JP6300206B2 - 離型フィルム付銅箔の製造方法 - Google Patents
離型フィルム付銅箔の製造方法 Download PDFInfo
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- JP6300206B2 JP6300206B2 JP2014261806A JP2014261806A JP6300206B2 JP 6300206 B2 JP6300206 B2 JP 6300206B2 JP 2014261806 A JP2014261806 A JP 2014261806A JP 2014261806 A JP2014261806 A JP 2014261806A JP 6300206 B2 JP6300206 B2 JP 6300206B2
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- JP
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- Prior art keywords
- film
- layer
- copper
- copper foil
- release
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Physical Vapour Deposition (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014261806A JP6300206B2 (ja) | 2014-01-21 | 2014-12-25 | 離型フィルム付銅箔の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014008314 | 2014-01-21 | ||
| JP2014008314 | 2014-01-21 | ||
| JP2014261806A JP6300206B2 (ja) | 2014-01-21 | 2014-12-25 | 離型フィルム付銅箔の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015157472A JP2015157472A (ja) | 2015-09-03 |
| JP2015157472A5 JP2015157472A5 (enExample) | 2016-12-28 |
| JP6300206B2 true JP6300206B2 (ja) | 2018-03-28 |
Family
ID=54181892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014261806A Active JP6300206B2 (ja) | 2014-01-21 | 2014-12-25 | 離型フィルム付銅箔の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6300206B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6466235B2 (ja) * | 2015-04-16 | 2019-02-06 | 三井金属鉱業株式会社 | キャリア付銅箔、キャリア付銅張積層板、及びプリント配線板の製造方法 |
| JP6432793B2 (ja) * | 2015-12-03 | 2018-12-05 | 東レKpフィルム株式会社 | 離型フィルム付銅箔 |
| KR102112127B1 (ko) | 2015-12-25 | 2020-05-18 | 미쓰이금속광업주식회사 | 캐리어 부착 구리박, 수지 부착 구리박 및 프린트 배선판의 제조 방법 |
| WO2017149810A1 (ja) * | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200804626A (en) * | 2006-05-19 | 2008-01-16 | Mitsui Mining & Smelting Co | Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she |
| JP2009231790A (ja) * | 2008-02-27 | 2009-10-08 | Ajinomoto Co Inc | 多層プリント配線板の製造方法 |
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- 2014-12-25 JP JP2014261806A patent/JP6300206B2/ja active Active
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| Publication number | Publication date |
|---|---|
| JP2015157472A (ja) | 2015-09-03 |
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