JP6032070B2 - 半導体装置、半導体装置の製造方法 - Google Patents

半導体装置、半導体装置の製造方法 Download PDF

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Publication number
JP6032070B2
JP6032070B2 JP2013050141A JP2013050141A JP6032070B2 JP 6032070 B2 JP6032070 B2 JP 6032070B2 JP 2013050141 A JP2013050141 A JP 2013050141A JP 2013050141 A JP2013050141 A JP 2013050141A JP 6032070 B2 JP6032070 B2 JP 6032070B2
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JP
Japan
Prior art keywords
wiring
semiconductor device
wiring board
holding body
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013050141A
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English (en)
Japanese (ja)
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JP2014175642A5 (https=
JP2014175642A (ja
Inventor
耕佑 晴山
耕佑 晴山
大祐 茅野
大祐 茅野
祐司 西谷
祐司 西谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2013050141A priority Critical patent/JP6032070B2/ja
Priority to TW103105153A priority patent/TWI615933B/zh
Priority to CN201480009974.4A priority patent/CN105009279B/zh
Priority to US14/765,929 priority patent/US10332826B2/en
Priority to PCT/JP2014/001046 priority patent/WO2014141607A1/en
Publication of JP2014175642A publication Critical patent/JP2014175642A/ja
Publication of JP2014175642A5 publication Critical patent/JP2014175642A5/ja
Application granted granted Critical
Publication of JP6032070B2 publication Critical patent/JP6032070B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/209—Vertical interconnections, e.g. vias
    • H10W44/212—Coaxial feed-throughs in substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2013050141A 2013-03-13 2013-03-13 半導体装置、半導体装置の製造方法 Expired - Fee Related JP6032070B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013050141A JP6032070B2 (ja) 2013-03-13 2013-03-13 半導体装置、半導体装置の製造方法
TW103105153A TWI615933B (zh) 2013-03-13 2014-02-17 半導體裝置及其製造方法
CN201480009974.4A CN105009279B (zh) 2013-03-13 2014-02-27 半导体器件及制造半导体器件的方法
US14/765,929 US10332826B2 (en) 2013-03-13 2014-02-27 Semiconductor device and method of manufacturing semiconductor device
PCT/JP2014/001046 WO2014141607A1 (en) 2013-03-13 2014-02-27 Semiconductor device and method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013050141A JP6032070B2 (ja) 2013-03-13 2013-03-13 半導体装置、半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2014175642A JP2014175642A (ja) 2014-09-22
JP2014175642A5 JP2014175642A5 (https=) 2015-03-05
JP6032070B2 true JP6032070B2 (ja) 2016-11-24

Family

ID=50349816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013050141A Expired - Fee Related JP6032070B2 (ja) 2013-03-13 2013-03-13 半導体装置、半導体装置の製造方法

Country Status (5)

Country Link
US (1) US10332826B2 (https=)
JP (1) JP6032070B2 (https=)
CN (1) CN105009279B (https=)
TW (1) TWI615933B (https=)
WO (1) WO2014141607A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207134353U (zh) * 2017-08-31 2018-03-23 深圳市江波龙电子有限公司 移动终端及其芯片封装结构
CN108987425B (zh) * 2018-07-19 2020-09-18 豪威半导体（上海）有限责任公司 微led显示器及其制造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0645401A (ja) * 1992-07-23 1994-02-18 Nec Corp 半導体装置用パッケージ
JP2541102B2 (ja) * 1993-06-23 1996-10-09 日本電気株式会社 同軸フリップチップ接続構造の形成方法
JPH0878572A (ja) * 1994-08-31 1996-03-22 Hitachi Ltd 半導体パッケージおよび、それの製造方法および、それを実装した回路ボードと電子機器
JP2751913B2 (ja) * 1996-03-28 1998-05-18 日本電気株式会社 半導体装置用パッケージ
JPH10335547A (ja) 1997-05-29 1998-12-18 Canon Inc 電子回路装置及びその製造方法
US5851337A (en) * 1997-06-30 1998-12-22 Caesar Technology Inc. Method of connecting TEHS on PBGA and modified connecting structure
JP3629178B2 (ja) * 2000-02-21 2005-03-16 Ｎｅｃエレクトロニクス株式会社 フリップチップ型半導体装置及びその製造方法
US7120607B2 (en) * 2000-06-16 2006-10-10 Lenovo (Singapore) Pte. Ltd. Business system and method using a distorted biometrics
JP4427874B2 (ja) 2000-07-06 2010-03-10 住友ベークライト株式会社 多層配線板の製造方法および多層配線板
US7059009B2 (en) * 2002-07-19 2006-06-13 Valeo Electrical Systems, Inc. Windshield wiper drive linkage arm with grooves
US6650016B1 (en) * 2002-10-01 2003-11-18 International Business Machines Corporation Selective C4 connection in IC packaging
US7105931B2 (en) * 2003-01-07 2006-09-12 Abbas Ismail Attarwala Electronic package and method
US7394663B2 (en) * 2003-02-18 2008-07-01 Matsushita Electric Industrial Co., Ltd. Electronic component built-in module and method of manufacturing the same
US7331500B2 (en) * 2004-06-25 2008-02-19 Intel Corporation Solder bumps formation using solder paste with shape retaining attribute
US7045893B1 (en) 2004-07-15 2006-05-16 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
JP2006295019A (ja) * 2005-04-14 2006-10-26 Fujitsu Ltd 電子部品を基板に取り付け及び取り外す加熱装置
KR20090012933A (ko) * 2007-07-31 2009-02-04 삼성전자주식회사 반도체 패키지, 스택 모듈, 카드, 시스템 및 반도체패키지의 제조 방법
US20100327452A1 (en) * 2008-03-05 2010-12-30 Hirotsugu Kobayashi Mounting structure and method of manufacturing the same
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JP5228843B2 (ja) * 2008-11-28 2013-07-03 富士通株式会社 半導体素子搭載用基板及び半導体装置
JP5404513B2 (ja) 2010-04-19 2014-02-05 ソニー株式会社 半導体装置の製造方法
JPWO2012029526A1 (ja) * 2010-08-30 2013-10-28 住友ベークライト株式会社 半導体パッケージおよび半導体装置
KR101677739B1 (ko) * 2010-09-29 2016-11-21 삼성전자주식회사 반도체 패키지 및 그의 제조방법
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Also Published As

Publication number Publication date
WO2014141607A1 (en) 2014-09-18
US10332826B2 (en) 2019-06-25
CN105009279A (zh) 2015-10-28
TWI615933B (zh) 2018-02-21
JP2014175642A (ja) 2014-09-22
CN105009279B (zh) 2018-04-17
US20150380347A1 (en) 2015-12-31
TW201438172A (zh) 2014-10-01

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