JP6300206B2 - 離型フィルム付銅箔の製造方法 - Google Patents

離型フィルム付銅箔の製造方法 Download PDF

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Publication number
JP6300206B2
JP6300206B2 JP2014261806A JP2014261806A JP6300206B2 JP 6300206 B2 JP6300206 B2 JP 6300206B2 JP 2014261806 A JP2014261806 A JP 2014261806A JP 2014261806 A JP2014261806 A JP 2014261806A JP 6300206 B2 JP6300206 B2 JP 6300206B2
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Prior art keywords
film
layer
copper
copper foil
release
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JP2014261806A
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Japanese (ja)
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JP2015157472A5 (enExample
JP2015157472A (ja
Inventor
剛司 西山
剛司 西山
藤 信男
信男 藤
幸雄 長尾
幸雄 長尾
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Toray KP Films Inc
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Toray KP Films Inc
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  • Physical Vapour Deposition (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
JP2014261806A 2014-01-21 2014-12-25 離型フィルム付銅箔の製造方法 Active JP6300206B2 (ja)

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JP2014261806A JP6300206B2 (ja) 2014-01-21 2014-12-25 離型フィルム付銅箔の製造方法

Applications Claiming Priority (3)

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JP2014008314 2014-01-21
JP2014008314 2014-01-21
JP2014261806A JP6300206B2 (ja) 2014-01-21 2014-12-25 離型フィルム付銅箔の製造方法

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JP2015157472A JP2015157472A (ja) 2015-09-03
JP2015157472A5 JP2015157472A5 (enExample) 2016-12-28
JP6300206B2 true JP6300206B2 (ja) 2018-03-28

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JP2014261806A Active JP6300206B2 (ja) 2014-01-21 2014-12-25 離型フィルム付銅箔の製造方法

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6466235B2 (ja) * 2015-04-16 2019-02-06 三井金属鉱業株式会社 キャリア付銅箔、キャリア付銅張積層板、及びプリント配線板の製造方法
JP6432793B2 (ja) * 2015-12-03 2018-12-05 東レKpフィルム株式会社 離型フィルム付銅箔
KR102112127B1 (ko) 2015-12-25 2020-05-18 미쓰이금속광업주식회사 캐리어 부착 구리박, 수지 부착 구리박 및 프린트 배선판의 제조 방법
WO2017149810A1 (ja) * 2016-02-29 2017-09-08 三井金属鉱業株式会社 キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
JP2009231790A (ja) * 2008-02-27 2009-10-08 Ajinomoto Co Inc 多層プリント配線板の製造方法

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JP2015157472A (ja) 2015-09-03

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