JP5984475B2 - マスクフレーム組立体の製造方法 - Google Patents
マスクフレーム組立体の製造方法 Download PDFInfo
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- JP5984475B2 JP5984475B2 JP2012091975A JP2012091975A JP5984475B2 JP 5984475 B2 JP5984475 B2 JP 5984475B2 JP 2012091975 A JP2012091975 A JP 2012091975A JP 2012091975 A JP2012091975 A JP 2012091975A JP 5984475 B2 JP5984475 B2 JP 5984475B2
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- side clamping
- main body
- oblique
- clamping
- mask
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000000034 method Methods 0.000 title description 20
- 238000003466 welding Methods 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
- B05C21/005—Masking devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
- B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
110 本体部
111 パターン
115 接合部
120 サイドクランピング部
131a、131b、131c、131d 斜めクランピング部
300 フレーム
400 マスクフレーム組立体
Claims (10)
- パターンが形成された本体部、前記本体部の一側から延びた少なくとも一つ以上のサイドクランピング部、及び前記少なくとも一つ以上のサイドクランピング部の最外郭のサイドクランピング部に隣接して配される斜めクランピング部がそれぞれ備えられた複数の分割マスクと、前記複数の分割マスクが接合されるフレームと、を用意する段階と、
前記各分割マスクの前記サイドクランピング部と前記斜めクランピング部とを把持し、引張力を加えつつ前記本体部を前記フレームに溶接する段階と、
前記溶接が完了した後、前記サイドクランピング部と前記斜めクランピング部とを切断する段階を含み、
前記本体部を前記フレームに溶接する段階は、前記本体部と前記フレームとの溶接時、前記本体部と前記サイドクランピング部との間、及び前記本体部と前記斜めクランピング部との間を前記フレームに溶接し、
前記斜めクランピング部と前記サイドクランピング部とがなす角度(θ)は、0°<θ<90°であるマスクフレーム組立体の製造方法。 - 前記サイドクランピング部は、前記本体部から長手方向に沿って外側に延びた請求項1に記載のマスクフレーム組立体の製造方法。
- 前記サイドクランピング部は、
前記本体部の一側から延びた第1サイドクランピング部と、
前記一側に対向する前記本体部の他側から延びた第2サイドクランピング部と、で形成される請求項2に記載のマスクフレーム組立体の製造方法。 - 前記第1サイドクランピング部と前記第2サイドクランピング部とは、同数で形成される請求項3に記載のマスクフレーム組立体の製造方法。
- 前記第1サイドクランピング部は、等間隔で複数個形成され、かつ前記第2サイドクランピング部も、等間隔で複数個形成される請求項3に記載のマスクフレーム組立体の製造方法。
- 前記第1サイドクランピング部と前記第2サイドクランピング部とは、互いに対応するように形成された請求項3に記載のマスクフレーム組立体の製造方法。
- 前記サイドクランピング部は、同一長に形成され、かつ同一幅に形成される請求項1に記載のマスクフレーム組立体の製造方法。
- 前記斜めクランピング部は、前記本体部の4つの角から延びるように形成される請求項1に記載のマスクフレーム組立体の製造方法。
- 前記斜めクランピング部それぞれと前記斜めクランピング部それぞれとに隣接した前記サイドクランピング部間の角度は、いずれも同一である請求項8に記載のマスクフレーム組立体の製造方法。
- 前記斜めクランピング部は、同一長に形成され、かつ同一幅に形成される請求項8に記載のマスクフレーム組立体の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0041542 | 2011-05-02 | ||
KR1020110041542A KR20120123918A (ko) | 2011-05-02 | 2011-05-02 | 분할 마스크 및 이를 이용한 마스크 프레임 조립체의 조립방법 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012233253A JP2012233253A (ja) | 2012-11-29 |
JP2012233253A5 JP2012233253A5 (ja) | 2015-05-14 |
JP5984475B2 true JP5984475B2 (ja) | 2016-09-06 |
Family
ID=47090413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012091975A Active JP5984475B2 (ja) | 2011-05-02 | 2012-04-13 | マスクフレーム組立体の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8925480B2 (ja) |
JP (1) | JP5984475B2 (ja) |
KR (1) | KR20120123918A (ja) |
Families Citing this family (27)
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KR101030030B1 (ko) * | 2009-12-11 | 2011-04-20 | 삼성모바일디스플레이주식회사 | 마스크 조립체 |
KR101813549B1 (ko) * | 2011-05-06 | 2018-01-02 | 삼성디스플레이 주식회사 | 분할 마스크와 그 분할 마스크를 포함한 마스크 프레임 조립체의 조립장치 |
KR20140047889A (ko) * | 2012-10-15 | 2014-04-23 | 삼성전기주식회사 | 기판 고정용 지그 유닛 및 그를 포함하는 기판 이송 장치 |
KR102218656B1 (ko) * | 2013-05-08 | 2021-02-23 | 삼성디스플레이 주식회사 | 마스크 조립체 및 이의 제조 방법 |
CN103757589A (zh) * | 2014-01-23 | 2014-04-30 | 上海和辉光电有限公司 | 掩膜装置、制造该掩膜装置的系统以及方法 |
JP6844646B2 (ja) * | 2014-03-31 | 2021-03-17 | 大日本印刷株式会社 | 蒸着マスクの引張方法、フレーム付き蒸着マスクの製造方法、有機半導体素子の製造方法、及び引張装置 |
JP6511908B2 (ja) * | 2014-03-31 | 2019-05-15 | 大日本印刷株式会社 | 蒸着マスクの引張方法、フレーム付き蒸着マスクの製造方法、有機半導体素子の製造方法、及び引張装置 |
KR102441557B1 (ko) * | 2015-04-28 | 2022-09-08 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체, 그 제조 방법 및 표시 장치의 제조 방법 |
KR102352280B1 (ko) * | 2015-04-28 | 2022-01-18 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체 제조 장치 및 이를 이용한 마스크 프레임 조립체 제조 방법 |
KR102369675B1 (ko) * | 2015-06-22 | 2022-03-04 | 삼성디스플레이 주식회사 | 박막 증착용 마스크 어셈블리와, 이를 이용하여 제조된 유기 발광 디스플레이 장치 |
KR102549358B1 (ko) * | 2015-11-02 | 2023-06-29 | 삼성디스플레이 주식회사 | 증착 마스크 조립체 및 이를 이용한 표시 장치의 제조 방법 |
CN106086784B (zh) * | 2016-07-08 | 2018-09-04 | 京东方科技集团股份有限公司 | 一种掩膜版的张网装置、张网方法 |
KR101834194B1 (ko) * | 2016-07-13 | 2018-03-05 | 주식회사 케이피에스 | 텐션마스크 프레임 어셈블리의 제조 장치 및 방법 |
KR102642345B1 (ko) | 2016-09-06 | 2024-02-29 | 삼성디스플레이 주식회사 | 분할 마스크 |
KR102640219B1 (ko) * | 2016-09-12 | 2024-02-23 | 삼성디스플레이 주식회사 | 분할 마스크 |
JP7301497B2 (ja) * | 2016-10-07 | 2023-07-03 | 大日本印刷株式会社 | 蒸着マスクの製造方法、蒸着マスクが割り付けられた中間製品及び蒸着マスク |
CN106591775B (zh) * | 2016-12-26 | 2019-06-07 | 京东方科技集团股份有限公司 | 掩膜板本体、掩膜板及其制作方法 |
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CN108470753B (zh) * | 2018-03-28 | 2021-02-26 | 京东方科技集团股份有限公司 | 一种电致发光显示面板、其制作方法及显示装置 |
KR102337004B1 (ko) * | 2018-07-23 | 2021-12-09 | 주식회사 오럼머티리얼 | Oled 화소 형성용 마스크 및 프레임 일체형 마스크의 제조 방법 |
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KR101283315B1 (ko) * | 2010-12-28 | 2013-07-09 | 엘지디스플레이 주식회사 | 마스크 |
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-
2011
- 2011-05-02 KR KR1020110041542A patent/KR20120123918A/ko not_active Application Discontinuation
- 2011-11-23 US US13/303,617 patent/US8925480B2/en active Active
-
2012
- 2012-04-13 JP JP2012091975A patent/JP5984475B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20120282445A1 (en) | 2012-11-08 |
KR20120123918A (ko) | 2012-11-12 |
JP2012233253A (ja) | 2012-11-29 |
US8925480B2 (en) | 2015-01-06 |
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