JP6033952B2 - 回路板、特には、導電性基板を備える電力モジュールのための回路板 - Google Patents
回路板、特には、導電性基板を備える電力モジュールのための回路板 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims description 81
- 239000004020 conductor Substances 0.000 claims description 123
- 239000012212 insulator Substances 0.000 claims description 32
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 229910052782 aluminium Inorganic materials 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910020617 PbO—B2O3—SiO2 Inorganic materials 0.000 claims description 3
- 238000010304 firing Methods 0.000 description 44
- 238000000034 method Methods 0.000 description 31
- 230000008569 process Effects 0.000 description 19
- 238000005476 soldering Methods 0.000 description 18
- 239000012071 phase Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 238000007650 screen-printing Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000012808 vapor phase Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 2
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910018731 Sn—Au Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 238000007603 infrared drying Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
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Description
Claims (15)
- 導電性基板(3)を備える、特に電力モジュール(2)のためのプリント回路板(1a、1b、1c)であって、前記導電性基板(3)は少なくとも部分的に好ましくは全体的にアルミニウム及び/又はアルミニウム合金を備えており、
導電層の形態の少なくとも1つの導体表面(4a,4b)が前記導電性基板(3)の少なくとも1つの表面(3a,3b)に配置され、前記導体表面(4a,4b)が前記導電性基板(3)に直接電気接触することを特徴とし、
前記少なくとも1つの導体表面(4a,4b)は、該少なくとも1つの導体表面(4a,4b)と電子部品(7,8)との間のはんだ層を介して前記電子部品(7,8)がはんだ付けされるものであり、
前記導電性基板(3)は、直流電圧源又は三相モータに前記プリント回路板(1a、1b、1c)を接続するための接続要素(12)を有することを特徴とするプリント回路板。 - 前記導電性基板(3)の少なくとも1つの前記表面(3a,3b)が実質的に平面であることを特徴とする請求項1に記載のプリント回路板。
- 前記導体表面(4a,4b)は実質的に銅を含むことを特徴とする請求項1又は2に記載のプリント回路板。
- 前記導体表面(4a,4b)は、PbO−B2O3−SiO2系のガラス及び/又はBi2O3を含有するガラスを含むことを特徴とする請求項1から3のいずれか一項に記載のプリント回路板。
- 前記導体表面(4a,4b)は、25μmから125μmの間、好ましくは90μmから110μmの間の厚みを有することを特徴とする、請求項1から4のいずれか一項に記載のプリント回路板。
- 前記導電性基板(3)の少なくとも1つの前記表面(3a,3b)に配置されるのは、誘電層の形態の少なくとも1つの絶縁体表面(5)であることを特徴とする請求項1から5のいずれか一項に記載のプリント回路板。
- 少なくとも1つの前記絶縁体表面(5)は、少なくとも1つの前記導体表面(4a,4b)に対して、少なくとも部分的に接合し、好ましくは、少なくとも1つの前記導体表面(4a,4b)を包囲することを特徴とする請求項6に記載のプリント回路板。
- 導電層の形態の少なくとも1つの接続表面(6)が、少なくとも1つの前記絶縁体表面(5)上に配置されることを特徴とする請求項6又は7に記載のプリント回路板。
- 複数の前記導体表面(4a,4b)、好ましくは6つの前記導体表面(4a,4b)が、前記導電性基板(3)の少なくとも1つの前記表面(3a,3b)上に配置されており、好ましくは、前記導体表面(4a,4b)が前記絶縁体表面(5)で包囲されていることを特徴とする請求項8に記載のプリント回路板。
- 複数の前記接続表面(6)、好ましくは3つの前記接続表面(6)が前記絶縁体表面(5)上に配置されることを特徴とする請求項9に記載のプリント回路板。
- 複数の前記導体表面(4a,4b)、好ましくは2つの前記導体表面(4a,4b)が、前記導電性基板(3)の第1表面(3a)上に配置され、複数の前記導体表面(4a,4b)、好ましくは2つの前記導体表面(4a,4b)、及び、少なくとも1つの前記絶縁体表面(5)が前記導電性基板(3)の第2表面(3b)上に配置され、前記接続表面(6)が少なくとも1つの前記絶縁体表面(5)上に配置されることを特徴とする請求項8に記載のプリント回路板。
- 請求項1から11のいずれか一項に記載の少なくとも1つのプリント回路板(1a、1b、1c)を含む電気モジュール(2)。
- 請求項9に記載の第1のプリント回路板(1a)、請求項10に記載の第2のプリント回路板(1b)、及び請求項11に記載の第3のプリント回路板(1c)を含むことを特徴とする電気モジュール(2)。
- 前記プリント回路板(1a、1b、1c)が実質的に積み重ねられて配置され、前記第1のプリント回路板(1a)と前記第2のプリント回路板(1b)との間に、3つの前記第3のプリント回路板(1c)が、好ましくは互いに並列状態で配置されていることを特徴とする請求項13に記載の電気モジュール。
- 前記電力モジュール(2)は高電流多重相の電力ブリッジの形態であり、3つのトランジスタ、好ましくはIGBT及び3つのフリーホイーリングダイオードが、前記第1のプリント回路板(1a)の少なくとも1つの表面(3a)、及び/又は3つの前記第3のプリント回路板(1c)の前記第2表面(3b)に取り付けられ、そして、3つのトランジスタ、好ましくはIGBT及び3つのフリーホイーリングダイオードが、前記第2のプリント回路板(1b)の少なくとも1つの前記表面(3a)、及び/又は3つの前記第3のプリント回路板(1c)の前記第1表面(3a)に取り付けられることを特徴とする請求項13又は14に記載の電気モジュール。
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PCT/AT2013/000063 WO2013163664A1 (de) | 2012-05-04 | 2013-04-15 | Leiterplatte, insbesondere für ein leistungselektronikmodul, umfassend ein elektrisch leitfähiges substrat |
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Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2630680C2 (ru) * | 2015-09-21 | 2017-09-12 | Акционерное общество "Концерн "Моринформсистема - Агат" | Сильноточная многослойная печатная плата, содержащая слаботочные цепи управления |
JP6326038B2 (ja) * | 2015-12-24 | 2018-05-16 | 太陽誘電株式会社 | 電気回路装置 |
EP3208925B1 (de) * | 2016-02-17 | 2018-09-12 | Siemens Aktiengesellschaft | Umrichter |
CN107364456B (zh) * | 2016-05-12 | 2020-10-27 | 通用电气全球采购有限责任公司 | 逆变器驱动组件和用于车辆的逆变器驱动组件的汇流条 |
DE112017002796T5 (de) | 2016-06-01 | 2019-02-28 | Rohm Co., Ltd. | Halbleiter-Leistungsmodul |
FR3061627B1 (fr) * | 2016-12-29 | 2019-09-06 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Architecture d'un commutateur triphase |
US20210092845A1 (en) * | 2017-04-13 | 2021-03-25 | Hewlett-Packard Development Company, L.P. | Connecting circuit boards using functional components |
US10403558B2 (en) * | 2017-08-23 | 2019-09-03 | Ford Global Technologies, Llc | Power module with multi-layer substrate |
RU2677633C1 (ru) * | 2017-12-12 | 2019-01-18 | Федеральное государственное унитарное предприятие "Научно-производственный центр автоматики и приборостроения имени академика Н.А. Пилюгина" (ФГУП "НПЦАП") | Конструкция многослойных печатных плат со встроенным теплоотводом |
RU194738U1 (ru) * | 2017-12-22 | 2019-12-23 | Общество с ограниченной ответственностью "Завод Эма" | Хирургический светильник с управлением световым излучением |
JP7214966B2 (ja) * | 2018-03-16 | 2023-01-31 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
FR3082369B1 (fr) * | 2018-06-08 | 2021-02-19 | Valeo Equip Electr Moteur | Circuit electrique, bras de commutation et convertisseur de tension |
CN111415909B (zh) | 2019-01-07 | 2022-08-05 | 台达电子企业管理(上海)有限公司 | 多芯片封装功率模块 |
US11676756B2 (en) | 2019-01-07 | 2023-06-13 | Delta Electronics (Shanghai) Co., Ltd. | Coupled inductor and power supply module |
US11316438B2 (en) | 2019-01-07 | 2022-04-26 | Delta Eletronics (Shanghai) Co., Ltd. | Power supply module and manufacture method for same |
CN111415908B (zh) | 2019-01-07 | 2022-02-22 | 台达电子企业管理(上海)有限公司 | 电源模块、芯片嵌入式封装模块及制备方法 |
CN115734452A (zh) * | 2021-08-27 | 2023-03-03 | 中兴通讯股份有限公司 | 一种pcb印刷电路板 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60187087A (ja) * | 1984-03-07 | 1985-09-24 | 松下電器産業株式会社 | 金属ベ−ス回路基板 |
US4993148A (en) | 1987-05-19 | 1991-02-19 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a circuit board |
JPH01112793A (ja) * | 1987-10-27 | 1989-05-01 | Murata Mfg Co Ltd | 回路基板 |
JPH0414852A (ja) * | 1990-05-08 | 1992-01-20 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JPH04164384A (ja) * | 1990-10-29 | 1992-06-10 | Nec Corp | 電力用混成集積回路 |
JP2919674B2 (ja) * | 1992-07-17 | 1999-07-12 | 三洋電機株式会社 | 混成集積回路 |
RU2190284C2 (ru) | 1998-07-07 | 2002-09-27 | Закрытое акционерное общество "Техно-ТМ" | Двусторонний электронный прибор |
JP2000058717A (ja) * | 1998-08-17 | 2000-02-25 | Hitachi Ltd | 平型半導体装置、及びこれを用いた変換器 |
US6703703B2 (en) | 2000-01-12 | 2004-03-09 | International Rectifier Corporation | Low cost power semiconductor module without substrate |
JP4039202B2 (ja) * | 2002-10-16 | 2008-01-30 | 日産自動車株式会社 | 積層型半導体装置およびその組み立て方法 |
JP3972855B2 (ja) * | 2003-04-11 | 2007-09-05 | トヨタ自動車株式会社 | インバータモジュール |
DE102004018469B3 (de) * | 2004-04-16 | 2005-10-06 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Leistungshalbleiterschaltung |
US7176152B2 (en) * | 2004-06-09 | 2007-02-13 | Ferro Corporation | Lead-free and cadmium-free conductive copper thick film pastes |
JP2006049542A (ja) * | 2004-08-04 | 2006-02-16 | Toyota Motor Corp | パワーモジュール |
JP2006202938A (ja) * | 2005-01-20 | 2006-08-03 | Kojiro Kobayashi | 半導体装置及びその製造方法 |
KR100764388B1 (ko) * | 2006-03-17 | 2007-10-05 | 삼성전기주식회사 | 양극산화 금속기판 모듈 |
DK3425646T3 (da) | 2006-12-20 | 2021-03-08 | Primozone Production Ab | Højspændingstransformer |
TW200835409A (en) * | 2007-02-15 | 2008-08-16 | Insight Electronic Group Inc | Method of manufacturing circuit board capable of preventing etchant from eroding aluminum substrate |
JP2008270528A (ja) * | 2007-04-20 | 2008-11-06 | Ihi Corp | 半導体モジュールの構造 |
US20080318061A1 (en) | 2007-06-20 | 2008-12-25 | Akira Inaba | Insulation paste for a metal core substrate and electronic device |
US7704416B2 (en) | 2007-06-29 | 2010-04-27 | E.I. Du Pont De Nemours And Company | Conductor paste for ceramic substrate and electric circuit |
CN101593707B (zh) * | 2009-07-03 | 2010-10-27 | 无锡友达电子有限公司 | 用于大功率集成电路的封装方法 |
CN201657572U (zh) * | 2009-11-27 | 2010-11-24 | 芯通科技(成都)有限公司 | 功放模块基板结构 |
CN201986264U (zh) * | 2011-04-28 | 2011-09-21 | 芯通科技(成都)有限公司 | 一种低热阻射频功放复合基板 |
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US10091874B2 (en) | 2018-10-02 |
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US20170135207A1 (en) | 2017-05-11 |
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