TWI615933B - 半導體裝置及其製造方法 - Google Patents

半導體裝置及其製造方法 Download PDF

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Publication number
TWI615933B
TWI615933B TW103105153A TW103105153A TWI615933B TW I615933 B TWI615933 B TW I615933B TW 103105153 A TW103105153 A TW 103105153A TW 103105153 A TW103105153 A TW 103105153A TW I615933 B TWI615933 B TW I615933B
Authority
TW
Taiwan
Prior art keywords
wiring substrate
wiring
solder ball
retention
semiconductor device
Prior art date
Application number
TW103105153A
Other languages
English (en)
Chinese (zh)
Other versions
TW201438172A (zh
Inventor
Kosuke HAREYAMA
晴山耕佑
Daisuke Chino
茅野大祐
Yuuji Nishitani
西谷祐司
Original Assignee
Sony Corporation
新力股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corporation, 新力股份有限公司 filed Critical Sony Corporation
Publication of TW201438172A publication Critical patent/TW201438172A/zh
Application granted granted Critical
Publication of TWI615933B publication Critical patent/TWI615933B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/209—Vertical interconnections, e.g. vias
    • H10W44/212—Coaxial feed-throughs in substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW103105153A 2013-03-13 2014-02-17 半導體裝置及其製造方法 TWI615933B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-050141 2013-03-13
JP2013050141A JP6032070B2 (ja) 2013-03-13 2013-03-13 半導体装置、半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW201438172A TW201438172A (zh) 2014-10-01
TWI615933B true TWI615933B (zh) 2018-02-21

Family

ID=50349816

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103105153A TWI615933B (zh) 2013-03-13 2014-02-17 半導體裝置及其製造方法

Country Status (5)

Country Link
US (1) US10332826B2 (https=)
JP (1) JP6032070B2 (https=)
CN (1) CN105009279B (https=)
TW (1) TWI615933B (https=)
WO (1) WO2014141607A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207134353U (zh) * 2017-08-31 2018-03-23 深圳市江波龙电子有限公司 移动终端及其芯片封装结构
CN108987425B (zh) * 2018-07-19 2020-09-18 豪威半导体（上海）有限责任公司 微led显示器及其制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851337A (en) * 1997-06-30 1998-12-22 Caesar Technology Inc. Method of connecting TEHS on PBGA and modified connecting structure
US6650016B1 (en) * 2002-10-01 2003-11-18 International Business Machines Corporation Selective C4 connection in IC packaging
US20060231541A1 (en) * 2005-04-14 2006-10-19 Fujitsu Limited Heater that attaches electronic component to and detaches the same from substrate
US20120074566A1 (en) * 2010-09-29 2012-03-29 Samsung Electronics Co., Ltd. Package For Semiconductor Device Including Guide Rings And Manufacturing Method Of The Same
US20120193789A1 (en) * 2011-01-27 2012-08-02 Unimicron Technology Corporation Package stack device and fabrication method thereof

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Publication number Priority date Publication date Assignee Title
JPH0645401A (ja) * 1992-07-23 1994-02-18 Nec Corp 半導体装置用パッケージ
JP2541102B2 (ja) * 1993-06-23 1996-10-09 日本電気株式会社 同軸フリップチップ接続構造の形成方法
JPH0878572A (ja) * 1994-08-31 1996-03-22 Hitachi Ltd 半導体パッケージおよび、それの製造方法および、それを実装した回路ボードと電子機器
JP2751913B2 (ja) * 1996-03-28 1998-05-18 日本電気株式会社 半導体装置用パッケージ
JPH10335547A (ja) 1997-05-29 1998-12-18 Canon Inc 電子回路装置及びその製造方法
JP3629178B2 (ja) * 2000-02-21 2005-03-16 Ｎｅｃエレクトロニクス株式会社 フリップチップ型半導体装置及びその製造方法
US7120607B2 (en) * 2000-06-16 2006-10-10 Lenovo (Singapore) Pte. Ltd. Business system and method using a distorted biometrics
JP4427874B2 (ja) 2000-07-06 2010-03-10 住友ベークライト株式会社 多層配線板の製造方法および多層配線板
US7059009B2 (en) * 2002-07-19 2006-06-13 Valeo Electrical Systems, Inc. Windshield wiper drive linkage arm with grooves
US7105931B2 (en) * 2003-01-07 2006-09-12 Abbas Ismail Attarwala Electronic package and method
US7394663B2 (en) * 2003-02-18 2008-07-01 Matsushita Electric Industrial Co., Ltd. Electronic component built-in module and method of manufacturing the same
US7331500B2 (en) * 2004-06-25 2008-02-19 Intel Corporation Solder bumps formation using solder paste with shape retaining attribute
US7045893B1 (en) 2004-07-15 2006-05-16 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
KR20090012933A (ko) * 2007-07-31 2009-02-04 삼성전자주식회사 반도체 패키지, 스택 모듈, 카드, 시스템 및 반도체패키지의 제조 방법
US20100327452A1 (en) * 2008-03-05 2010-12-30 Hirotsugu Kobayashi Mounting structure and method of manufacturing the same
US7516879B1 (en) * 2008-07-02 2009-04-14 International Business Machines Corporation Method of producing coaxial solder bump connections using injection molding of solder
JP5228843B2 (ja) * 2008-11-28 2013-07-03 富士通株式会社 半導体素子搭載用基板及び半導体装置
JP5404513B2 (ja) 2010-04-19 2014-02-05 ソニー株式会社 半導体装置の製造方法
JPWO2012029526A1 (ja) * 2010-08-30 2013-10-28 住友ベークライト株式会社 半導体パッケージおよび半導体装置
TWI433278B (zh) * 2011-03-10 2014-04-01 矽品精密工業股份有限公司 無承載板之封裝件及其製法
CN103975427B (zh) * 2011-10-07 2017-03-01 沃尔泰拉半导体公司 互连衬底的功率管理应用
WO2013054504A1 (ja) * 2011-10-13 2013-04-18 住友ベークライト株式会社 半導体パッケージおよび半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851337A (en) * 1997-06-30 1998-12-22 Caesar Technology Inc. Method of connecting TEHS on PBGA and modified connecting structure
US6650016B1 (en) * 2002-10-01 2003-11-18 International Business Machines Corporation Selective C4 connection in IC packaging
US20060231541A1 (en) * 2005-04-14 2006-10-19 Fujitsu Limited Heater that attaches electronic component to and detaches the same from substrate
US20120074566A1 (en) * 2010-09-29 2012-03-29 Samsung Electronics Co., Ltd. Package For Semiconductor Device Including Guide Rings And Manufacturing Method Of The Same
US20120193789A1 (en) * 2011-01-27 2012-08-02 Unimicron Technology Corporation Package stack device and fabrication method thereof

Also Published As

Publication number Publication date
WO2014141607A1 (en) 2014-09-18
US10332826B2 (en) 2019-06-25
CN105009279A (zh) 2015-10-28
JP2014175642A (ja) 2014-09-22
CN105009279B (zh) 2018-04-17
US20150380347A1 (en) 2015-12-31
TW201438172A (zh) 2014-10-01
JP6032070B2 (ja) 2016-11-24

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