JP6069749B2 - 離型フィルム付銅箔 - Google Patents

離型フィルム付銅箔 Download PDF

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Publication number
JP6069749B2
JP6069749B2 JP2013248869A JP2013248869A JP6069749B2 JP 6069749 B2 JP6069749 B2 JP 6069749B2 JP 2013248869 A JP2013248869 A JP 2013248869A JP 2013248869 A JP2013248869 A JP 2013248869A JP 6069749 B2 JP6069749 B2 JP 6069749B2
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Japan
Prior art keywords
film
layer
copper
copper foil
less
Prior art date
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Active
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JP2013248869A
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English (en)
Japanese (ja)
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JP2015104891A (ja
JP2015104891A5 (enExample
Inventor
剛司 西山
剛司 西山
馬場　智宏
智宏 馬場
松本　徹
徹 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray KP Films Inc
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Toray KP Films Inc
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Priority to JP2013248869A priority Critical patent/JP6069749B2/ja
Publication of JP2015104891A publication Critical patent/JP2015104891A/ja
Publication of JP2015104891A5 publication Critical patent/JP2015104891A5/ja
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Publication of JP6069749B2 publication Critical patent/JP6069749B2/ja
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  • Laminated Bodies (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2013248869A 2013-12-02 2013-12-02 離型フィルム付銅箔 Active JP6069749B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013248869A JP6069749B2 (ja) 2013-12-02 2013-12-02 離型フィルム付銅箔

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013248869A JP6069749B2 (ja) 2013-12-02 2013-12-02 離型フィルム付銅箔

Publications (3)

Publication Number Publication Date
JP2015104891A JP2015104891A (ja) 2015-06-08
JP2015104891A5 JP2015104891A5 (enExample) 2016-03-03
JP6069749B2 true JP6069749B2 (ja) 2017-02-01

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ID=53435313

Family Applications (1)

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JP2013248869A Active JP6069749B2 (ja) 2013-12-02 2013-12-02 離型フィルム付銅箔

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JP (1) JP6069749B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6705094B2 (ja) * 2015-07-30 2020-06-03 東レＫｐフィルム株式会社 離型フィルム付銅箔および離型フィルム付銅箔の製造方法
KR102112127B1 (ko) * 2015-12-25 2020-05-18 미쓰이금속광업주식회사 캐리어 부착 구리박, 수지 부착 구리박 및 프린트 배선판의 제조 방법
JP6671050B2 (ja) * 2016-03-31 2020-03-25 東レＫｐフィルム株式会社 離型フィルム付銅箔
JP2018009237A (ja) * 2016-07-15 2018-01-18 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP7151758B2 (ja) * 2020-12-24 2022-10-12 住友金属鉱山株式会社 銅張積層板および銅張積層板の製造方法
CN112721381A (zh) * 2021-01-21 2021-04-30 苏州佳值电子工业有限公司 一种用于笔记本电脑中的铜基导电复合膜及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004009357A (ja) * 2002-06-04 2004-01-15 Toyo Metallizing Co Ltd 金属蒸着／金属メッキ積層フィルム及びこれを用いた電子部品
JP4754402B2 (ja) * 2006-05-17 2011-08-24 三井金属鉱業株式会社 キャリア箔付銅箔、キャリア箔付銅箔の製造方法、キャリア箔付表面処理銅箔及びそのキャリア箔付表面処理銅箔を用いた銅張積層板
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
JP2009224369A (ja) * 2008-03-13 2009-10-01 Sumitomo Metal Mining Co Ltd 配線基板用積層体及び配線基板
JP5500073B2 (ja) * 2008-08-29 2014-05-21 味の素株式会社 金属膜付きフィルム
JP2014004807A (ja) * 2012-06-27 2014-01-16 Toray Ind Inc 積層フイルム
JP6085919B2 (ja) * 2012-08-31 2017-03-01 味の素株式会社 極薄銅層付きフィルム、極薄銅層付き接着フィルム、それらの製造方法、銅張積層板、及び配線板

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Publication number Publication date
JP2015104891A (ja) 2015-06-08

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