JP6027255B2 - 基板収納容器を梱包するための梱包構造体 - Google Patents
基板収納容器を梱包するための梱包構造体 Download PDFInfo
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- JP6027255B2 JP6027255B2 JP2015536401A JP2015536401A JP6027255B2 JP 6027255 B2 JP6027255 B2 JP 6027255B2 JP 2015536401 A JP2015536401 A JP 2015536401A JP 2015536401 A JP2015536401 A JP 2015536401A JP 6027255 B2 JP6027255 B2 JP 6027255B2
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- buffer
- plate
- cushioning
- storage container
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
- B65D81/051—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using pillow-like elements filled with cushioning material, e.g. elastic foam, fabric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
- B65D81/107—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material
- B65D81/113—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material of a shape specially adapted to accommodate contents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Buffer Packaging (AREA)
- Packaging Frangible Articles (AREA)
Description
上記の第1実施形態では、第1緩衝部4fの緩衝支持部40及び緩衝部連結部70は、いずれも同じ発泡スチロール製であり、一体成形されている。緩衝部連結部70の形状は、上端部から下端部に向けて徐々に細くなるテーパの付いた円筒形(裁頭円錐形)である。第2緩衝部4sの緩衝板状部50は、第1緩衝部4fの発泡スチロールよりも硬い剛性体で作られ、緩衝板状部50の貫通孔53の形状は、円筒状の丸孔である。第2緩衝部4sの緩衝脚部60は、緩衝部連結部70の発泡スチロールよりも柔らかい弾性係数を有するコイルバネにより構成されている。これが、下部緩衝材4の第1緩衝部4fと第2緩衝部4sとの基本的な組み合わせである。
10 梱包箱
2 基板収納容器
4 下部緩衝材
4f 第1緩衝部
4s 第2緩衝部
40 緩衝支持部
50 緩衝板状部
51 上面
52 下面
53 貫通孔
60 コイルバネ(緩衝脚部)
60J スポンジ(緩衝脚部)
70 緩衝部連結部
Claims (7)
- 半導体ウェーハからなる基板を収納して輸送するための基板収納容器を梱包するための梱包構造体であって、
梱包箱と、
前記梱包箱内において前記基板収納容器が載置される下部緩衝材と、を備え、
前記下部緩衝材は、第1緩衝部と第2緩衝部とを有し、
前記第1緩衝部は、緩衝材により構成されて前記基板収納容器に直接当接して前記基板収納容器を支持する緩衝支持部と、緩衝材により構成されて前記緩衝支持部に接続され前記緩衝支持部から下方へ延びる緩衝部連結部と、を有し、
前記第2緩衝部は、貫通孔が形成された緩衝板状部と、前記第1緩衝部の前記緩衝部連結部よりも柔らかい緩衝材により構成され前記緩衝板状部から下方へ延びる緩衝脚部と、を有し、
前記緩衝板状部の前記貫通孔に前記緩衝部連結部が貫通した状態で、前記緩衝板状部は、前記第1緩衝部を支持する梱包構造体。 - 前記第2緩衝部の前記緩衝脚部の下端部は前記梱包箱に支持され、
前記第1緩衝部の前記緩衝部連結部の下端部は、前記梱包箱に支持されておらず、前記緩衝脚部の下端部よりも上方に位置して前記梱包箱から離間している請求項1に記載の梱包構造体。 - 前記第1緩衝部の前記緩衝支持部と前記緩衝部連結部とは、同一の緩衝材により一体成形されている請求項1又は請求項2に記載の梱包構造体。
- 前記第2緩衝部の前記緩衝脚部を構成する緩衝材は、コイルバネ、空気バネ、ゲル、スポンジ、ゴム、弾性を有する高分子発泡体のうちのいずれかにより構成される請求項1〜請求項3のいずれかに記載の梱包構造体。
- 前記第2緩衝部の前記緩衝板状部は、それぞれ平坦な上面及び下面を有する板状を有して前記第1緩衝部の前記緩衝支持部に当接可能な剛性体であって、前記第1緩衝部の前記緩衝支持部に前記基板収納容器が載置されたときに前記緩衝支持部の変形を抑えて前記緩衝支持部を支持可能な程度の硬さを有する剛性体により構成されている請求項1〜請求項4のいずれかに記載の梱包構造体。
- 前記第2緩衝部の前記緩衝脚部を構成する緩衝材は、スポンジにより構成され、前記第2緩衝部の前記緩衝板状部は、前記緩衝脚部を構成するスポンジと同一のスポンジにより構成され、前記緩衝板状部と前記緩衝脚部とは一体成形されている請求項1〜請求項3のいずれかに記載の梱包構造体。
- 前記第1緩衝部の前記緩衝部連結部は、前記第2緩衝部の前記緩衝板状部に接着されておらず、前記緩衝板状部の前記貫通孔に嵌合されることによって前記緩衝板状部に固定されている請求項1〜請求項6のいずれかに記載の梱包構造体。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/074887 WO2015037136A1 (ja) | 2013-09-13 | 2013-09-13 | 基板収納容器を梱包するための梱包構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6027255B2 true JP6027255B2 (ja) | 2016-11-16 |
JPWO2015037136A1 JPWO2015037136A1 (ja) | 2017-03-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015536401A Active JP6027255B2 (ja) | 2013-09-13 | 2013-09-13 | 基板収納容器を梱包するための梱包構造体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9850055B2 (ja) |
JP (1) | JP6027255B2 (ja) |
KR (1) | KR102075009B1 (ja) |
TW (1) | TWI608976B (ja) |
WO (1) | WO2015037136A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9892948B2 (en) * | 2016-06-08 | 2018-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer container having damping device |
KR101881980B1 (ko) * | 2016-10-21 | 2018-07-25 | 전북대학교산학협력단 | 웨이퍼 파손 방지용 카세트 |
CN106882213A (zh) * | 2017-03-01 | 2017-06-23 | 四川佳怡德环境科技有限公司 | 一种具有防震功能的污水水样运输装置 |
CN108216923A (zh) * | 2018-04-04 | 2018-06-29 | 江苏鑫城包装科技有限公司 | 可重复使用的多层缓冲包装盒 |
CN111137577A (zh) * | 2019-12-28 | 2020-05-12 | 青岛海尔电冰箱有限公司 | 用于冰箱的包装结构及包装方法 |
US10937463B1 (en) * | 2019-12-30 | 2021-03-02 | Comptake Technology Inc. | Packaging tray for hard disk drive |
TWI733470B (zh) * | 2020-05-26 | 2021-07-11 | 台灣電鏡儀器股份有限公司 | 密封傳輸裝置 |
JP2023069635A (ja) * | 2021-11-08 | 2023-05-18 | 京セラドキュメントソリューションズ株式会社 | 梱包部材 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58159268U (ja) * | 1982-04-19 | 1983-10-24 | 松下電器産業株式会社 | 緩衝装置 |
JPS593873U (ja) * | 1982-06-30 | 1984-01-11 | 株式会社日立製作所 | 緩衝体 |
JPS6231062U (ja) * | 1985-08-09 | 1987-02-24 | ||
JPS6397672U (ja) * | 1986-12-17 | 1988-06-24 | ||
JPS63197830U (ja) * | 1987-06-09 | 1988-12-20 | ||
JP2000159270A (ja) * | 1998-11-30 | 2000-06-13 | Sekisui Plastics Co Ltd | 緩衝包装材 |
JP2007137454A (ja) * | 2005-11-16 | 2007-06-07 | Shin Etsu Polymer Co Ltd | 梱包体 |
JP2010132331A (ja) * | 2008-12-05 | 2010-06-17 | Miraial Kk | 半導体収納容器用梱包箱 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2951669A (en) * | 1957-04-17 | 1960-09-06 | Davidson Louis | Folding industrial pallet |
US3356209A (en) * | 1964-08-24 | 1967-12-05 | Corning Glass Works | Modular packaging |
US5462171A (en) * | 1994-03-18 | 1995-10-31 | The Timken Company | Shock-absorbing package |
JPH07291280A (ja) | 1994-04-27 | 1995-11-07 | Nec Gumma Ltd | 複合梱包材料 |
JP3711778B2 (ja) * | 1998-09-18 | 2005-11-02 | セイコーエプソン株式会社 | 梱包方法及び梱包物 |
US6817161B1 (en) * | 2002-05-17 | 2004-11-16 | Taiwan Semiconductor Manufacturing Company | Support for protecting containers holding breakable substrates |
TWM440281U (en) * | 2012-05-28 | 2012-11-01 | Acer Inc | Packing structure |
TWM444999U (zh) * | 2012-07-30 | 2013-01-11 | Quanta Comp Inc | 緩衝材及板體 |
-
2013
- 2013-09-13 WO PCT/JP2013/074887 patent/WO2015037136A1/ja active Application Filing
- 2013-09-13 JP JP2015536401A patent/JP6027255B2/ja active Active
- 2013-09-13 KR KR1020167008807A patent/KR102075009B1/ko active IP Right Grant
- 2013-09-13 US US15/021,542 patent/US9850055B2/en active Active
-
2014
- 2014-09-10 TW TW103131176A patent/TWI608976B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58159268U (ja) * | 1982-04-19 | 1983-10-24 | 松下電器産業株式会社 | 緩衝装置 |
JPS593873U (ja) * | 1982-06-30 | 1984-01-11 | 株式会社日立製作所 | 緩衝体 |
JPS6231062U (ja) * | 1985-08-09 | 1987-02-24 | ||
JPS6397672U (ja) * | 1986-12-17 | 1988-06-24 | ||
JPS63197830U (ja) * | 1987-06-09 | 1988-12-20 | ||
JP2000159270A (ja) * | 1998-11-30 | 2000-06-13 | Sekisui Plastics Co Ltd | 緩衝包装材 |
JP2007137454A (ja) * | 2005-11-16 | 2007-06-07 | Shin Etsu Polymer Co Ltd | 梱包体 |
JP2010132331A (ja) * | 2008-12-05 | 2010-06-17 | Miraial Kk | 半導体収納容器用梱包箱 |
Also Published As
Publication number | Publication date |
---|---|
TWI608976B (zh) | 2017-12-21 |
US9850055B2 (en) | 2017-12-26 |
KR20160054525A (ko) | 2016-05-16 |
KR102075009B1 (ko) | 2020-02-10 |
TW201515958A (zh) | 2015-05-01 |
JPWO2015037136A1 (ja) | 2017-03-02 |
WO2015037136A1 (ja) | 2015-03-19 |
US20160280443A1 (en) | 2016-09-29 |
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