TWI502617B - 用於調整電偏斜的方法、電漿處理裝置與襯管組件 - Google Patents

用於調整電偏斜的方法、電漿處理裝置與襯管組件 Download PDF

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Publication number
TWI502617B
TWI502617B TW100122473A TW100122473A TWI502617B TW I502617 B TWI502617 B TW I502617B TW 100122473 A TW100122473 A TW 100122473A TW 100122473 A TW100122473 A TW 100122473A TW I502617 B TWI502617 B TW I502617B
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TW
Taiwan
Prior art keywords
liner assembly
slots
plasma
liner
processing apparatus
Prior art date
Application number
TW100122473A
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English (en)
Chinese (zh)
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TW201205639A (en
Inventor
卡杜祺詹姆斯Ｄ
陳誌剛
羅夫沙西德
柯林斯肯尼士Ｓ
Original Assignee
應用材料股份有限公司
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Publication of TW201205639A publication Critical patent/TW201205639A/zh
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Publication of TWI502617B publication Critical patent/TWI502617B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electromagnetism (AREA)
  • Plasma Technology (AREA)
TW100122473A 2010-07-21 2011-06-27 用於調整電偏斜的方法、電漿處理裝置與襯管組件 TWI502617B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US36646210P 2010-07-21 2010-07-21

Publications (2)

Publication Number Publication Date
TW201205639A TW201205639A (en) 2012-02-01
TWI502617B true TWI502617B (zh) 2015-10-01

Family

ID=45492720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100122473A TWI502617B (zh) 2010-07-21 2011-06-27 用於調整電偏斜的方法、電漿處理裝置與襯管組件

Country Status (6)

Country Link
US (2) US20120018402A1 (enExample)
JP (1) JP6025722B2 (enExample)
KR (2) KR20130092387A (enExample)
CN (2) CN102860138A (enExample)
TW (1) TWI502617B (enExample)
WO (1) WO2012012200A1 (enExample)

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Also Published As

Publication number Publication date
JP6025722B2 (ja) 2016-11-16
US10242847B2 (en) 2019-03-26
TW201205639A (en) 2012-02-01
KR20180030729A (ko) 2018-03-23
US20120018402A1 (en) 2012-01-26
JP2013539159A (ja) 2013-10-17
KR101970615B1 (ko) 2019-04-19
US20150279633A1 (en) 2015-10-01
KR20130092387A (ko) 2013-08-20
WO2012012200A1 (en) 2012-01-26
CN108538695A (zh) 2018-09-14
CN102860138A (zh) 2013-01-02
CN108538695B (zh) 2021-01-29

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