CN105009279B - 半导体器件及制造半导体器件的方法 - Google Patents

半导体器件及制造半导体器件的方法 Download PDF

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Publication number
CN105009279B
CN105009279B CN201480009974.4A CN201480009974A CN105009279B CN 105009279 B CN105009279 B CN 105009279B CN 201480009974 A CN201480009974 A CN 201480009974A CN 105009279 B CN105009279 B CN 105009279B
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CN
China
Prior art keywords
wiring substrate
semiconductor device
wiring
insulating
solder ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201480009974.4A
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English (en)
Chinese (zh)
Other versions
CN105009279A (zh
Inventor
晴山耕佑
茅野大祐
西谷祐司
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Sony Corp
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Sony Corp
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Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN105009279A publication Critical patent/CN105009279A/zh
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Publication of CN105009279B publication Critical patent/CN105009279B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/209—Vertical interconnections, e.g. vias
    • H10W44/212—Coaxial feed-throughs in substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN201480009974.4A 2013-03-13 2014-02-27 半导体器件及制造半导体器件的方法 Expired - Fee Related CN105009279B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-050141 2013-03-13
JP2013050141A JP6032070B2 (ja) 2013-03-13 2013-03-13 半導体装置、半導体装置の製造方法
PCT/JP2014/001046 WO2014141607A1 (en) 2013-03-13 2014-02-27 Semiconductor device and method of manufacturing semiconductor device

Publications (2)

Publication Number Publication Date
CN105009279A CN105009279A (zh) 2015-10-28
CN105009279B true CN105009279B (zh) 2018-04-17

Family

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Family Applications (1)

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CN201480009974.4A Expired - Fee Related CN105009279B (zh) 2013-03-13 2014-02-27 半导体器件及制造半导体器件的方法

Country Status (5)

Country Link
US (1) US10332826B2 (https=)
JP (1) JP6032070B2 (https=)
CN (1) CN105009279B (https=)
TW (1) TWI615933B (https=)
WO (1) WO2014141607A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207134353U (zh) * 2017-08-31 2018-03-23 深圳市江波龙电子有限公司 移动终端及其芯片封装结构
CN108987425B (zh) * 2018-07-19 2020-09-18 豪威半导体（上海）有限责任公司 微led显示器及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026171A (ja) * 2000-07-06 2002-01-25 Sumitomo Bakelite Co Ltd 多層配線板の製造方法および多層配線板
CN1957450A (zh) * 2004-06-25 2007-05-02 英特尔公司 利用在uv辐射之后保持其形状的焊膏的焊料凸起构造
CN101359659A (zh) * 2007-07-31 2009-02-04 三星电子株式会社 半导体封装及制造方法、半导体模块和包括该模块的装置
US7516879B1 (en) * 2008-07-02 2009-04-14 International Business Machines Corporation Method of producing coaxial solder bump connections using injection molding of solder

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JPH0645401A (ja) * 1992-07-23 1994-02-18 Nec Corp 半導体装置用パッケージ
JP2541102B2 (ja) * 1993-06-23 1996-10-09 日本電気株式会社 同軸フリップチップ接続構造の形成方法
JPH0878572A (ja) * 1994-08-31 1996-03-22 Hitachi Ltd 半導体パッケージおよび、それの製造方法および、それを実装した回路ボードと電子機器
JP2751913B2 (ja) * 1996-03-28 1998-05-18 日本電気株式会社 半導体装置用パッケージ
JPH10335547A (ja) 1997-05-29 1998-12-18 Canon Inc 電子回路装置及びその製造方法
US5851337A (en) * 1997-06-30 1998-12-22 Caesar Technology Inc. Method of connecting TEHS on PBGA and modified connecting structure
JP3629178B2 (ja) * 2000-02-21 2005-03-16 Ｎｅｃエレクトロニクス株式会社 フリップチップ型半導体装置及びその製造方法
US7120607B2 (en) * 2000-06-16 2006-10-10 Lenovo (Singapore) Pte. Ltd. Business system and method using a distorted biometrics
US7059009B2 (en) * 2002-07-19 2006-06-13 Valeo Electrical Systems, Inc. Windshield wiper drive linkage arm with grooves
US6650016B1 (en) * 2002-10-01 2003-11-18 International Business Machines Corporation Selective C4 connection in IC packaging
US7105931B2 (en) * 2003-01-07 2006-09-12 Abbas Ismail Attarwala Electronic package and method
US7394663B2 (en) * 2003-02-18 2008-07-01 Matsushita Electric Industrial Co., Ltd. Electronic component built-in module and method of manufacturing the same
US7045893B1 (en) 2004-07-15 2006-05-16 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
JP2006295019A (ja) * 2005-04-14 2006-10-26 Fujitsu Ltd 電子部品を基板に取り付け及び取り外す加熱装置
US20100327452A1 (en) * 2008-03-05 2010-12-30 Hirotsugu Kobayashi Mounting structure and method of manufacturing the same
JP5228843B2 (ja) * 2008-11-28 2013-07-03 富士通株式会社 半導体素子搭載用基板及び半導体装置
JP5404513B2 (ja) 2010-04-19 2014-02-05 ソニー株式会社 半導体装置の製造方法
JPWO2012029526A1 (ja) * 2010-08-30 2013-10-28 住友ベークライト株式会社 半導体パッケージおよび半導体装置
KR101677739B1 (ko) * 2010-09-29 2016-11-21 삼성전자주식회사 반도체 패키지 및 그의 제조방법
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Publication number Priority date Publication date Assignee Title
JP2002026171A (ja) * 2000-07-06 2002-01-25 Sumitomo Bakelite Co Ltd 多層配線板の製造方法および多層配線板
CN1957450A (zh) * 2004-06-25 2007-05-02 英特尔公司 利用在uv辐射之后保持其形状的焊膏的焊料凸起构造
CN101359659A (zh) * 2007-07-31 2009-02-04 三星电子株式会社 半导体封装及制造方法、半导体模块和包括该模块的装置
US7516879B1 (en) * 2008-07-02 2009-04-14 International Business Machines Corporation Method of producing coaxial solder bump connections using injection molding of solder

Also Published As

Publication number Publication date
WO2014141607A1 (en) 2014-09-18
US10332826B2 (en) 2019-06-25
CN105009279A (zh) 2015-10-28
TWI615933B (zh) 2018-02-21
JP2014175642A (ja) 2014-09-22
US20150380347A1 (en) 2015-12-31
TW201438172A (zh) 2014-10-01
JP6032070B2 (ja) 2016-11-24

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Granted publication date: 20180417