TW201339059A - Packaging assembly and packaging structure thereof - Google Patents
Packaging assembly and packaging structure thereof Download PDFInfo
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- TW201339059A TW201339059A TW101110726A TW101110726A TW201339059A TW 201339059 A TW201339059 A TW 201339059A TW 101110726 A TW101110726 A TW 101110726A TW 101110726 A TW101110726 A TW 101110726A TW 201339059 A TW201339059 A TW 201339059A
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Abstract
Description
本發明係有關於一種包裝組合及其包裝結構,特別是有關於一種用以容納電子裝置之包裝組合及其包裝結構。The present invention relates to a package assembly and a package structure thereof, and more particularly to a package combination for accommodating an electronic device and a package structure thereof.
電子裝置(如筆記型電腦或平板電腦)常使用紙盒包裝,而包裝盒內部可使用發泡聚乙烯(Expandable Polyethylene,EPE)、發泡聚苯乙烯(Expandable Polystyrene,EPS)等發泡材料來保護電子裝置。由於環保與回收的觀念普及,現行電子裝置的包裝已大量使用瓦楞紙或其他紙材作為包裝材料,然而紙材本身有其彈性、韌性及硬度之限制,因此如何設計紙材的包裝結構,進而使電子裝置在運輸及搬運的過程中,不易因衝擊與振動等外力而造成損傷,始成為一重要之課題。Electronic devices (such as notebook computers or tablets) are often used in carton packs, and foamed materials such as Expandable Polyethylene (EPE) and Expandable Polystyrene (EPS) can be used inside the package. Protect the electronic device. Due to the widespread concept of environmental protection and recycling, corrugated paper or other paper materials have been widely used as packaging materials in the packaging of current electronic devices. However, the paper itself has limitations on its elasticity, toughness and hardness. Therefore, how to design the packaging structure of the paper material, thereby In the process of transportation and transportation, electronic devices are not easily damaged by external forces such as shock and vibration, and have become an important issue.
本發明之一實施例提供一種包裝結構,用以容置一電子裝置,包括一盒體與複數個支承部,其中盒體形成有一底板以及分別連接底板的複數個側板,支承部設置於盒體中,每一支承部包括兩個凹形板與兩個連接板,其中凹形板相互連接,並分別形成有一凹口,凹口相互連接,且凹口與底板之間相隔一距離,兩個連接板分別連接凹形板,且凹形板與連接板分別與底板垂直,並形成一口字形結構。An embodiment of the present invention provides a package structure for accommodating an electronic device, including a box body and a plurality of support portions, wherein the box body is formed with a bottom plate and a plurality of side plates respectively connected to the bottom plate, and the support portion is disposed on the box body Each support portion includes two concave plates and two connecting plates, wherein the concave plates are connected to each other and respectively formed with a notch, the notches are connected to each other, and the notches are separated from the bottom plate by a distance, two The connecting plates are respectively connected to the concave plates, and the concave plates and the connecting plates are respectively perpendicular to the bottom plate and form a mouth-shaped structure.
於一實施例中,前述支承部更具有一彎折板,大致呈一L形結構並連接凹形板。In an embodiment, the support portion further has a bent plate, and has an L-shaped structure and is connected to the concave plate.
於一實施例中,前述凹口邊緣形成有刻痕線。In an embodiment, the aforementioned notch edge is formed with a score line.
於一實施例中,前述包裝結構係以刀模裁切製造。In one embodiment, the aforementioned packaging structure is manufactured by knife die cutting.
於一實施例中,前述盒體與支承部為一體成型裁切製造。In an embodiment, the casing and the support portion are integrally formed and cut.
於一實施例中,前述包裝結構之材質為瓦楞紙。In an embodiment, the material of the packaging structure is corrugated paper.
於一實施例中,前述支承部設置在盒體的角落。In an embodiment, the support portion is disposed at a corner of the case.
本發明之一實施例更提供一種包裝組合,包括一如前所述之包裝結構以及一內箱,其中電子裝置容置於內箱內,且內箱容置於凹口。An embodiment of the present invention further provides a package assembly comprising a package structure as described above and an inner box, wherein the electronic device is housed in the inner box and the inner box is received in the recess.
於一實施例中,前述支承部更具有一彎折板,大致呈一L形結構並連接凹形板。In an embodiment, the support portion further has a bent plate, and has an L-shaped structure and is connected to the concave plate.
於一實施例中,前述凹口邊緣形成有刻痕線。In an embodiment, the aforementioned notch edge is formed with a score line.
請一併參閱第1、2圖,本發明一實施例之包裝結構10主要係由一盒體100和複數個支承部200所組成,其材質可為瓦楞紙或其他紙材,可用以包裝一電子裝置。前述盒體100與支承部200可經由刀模裁切一紙材而一體成型製造,或是分別完成盒體100和複數個支承部200,再將其組合成包裝結構10。Please refer to FIG. 1 and FIG. 2 together. The packaging structure 10 of an embodiment of the present invention is mainly composed of a box body 100 and a plurality of supporting portions 200, which may be made of corrugated paper or other paper materials, and can be used for packaging an electronic device. Device. The case body 100 and the support portion 200 can be integrally molded by cutting a paper material through a die, or the case body 100 and the plurality of support portions 200 are respectively completed, and then combined into the package structure 10.
如第1圖所示,支承部200由兩個凹形板210、兩個連接板220和一彎折板230所組成,其中凹形板210形成有一凹口250,且兩個凹形板210以凹口250相連的方式相互連接,兩個連接板220係互相連接,並分別連接兩個凹形板210;換言之,凹形板210與連接板220係形成一口字形的柱狀結構,且相鄰之凹形板210與相鄰之連接板220皆大致呈90度。如第1圖所示,彎折板230係大致呈一L形結構,對應於前述凹口250並連接兩個凹形板210,藉以加強支承部200整體的結構強度。需要特別說明的是,前述凹口250的邊緣更形成有刻痕線240,以避免應力集中於凹口250的邊緣。As shown in FIG. 1, the support portion 200 is composed of two concave plates 210, two connecting plates 220 and a bent plate 230, wherein the concave plate 210 is formed with a notch 250, and two concave plates 210 The two connecting plates 220 are connected to each other and connected to the two concave plates 210; in other words, the concave plate 210 and the connecting plate 220 form a columnar columnar structure, and the phase is connected to each other. The adjacent concave plate 210 and the adjacent connecting plate 220 are both approximately 90 degrees. As shown in FIG. 1, the bent plate 230 has a substantially L-shaped structure corresponding to the aforementioned recess 250 and connects the two concave plates 210, thereby reinforcing the structural strength of the entire support portion 200. It should be particularly noted that the edge of the aforementioned recess 250 is further formed with a score line 240 to prevent stress from being concentrated on the edge of the recess 250.
接著請參閱第2圖,前述盒體100主要包括一底板110以及分別連接底板110的四個側板120,且前述四個支承部200分別設置於盒體100的四個角落,其中支承部200大致垂直於底板110,且連接板220連接側板120,凹形板210的凹口250則朝向盒體100的內側。由第2圖可以看出,包裝結構10的凹口250與底板110相隔一距離,藉此可透過四個支承部200的凹口250懸置一包裝物,並使得包裝物不會接觸到底板110。此外,盒體100更具有一盒蓋130,當盒蓋130關閉時,更可進一步固定支承部200以及其中的電子裝置。Referring to FIG. 2 , the casing 100 mainly includes a bottom plate 110 and four side plates 120 respectively connected to the bottom plate 110 , and the four supporting portions 200 are respectively disposed at four corners of the casing 100 , wherein the supporting portion 200 is substantially The bottom plate 110 is perpendicular to the bottom plate 110, and the connecting plate 220 is connected to the side plate 120. The notch 250 of the concave plate 210 faces the inner side of the casing 100. As can be seen from Fig. 2, the recess 250 of the package structure 10 is spaced from the bottom plate 110 by a distance from the recess 250 of the four support portions 200 so that the package does not touch the bottom plate. 110. In addition, the case 100 further has a cover 130. When the cover 130 is closed, the support portion 200 and the electronic device therein can be further fixed.
再請一併參閱第3、4圖,本發明更提供一種包裝組合20,其主要係由前述的包裝結構10以及一內箱300所組成。前述內箱300之材質可為瓦楞紙或其他紙材,用以容置一電子裝置400。如第3圖所示,當內箱300容置於盒體100之中時,盒體100的四個支承部200可透過凹口250分別支撐內箱300的四個角落,且支承部200的彎折板230可進一步固定內箱300,以增加支承部200的結構強度。再請參閱第4圖,需要注意的是,由於凹口250與底板110相隔一距離,故外箱300會被懸置於盒體100內,且與盒體100無直接接觸。位於凹口250邊緣的刻痕線240則可避免應力集中在該處,同時可吸收盒體100因碰撞所產生的衝擊力,使得包裝組合20可更完善地保護其內的電子裝置400。Referring again to Figures 3 and 4, the present invention further provides a package assembly 20 which is mainly composed of the aforementioned package structure 10 and an inner box 300. The material of the inner box 300 may be corrugated paper or other paper material for accommodating an electronic device 400. As shown in FIG. 3, when the inner box 300 is received in the casing 100, the four supporting portions 200 of the casing 100 can respectively support the four corners of the inner box 300 through the notches 250, and the supporting portion 200 The bent plate 230 may further fix the inner box 300 to increase the structural strength of the support portion 200. Referring to FIG. 4 again, it should be noted that since the notch 250 is spaced apart from the bottom plate 110, the outer case 300 is suspended in the case 100 and is not in direct contact with the case 100. The score line 240 at the edge of the recess 250 prevents stress from being concentrated there, while absorbing the impact force of the cartridge 100 due to the collision, so that the package assembly 20 can more fully protect the electronic device 400 therein.
綜上所述,本發明提供一種包裝組合及其包裝結構,其中一內箱可設置於包裝結構之中,以保護容置於內箱中的電子裝置。特別地是,包裝結構可藉由四個支承部使內箱及其中的電子裝置懸置於包裝結構內部,如此一來衝擊力便可藉由電子裝置外側的包裝結構、支承部以及內箱加以吸收,進而可有效地保護包裝結構內的電子裝置。In summary, the present invention provides a package assembly and a package structure thereof, wherein an inner box can be disposed in the package structure to protect the electronic device housed in the inner box. In particular, the packaging structure can suspend the inner box and the electronic device therein by the four supporting portions, so that the impact force can be applied by the packaging structure, the supporting portion and the inner box on the outer side of the electronic device. Absorption, which in turn effectively protects the electronic devices within the package structure.
雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可做些許之更動與潤飾。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. Those skilled in the art having the ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
10...包裝結構10. . . Packaging structure
20...包裝組合20. . . Packaging combination
100...盒體100. . . Box
110...底板110. . . Bottom plate
120...側板120. . . Side panel
130...盒蓋130. . . Cover
200...支承部200. . . Support
210...凹形板210. . . Concave plate
220...連接板220. . . Connection plate
230...彎折板230. . . Bent plate
240...刻痕線240. . . Scoring line
250...凹口250. . . Notch
300...內箱300. . . Inner box
400...電子裝置400. . . Electronic device
第1圖表示本發明一實施例之支承部示意圖;Figure 1 is a schematic view showing a support portion according to an embodiment of the present invention;
第2圖表示本發明一實施例之包裝結構示意圖;2 is a schematic view showing a package structure according to an embodiment of the present invention;
第3圖表示本發明一實施例之內箱設置於包裝結構中之示意圖;以及3 is a schematic view showing an inner box disposed in a packaging structure according to an embodiment of the present invention;
第4圖表示本發明一實施例之包裝組合的剖面圖。Figure 4 is a cross-sectional view showing a package assembly in accordance with an embodiment of the present invention.
10...包裝結構10. . . Packaging structure
100...盒體100. . . Box
110...底板110. . . Bottom plate
120...側板120. . . Side panel
130...盒蓋130. . . Cover
200...支承部200. . . Support
210...凹形板210. . . Concave plate
220...連接板220. . . Connection plate
250...凹口250. . . Notch
Claims (10)
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TW101110726A TW201339059A (en) | 2012-03-28 | 2012-03-28 | Packaging assembly and packaging structure thereof |
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TW101110726A TW201339059A (en) | 2012-03-28 | 2012-03-28 | Packaging assembly and packaging structure thereof |
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TW201339059A true TW201339059A (en) | 2013-10-01 |
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TW101110726A TW201339059A (en) | 2012-03-28 | 2012-03-28 | Packaging assembly and packaging structure thereof |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110758908A (en) * | 2018-07-25 | 2020-02-07 | 技嘉科技股份有限公司 | Server protective cover |
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2012
- 2012-03-28 TW TW101110726A patent/TW201339059A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110758908A (en) * | 2018-07-25 | 2020-02-07 | 技嘉科技股份有限公司 | Server protective cover |
CN110758908B (en) * | 2018-07-25 | 2021-07-30 | 技嘉科技股份有限公司 | Server protective cover |
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