki Kaisha Toshiba Electronic device
US10455202B2 (en) * 2016-05-13 2019-10-22 Lenovo (Beijing) Co., Ltd. Heat dissipating apparatus and electronic device
JP7062048B2 (ja) * 2018-03-22 2022-05-02 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2020239977A1 (en) * 2019-05-29 2020-12-03 Thomson Licensing Apparatus for heat management in an electronic device
US11729938B2 (en) * 2019-09-06 2023-08-15 Comcast Cable Communications, Llc Ventilated housing for electronic devices
US11101597B1 (en) * 2020-05-06 2021-08-24 Lear Corporation Vented electrical connector
EP4149224A1 (en) 2021-09-09 2023-03-15 Stryker European Operations Limited Housing assembly for accommodating printed circuit boards

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4665466A (en) * 1983-09-16 1987-05-12 Service Machine Company Low headroom ventilating apparatus for cooling an electrical enclosure
JPS619891U (ja) * 1984-06-20 1986-01-21 三菱電機株式会社 電子機器
JPS6115789U (ja) * 1984-07-02 1986-01-29 三菱電機株式会社 プログラマブルコントロ−ラ
JPS62190899A (ja) * 1986-02-06 1987-08-21 シ−メンス、アクチエンゲゼルシヤフト 自動化装置
US4732281A (en) * 1986-03-31 1988-03-22 The Babcock & Wilcox Company Mounting bracket assembly for electronic instrument mounting, heat dissipation and environmental protection
US4840225A (en) * 1987-04-10 1989-06-20 Digital Equipment Corporation Heat exchange element and enclosure incorporating same
JPH0332496U (enExample) * 1989-08-07 1991-03-29
DE4128047C2 (de) * 1991-08-23 1994-06-09 Schroff Gmbh Führungsschiene
JPH0878872A (ja) * 1994-09-08 1996-03-22 Nec Corp 通信装置筺体の放熱構造
SE504430C2 (sv) * 1995-06-20 1997-02-10 Ericsson Telefon Ab L M Magasin
JP3323881B2 (ja) * 1997-05-28 2002-09-09 シャープ株式会社 薄型ケーブルモデム及びその載置用スタンド
US5914858A (en) * 1997-11-13 1999-06-22 Northern Telecom Limited Baffle arrangement for an airflow balance system
JPH11260498A (ja) * 1998-03-13 1999-09-24 Mitsubishi Electric Corp ユニット式電子装置
US5978217A (en) * 1998-10-19 1999-11-02 International Business Machines Corporation Cooling air diffuser for computer enclosure
US5995368A (en) * 1998-10-20 1999-11-30 Nortel Networks Corporation Air flow distribution device for shelf-based circuit cards
JP2001144480A (ja) * 1999-11-12 2001-05-25 Yamatake Building Systems Co Ltd 熱発生源内蔵装置
US6749498B2 (en) * 2001-09-12 2004-06-15 Arris International, Inc. Ventilated outdoor electronics enclosure
US7167641B2 (en) * 2002-06-06 2007-01-23 S.C. Johnson & Son, Inc. Localized surface volatilization
TW592031B (en) * 2003-06-18 2004-06-11 Delta Electronics Inc Electronic apparatus with natural convection structure
US6912129B2 (en) * 2003-09-10 2005-06-28 Intel Corporation Chassis cooling system
US7652891B2 (en) * 2004-12-06 2010-01-26 Radisys Corporation Airflow control system
US7365974B2 (en) * 2005-10-14 2008-04-29 Smiths Aerospace Llc Method for electronics equipment cooling having improved EMI control and reduced weight
JP4917147B2 (ja) * 2006-03-20 2012-04-18 フレクストロニクス エイピー エルエルシー 空気入口または空気出口のサイズを拡大する電子機器外枠
US7394654B2 (en) * 2006-10-19 2008-07-01 Cisco Technology, Inc. Method and apparatus for providing thermal management in an electronic device
CN101257780B (zh) * 2007-02-27 2011-05-04 鸿富锦精密工业（深圳）有限公司 电子设备导风装置
US8154886B2 (en) * 2007-03-27 2012-04-10 Commscope, Inc. Of North Carolina Compact fiber panel with sliding tray having removable hood
US20090015120A1 (en) * 2007-07-13 2009-01-15 Tellabs Petaluma, Inc. Heat dissipation device for electronics cabinet
US20090201641A1 (en) * 2008-02-13 2009-08-13 Inventec Corporation Airflow conducting structure
US20100128433A1 (en) * 2008-11-21 2010-05-27 Charles Industries, Ltd. Cap for Electronics Enclosure

Also Published As

Publication number Publication date
US7903405B1 (en) 2011-03-08
GB2505357A (en) 2014-02-26
GB201320215D0 (en) 2014-01-01
GB2474106B (en) 2014-01-22
GB201015573D0 (en) 2010-10-27
PH12010000283A1 (en) 2013-03-11
DE102010037584B4 (de) 2021-04-08
CN102026505B (zh) 2015-07-22
DE102010037584A1 (de) 2011-03-31
JP6088078B2 (ja) 2017-03-01
CN102026505A (zh) 2011-04-20
US20110069449A1 (en) 2011-03-24
JP2016058759A (ja) 2016-04-21
GB2505357B (en) 2014-06-18
JP2011066421A (ja) 2011-03-31
GB2474106A (en) 2011-04-06

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