JP2015104891A5 - - Google Patents
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- JP2015104891A5 JP2015104891A5 JP2013248869A JP2013248869A JP2015104891A5 JP 2015104891 A5 JP2015104891 A5 JP 2015104891A5 JP 2013248869 A JP2013248869 A JP 2013248869A JP 2013248869 A JP2013248869 A JP 2013248869A JP 2015104891 A5 JP2015104891 A5 JP 2015104891A5
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- JP
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- Prior art keywords
- film
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- 229910052799 carbon Inorganic materials 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- 230000003746 surface roughness Effects 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 238000001237 Raman spectrum Methods 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 229920006254 polymer film Polymers 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 description 30
- 150000001721 carbon Chemical class 0.000 description 15
- 238000001755 magnetron sputter deposition Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000007738 vacuum evaporation Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- 230000037303 wrinkles Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004727 Noryl Substances 0.000 description 1
- 229920001207 Noryl Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013248869A JP6069749B2 (ja) | 2013-12-02 | 2013-12-02 | 離型フィルム付銅箔 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013248869A JP6069749B2 (ja) | 2013-12-02 | 2013-12-02 | 離型フィルム付銅箔 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015104891A JP2015104891A (ja) | 2015-06-08 |
| JP2015104891A5 true JP2015104891A5 (enExample) | 2016-03-03 |
| JP6069749B2 JP6069749B2 (ja) | 2017-02-01 |
Family
ID=53435313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013248869A Active JP6069749B2 (ja) | 2013-12-02 | 2013-12-02 | 離型フィルム付銅箔 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6069749B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6705094B2 (ja) * | 2015-07-30 | 2020-06-03 | 東レＫｐフィルム株式会社 | 離型フィルム付銅箔および離型フィルム付銅箔の製造方法 |
| KR102112127B1 (ko) * | 2015-12-25 | 2020-05-18 | 미쓰이금속광업주식회사 | 캐리어 부착 구리박, 수지 부착 구리박 및 프린트 배선판의 제조 방법 |
| JP6671050B2 (ja) * | 2016-03-31 | 2020-03-25 | 東レＫｐフィルム株式会社 | 離型フィルム付銅箔 |
| JP2018009237A (ja) * | 2016-07-15 | 2018-01-18 | Ｊｘ金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
| JP7151758B2 (ja) * | 2020-12-24 | 2022-10-12 | 住友金属鉱山株式会社 | 銅張積層板および銅張積層板の製造方法 |
| CN112721381A (zh) * | 2021-01-21 | 2021-04-30 | 苏州佳值电子工业有限公司 | 一种用于笔记本电脑中的铜基导电复合膜及其制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004009357A (ja) * | 2002-06-04 | 2004-01-15 | Toyo Metallizing Co Ltd | 金属蒸着／金属メッキ積層フィルム及びこれを用いた電子部品 |
| JP4754402B2 (ja) * | 2006-05-17 | 2011-08-24 | 三井金属鉱業株式会社 | キャリア箔付銅箔、キャリア箔付銅箔の製造方法、キャリア箔付表面処理銅箔及びそのキャリア箔付表面処理銅箔を用いた銅張積層板 |
| TW200804626A (en) * | 2006-05-19 | 2008-01-16 | Mitsui Mining & Smelting Co | Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she |
| JP2009224369A (ja) * | 2008-03-13 | 2009-10-01 | Sumitomo Metal Mining Co Ltd | 配線基板用積層体及び配線基板 |
| JP5500073B2 (ja) * | 2008-08-29 | 2014-05-21 | 味の素株式会社 | 金属膜付きフィルム |
| JP2014004807A (ja) * | 2012-06-27 | 2014-01-16 | Toray Ind Inc | 積層フイルム |
| JP6085919B2 (ja) * | 2012-08-31 | 2017-03-01 | 味の素株式会社 | 極薄銅層付きフィルム、極薄銅層付き接着フィルム、それらの製造方法、銅張積層板、及び配線板 |
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2013
- 2013-12-02 JP JP2013248869A patent/JP6069749B2/ja active Active
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