JP2015157472A5 - - Google Patents
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- Publication number
- JP2015157472A5 JP2015157472A5 JP2014261806A JP2014261806A JP2015157472A5 JP 2015157472 A5 JP2015157472 A5 JP 2015157472A5 JP 2014261806 A JP2014261806 A JP 2014261806A JP 2014261806 A JP2014261806 A JP 2014261806A JP 2015157472 A5 JP2015157472 A5 JP 2015157472A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- release
- layer
- less
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 43
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 27
- 229910052799 carbon Inorganic materials 0.000 claims description 27
- 239000011889 copper foil Substances 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 230000003746 surface roughness Effects 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 229910052732 germanium Inorganic materials 0.000 claims 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000011133 lead Substances 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 description 32
- 238000000151 deposition Methods 0.000 description 10
- 230000008021 deposition Effects 0.000 description 10
- 238000003825 pressing Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000005566 electron beam evaporation Methods 0.000 description 9
- 238000007740 vapor deposition Methods 0.000 description 9
- 230000037303 wrinkles Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000001755 magnetron sputter deposition Methods 0.000 description 7
- 229920002799 BoPET Polymers 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014261806A JP6300206B2 (ja) | 2014-01-21 | 2014-12-25 | 離型フィルム付銅箔の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014008314 | 2014-01-21 | ||
| JP2014008314 | 2014-01-21 | ||
| JP2014261806A JP6300206B2 (ja) | 2014-01-21 | 2014-12-25 | 離型フィルム付銅箔の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015157472A JP2015157472A (ja) | 2015-09-03 |
| JP2015157472A5 true JP2015157472A5 (enExample) | 2016-12-28 |
| JP6300206B2 JP6300206B2 (ja) | 2018-03-28 |
Family
ID=54181892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014261806A Active JP6300206B2 (ja) | 2014-01-21 | 2014-12-25 | 離型フィルム付銅箔の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6300206B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6466235B2 (ja) * | 2015-04-16 | 2019-02-06 | 三井金属鉱業株式会社 | キャリア付銅箔、キャリア付銅張積層板、及びプリント配線板の製造方法 |
| JP6432793B2 (ja) * | 2015-12-03 | 2018-12-05 | 東レＫｐフィルム株式会社 | 離型フィルム付銅箔 |
| KR102112127B1 (ko) | 2015-12-25 | 2020-05-18 | 미쓰이금속광업주식회사 | 캐리어 부착 구리박, 수지 부착 구리박 및 프린트 배선판의 제조 방법 |
| WO2017149810A1 (ja) * | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200804626A (en) * | 2006-05-19 | 2008-01-16 | Mitsui Mining & Smelting Co | Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she |
| JP2009231790A (ja) * | 2008-02-27 | 2009-10-08 | Ajinomoto Co Inc | 多層プリント配線板の製造方法 |
-
2014
- 2014-12-25 JP JP2014261806A patent/JP6300206B2/ja active Active
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