TW201406624A - Package assembly - Google Patents

Abstract

A package assembly for packaging an electronic device is provided, including a box, a cover and a buffering unit. The box is used for receiving the electronic device, and the cover is detachably connected to the box. The buffering unit, disposed on an inner surface of the cover, includes a plurality of flat portions and ridged structures connected to each other, and the ridged structures protrude toward the box from the flat portions.

Description

Packaging component

The present invention relates to a package assembly, and more particularly to a package assembly for an electronic device.

The electronic device is damaged during the transportation process due to the impact of external force, so the requirements for the packaging component are more stringent.

At present, the common electronic device packaging has used corrugated paper in a large amount, and the elasticity and damping buffer of the paper material and the absorption of energy can prevent the electronic device from being damaged by impact during transportation. However, the inside of the upper cover of the package still needs to add additional cushioning members such as foam or styrofoam to prevent the impact from the upper cover, but this will greatly increase the material and assembly cost.

One embodiment of the present invention provides a package assembly for packaging an electronic device and includes a bottom case, an upper cover, and a buffer unit. The bottom box is for carrying the electronic device; the upper cover is detachably connected to the bottom box; the buffer unit is disposed on an inner side surface of the upper cover, and has a plurality of flat portions and a plurality of ridge structures, and the ridge structure is connected The flat plate portion protrudes from the flat plate portion toward the bottom case.

In one embodiment, the ridge structures respectively include two slanted faces connected to each other, the slanted faces are connected to the flat plate portion, and the slanting portions of the slanted faces respectively form a ridge line, wherein the slanted faces and the slanted surface are respectively Each of the flat portions has an inclined angle therebetween.

In an embodiment, the aforementioned tilt angle is between 30 degrees and 45 degrees.

In one embodiment, the ridge line and the flat portion have a height between 5 and 10 mm.

In one embodiment, one of the ridge lines is spaced apart from an edge of the buffer unit by a distance, the edge is parallel to the ridge lines, and the buffer unit has a length in a first direction, and the distance is Between 1/4 and 1/3 of the length.

In one embodiment, the ridge structure further has at least one crush line, wherein the crush lines and the ridge line are perpendicular to each other.

In one embodiment, one of the collapse lines is spaced apart from an edge of the buffer unit, the edge is parallel to the crush lines, and the buffer unit has a length in a second direction. The distance is between 1/4 and 1/3 of the length.

In one embodiment, the ridge structure spans the buffer unit.

In one embodiment, the ridge structure and the flat portion are made of corrugated paper in one piece.

The above described objects, features, and advantages of the invention will be apparent from the description and appended claims

1 is an exploded view of a package assembly 100 and an electronic device 200 according to an embodiment of the present invention, wherein the electronic device 200 can be a tablet computer or a notebook computer or the like. The foregoing packaging assembly 100 mainly includes an upper cover 110, a buffer unit 120 and a bottom box 130, all of which are made of corrugated paper. As shown in FIG. 1, the bottom case 130 has an accommodation space P1, The cover 110 and the buffer unit 120 cover the electronic device 200 and the bottom box 130. In the packaging process, the electronic device 200 can be placed in the accommodating space P1, and then the buffer unit 120 is overlaid on the electronic device 200. Finally, the upper cover 110 is smashed and combined with the bottom box 130 to complete the entire packaging process. .

Referring to FIG. 2A, the buffer unit 120 of the aforementioned packaging assembly 100 includes three flat portions S1 and two ridge structures R1. Each of the ridge structures R1 has two inclined slope portions S2 connected thereto, and the flat plate portion S1 and the slope portion S2 of the ridge structure R1 are connected to each other, and a joint portion of the two slope portions S2 of each of the ridge structures R1 is formed. The ridge line L1 in which the inclined angle T1 is formed between the inclined surface portion S2 and the flat plate portion S1 (as shown in FIG. 2B).

Continuing to refer to FIG. 2B, the ridge line L1 and the flat portion S1 have a height H therebetween, and the inclined surface portion S2 and the flat portion S1 respectively have an inclination angle T1, wherein the height H is preferably between 5 and 10 It is preferable that the inclination angle T1 is between 30 degrees and 45 degrees.

It should be understood that, in this embodiment (FIG. 2A), the buffer unit 120 has a length D1 along the first direction (X-axis direction), and the ridge line L1 of the right ridge structure R1 and one edge of the buffer unit 120 The distance D3 between L2 is between 1/4 and 1/3 of the aforementioned length D1, that is, D1/4≦D3≦D1/3, wherein the edge L2 and the ridge line L1 are parallel to each other, and the two ridge structures R1 They are symmetrical to each other. In addition, the buffer unit 120 further has a length D2 along the second direction (Y-axis direction), the ridge structure R1 spans the buffer unit 120, and the length of the ridge structure R1 along the Y-axis direction may be the same as the foregoing length D2. Isometric, but not particularly limited, wherein the ridge structure R1 and the flat portion S1 It can be formed by bending the integrally formed corrugated paper.

It should be particularly emphasized that the inclined surface portion S2 of the ridge structure R1 further has at least one collapsing line K1, wherein the crush line K1 and the ridge line L1 are perpendicular to each other, and the crush line K1 and the buffer unit 120 The distance D4 between the edges L3 is between 1/4 and 1/3 of the aforementioned length D2, that is, D2/4≦D4≦D2/3, wherein the edge L3 and the crush line K1 are parallel to each other. In the present embodiment, the method of pre-pressing the score line through the machine to form the crush line K1 can thereby absorb the impact by means of the deformation deformation, thereby achieving the effect of protecting the electronic device 200.

As shown in FIG. 3, when the packaging assembly 100 is caused to invert the gravity F1 of the electronic device 200 itself to the buffer unit 120, since the ridge structure R1 is made of corrugated paper, a Damping effect shock absorbing structure to avoid damage to the electronic device 200. It should be understood that since the ridge line L1 of the ridge structure R1 can directly abut against the electronic device 200, in addition to avoiding the shaking of the electronic device 200, the impact force from the outside can be first received through the ridge structure R1. In addition, through the design of the crush line K1, the vibration energy can be effectively absorbed to avoid deformation and damage to the package component 100, thereby achieving the effect of protecting the electronic device 200.

In summary, the present invention provides a package assembly, which mainly includes a bottom box, an upper cover, and a buffer unit for carrying an electronic device; the upper cover is detachably connected to the bottom case; The carrying unit is disposed on an inner side surface of the upper cover and has a plurality of flat portions and a plurality of ridge structures, wherein the ridge structures protrude from the surface of the flat portions. Through the above design features, the package assembly of the present invention can provide a better cushioning protection effect of the electronic device, and save the need for the upper cover buffer member in the conventional package. cost.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. Those skilled in the art having the ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧Packaging components

110‧‧‧Upper cover

120‧‧‧buffer unit

130‧‧‧ bottom box

200‧‧‧Electronic devices

K1‧‧‧cure line

L1‧‧‧ ridgeline

L2/L3‧‧‧ edge

P1‧‧‧ accommodating space

R1‧‧‧ ridge structure

S1‧‧‧ Flat Department

S2‧‧‧Slope

T1‧‧‧ tilt angle

F1‧‧‧Gravity

1 is a view showing an exploded view of a package assembly and an electronic device according to an embodiment of the present invention; FIG. 2A is a schematic view showing a buffer unit of a package assembly according to an embodiment of the present invention; and FIG. 2B is an enlarged view showing a portion A of FIG. 2A; And Fig. 3 is a view showing a state in which the ridge structure of the embodiment of the present invention abuts the electronic device.

120‧‧‧buffer unit

K1‧‧‧cure line

L1‧‧‧ ridgeline

L2/L3‧‧‧ edge

R1‧‧‧ ridge structure

S1‧‧‧ Flat Department

S2‧‧‧Slope

Claims (9)

A packaging assembly for packaging an electronic device, comprising: a bottom box for carrying the electronic device; an upper cover detachably connected to the bottom box; and a buffer unit disposed on the upper cover The inner side surface has a plurality of flat portions and a plurality of ridge structures, and the ridge structures connect the flat portions and protrude from the flat portions toward the bottom box. The package assembly of claim 1, wherein the ridge structures respectively comprise two inclined slope portions connected to each other, the slope portions are connected to the flat plate portions, and the joint portions of the slope portions are respectively formed An ridge line, wherein the inclined surface portions and the flat plate portions respectively have an inclined angle. The package assembly of claim 2, wherein the inclination angles are between 30 degrees and 45 degrees. The package assembly of claim 2, wherein the ridge lines and the flat portions have a height between 5 and 10 mm. The package assembly of claim 2, wherein one of the ridge lines is spaced apart from an edge of the buffer unit by a distance, the edge and the ridge line are parallel to each other, and the buffer unit is first There is a length in the direction which is between 1/4 and 1/3 of the length. The package assembly of claim 2, wherein the ridge structures each have at least one crush line, wherein the crush lines and the ridge lines are perpendicular to each other. The package assembly of claim 6, wherein one of the crush lines is separated from an edge of the buffer unit by a distance, The edge is parallel to the crush lines, and the buffer unit has a length in a second direction that is between 1/4 and 1/3 of the length. The package assembly of claim 1, wherein the ridge structures span the buffer unit. The package assembly of claim 1, wherein the ridge structures and the flat portions are made of corrugated paper in one piece.