JP6002065B2 - 金型清掃用樹脂組成物及び金型清掃方法 - Google Patents

金型清掃用樹脂組成物及び金型清掃方法 Download PDF

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Publication number
JP6002065B2
JP6002065B2 JP2013050483A JP2013050483A JP6002065B2 JP 6002065 B2 JP6002065 B2 JP 6002065B2 JP 2013050483 A JP2013050483 A JP 2013050483A JP 2013050483 A JP2013050483 A JP 2013050483A JP 6002065 B2 JP6002065 B2 JP 6002065B2
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JP
Japan
Prior art keywords
mold
cleaning
resin composition
mold cleaning
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013050483A
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English (en)
Japanese (ja)
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JP2013216093A (ja
Inventor
吉村　勝則
勝則 吉村
野村　弘明
弘明 野村
太地 佐藤
太地 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Carbide Industries Co Inc
Original Assignee
Nippon Carbide Industries Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Industries Co Inc filed Critical Nippon Carbide Industries Co Inc
Priority to JP2013050483A priority Critical patent/JP6002065B2/ja
Publication of JP2013216093A publication Critical patent/JP2013216093A/ja
Application granted granted Critical
Publication of JP6002065B2 publication Critical patent/JP6002065B2/ja
Expired - Fee Related legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B29C33/722—Compositions for cleaning moulds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1545—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2220/00—Type of materials or objects being removed
    • B08B2220/04—Polymers

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2013050483A 2012-03-14 2013-03-13 金型清掃用樹脂組成物及び金型清掃方法 Expired - Fee Related JP6002065B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013050483A JP6002065B2 (ja) 2012-03-14 2013-03-13 金型清掃用樹脂組成物及び金型清掃方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012057615 2012-03-14
JP2012057615 2012-03-14
JP2013050483A JP6002065B2 (ja) 2012-03-14 2013-03-13 金型清掃用樹脂組成物及び金型清掃方法

Publications (2)

Publication Number Publication Date
JP2013216093A JP2013216093A (ja) 2013-10-24
JP6002065B2 true JP6002065B2 (ja) 2016-10-05

Family

ID=49130644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013050483A Expired - Fee Related JP6002065B2 (ja) 2012-03-14 2013-03-13 金型清掃用樹脂組成物及び金型清掃方法

Country Status (4)

Country Link
JP (1) JP6002065B2 (zh)
KR (1) KR20130105437A (zh)
CN (1) CN103304901B (zh)
TW (1) TWI565576B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102161835B1 (ko) * 2013-01-31 2020-10-05 닛뽕 카바이도 고교 가부시키가이샤 금형 청소용 수지 조성물 및 금형 청소 방법
JP6274948B2 (ja) * 2014-04-04 2018-02-07 日本カーバイド工業株式会社 金型清掃用樹脂組成物及びそれを用いる金型清掃方法
CN108047694A (zh) * 2017-12-27 2018-05-18 东莞市浦元电子有限公司 半导体封装模具用清模材料及其制备方法
EP3805311A4 (en) * 2018-05-29 2022-03-16 NOK Corporation RUBBER COMPOSITION WITH ETHYLENE-PROPYLENE NON-CONJUGATED POLYENCOPOLYMER
CN112847970B (zh) * 2020-12-24 2022-09-30 天津德高化成新材料股份有限公司 一种不含致癌、致突变或生殖毒性组分的发泡清模胶条

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0220538A (ja) * 1988-07-08 1990-01-24 Denki Kagaku Kogyo Kk 金型クリーニング用ゴム組成物
JP3764239B2 (ja) * 1996-12-10 2006-04-05 日東電工株式会社 半導体装置成形用金型洗浄剤組成物およびそれを用いた金型クリーニング方法
JP4490037B2 (ja) * 2000-12-13 2010-06-23 旭化成ケミカルズ株式会社 洗浄剤
JP2002210748A (ja) * 2001-01-18 2002-07-30 West Japan Plastic Products Industrial Association プラスチック成形機用洗浄剤
JP2005254786A (ja) * 2004-03-13 2005-09-22 Toshiyuki Watabe 成形金型用洗浄剤と洗浄方法
JP2005344210A (ja) * 2004-05-06 2005-12-15 Somakkusu Kk 金型洗浄液、金型洗浄方法および金型洗浄装置
KR101491757B1 (ko) * 2007-10-29 2015-02-11 닛뽕 카바이도 고교 가부시키가이샤 금형 청소용 고무계 조성물
JP5604822B2 (ja) * 2009-07-17 2014-10-15 日立化成株式会社 半導体装置成形用金型洗浄剤組成物および半導体装置成形用金型洗浄材、ならびにそれを用いた半導体装置成形用金型のクリーニング方法
KR20110009873A (ko) * 2009-07-23 2011-01-31 (주)에이씨티 반도체 금형 세정용 고무조성물

Also Published As

Publication number Publication date
TWI565576B (zh) 2017-01-11
TW201343355A (zh) 2013-11-01
JP2013216093A (ja) 2013-10-24
CN103304901B (zh) 2017-03-01
KR20130105437A (ko) 2013-09-25
CN103304901A (zh) 2013-09-18

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