料40281 五、新型說明： 【新型所屬之技術領域】 且特別是一種電子襞 本創作是有關於一種包裝結構， 置的包裝結構。 【先前技術】 電子產品在運送過程中，由於交且企· · 損’因此對包裝結構的要求較為嚴苛^ ’力揸擊而受 目前較為常I的作法係在包駿4中， :，例如隔板、紙類或塑膠_料皿塑膠=:緩:構 擊包裝盒壁，進而保護包裝盒内之電子 晃動而撞 ，呆與回收議題，上述塑膠類之、;衝構:對=能，因 的衝擊’並減少倉儲所需要的空間，：使其具有兄 競爭優勢，實值得相關人員所深思。八/、成本上之 【新型内容】 供一種包裝結構，其具有較佳的緩衝效果。 本創作提出一種包裝結構，用以包裝一電子裝置。 ，置具有彼此相對的-底面與-細。包|結^包括一 承载盤以及-上蓋。承載盤具有至少—第_承載面盘至少 一第-潰縮線。第-潰縮線位在第—承載面的—側緣。電 4 M440281Material 40281 V. New description: [New technical field] and especially an electronic 襞 This creation is about a packaging structure, packaging structure. [Prior Art] In the process of transporting electronic products, the requirements for the packaging structure are more stringent due to the intersection of the company and the damage. ^The force is attacked and the current practice is more often in the Baojun 4, :, For example, partitions, paper or plastic _ ware plastic =: slow: structuring the wall of the packaging box, and then protect the electronic sway in the packaging box to hit, stay and recycle issues, the above-mentioned plastics; Because of the impact' and reduce the space required for storage, it is worthwhile for the relevant personnel to ponder. Eight /, cost [new content] For a packaging structure, it has a better cushioning effect. The present application proposes a packaging structure for packaging an electronic device. , placed opposite each other - bottom and - fine. The package|junction includes a carrier tray and an upper cover. The carrier tray has at least a first-crushing line of the first carrier disk. The first-crush line is at the side edge of the first bearing surface. Electricity 4 M440281
面上以潰縮第一潰縮線， 上蓋移動而抵靠於上蓋。 在本創作之一實施例中，上述之角度為30度至45度。 在本，作之—實施例中’上述之底面與頂面之間存在 厚度。第一潰縮線相對於底面的距離為厚度的二分之一 至厚度的四分之三。 β在本創作之一實施例中，上述之底面與頂面之間存在 一厚度。電子裝置朝向上蓋的移動距離小於厚度的四分之 ——〇 在本創作之一實施例中，上述之承載盤還具有一第二 承載面。第一承載面環繞地鄰接於第二承載面。第一潰縮 線位在第一承載面遠離第二承載面的一側^電子裝置的底 面面對弟—承載面。 在本創作之一實施例中，上述之承載盤還具有一預折 線，位在第一承載面與第二承載面之間。 在本創作之一實施例中，還包括一底盒。承載盤配置 在底盒内，上蓋用以閉闓底盒。 在本創作之一實施例中’上述之承載盤包括一本體、 多個第一延伸部以及多個第二延伸部。本體具有上述之第 二承載面。第一延伸部設置在本體的周緣’並從本體朝上 5 M440281 蓋延伸。各第一延伸部具有―第—承载面第二延伸部從對 應的第一延伸部朝底盒延伸並抵接於底盒的底部，以將本 體與第一延伸部支撐在底盒的底部上。 ^在本創作之一實施例中，上述之各第二延伸部具有一 為折線帛一潰縮線與一抵接線。第二延伸部藉由彎折 線4接對應的第-延伸部。第二延伸部藉由抵接線抵接於 底孤的底部。第二〉魏線位在彎折線與抵接線之間。 在本創作之-實施例巾’上述之第二潰縮線相對於抵 接線的距離，小於彎折_對於抵接_距_五分之一。 基於上述，在本創作的上述實施例中，當對包裝結構 一匕裝其内的f子裝置進行落下測試時，承載盤藉由其第 ^載面與電子裝置的底面夾—角度，而讓包裳結構在衝 :广成電子裝置沿著第—承載面朝向上蓋移動並抵靠於 盍亦即讓電子裝置產生相對於重力方向的側向位移， 裝結構僅需承受部分的衝擊力。再者，由於承载 上有,在第一承载面之側緣的第-潰縮線，故而包裝 :右電子裝置的衝擊時’能以第一潰縮線產生潰縮 有效地吸收其衝擊力。據此，包裝社構便能藉由上 電子f置树下時料裝結構所產生^ >· '、即包裝結構具有較佳的衝擊吸收能力。 兴音本創作之上述特徵和優點能更明顯易懂，下文特 舉實施例’並配麵_式作詳細如下。 【實施方式】 6 M440281 圖1是依照本創作一實施例的一種包裝結構與電子裝 置的包裝示意圖。圖2是圖1包裝結構的部分構件示意圖。 请同時參考圖1與圖2，在本實施例中，電子裝置200例 如是一平板電腦或依筆記型電腦，在此並不予以限制，其 具有一厚度H1，及彼此相對的一底面210與一頂面220， 其中厚度H1為底面210與頂面220之相對距離。包裝結 構1〇〇包括一上蓋110、一承載盤120與一底盒13〇。承載 φ 盤120例如是以瓦楞紙材所製成，其配置在底盒13〇内且 與底盒130之間保持一容置空間R1，其用以收納電子裝置 200的相關配件（未繪示）。在包裝過程中，先將電子裝 置200的相關配件放置在底盒13〇内後，再將承載盤12〇 配置於底盒13〇，而後將電子裝置2〇〇配置在承載盤12〇 上，最終將上蓋110閉闔於底盒130。至此，便完成初步 的包裝過程。 在本實施例中是以呈長方體的電子裝置2〇〇與包裴結 構100作為描述對象，因此在其進行落下測試時，會以^ •方體的-稜角、交點於該稜角的三稜線，及長方體的六個 面分別進行落下測試。惟，本創作並不以此為限，其係依 據受測物之外形與對應其的規範而有所改變。以下i以其 中兩種不同模式的落下測試予以進一步地說明。 請再參考圖1與圖2，在本實施例中同時提供一直角 座標以便於後續之描述。如圖2所綠示，承載盤120包括 一本體123、四個第一延伸部121與四個第二延伸部122， 中四個第&伸部121分別沿X轴與γ軸彼此對向延伸 7 M440281 地連接在本體123的周緣，且各第一延伸部121具有一第 一承载面U1，而本體123具有一第二承載面U2，即本實 施例的多個第一承載SU1是環繞地鄰接在第二承載面U2 的周緣。當電子裝置200放置於承載盤12〇上時，電子裝 置200的底面21〇朝向第二承載面u2,而底面21〇的四個 周緣E1 (圖1中僅繪示其二）承靠在第一承載面ui上， 頂面220背對於第一、第二承載面U1、U2而朝向上蓋110。 再者’上述四個第一延伸部121是從本體123的周緣 朝上盍110延伸，而第二延伸部122分別對應地從第一延 伸部121朝底盒13〇延伸並抵接於底盒13〇的底部B1，以 在承載盤120放置於底盒130内時，藉由第二延伸部122 將本體123與第一延伸部121支撐在底盒13〇的底部B1 上方。進一步地說，第二延伸部122具有一彎折線與 一抵接線L2，其中第二延伸部122藉由彎折線u而與第 —延伸部121鄰接，並以其抵接線u抵接於底盒13〇的 底部B1。 ”由於承載盤120的第一、第二延伸部卜122在X-Y 平面上是呈對稱配置，故以下將以其中一第一、第二延伸 邻121 122與對此處進行落下測試作為代表而進行說明。 圖3與圖4分別是圖！的電子裝置與包裝結構的局部 剖面圖，以繪示在第一衝擊狀態時的電子裝置2〇〇與包裝 結構100的相對關係。請同時參考圖2至圖4，由於第一 承，面U1與電子裝置200的底面210 (或頂面220，此處 指落下測試時的重力方向，即相t於圖丨所繪示之χ轴或 M440281 y軸）之間存在一夾角T1，亦即第一承載面m並非平行 ，重力方‘故在衝擊瞬間，電子裝置·會因重力而沿 第-=载，υι移動。此外’在本實施例的包裝結構1〇〇 中田上盍110與底盒130閉闔之後，電子裝置200的頂 面220 _與上蓋保持距離D卜因此電子裝置2⑻在第 一衝擊狀態下會沿第—承載面m朝向上蓋13G移動距離 D1後抵靠於上蓋13〇。 換句話說，在圖3、4所述的第一衝擊狀態下，電子 裝置200在抵壓第一承載面m的同時亦會沿著第一承載 面υι移動，進而使電子裝置細的頂自22〇抵靠於上蓋 =二舉藉由第—承載面m的結構特徵’即其為相對於 斜面，_包餘構〗⑻原本所需承受因重 以==Π ’/㈣沿重力方向的正向衝力 __ 11、側向衝力F2，正向衝力F3施加於第 於上Ϊ進^^力Μ導致電子裝置移動而抵靠 甩 a使上盍130承爻此側向衝力F2。如此—來， 原本耑完全承受電子裝置2〇〇之衝力 m，得以藉此改為與上苗13〇同時I 承載面 i一士^ 〜、上1⑽冋時承党此衝力F1，而使 -，=F1能由包裝結構100的不同部位共同^ ^例^ _力F1對包裝結構1GG的單—位置（如本實 _的4-承載面m)所造成的_破壞。I如本貫 在第=:!= 13°與電子裝置2。。的頂面22。 =衝极悲刚所保持的距離D1，即為電子 4 -承载面m所移動的側向(沿z軸)距離叫 9 M4402S1 離D1較佳為小於電子裝置200之厚度HI的四分之一。再 者，上述第〆承載面ui與底面220之失角τι刀較佳為如 度至45度，以使其具備讓電子裝置200側向移動所需的結 構條件。 ' 此外，承載盤120的第一延伸部121上還耳有一第一 潰縮線κι，位在第一承載面υι遠離第二承載面U2的一 側緣。當落下測試進行時，第一潰縮線K1實質上位在電 子裝置2GG的下方。因此上述從衝力F1分出的正向衝力 F3會因此造成第一潰縮線K1的潰縮現象，進而藉由包裝 結構100之第一承載面U1在此處的潰縮現象即以第一 承載面U1產生位移而吸收正向衝力F3，以達到讓包裝結 構100吸收衝力而產生對電子裝置200的保護效果。 在本實施例中’當包裝結構100完成對電子裝置2〇〇 的包裝後，第一潰縮線κι相對於電子裝置2〇〇之^面21〇 的距離D2為厚度H1的二分之一至厚度H1的四分之三。 另一方面’本實施例的承載盤120還具有一預折線 L3，其位在第一承载面υι與第二承载面U2之間，預折 線L3是用以從本體（即第二承載面U2)形成出第一承載 面m者，即讓第〆承載面υι與第二承載面U2形成如上 述之夾角T1。 圖5是本創作的包裝結構與電子裝置的局部剖面圖， 用以說明圖1的包裝結構100與電子裝置200在第二衝擊 狀態的情形。在此同時省略底盒130的局部，以能清楚辨 識承载盤120側面的結構特徵。請同時參考圖〗與圖5， M440281 各第二延伸部122還具有一第二潰縮線K2，位在彎折線 與抵接線L2之間。在本實施例_，第二潰縮線Κ2係 垂直於第二衝擊狀態時的重力方向（即此時是沿Ζ軸對包 裝，構100與電子裝置2〇〇進行落下測試），亦即在結構 上第二潰縮線Κ2實質上平行於彎折線L1與抵接線L2。 與上述第一潰縮線K1類似地，第二潰縮線K2用以讓承载 盤120的第二延伸部122於第二衝擊狀態能有效吸收此時 的，力，以藉由讓第二潰縮線K2吸收衝力而產生的降伏 f態i而達到在此方向保護電子裝置200的效果。在此， 第二潰縮線K2相對於抵接線L2的距離D3，小於彎折線 L1相對於抵接線L2的距離D4的五分之一。The first crushing line is collapsed on the surface, and the upper cover moves to abut against the upper cover. In one embodiment of the present invention, the above angle is from 30 degrees to 45 degrees. In the present invention, there is a thickness between the bottom surface and the top surface. The distance of the first crush line from the bottom surface is one-half of the thickness to three-quarters of the thickness. In one embodiment of the present invention, there is a thickness between the bottom surface and the top surface. The moving distance of the electronic device toward the upper cover is less than four quarters of the thickness - 之一 In one embodiment of the present invention, the carrier tray further has a second bearing surface. The first bearing surface is circumferentially adjacent to the second bearing surface. The first crush line is on the side of the first bearing surface away from the second bearing surface, and the bottom surface of the electronic device faces the younger-bearing surface. In an embodiment of the present invention, the carrier tray further has a pre-fold line between the first bearing surface and the second bearing surface. In an embodiment of the present invention, a bottom box is also included. The carrier tray is arranged in the bottom box, and the upper cover is used to close the bottom box. In one embodiment of the present invention, the carrier tray described above includes a body, a plurality of first extensions, and a plurality of second extensions. The body has the second bearing surface described above. The first extension is disposed at the periphery of the body and extends from the body toward the upper 5 M440281 cover. Each of the first extensions has a first-bearing surface. The second extension extends from the corresponding first extension toward the bottom case and abuts against the bottom of the bottom case to support the body and the first extension on the bottom of the bottom case. . In one embodiment of the present invention, each of the second extensions has a fold line and a break line and an offset line. The second extension is connected to the corresponding first extension by the bending line 4. The second extension abuts against the bottom of the bottom by means of an abutment. The second > Wei line is between the bend line and the offset line. In the present invention, the distance between the second crush line and the abutting line is less than one-fifth of the bending_for the abutting_distance. Based on the above, in the above embodiment of the present invention, when the drop-down test is performed on the f-sub-device in the package structure, the carrier disk is clamped by the bottom surface of the electronic device The package body structure is in the punch: the Guangcheng electronic device moves along the first bearing surface toward the upper cover and abuts against the crucible, that is, the electronic device generates lateral displacement with respect to the direction of gravity, and the mounting structure only needs to bear part of the impact force. Further, since the carrier has the first-crush line at the side edge of the first bearing surface, the package: the impact of the right electronic device can be collapsed by the first crush line to effectively absorb the impact force. According to this, the packaging structure can be produced by the material loading structure when the upper electrons are placed under the tree, that is, the packaging structure has better impact absorption capability. The above features and advantages of the present invention can be more clearly understood, and the following detailed description of the embodiment and the configuration is as follows. [Embodiment] 6 M440281 FIG. 1 is a schematic diagram of a packaging structure and an electronic device according to an embodiment of the present invention. Figure 2 is a partial schematic view of the package structure of Figure 1. Referring to FIG. 1 and FIG. 2 simultaneously, in the embodiment, the electronic device 200 is, for example, a tablet computer or a notebook computer, which is not limited herein, and has a thickness H1 and a bottom surface 210 opposite to each other. A top surface 220, wherein the thickness H1 is the relative distance between the bottom surface 210 and the top surface 220. The package structure 1 includes an upper cover 110, a carrier tray 120 and a bottom box 13A. The bearing φ disk 120 is made of, for example, a corrugated paper material, and is disposed in the bottom case 13 且 and maintains an accommodating space R1 between the bottom case 130 for accommodating the related accessories (not shown) of the electronic device 200. . In the packaging process, after the related components of the electronic device 200 are placed in the bottom box 13〇, the carrier tray 12 is disposed in the bottom box 13〇, and then the electronic device 2〇〇 is disposed on the carrier tray 12〇. Finally, the upper cover 110 is closed to the bottom case 130. At this point, the initial packaging process is completed. In the present embodiment, the electronic device 2〇〇 and the package structure 100 having a rectangular parallelepiped shape are used as description objects, and therefore, when the drop test is performed, the square-angle of the square body is intersected with the triangular edge of the edge. And the six sides of the rectangular parallelepiped were tested for drop. However, this creation is not limited to this, and it is subject to change depending on the shape of the object under test and the specifications corresponding to it. The following i is further illustrated by the drop test of two different modes. Referring again to Figures 1 and 2, a right-angled coordinate is provided in the present embodiment for subsequent description. As shown in FIG. 2, the carrier 120 includes a body 123, four first extending portions 121 and four second extending portions 122. The four first & extension portions 121 face each other along the X-axis and the γ-axis. The extension 7 M440281 is connected to the periphery of the body 123, and each of the first extensions 121 has a first bearing surface U1, and the body 123 has a second bearing surface U2, that is, the plurality of first carriers SU1 of the embodiment are surrounded. Adjacent to the periphery of the second bearing surface U2. When the electronic device 200 is placed on the carrier tray 12, the bottom surface 21 of the electronic device 200 faces the second bearing surface u2, and the four peripheral edges E1 of the bottom surface 21〇 (only two of which are shown in FIG. 1) bear the same On a bearing surface ui, the top surface 220 faces the upper cover 110 with respect to the first and second bearing surfaces U1, U2. Furthermore, the four first extending portions 121 extend from the periphery of the body 123 toward the upper cymbal 110, and the second extending portions 122 respectively extend from the first extending portion 121 toward the bottom case 13 并 and abut against the bottom case. The bottom portion B1 of the 13 inch is used to support the body 123 and the first extending portion 121 above the bottom portion B1 of the bottom case 13〇 by the second extending portion 122 when the carrier tray 120 is placed in the bottom case 130. Further, the second extending portion 122 has a bending line and an abutting line L2, wherein the second extending portion 122 is adjacent to the first extending portion 121 by the bending line u, and abuts the bottom box with the abutting wire u 13〇 bottom B1. Since the first and second extensions 122 of the carrier 120 are symmetrically arranged on the XY plane, the following will be performed by taking one of the first and second extensions 121 122 and performing a drop test thereon. 3 and FIG. 4 are partial cross-sectional views of the electronic device and the package structure, respectively, to illustrate the relative relationship between the electronic device 2 and the package structure 100 in the first impact state. Please refer to FIG. 2 at the same time. 4, due to the first bearing, the surface U1 and the bottom surface 210 of the electronic device 200 (or the top surface 220, here refers to the direction of gravity when the test is dropped, that is, the phase t or the M440281 y axis shown in FIG. There is an angle T1 between the two, that is, the first bearing surface m is not parallel, and the gravity side is so that at the moment of impact, the electronic device will move along the first-loaded, υι by gravity. In addition, the packaging in this embodiment After the structure 1〇〇中田上盍110 and the bottom case 130 are closed, the top surface 220_ of the electronic device 200 is kept at a distance D from the upper cover. Therefore, the electronic device 2 (8) will face the upper cover 13G along the first bearing surface m in the first impact state. After moving the distance D1, it is pressed against the upper cover 13〇. In other words, in the first impact state described in FIGS. 3 and 4, the electronic device 200 also moves along the first bearing surface υ while pressing the first bearing surface m, thereby making the electronic device finely topped from 22 〇 靠 靠 靠 靠 靠 靠 靠 靠 靠 靠 靠 靠 靠 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = The impulse __11, the lateral impulse F2, and the forward impulse force F3 are applied to the upper yoke force, causing the electronic device to move against the 甩a to cause the upper cymbal 130 to bear the lateral impulse F2. Originally, the 耑 completely withstands the impulse of the electronic device 2〇〇, so that it can be changed to the same as the upper seedling 13 〇 I bearing surface i 士 ^ 〜, 1 (10) 冋 when the party is this impulse F1, and make -, = F1 The _-destruction caused by the different parts of the package structure 100 to the single-position of the package structure 1GG (such as the 4-bearing surface m of the actual _) can be caused by the _ destruction in the first =: != 13° with the top surface 22 of the electronic device 2. The distance D1 held by the singularity is the lateral (along the z-axis) distance of the electron 4 - bearing surface m is called 9 M44 02S1 is preferably less than a quarter of the thickness HI of the electronic device 200. Further, the angle τ of the second bearing surface ui and the bottom surface 220 is preferably from 45 degrees to 45 degrees, so that The structural condition required for the lateral movement of the electronic device 200. In addition, the first extension portion 121 of the carrier disk 120 has a first crush line κι on the ear, and the first bearing surface υ is away from the second bearing surface U2. The side edge. When the drop test is performed, the first crush line K1 is substantially below the electronic device 2GG. Therefore, the forward momentum F3 branched from the impulse F1 causes the collapse of the first crush line K1. The forward impact force F3 is absorbed by the first bearing surface U1 in the collapsed phenomenon of the first bearing surface U1 of the packaging structure 100, so as to absorb the momentum of the packaging structure 100 to generate the electronic device 200. Protection effect. In the present embodiment, when the packaging structure 100 completes the packaging of the electronic device 2, the distance D2 of the first crush line κι relative to the surface 21 of the electronic device 2 is one-half of the thickness H1. To three-quarters of the thickness H1. On the other hand, the carrier tray 120 of the present embodiment further has a pre-folding line L3 between the first bearing surface υ1 and the second bearing surface U2, and the pre-folding line L3 is used for the slave body (ie, the second bearing surface U2). The first bearing surface m is formed, that is, the second bearing surface υ1 and the second bearing surface U2 form an angle T1 as described above. Figure 5 is a partial cross-sectional view of the package structure and electronic device of the present invention for explaining the state of the package structure 100 of Figure 1 and the electronic device 200 in a second impact state. At the same time, portions of the bottom case 130 are omitted to clearly identify the structural features of the side of the carrier tray 120. Referring to FIG. 5 and FIG. 5, each of the second extensions 122 of the M440281 further has a second crush line K2 located between the bend line and the contact line L2. In this embodiment, the second crush line Κ 2 is perpendicular to the direction of gravity in the second impact state (ie, the package is taken along the Ζ axis, and the structure 100 and the electronic device 2 落 are tested), that is, The second crush line Κ 2 is substantially parallel to the bending line L1 and the abutting line L2. Similar to the first crush line K1 described above, the second crush line K2 is used to allow the second extension portion 122 of the carrier disk 120 to effectively absorb the force at this time in the second impact state, so as to let the second collapse The reduced line K2 absorbs the falling f state i generated by the impulse to achieve the effect of protecting the electronic device 200 in this direction. Here, the distance K3 of the second crush line K2 with respect to the abutting wire L2 is less than one fifth of the distance D4 of the bending line L1 with respect to the wire L2.
紅上所述，在本創作的上述實施例中，包裝結構藉由 ^承載面與與電子裝㈣底面爽—角度，而讓包裝結構 土衝摹^造成電子裝置沿著第一承載面朝向上蓋移動並抵 罪於上蓋’亦即讓電子裝置產生㈣於重力方向的側向位 =進而使包裝結構僅需承受部分的衝擊力。再者，包裝 結構f由其在第—承載面上的第-潰縮線’與第二延伸部 上的第二潰縮線’藉由其結構特性，即在受力時會產生降 ====吸枚衝擊瞬間的衝力，而進一步達到保護電子I 雖然本|彳作已以實施顯露如上，财並相以限定 任何所屬技術領域中具有通f知識者，在不脫離 =作之精神和範_，當可作些許之更動與潤飾，故本 M乍之保魏圍當視_之”專·_界定者為準。 11 M440281 【圖式簡單說明】 圖1是依照本創作一實施例的一種包裝結構與電子裝 置的包裝示意圖。 圖2是圖1包裝結構的部分構件示意圖。 圖3與圖4分別是圖1的電子裝置與包裝結構的局部 剖面圖。 圖5是本創作的包裝結構與電子裝置的局部剖面圖。 【主要元件符號說明】 100 :包裝結構 110 :上蓋 120 :承載盤 121 :第一延伸部 122 :第二延伸部 123 :本體 130 :底盒 200 :電子裝置 210 :底面 220 :頂面 B1 :底部In the above embodiment of the present invention, in the above-mentioned embodiment of the present invention, the packaging structure is caused by the surface of the package and the bottom surface of the electronic device (4), so that the packaging structure is flushed and the electronic device faces upward along the first bearing surface. The cover moves and succumbs to the upper cover', that is, the electronic device generates (4) the lateral position in the direction of gravity = and thus the package structure only needs to bear part of the impact force. Furthermore, the packaging structure f has its structural characteristics by its first-crush line ' on the first bearing surface and the second crushing line ' on the second extending portion, that is, when the force is applied, a drop is generated== == absorbing the impact of the moment of impact, and further reaching the protection of the electron I. Although this has been implemented to expose the above, the financial sector has been defined to limit the knowledge of anyone in the field of technology. _, when a little change and retouching can be made, the premise of the 乍 ” 围 围 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 Figure 2 is a partial schematic view of the packaging structure of Figure 1. Figure 3 and Figure 4 are partial cross-sectional views of the electronic device and packaging structure of Figure 1. Figure 5 is a packaging structure of the present invention. A partial cross-sectional view of the electronic device. [Main component symbol description] 100: packaging structure 110: upper cover 120: carrier disk 121: first extension portion 122: second extension portion 123: body 130: bottom case 200: electronic device 210: Bottom surface 220: top surface B1: bottom
Dl、D2、D3、D4 :距離 E1 :周緣 F1 :衝力 12 M440281 F2 :側向衝力 F3 :正向衝力 H1 :厚度 K1 :第一潰縮線 K2 :第二潰縮線 L1 :彎折線 L2 :抵接線 L3 :預折線 R1 :容置空間 T1 :夾角 U1 :第一7豕載面 U2 ··第二承載面Dl, D2, D3, D4: distance E1: circumference F1: impulse 12 M440281 F2: lateral impulse F3: positive impulse H1: thickness K1: first crush line K2: second crush line L1: bending line L2: Abutment line L3: Pre-fold line R1: accommodating space T1: Angle U1: First 7 豕 plane U2 ··Second bearing surface