TW201332851A - Packaging assembly and packaging structure thereof - Google Patents

Abstract

A packaging structure is provided, including a bottom plate, an arching roof, and a bent portion. The arching roof connects to the bottom plate and forms a first curved surface. An opening is formed between the first curved surface and the bottom plate. The bent portion is connected to the bottom plate and adjacent to the opening.

Description

Packaging combination and packaging structure

The present invention relates to a package assembly and a package structure thereof, and more particularly to a package structure having a curved shape.

Electronic devices (such as notebook computers or tablets) are often used in carton packs, and foamed materials such as Expandable Polyethylene (EPE) and Expandable Polystyrene (EPS) can be used inside the package. Protect the electronic device. Due to the widespread concept of environmental protection and recycling, corrugated paper or other paper materials have been widely used as packaging materials in the packaging of current electronic devices. However, the paper itself has limitations on its elasticity, toughness and hardness. Therefore, how to design the packaging structure of the paper material, thereby In the process of transportation and transportation, electronic devices are not easily damaged by external forces such as shock and vibration, and have become an important issue.

An embodiment of the present invention provides a packaging structure including a bottom plate, an arc top, and a bent portion. The top of the arc is connected to the bottom plate to form a first curved surface, and an opening is formed between the first curved surface and the bottom plate. The first direction has a first height, and the first direction is perpendicular to the bottom plate; the bent portion is connected to the bottom plate and adjacent to the opening, wherein the bent portion has a second height in the first direction, and the second The height is greater than the first height.

In an embodiment, the foregoing packaging structure further comprises a side plate, and the side plate is connected to the bottom plate and the top of the arc.

In an embodiment, the bent portion forms a second curved surface, and the second curved surface shields the opening.

In an embodiment, the material of the packaging structure is corrugated paper.

In an embodiment, the bent portion and the top of the arc are located on the same side of the bottom plate.

An embodiment of the present invention further provides a package assembly, comprising the foregoing one of a package structure and an outer box structure, the outer box structure comprising a box body and a buffer device, wherein the package structure is disposed in the box body, and the buffer structure is disposed in the box The body is in contact with the bottom plate of the packaging structure.

In an embodiment, the foregoing packaging structure further comprises a side plate, and the side plate is connected to the bottom plate and the top of the arc.

In an embodiment, the bent portion has a second curved surface, and the second curved surface shields the opening.

In an embodiment, the material of the packaging structure and the outer box structure is corrugated paper.

In an embodiment, the bent portion and the top of the arc are located on the same side of the bottom plate.

Please refer to FIG. 1 and FIG. 2 together. The packaging structure 1 according to an embodiment of the present invention mainly comprises a bottom plate 10, an arc top 20, a side plate 30 and a bent portion 40, and the material thereof can be corrugated paper or the like. Paper. As shown in the first and second figures, the bottom plate 10 is substantially parallel to the XY plane, and the arc top 20 is connected to the bottom plate 10 to form a first curved surface 70, wherein an electronic device 100 (for example, a notebook computer or a tablet computer) It can be accommodated between the bottom plate 10 and the top portion 20 of the arc. Further, an opening 50 is formed between the first curved surface 70 and the bottom plate 10. The opening 50 has a first height A1 in the Z-axis direction (first direction). In the present embodiment, the aforementioned side panel 30 is connected to the bottom panel 10 and the arc top 20 and is located on the other side of the package structure 1 with respect to the opening 50.

Continuing to refer to FIGS. 1 and 2, the aforementioned bent portion 40 is coupled to the bottom plate 10 and adjacent to the opening 50, and the bent portion 40 is tied to the arc top portion 20 on the same side of the bottom plate 10. In particular, the bent portion 40 has a second height A2 in the Z-axis direction, and it can be seen from FIG. 2 that the second height A2 is greater than the first height A1. In addition, it can be seen from FIG. 1 that the bent portion 40 is formed with a second curved surface 60, wherein the second curved surface 60 can be used to shield the opening 50.

It should be particularly noted that the electronic device 100 can be prevented from sliding out of the packaging structure 1 by shielding the opening 50 by the bending portion 40 described above. When the package structure 1 is being transported, the first curved surface 70 formed through the bottom plate 10 and the arc top 20 can absorb the impact force from the vertical direction (such as the Z-axis direction in FIG. 1), and the side plate 30 and the bent portion 40 are formed. The second curved surface 60 can absorb the impact force from the horizontal direction (such as the Y-axis direction in FIG. 1), and the first curved surface 70 formed by the bottom plate 10 and the arc top 20 can absorb from another horizontal direction (such as the first The impact force in the X-axis direction in the figure. As described above, with the packaging structure 1 of the present invention and the cushioning property of the corrugated paper itself, the package structure 1 can properly protect the electronic device 100 therein.

Next, please refer to Figures 3 and 4 together. The present invention further provides a package assembly mainly composed of the foregoing package structure 1 and an outer box structure 2. The outer box structure 2 has an upper cover 110, a box body 80 and a buffer structure 90, which may be made of corrugated paper or other paper materials. The buffer structure 90 may be first disposed in the box body 80 during assembly, and then the package structure 1 is assembled. It is disposed on the buffer structure 90, wherein the buffer structure 90 can abut the bottom plate 10 of the packaging structure 1, and the upper cover 110 can close the outer box structure 2 and fix the packaging structure 1 in the outer box structure 2.

It should be particularly noted that when the package assembly is transported, the box body 80 and the upper cover 110 can absorb impact forces from various directions, and the buffer structure 90 disposed in the box body 80 can support the bottom plate 10 of the package structure 1. As shown in FIG. 4, the present invention can form a suspension elastic system to absorb the impact force by arranging the packaging structure 1 on the buffer structure 90, and furthermore, with the cushioning property of the packaging structure 1, the packaging combination can be more capable. The electronic device 100 therein is perfectly protected.

In summary, the present invention provides a package assembly and a package structure thereof, wherein the package structure can be disposed in an outer box structure to protect an electronic device housed in the package structure. The packaging structure can absorb the impact force from multiple directions by a curved surface shape, and the electronic device can be more fully protected by the packaging structure and the outer box structure.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. Those skilled in the art having the ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

1. . . Packaging structure

2. . . Outer box structure

10. . . Bottom plate

20. . . Arc top

30. . . Side panel

40. . . Bending section

50. . . Opening

60. . . Second surface

70. . . First surface

80. . . Box

90. . . Buffer structure

100. . . Electronic device

110. . . Upper cover

A1. . . First height

A2. . . Second height

1 is a schematic view showing a package structure according to an embodiment of the present invention;

Figure 2 is a side view showing a package structure according to an embodiment of the present invention;

Figure 3 is a view showing a package structure and an outer box structure according to an embodiment of the present invention;

Figure 4 is a cross-sectional view showing a package assembly in accordance with an embodiment of the present invention

1. . . Packaging structure

10. . . Bottom plate

20. . . Arc top

30. . . Side panel

40. . . Bending section

50. . . Opening

60. . . Second surface

70. . . First surface

100. . . Electronic device

A1. . . First height

A2. . . Second height

Claims (10)

A packaging structure comprising: a bottom plate; an arc top portion connected to the bottom plate and forming a first curved surface, wherein an opening is formed between the first curved surface and the bottom plate, the opening having a first direction in a first direction a height, and the first direction is perpendicular to the bottom plate; and a bent portion connected to the bottom plate and adjacent to the opening, wherein the bent portion has a second height in the first direction, and the second portion The height is greater than the first height. The packaging structure of claim 1, wherein the packaging structure further comprises a side panel, and the side panel is connected to the bottom panel and the top of the arc. The package structure of claim 1, wherein the bent portion forms a second curved surface, and the second curved surface shields the opening. The packaging structure of claim 1, wherein the packaging structure is made of corrugated paper. The package structure of claim 1, wherein the bent portion and the top of the arc are located on the same side of the bottom plate. A packaging package comprising: the packaging structure according to claim 1; an outer box structure comprising: a box body, wherein the package structure is disposed in the box body; and a buffer structure disposed in the box The body is in contact with the bottom plate of the packaging structure. The package assembly of claim 6, wherein the package structure further comprises a side panel, and the side panel is coupled to the bottom panel and the top of the arc. The package combination of claim 6, wherein the bent portion forms a second curved surface, and the second curved surface shields the opening. The packaging assembly of claim 6, wherein the packaging structure and the outer casing structure are made of corrugated paper. The package combination of claim 6, wherein the bent portion and the top of the arc are on the same side of the bottom plate.