DE102010037584B4 - Gehäuse für elektronische Vorrichtungen mit verbesserter Lüftung zur Wärmeableitung - Google Patents

Gehäuse für elektronische Vorrichtungen mit verbesserter Lüftung zur Wärmeableitung Download PDF

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Publication number
DE102010037584B4
DE102010037584B4 DE102010037584.5A DE102010037584A DE102010037584B4 DE 102010037584 B4 DE102010037584 B4 DE 102010037584B4 DE 102010037584 A DE102010037584 A DE 102010037584A DE 102010037584 B4 DE102010037584 B4 DE 102010037584B4
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Germany
Prior art keywords
receptacle
baffle
electronic circuit
circuit board
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102010037584.5A
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German (de)
English (en)
Other versions
DE102010037584A1 (de
Inventor
Arlyn Earl Miller
Gary Law
Kent A. Burr
Paul Noble-Campbell
Vincent Lam
Laura Avery
Garrett Lewis
Kevin Sloan
Mark William Foohey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fisher Rosemount Systems Inc
Original Assignee
Fisher Rosemount Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fisher Rosemount Systems Inc filed Critical Fisher Rosemount Systems Inc
Publication of DE102010037584A1 publication Critical patent/DE102010037584A1/de
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Publication of DE102010037584B4 publication Critical patent/DE102010037584B4/de
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE102010037584.5A 2009-09-18 2010-09-16 Gehäuse für elektronische Vorrichtungen mit verbesserter Lüftung zur Wärmeableitung Active DE102010037584B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/562,546 US7903405B1 (en) 2009-09-18 2009-09-18 Electronic device enclosures having improved ventilation to dissipate heat
US12/562,546 2009-09-18

Publications (2)

Publication Number Publication Date
DE102010037584A1 DE102010037584A1 (de) 2011-03-31
DE102010037584B4 true DE102010037584B4 (de) 2021-04-08

Family

ID=43065390

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102010037584.5A Active DE102010037584B4 (de) 2009-09-18 2010-09-16 Gehäuse für elektronische Vorrichtungen mit verbesserter Lüftung zur Wärmeableitung

Country Status (6)

Country Link
US (1) US7903405B1 (enExample)
JP (2) JP6073041B2 (enExample)
CN (1) CN102026505B (enExample)
DE (1) DE102010037584B4 (enExample)
GB (2) GB2505357B (enExample)
PH (1) PH12010000283A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA145294S (en) * 2011-10-21 2013-03-27 Ellenberger & Poensgen Circuit breaker
USD673509S1 (en) * 2012-01-23 2013-01-01 Emerson Climate Technologies, Inc. Contactor housing
US9101049B2 (en) * 2013-01-02 2015-08-04 Mcafee Inc. Opacity baffle to prevent viewing of internal structures in secure electronic equipment
TWM461348U (zh) * 2013-02-19 2013-09-11 Compal Broadband Networks Inc 用於電子裝置之殼體
WO2016094150A1 (en) 2014-12-10 2016-06-16 Graftech International Holdings Inc. Flexible graphite sheet support structure and thermal management arrangement
US9585285B2 (en) 2015-01-20 2017-02-28 Microsoft Technology Licensing, Llc Heat dissipation structure for an electronic device
US9609739B2 (en) * 2015-03-10 2017-03-28 Kabushiki Kaisha Toshiba Electronic device
US10455202B2 (en) * 2016-05-13 2019-10-22 Lenovo (Beijing) Co., Ltd. Heat dissipating apparatus and electronic device
WO2019181804A1 (ja) * 2018-03-22 2019-09-26 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2020239977A1 (en) * 2019-05-29 2020-12-03 Thomson Licensing Apparatus for heat management in an electronic device
US11729938B2 (en) * 2019-09-06 2023-08-15 Comcast Cable Communications, Llc Ventilated housing for electronic devices
US11101597B1 (en) * 2020-05-06 2021-08-24 Lear Corporation Vented electrical connector
EP4149224A1 (en) 2021-09-09 2023-03-15 Stryker European Operations Limited Housing assembly for accommodating printed circuit boards

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4128047A1 (de) * 1991-08-23 1993-02-25 Schroff Gmbh Fuehrungsschiene
US20080094799A1 (en) * 2006-10-19 2008-04-24 Cisco Technology, Inc. Method and apparatus for providing thermal management in an electronic device

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US4665466A (en) * 1983-09-16 1987-05-12 Service Machine Company Low headroom ventilating apparatus for cooling an electrical enclosure
JPS619891U (ja) * 1984-06-20 1986-01-21 三菱電機株式会社 電子機器
JPS6115789U (ja) * 1984-07-02 1986-01-29 三菱電機株式会社 プログラマブルコントロ−ラ
JPS62190899A (ja) * 1986-02-06 1987-08-21 シ−メンス、アクチエンゲゼルシヤフト 自動化装置
US4732281A (en) * 1986-03-31 1988-03-22 The Babcock & Wilcox Company Mounting bracket assembly for electronic instrument mounting, heat dissipation and environmental protection
US4840225A (en) * 1987-04-10 1989-06-20 Digital Equipment Corporation Heat exchange element and enclosure incorporating same
JPH0332496U (enExample) * 1989-08-07 1991-03-29
JPH0878872A (ja) * 1994-09-08 1996-03-22 Nec Corp 通信装置筺体の放熱構造
SE504430C2 (sv) * 1995-06-20 1997-02-10 Ericsson Telefon Ab L M Magasin
JP3323881B2 (ja) * 1997-05-28 2002-09-09 シャープ株式会社 薄型ケーブルモデム及びその載置用スタンド
US5914858A (en) * 1997-11-13 1999-06-22 Northern Telecom Limited Baffle arrangement for an airflow balance system
JPH11260498A (ja) * 1998-03-13 1999-09-24 Mitsubishi Electric Corp ユニット式電子装置
US5978217A (en) * 1998-10-19 1999-11-02 International Business Machines Corporation Cooling air diffuser for computer enclosure
US5995368A (en) * 1998-10-20 1999-11-30 Nortel Networks Corporation Air flow distribution device for shelf-based circuit cards
JP2001144480A (ja) * 1999-11-12 2001-05-25 Yamatake Building Systems Co Ltd 熱発生源内蔵装置
US6749498B2 (en) * 2001-09-12 2004-06-15 Arris International, Inc. Ventilated outdoor electronics enclosure
US7167641B2 (en) * 2002-06-06 2007-01-23 S.C. Johnson & Son, Inc. Localized surface volatilization
TW592031B (en) * 2003-06-18 2004-06-11 Delta Electronics Inc Electronic apparatus with natural convection structure
US6912129B2 (en) * 2003-09-10 2005-06-28 Intel Corporation Chassis cooling system
US7652891B2 (en) * 2004-12-06 2010-01-26 Radisys Corporation Airflow control system
US7365974B2 (en) * 2005-10-14 2008-04-29 Smiths Aerospace Llc Method for electronics equipment cooling having improved EMI control and reduced weight
US8257156B2 (en) * 2006-03-20 2012-09-04 Flextronics Ap, Llc Increasing air inlet/outlet size for electronics chassis
CN101257780B (zh) * 2007-02-27 2011-05-04 鸿富锦精密工业（深圳）有限公司 电子设备导风装置
US8154886B2 (en) * 2007-03-27 2012-04-10 Commscope, Inc. Of North Carolina Compact fiber panel with sliding tray having removable hood
US20090015120A1 (en) * 2007-07-13 2009-01-15 Tellabs Petaluma, Inc. Heat dissipation device for electronics cabinet
US20090201641A1 (en) * 2008-02-13 2009-08-13 Inventec Corporation Airflow conducting structure
US20100128433A1 (en) * 2008-11-21 2010-05-27 Charles Industries, Ltd. Cap for Electronics Enclosure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4128047A1 (de) * 1991-08-23 1993-02-25 Schroff Gmbh Fuehrungsschiene
US20080094799A1 (en) * 2006-10-19 2008-04-24 Cisco Technology, Inc. Method and apparatus for providing thermal management in an electronic device

Also Published As

Publication number Publication date
GB2474106A (en) 2011-04-06
GB201015573D0 (en) 2010-10-27
JP6073041B2 (ja) 2017-02-01
PH12010000283A1 (en) 2013-03-11
JP6088078B2 (ja) 2017-03-01
CN102026505A (zh) 2011-04-20
US7903405B1 (en) 2011-03-08
DE102010037584A1 (de) 2011-03-31
GB201320215D0 (en) 2014-01-01
US20110069449A1 (en) 2011-03-24
CN102026505B (zh) 2015-07-22
JP2016058759A (ja) 2016-04-21
GB2505357A (en) 2014-02-26
GB2474106B (en) 2014-01-22
GB2505357B (en) 2014-06-18
JP2011066421A (ja) 2011-03-31

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