TWM550286U - Packing box - Google Patents

Abstract

A packing box including a first box, a buffering plate and a buffering casing is provided. The buffering plate is disposed in the first box. The buffering casing is disposed on the buffering plate and located in the first box. The buffering casing has an accommodating structure, and the accommodating structure is configured to cover an electronic device disposed on the buffering plate.

Description

Packing box

The novel creation relates to a packaging structure, and in particular to a package.

Electronic products are usually stored in the box during the exhibition or delivery to avoid damage to the electronic products caused by foreign objects or external forces. On the other hand, a large amount of sponge or styrofoam is usually provided in the package to buffer the impact of external force on the electronic product, but this method is not easy to reduce the size of the package, and a large amount of packaging materials.

The novel creation provides a package that is lightweight and reduces the use of the package.

The package created by the present invention comprises a first box body, a buffer board and a buffer shell. The buffer plate is disposed in the first case. The buffer shell is disposed on the buffer board and located in the first box body. The buffer case has a receiving structure configured to cover the electronic device on the buffer plate.

Based on the above, the package created by the present invention can buffer the impact of the external force on the electronic device by the buffer case, which not only helps to reduce the size of the package, but also saves the use amount of the package.

The above described features and advantages of the present invention will become more apparent and understood from the following description.

1 is a schematic view of a package and an electronic device housed therein according to an embodiment of the present invention. 2 is a schematic view of a buffer case of an embodiment of the present invention. Figure 3 is a cross-sectional view taken along line I-I of Figure 1. Referring to FIG. 1 to FIG. 3 , in the embodiment, the package 100 includes a first case 110 , a buffer plate 120 , and a buffer case 130 . The first case 110 can be a paper case and configured to receive the buffer board 120, the electronic device 10, and the buffer case 130.

The package 100 further includes a second case 140, wherein the second case 140 can be a paper case and disposed in the first case 110. The second casing 140 is configured to receive the buffer plate 120, the buffer casing 130, and the electronic device 10. In the packaging step, the buffer plate 120 is firstly fixed in the second casing 140 through the opening of the second casing 140. The electronic device 10 is placed on the buffer board 120 through the opening of the second box 140. The buffer shell 130 is placed on the buffer board 120 through the opening of the second box 140, and is fixed to the second box 140. Inside. The buffer case 130 covers the electronic device 10 and is configured to fix the position of the electronic device 10 on the buffer plate 120 such that the electronic device 10 does not slip on the buffer plate 120 or the second case 140. Finally, the second box body 140 is placed and fixed in the first box body 110, thereby preventing the foreign object from causing damage to the electronic device 10 or buffering the external force on the electronic device 10 through the double-layer box body and the buffer structure inside the box body. Shock.

The electronic device 10 may be a notebook computer, a tablet computer, a display, or other electronic product, and the buffer plate 120 is, for example, a thin plate made of expandable polyethylene (EPE). The thickness D1 of the buffer plate 120 is about 1 to 1.2 times the thickness D2 of the electronic device 10, which helps to buffer the impact of the external force on the electronic device 10. On the other hand, the buffer plate 120 may be provided with a slot 121, and the side length L1 of the slot 121 is about 0.5 to 0.75 times the side length L2 of the electronic device 10 for improving the buffering effect. As shown in FIG. 3, the electronic device 10 disposed on the buffer board 120 can completely cover the slot 121.

The buffer case 130 may be a transparent thin case made of polyethylene terephthalate (PET) having a thickness D3 of about 0.8 to 1.2 mm and having an explosion-proof effect. The buffer case 130 has a receiving structure 131 configured to cover the electronic device 10 and fix the position of the electronic device 10 on the buffer board 120. In the present embodiment, the top surface 131a of the receiving structure 131 and the top portion 111 of the first case 110 are opposed to each other, and the pitch G1 is maintained. For example, the pitch G1 is 1 to 1.2 times the thickness D2 of the electronic device 10, which helps to buffer the impact of the external force on the electronic device 10. In some embodiments, the buffer case may be provided with a plurality of receiving structures configured to receive the electronic periphery. The impact of the external force on the electronic device 10 by the buffer case 130 not only helps to reduce the size of the package 100, but also saves the amount of use of the package.

The buffer shell 130 further has a side wall portion 132 and a connecting portion 133 , wherein the side wall portion 132 surrounds the receiving structure 131 , and the connecting portion 133 connects the side wall portion 131 and the receiving structure 131 . The side wall portion 132 abuts against the second box body 140, and the side wall surface 131b of the receiving structure 131 facing the side wall portion 132 and the side wall portion 132 are kept at a distance G2. In other words, the receiving structure 131 and the second case 140 are separated from the connecting portion 133 by the side wall portion 131. For example, the pitch G2 is 1 to 1.2 times the thickness D2 of the electronic device 10, which helps to buffer the impact of the external force on the electronic device 10. As shown in FIG. 3 , the height H1 of the side wall portion 132 is greater than the height H2 of the receiving structure 131 , and the side wall portion 132 abuts the top portion 111 of the first box body 110 , the buffer plate 120 , and the second box body 140 , so the buffer shell The 130 can be securely secured within the second casing 140 and secure the position of the electronic device 10 on the baffle 120.

In the present embodiment, the top portion 111 of the first case 110 has a see-through area 112 configured to expose the top surface 131a of the receiving structure 131. Since the buffer case 130 can be a transparent thin case, the consumer can view the electronic device 10 covered by the buffer case 130 through the see-through area 112. For example, the see-through region 112 can be provided with a transparent sheet or a transparent film.

In summary, the package created by the novel can absorb the impact of the external force on the electronic device by the buffer shell, which not only helps to reduce the size of the package, but also saves the use of the package material. On the other hand, the package created by the present invention has a see-through packaging design for the consumer to directly view the electronic device inside the package.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

10‧‧‧Electronic devices
100‧‧‧Package box
110‧‧‧First box
111‧‧‧ top
112‧‧‧ Perspective area
120‧‧‧buffer board
121‧‧‧ slotting
130‧‧‧ cushion shell
131‧‧‧ containment structure
131a‧‧‧ top
131b‧‧‧ sidewall surface
132‧‧‧ Side wall
133‧‧‧Connecting Department
140‧‧‧Second box
D1~D3‧‧‧ thickness
G1, G2‧‧‧ spacing
H1, H2‧‧‧ height
L1, L2‧‧‧

1 is a schematic view of a package and an electronic device housed therein according to an embodiment of the present invention. 2 is a schematic view of a buffer case of an embodiment of the present invention. Figure 3 is a cross-sectional view taken along line I-I of Figure 1.

10‧‧‧Electronic devices

100‧‧‧Package box

110‧‧‧First box

111‧‧‧ top

112‧‧‧ Perspective area

120‧‧‧buffer board

121‧‧‧ slotting

130‧‧‧ cushion shell

131‧‧‧ containment structure

131a‧‧‧ top

131b‧‧‧ sidewall surface

132‧‧‧ Side wall

133‧‧‧Connecting Department

140‧‧‧Second box

D1~D3‧‧‧ thickness

G1, G2‧‧‧ spacing

H1, H2‧‧‧ height

L1, L2‧‧‧

Claims (10)

A packaging box comprising: a first casing; a buffer plate disposed in the first casing; and a buffer casing disposed on the buffer plate and located in the first casing, the buffer casing having a receiving body The structure is configured to cover an electronic device disposed on the buffer board. The package of claim 1, further comprising: a second casing disposed in the first casing, configured to receive the buffer plate, the buffer casing and the electronic device. The package of claim 1, wherein the buffer shell further has a side wall surrounding the receiving structure, and a side wall surface of the receiving structure facing the side wall portion is spaced apart from the side wall portion. The package of claim 3, wherein the pitch is from 1 to 1.2 times the thickness of the electronic device. The package of claim 1, wherein a top surface of the receiving structure and a top portion of the first casing are opposite each other and maintain a spacing. The package of claim 5, wherein the pitch is from 1 to 1.2 times the thickness of the electronic device. The package of claim 1, wherein a top portion of the first casing has a see-through region configured to reveal a top surface of the receiving structure. The package of claim 1, wherein the buffer case is made of a transparent material. The package of claim 1, wherein the buffer shell has a thickness of between 0.8 and 1.2 mm. The package of claim 1, wherein the buffer plate has a thickness of 1 to 1.2 times a thickness of the electronic device, and the buffer plate has a slot, and the electronic device covers the slot.