JP5981600B2 - キャリア付金属箔を有する積層体 - Google Patents

キャリア付金属箔を有する積層体 Download PDF

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Publication number
JP5981600B2
JP5981600B2 JP2015076338A JP2015076338A JP5981600B2 JP 5981600 B2 JP5981600 B2 JP 5981600B2 JP 2015076338 A JP2015076338 A JP 2015076338A JP 2015076338 A JP2015076338 A JP 2015076338A JP 5981600 B2 JP5981600 B2 JP 5981600B2
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Prior art keywords
metal
laminate
carrier
metal foil
foil
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Japanese (ja)
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JP2016026914A (ja
Inventor
晃正 森山
晃正 森山
倫也 古曳
倫也 古曳
雅史 石井
雅史 石井
雅之 高森
雅之 高森
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
JP2015076338A 2014-04-02 2015-04-02 キャリア付金属箔を有する積層体 Active JP5981600B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015076338A JP5981600B2 (ja) 2014-04-02 2015-04-02 キャリア付金属箔を有する積層体

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014076485 2014-04-02
JP2014076485 2014-04-02
JP2014132142 2014-06-27
JP2014132142 2014-06-27
JP2015076338A JP5981600B2 (ja) 2014-04-02 2015-04-02 キャリア付金属箔を有する積層体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016087294A Division JP6184549B2 (ja) 2014-04-02 2016-04-25 キャリア付金属箔を有する積層体

Publications (2)

Publication Number Publication Date
JP2016026914A JP2016026914A (ja) 2016-02-18
JP5981600B2 true JP5981600B2 (ja) 2016-08-31

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ID=54269924

Family Applications (2)

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JP2015076338A Active JP5981600B2 (ja) 2014-04-02 2015-04-02 キャリア付金属箔を有する積層体
JP2016087294A Active JP6184549B2 (ja) 2014-04-02 2016-04-25 キャリア付金属箔を有する積層体

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JP2016087294A Active JP6184549B2 (ja) 2014-04-02 2016-04-25 キャリア付金属箔を有する積層体

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JP (2) JP5981600B2 (zh)
KR (1) KR101848974B1 (zh)
CN (1) CN104972713B (zh)
TW (1) TWI621381B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016137727A (ja) * 2014-04-02 2016-08-04 Ｊｘ金属株式会社 キャリア付金属箔を有する積層体

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Publication number Priority date Publication date Assignee Title
JP2016036829A (ja) * 2014-08-07 2016-03-22 Jx日鉱日石金属株式会社 圧延銅箔及びそれを用いた二次電池用集電体
WO2017149811A1 (ja) 2016-02-29 2017-09-08 三井金属鉱業株式会社 キャリア付銅箔、並びに配線層付コアレス支持体及びプリント配線板の製造方法
US11217445B2 (en) * 2016-08-05 2022-01-04 Mitsubishi Gas Chemical Company, Inc. Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device
US9955588B1 (en) * 2016-11-28 2018-04-24 Chang Chun Petrochemical Co., Ltd. Multilayer carrier foil
JP6880723B2 (ja) * 2016-12-27 2021-06-02 住友金属鉱山株式会社 両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法
JP2018122590A (ja) * 2017-02-02 2018-08-09 Ｊｘ金属株式会社 離型層付き金属箔、金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
JP6806951B2 (ja) 2018-02-20 2021-01-06 三井金属鉱業株式会社 ガラスキャリア付銅箔及びその製造方法
JP6836689B2 (ja) 2018-03-29 2021-03-03 三井金属鉱業株式会社 ガラスキャリア付銅箔及びその製造方法
KR20200045785A (ko) * 2018-10-23 2020-05-06 안범모 반도체 제조 공정용 또는 디스플레이 제조 공정용 프로세스 유체가 통과하는 접합부품
CN116669906A (zh) 2020-12-08 2023-08-29 三井金属矿业株式会社 带载体的金属箔及其制造方法
TWI796042B (zh) * 2020-12-10 2023-03-11 韓商Ｙｍｔ股份有限公司 用於具有載體的金屬箔的離型層及包含其的金屬箔
CN116916538B (zh) * 2023-09-11 2023-12-22 圆周率半导体(南通)有限公司 一种去除钻孔后孔口毛刺的加工方法

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JP2001068804A (ja) * 1999-08-31 2001-03-16 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板
JP2001127429A (ja) * 1999-10-25 2001-05-11 Hitachi Chem Co Ltd 多層印刷配線板の製造方法
JP2001127427A (ja) * 1999-10-29 2001-05-11 Auto Network Gijutsu Kenkyusho:Kk 平型導体配線板における回路形成方法及び回路形成構造
JP3370636B2 (ja) * 2000-03-03 2003-01-27 三井金属鉱業株式会社 キャリア箔付金属箔及びその製造方法
JP3973197B2 (ja) * 2001-12-20 2007-09-12 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその製造方法
JP4395295B2 (ja) * 2002-10-17 2010-01-06 日立化成工業株式会社 プリント配線板の製造方法並びにプリント配線板
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
JP4273895B2 (ja) * 2003-09-24 2009-06-03 日立化成工業株式会社 半導体素子搭載用パッケージ基板の製造方法
JP4087369B2 (ja) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 キャリア付き極薄銅箔、およびプリント配線板
JP4217786B2 (ja) * 2004-03-12 2009-02-04 古河電気工業株式会社 キャリア付き極薄銅箔、およびキャリア付き極薄銅箔を用いた配線板
JP2005260058A (ja) * 2004-03-12 2005-09-22 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、キャリア付き極薄銅箔の製造方法および配線板
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
KR101089649B1 (ko) * 2009-12-01 2011-12-06 삼성전기주식회사 금속적층판 및 이를 이용한 코어기판 제조방법
US20110262722A1 (en) * 2009-12-22 2011-10-27 Jx Nippon Mining & Metals Corporation Method of Producing Laminated Body, and Laminated Body
TWI400025B (zh) * 2009-12-29 2013-06-21 Subtron Technology Co Ltd 線路基板及其製作方法
JP2012216824A (ja) * 2011-03-31 2012-11-08 Hitachi Chem Co Ltd 半導体素子搭載用パッケージ基板の製造方法
JP5962094B2 (ja) * 2012-03-16 2016-08-03 凸版印刷株式会社 積層基板の製造方法
WO2013183606A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
TWI621381B (zh) * 2014-04-02 2018-04-11 Jx Nippon Mining & Metals Corp Laminated body with metal foil with carrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016137727A (ja) * 2014-04-02 2016-08-04 Ｊｘ金属株式会社 キャリア付金属箔を有する積層体

Also Published As

Publication number Publication date
JP2016026914A (ja) 2016-02-18
CN104972713A (zh) 2015-10-14
CN104972713B (zh) 2018-06-12
JP6184549B2 (ja) 2017-08-23
JP2016137727A (ja) 2016-08-04
KR101848974B1 (ko) 2018-04-13
KR20150114918A (ko) 2015-10-13
TWI621381B (zh) 2018-04-11
TW201543969A (zh) 2015-11-16

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