JP6025722B2 - 電気的な偏りを調整するためのプラズマ処理装置及びライナーアセンブリ、プラズマ処理方法 - Google Patents

電気的な偏りを調整するためのプラズマ処理装置及びライナーアセンブリ、プラズマ処理方法 Download PDF

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Publication number
JP6025722B2
JP6025722B2 JP2013520730A JP2013520730A JP6025722B2 JP 6025722 B2 JP6025722 B2 JP 6025722B2 JP 2013520730 A JP2013520730 A JP 2013520730A JP 2013520730 A JP2013520730 A JP 2013520730A JP 6025722 B2 JP6025722 B2 JP 6025722B2
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JP
Japan
Prior art keywords
plasma processing
processing apparatus
liner assembly
slots
liner
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2013520730A
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English (en)
Japanese (ja)
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JP2013539159A5 (enExample
JP2013539159A (ja
Inventor
ジェームズ ディー カードゥッチ
ジェームズ ディー カードゥッチ
ジガング チェン
ジガング チェン
シャヒド ラウフ
シャヒド ラウフ
ケネス エス コリンズ
ケネス エス コリンズ
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2013539159A5 publication Critical patent/JP2013539159A5/ja
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Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electromagnetism (AREA)
  • Plasma Technology (AREA)
JP2013520730A 2010-07-21 2011-07-06 電気的な偏りを調整するためのプラズマ処理装置及びライナーアセンブリ、プラズマ処理方法 Expired - Fee Related JP6025722B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36646210P 2010-07-21 2010-07-21
US61/366,462 2010-07-21
PCT/US2011/043083 WO2012012200A1 (en) 2010-07-21 2011-07-06 Plasma processing apparatus and liner assembly for tuning electrical skews

Publications (3)

Publication Number Publication Date
JP2013539159A JP2013539159A (ja) 2013-10-17
JP2013539159A5 JP2013539159A5 (enExample) 2016-02-18
JP6025722B2 true JP6025722B2 (ja) 2016-11-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013520730A Expired - Fee Related JP6025722B2 (ja) 2010-07-21 2011-07-06 電気的な偏りを調整するためのプラズマ処理装置及びライナーアセンブリ、プラズマ処理方法

Country Status (6)

Country Link
US (2) US20120018402A1 (enExample)
JP (1) JP6025722B2 (enExample)
KR (2) KR20130092387A (enExample)
CN (2) CN102860138A (enExample)
TW (1) TWI502617B (enExample)
WO (1) WO2012012200A1 (enExample)

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KR102262026B1 (ko) * 2019-07-18 2021-06-07 세메스 주식회사 기판 처리 장치
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Also Published As

Publication number Publication date
US10242847B2 (en) 2019-03-26
TW201205639A (en) 2012-02-01
TWI502617B (zh) 2015-10-01
KR20180030729A (ko) 2018-03-23
US20120018402A1 (en) 2012-01-26
JP2013539159A (ja) 2013-10-17
KR101970615B1 (ko) 2019-04-19
US20150279633A1 (en) 2015-10-01
KR20130092387A (ko) 2013-08-20
WO2012012200A1 (en) 2012-01-26
CN108538695A (zh) 2018-09-14
CN102860138A (zh) 2013-01-02
CN108538695B (zh) 2021-01-29

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