JP5981600B2 - Laminated body having metal foil with carrier - Google Patents

Description

  The present invention relates to a laminate having a metal foil with a carrier. More specifically, the present invention relates to a laminate used in the production of a single-sided or two- or more-layer laminated board used for a printed wiring board or an ultra-thin coreless substrate.

  In general, a printed wiring board uses, as a basic constituent material, a dielectric material called “prepreg” obtained by impregnating a base material such as a synthetic resin plate, a glass plate, a glass nonwoven fabric, and paper with a synthetic resin. . Further, a sheet such as copper or copper alloy foil having electrical conductivity is bonded to the side facing the prepreg. The laminated body thus assembled is generally called a CCL (Copper Clad Laminate) material. The surface of the copper foil in contact with the prepreg is usually a mat surface in order to increase the bonding strength. A foil made of aluminum, nickel, zinc or the like may be used instead of the copper or copper alloy foil. Their thickness is about 5 to 200 μm. This commonly used CCL (Copper Clad Laminate) material is shown in FIG.

  Patent Document 1 proposes a metal foil with a carrier composed of a synthetic resin plate-shaped carrier and a metal foil that is mechanically peelably adhered to at least one surface of the carrier. Describes that it can be used for the assembly of printed wiring boards. And it was shown that the peel strength between the plate-like carrier and the metal foil is desirably 1 gf / cm to 1 kgf / cm. According to the metal foil with a carrier, since the copper foil is supported over the entire surface by the synthetic resin, generation of wrinkles on the copper foil during lamination can be prevented. In addition, since the metal foil with carrier is in close contact with the synthetic resin without gaps, when the surface of the metal foil is plated or etched, it can be put into the chemical solution for plating or etching. . Furthermore, since the linear expansion coefficient of the synthetic resin is at the same level as the copper foil that is a constituent material of the substrate and the prepreg after polymerization, the circuit is not misaligned, resulting in fewer defective products, It has the outstanding effect that a yield can be improved.

JP 2009-272589 A

  The metal foil with a carrier described in Patent Document 1 is an epoch-making invention that greatly contributes to the reduction of the manufacturing cost by simplifying the manufacturing process of the printed wiring board and increasing the yield. There is still room for consideration. Such a metal foil with a carrier has a resin substrate having a thickness of about 200 μm as a core as a prepreg as a resin plate carrier. On the other hand, the total number of build-ups may be 20 or more with the increase in density and multi-layered wiring circuit. In such a case, when the core is a normal prepreg, the entire build-up board In some cases, the thickness may exceed 2 mm, and it may become impossible to process with the conventional manufacturing equipment. Therefore, a thinner core, that is, a carrier has been demanded in the metal foil with a carrier.

  Further, from the viewpoint of practical use, for example, from the viewpoint of strength, quality deterioration due to dents, deformation, etc., simply reducing the thickness of the carrier may cause a problem in handling.

  As a result of earnestly examining the laminated body that realizes good handling properties like a conventional metal foil with a carrier and that can easily cope with higher density and multi-layered wiring circuits. The present inventors have found that the problem can be solved by using a metal plate or a metal foil as a carrier and laminating two metal foils with a carrier in a predetermined manner, thereby completing the present invention.

That is, the present invention is as follows.
(1) A laminate obtained by laminating two metal foils with a carrier in which the metal foil is brought into contact with the surface of the metal carrier so as to be peelable.
(2) The laminate according to (1), which is obtained by directly laminating the metal carriers with an adhesive as necessary.
(3) The laminate according to (1) or (2), wherein the metal carriers are bonded to each other.
(4) The laminate according to (1), obtained by laminating the metal carriers with an inorganic substrate or a metal plate interposed therebetween.
(5) The laminate according to any one of (1) to (4), wherein the metal carrier and the metal foil are bonded together using a release layer.
(6) The laminate according to (5), wherein a peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less.
(7) The laminate according to (5) or (6), wherein the ten-point average roughness (Rz jis) of the surface on the side in contact with the metal foil in the metal carrier is 3.5 μm or less.
(8) The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 0.5 gf / cm or more and 200 gf / cm or less (5) The laminated body in any one of-(7).
(9) The laminate according to any one of (1) to (8), having a thickness of 8 to 500 μm.
(10) A laminate according to any one of (1) to (9), wherein a laminate is provided.
(11) The laminate according to (10), wherein the hole has a diameter of 0.01 mm to 10 mm and is provided at 1 to 10 locations.
(12) The laminate according to any one of (1) to (11), wherein at least one of the metal foils is a copper foil or a copper alloy foil.
(13) In the laminated body according to any one of (1) to (12), when viewed in plan on the surface of the metal foil, at least a part of the outer periphery of the laminated portion of the metal carrier and the metal foil is Laminated body covered with resin.
(14) The laminate according to (13), wherein the laminate is covered with a resin over the entire outer periphery of the laminate portion of the metal carrier and the metal foil when viewed in plan on the surface of the metal foil.
(15) The laminate according to (13) or (14), wherein the resin contains a thermosetting resin.
(16) The laminate according to any one of (13) to (15), wherein the resin includes a thermoplastic resin.
(17) The laminate according to any one of (13) to (16), wherein a hole is provided outside the metal foil or the metal carrier of the resin.
(18) The laminate according to (17), wherein the hole has a diameter of 0.01 mm to 10 mm and is provided at 1 to 10 locations.
(19) When the laminate according to any one of (1) to (18) is viewed in plan on the surface of the metal foil, the laminate is obtained by cutting on the laminate surface of the metal carrier and the metal foil. Laminated body.
(20) The multilayer body according to any one of (1) to (19), wherein a resin is laminated on the surface of each metal foil.
(21) The multilayer laminate according to (20), wherein a metal layer is further laminated on the surface of each resin.
(22) A multilayer laminate obtained by cutting the multilayer laminate according to (21) on the laminate surface of the resin and the metal layer when viewed in plan on the surface of the metal layer.
(23) The multilayer laminate according to (21), wherein a through-hole is provided in a portion of the laminate according to any one of (1) to (19).
(24) A multilayer laminate obtained by cutting the multilayer laminate according to (23) on the laminate surface of the resin and the metal layer when viewed in plan on the surface of the metal layer.
(25) The multilayer laminate according to (24), wherein a hole penetrating the entire multilayer laminate is provided inside the hole.
( 26 ) With respect to the surface direction of at least one metal foil of the laminate according to any one of (1) to (19) or the multilayer laminate according to any one of (20) to (25) , a resin or A method for producing a multilayer metal-clad laminate comprising laminating a metal layer once or more.
( 27 ) With respect to the surface direction of at least one metal foil of the laminate according to any one of (1) to (19) or the multilayer laminate according to any one of (20) to (25) , a resin, A single-sided or double-sided metal-clad laminate, a laminate according to any one of (1) to (19), a multilayer laminate according to any one of (20) to (25), a metal layer with a resin substrate or a metal layer A method for producing a multilayer metal-clad laminate comprising laminating at least once.
( 28 ) In the method for producing a multilayer metal-clad laminate according to ( 26 ) or ( 27 ), when the laminate is viewed in plan on the surface of the metal layer, at least of the laminate surface of the metal carrier and the metal foil A method for producing a multilayer metal-clad laminate comprising a step of cutting by one.
( 29 ) In the method for producing a multilayer metal-clad laminate according to any one of ( 26 ) to ( 28 ), the multilayer metal-clad laminate further comprising a step of peeling and separating the metal foil of the laminate from a metal carrier. Manufacturing method.
( 30 ) In the method for producing a multilayer metal-clad laminate according to ( 28 ) or ( 29 ), the multilayer metal-clad laminate further comprising a step of separating and separating the metal foil of the cut portion of the laminate from the metal carrier. A manufacturing method of a board.
(31) (29) or in the method according to (30), a method for manufacturing a multilayer metal-clad laminate comprising the step of removing some or all of the metal foil separated by the peeling by etching.
( 32 ) A multilayer metal-clad laminate obtained by the production method according to any one of ( 26 ) to ( 31 ).
( 33 ) Build-up with respect to the surface direction of at least one metal foil of the laminate according to any one of (1) to (19) or the multilayer laminate according to any one of (20) to (25) A method for manufacturing a build-up substrate, including a step of forming one or more wiring layers.
( 34 ) The buildup wiring layer manufacturing method according to ( 33 ), wherein the buildup wiring layer is formed using at least one of a subtractive method, a full additive method, and a semi-additive method.
( 35 ) A resin, with respect to the surface direction of at least one metal foil of the laminate according to any one of (1) to (19) or the multilayer laminate according to any one of (20) to (25) , Single-sided or double-sided wiring board, single-sided or double-sided metal-clad laminate, laminate according to any of (1) to (19) , multilayer laminate according to any of (20) to (25), with resin substrate A method for manufacturing a build-up substrate, comprising laminating a metal layer, wiring, circuit, or metal layer at least once.
( 36 ) In the method for manufacturing a buildup board according to ( 35 ), a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, a metal layer, a metal foil of the laminate, a metal carrier of the laminate , and a multilayer laminate Metal foil, metal carrier of multilayer laminate, resin of multilayer laminate, metal layer of multilayer laminate, resin of metal layer with resin substrate, metal layer or resin of metal layer with resin substrate, side surface of the hole And a method for manufacturing a build-up substrate, further comprising conducting a conductive plating on the bottom surface.
( 37 ) In the method for manufacturing a buildup board according to ( 35 ) or ( 36 ), a metal layer constituting the single-sided or double-sided wiring board, a metal layer constituting a single-sided or double-sided metal-clad laminate, and a laminate. The step of forming the wiring on at least one of the metal foil constituting the metal foil, the metal foil constituting the multilayer laminate, the metal layer of the multilayer laminate, the metal layer of the metal layer with a resin substrate, and the metal layer is performed once or more. The manufacturing method of the buildup board | substrate further including this.
( 38 ) A step of laminating the laminate according to any one of (1) to (19) or the multilayer laminate according to any one of (20) to (25) on the surface on which the wiring is formed. The manufacturing method of the buildup board | substrate in any one of ( 35 )-( 37 ) containing.
( 39 ) In the build-up substrate manufacturing method according to any one of ( 33 ) to ( 38 ), when the laminate is viewed in plan on the surface of the metal foil, the laminate surface of the metal carrier and the metal foil A method for manufacturing a build-up board, comprising a step of cutting at least one.
( 40 ) In the method for manufacturing a buildup board according to any one of ( 33 ) to ( 39 ), the buildup wiring board further includes a step of separating and separating the metal foil of the laminate from the metal carrier. Method.
( 41 ) The method for producing a buildup wiring board according to ( 39 ), further comprising a step of peeling and separating the metal foil of the cut portion of the laminate from the metal carrier.
(42) (40) or the build-up wiring board manufacturing method according to (41), further preparation of the build-up wiring board including some or all the step of removing by etching the peeling to separate the metal foil Method.
( 43 ) A build-up wiring board obtained by the production method according to any one of ( 40 ) to ( 42 ), wherein dents and deformation are suppressed .
( 44 ) A method for producing a printed circuit board, comprising a step of producing a build-up wiring board by the production method according to any one of ( 40 ) to ( 42 ).
( 45 ) A method for producing a printed circuit board, comprising a step of producing a build-up substrate by the production method according to any one of ( 33 ) to ( 39 ).
( 46 ) A buildup substrate obtained by the production method according to any one of ( 33 ) to ( 39 ).
(47) A method for producing a multilayer metal-clad laminate comprising laminating a resin once or more with respect to the surface direction of two metal foils of the laminate according to any one of (1) to (19).
(48) The method according to (47), further comprising laminating a metal layer once or more on the surface of each resin.
(49) A multilayer metal-clad laminate obtained by the production method according to (47) or (48).
(50) A build-up board including laminating a resin and a metal layer at least once in this order with respect to the surface direction of two metal foils of the laminate according to any one of (1) to (19) Manufacturing method.
(51) The buildup substrate manufacturing method according to (50), further comprising a step of forming a hole in the metal layer and the resin, and conducting conductive plating on a side surface and a bottom surface of the hole.
(52) The method for manufacturing a buildup board according to (50) or (51), further comprising performing a step of forming a wiring on at least one of the metal layers one or more times.
(53) A step of laminating the laminate according to any one of (1) to (19) or the multilayer laminate according to any one of (20) to (25) on the surface on which the wiring is formed. The manufacturing method of the buildup board | substrate as described in (52) including.
(54) In the method for manufacturing a buildup substrate according to any one of (50) to (53), when the laminate is viewed in plan on the surface of the metal foil, the laminate surface of the metal carrier and the metal foil A method for manufacturing a build-up board, comprising a step of cutting at least one.
(55) The method for manufacturing a buildup wiring board according to any one of (50) to (54), further including a step of separating and separating the metal foil of the laminate from the metal carrier. .
(56) The method for manufacturing a buildup wiring board according to (54), further comprising a step of peeling and separating the metal foil of the cut portion of the laminate from the metal carrier.
(57) In the manufacturing method of the buildup wiring board according to (55) or (56), the manufacturing of the buildup wiring board further includes a step of removing a part or all of the separated and separated metal foil by etching. Method.
(58) A build-up wiring board obtained by the production method according to any one of (55) to (57), wherein dents and deformation are suppressed.
(59) A method for producing a printed circuit board, comprising a step of producing a build-up wiring board by the production method according to any one of (55) to (57).
(60) A method for producing a printed circuit board, comprising a step of producing a build-up substrate by the production method according to any one of (50) to (54).
(61) A build-up substrate obtained by the production method according to any one of (50) to (54).

  According to the present invention, there is provided a laminate that realizes good handling properties and that can easily cope with the increase in the density and the multilayer of the wiring circuit.

An example of the configuration of CCL is shown. The typical structural example of the laminated body which concerns on this invention is shown. The other typical structural example of the laminated body which concerns on this invention is shown. FIG. 4 is a cross-sectional view taken along the line A-A ′ of the configuration example of FIG. 3. The other typical structural example of the laminated body which concerns on this invention is shown. The other typical structural example of the laminated body which concerns on this invention is shown. The other typical structural example of the laminated body which concerns on this invention is shown. The assembly example of the multilayer CCL using the laminated body which concerns on this invention is shown. The assembly example of the multilayer CCL using the laminated body which concerns on this invention is shown. The other typical structural example of the laminated body which concerns on this invention is shown. The other typical structural example of the laminated body which concerns on this invention is shown. The other typical structural example of the laminated body which concerns on this invention is shown. It is a schematic diagram explaining the assembly example of multilayer CCL using the laminated body which concerns on this invention. It is a schematic diagram explaining the assembly example of multilayer CCL using the laminated body which concerns on this invention. It is a schematic diagram explaining the assembly example of multilayer CCL using the laminated body which concerns on this invention. It is a schematic diagram explaining the assembly example of multilayer CCL using the laminated body which concerns on this invention. It is a schematic diagram explaining the assembly example of multilayer CCL using the laminated body which concerns on this invention.

  The laminated body according to one embodiment of the present invention is configured so that two metal foils with a carrier formed by bringing a metal foil into contact with the surface of a metal carrier in a peelable manner are interposed via an inorganic substrate and / or a metal plate as necessary. And obtained by laminating the metal carriers.

  One structural example of the metal foil with a carrier used suitably for this invention is shown in FIG. FIG. 2 shows a laminate in which two metal carriers with a carrier in which the metal foil 11a is detachably adhered to both surfaces of the metal carrier 11c are laminated with each other. In addition, the metal carrier 11c and the metal foil 11a are bonded together via the mold release layer 11b mentioned later.

  The metal foil with a carrier constituting the laminate is structurally similar to the CCL shown in FIG. 1, but in this metal foil with a carrier, the metal carrier and the metal foil are finally separated. Therefore, it has a structure that can be easily peeled manually. In this respect, since the CCL is not peeled off, the structure and function are completely different.

  Moreover, the other structural example of the metal foil with a carrier used suitably for this invention is shown in FIG. In FIG. 10, similarly to FIG. 2, two metal foils with a carrier made of a metal carrier 11 c to which the metal foil 11 a is peelably adhered are connected via an inorganic substrate and / or a metal plate 11 d as described later. A laminated body is shown.

  In the embodiment of the laminate used in the present invention, the metal carrier and the metal foil must be separated, that is, peeled off, so that it is inconvenient that the adhesiveness is excessively high, but plating performed in the printed circuit board manufacturing process, etc. It is more preferable to provide the adhesiveness which does not peel in the chemical treatment process. From such a viewpoint, the peel strength between the metal layers is preferably 0.5 gf / cm or more, preferably 1 gf / cm or more, preferably 2 gf / cm or more, and 3 gf / cm or more. While it is preferably 5 gf / cm or more, preferably 10 gf / cm or more, more preferably 30 gf / cm or more, and even more preferably 50 gf / cm or more, It is preferably 200 gf / cm or less, more preferably 150 gf / cm or less, and still more preferably 80 gf / cm or less. When the metal layers have adhesion, by setting the peel strength between the metal layers in such a range, the metal layers can be easily peeled off manually while being not peeled off during transport or processing.

  As described later, the adjustment of the peel strength for realizing such adhesion can be easily realized by applying a specific surface treatment to the surface of the metal carrier.

  Further, the laminate of the present invention may contain a resin that preferably covers the entire outer surface of at least a part of the outer periphery of the laminated portion of the metal carrier and the metal foil when viewed in plan on the surface of the metal foil.

  That is, as a preferred mode, mode 1 (FIG. 3) in which the resin covers the entire metal foil and covers the entire circumference of the laminated portion of the metal foil and the metal carrier when viewed in plan on the surface of the metal foil, Aspect 2 (for example, FIG. 4) that covers the entire surface of the foil and covers a part of the outer periphery of the laminated portion of the metal foil and the metal carrier, so that the resin has an opening when viewed in plan on the surface of the metal foil A mode 3 (for example, FIGS. 5 and 6) in which the outer periphery of the laminated portion of the metal foil and the metal carrier is covered and the metal foil is exposed in the opening is conceivable.

3 and 4 show typical configuration examples of the laminate. FIG. 3 is a diagram when this configuration example is viewed in plan, and FIG. 4 is a cross-sectional view taken along the line AA ′ of this configuration example.
3 and 4, two metal foils with a carrier in which the metal carrier 22 is in contact with the metal foil 23 via the release layer 24 have a structure in which the metal carriers 22 are laminated, and the resin 31 further includes The entire metal foil 23 is covered, and the entire circumference of the laminated surface of the metal carrier 22 and the metal foil 23 is covered.

  By adopting such a configuration, when viewed in plan on the surface of the metal foil, the laminated portion of the metal carrier and the metal foil is covered with the resin, and other members are in the lateral direction of this portion, that is, in the lamination direction. Therefore, it is possible to prevent the metal foil from hitting from the side, and as a result, it is possible to reduce peeling of the metal foil during handling. Further, by covering the outer periphery of the laminated portion so as not to be exposed, it is possible to prevent the chemical solution from entering the interface in the chemical treatment process in the build-up process or the like, and to prevent the corrosion or erosion of the metal layer. .

  As another typical configuration example of the present invention, as shown in FIG. 5, when viewed in plan, the metal carrier, the metal foil, and a part of the laminated portion may be exposed. That is, in FIG. 5, although not covered with the resin 31 in the lateral direction of the metal foil 32, the same effect can be obtained in this aspect from the viewpoint that the metal foil is not separated from the metal carrier. Since the laminated portion is exposed on the side surface not covered with the resin 31, it is difficult to prevent the chemical solution from entering from this direction. For this reason, when the corrosion or erosion of the metal foil becomes a serious problem, it is necessary to prevent the chemical solution from entering from four directions. In this case, the embodiment shown in FIG. 3 is preferable.

  In addition, in the laminated body of FIGS. 3-5, in order to hold | maintain the said structure by pinching | interposing the laminated body obtained by laminating | stacking metal foil with a carrier of this invention, for example with two plate-shaped resin, Heat and bond together. This heat bonding is performed by hot pressing at a temperature at which the resin flows. Or even if it does not heat-adhere, a certain amount of adhesion is sufficient. Therefore, when the resins are brought into close contact with each other, an adhesive such as an epoxy resin adhesive can be suitably used. Furthermore, this adhesiveness can be effectively exerted when the region where the plate-like resin is bonded or heat-bonded is within a certain range. From this viewpoint, the ratio (Sa / Sb) between the area (Sa) of the metal foil and the area (Sb) of the plate-like resin when viewed in plan is 0.6 or more and less than 1.0, preferably 0.80 or more and 0. .95 or less is preferable because a necessary and sufficient area for bonding or heat-bonding the plate-like resins can be secured. From another point of view, the ratio (Sp) of the two plate-shaped resins bonded or heat bonded to the area (Sq) of the plate-shaped resin including the bonded or heat bonded surfaces (Sq) By setting Sp / Sq to 0.001 or more and 0.2 or less, preferably 0.01 or more and 0.20 or less, it is possible to secure a necessary and sufficient area for bonding or heat-bonding the plate-shaped resins. Therefore, it is preferable. The area and shape of the two plate-shaped resins laminated on each metal foil are preferably the same, but may be different. When the area and shape of the two plate resins are different, the values of Sa and Sq are those of the plate resin having the larger area.

  In addition, if the shape of resin can cover the laminated part of metal foil and a metal carrier, it will not be restrict | limited in a shape. That is, although the case where the shape of the resin in a plan view is a quadrangle in FIGS. 3 to 5, other shapes may be used. On the other hand, the metal layer may have a shape other than a quadrangle.

  Here, the carrier-attached metal layer is made of, for example, a laminated body 20 (or laminated body 30) as shown in FIGS. 3 and 4 (or FIG. 5), resin 21-metal foil 23-release layer 24-metal carrier 22. -It is obtained by cutting at a cut line B which is a surface including a laminated structure of a release layer 24-metal foil 23-resin 21. Alternatively, as will be described later, when viewed in plan on the surface of the metal foil, it may be cut on the laminated surface of the metal foil and the metal carrier. A multilayer metal-clad laminate is formed by laminating a wiring layer, resin, build-up layer, etc. on the laminate, as described later, and then separating the metal layers by cutting at predetermined positions as described above. It is good also as the state which the metal layer exposed to the outermost surface of a board or a buildup board | substrate.

  By using the exposed metal layer for circuit formation, it is possible to improve productivity while maintaining the effect of reducing manufacturing costs by simplifying the manufacturing process of printed circuit boards and increasing the yield as before. can do.

  When viewed in plan on the surface of the metal foil of the laminate, in a mode in which a sufficient space is taken outside the use area of the laminate (for example, a circuit is finally formed) in the region occupied by the laminate, The space outside the use area in the metal layer of this laminate or the case where the laminate is covered with a resin on the laminate surface as will be described later. You may provide about 1-10 places. Here, the diameter means the minimum diameter of a circle surrounding the hole. The holes thus provided can be used as means for fixing positioning pins or the like in the production of a multilayer metal-clad laminate described later or the build-up board. FIG. 12 shows an example of a cross section of the laminated body that has been perforated. In FIG. 12, the laminated body which joined the metal carriers of two metal foils with a carrier each having the metal carrier 22 and the metal foil 23 which contacts the surface of this metal carrier so that peeling is possible using the adhesive 112 in the edge part. Shows an example in which a hole 114 is formed inside the adhesive 112 when the laminate is viewed in plan. Prior to the drilling, the metal foil and the metal carrier have the same shape, and the ends are aligned, that is, in the case of a rectangular shape, so that the square positions are not displaced when viewed in plan. It is preferable to make the positioning easy when making holes.

  Moreover, this invention adheres a metal carrier and metal foil through a mold release layer. As a suitable release layer, for example, any release layer or intermediate layer known to those skilled in the art in a copper foil with a carrier (ultra-thin copper foil with a carrier) can be used. For example, the release layer may be one or more of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, alloys thereof, hydrates thereof, oxides thereof, or organic substances. It is preferable to form with the layer containing. The release layer may be composed of a plurality of layers. Note that the release layer can have a diffusion preventing function. Here, the diffusion preventing function has a function of preventing the element from the base material from diffusing into the ultrathin copper layer side.

In one embodiment of the present invention, the release layer 24 of FIG. 2 is one of the elements in the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al from the metal carrier 22 side. A single metal layer made of or an alloy layer made of one or more elements selected from the group of elements of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al (these have a function of preventing diffusion) And a hydrate or oxide or organic substance of one or more elements selected from the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al laminated thereon It is comprised from the layer which becomes.
Further, for example, the release layer 24 is a single metal composed of any one element from the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, and Zn from the metal carrier 22 side. Layer, or an alloy layer made of one or more elements selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, and Zn, and then Cr, Ni, Co, Fe , Mo, Ti, W, P, Cu, Al, Zn, a single metal layer made of any one element, or Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, It can be composed of an alloy layer made of one or more elements selected from the group consisting of Al and Zn. The total adhesion amount of each element can be, for example, 1 to 50000 μg / dm ^2, and the adhesion amount can be, for example, 1 to 6000 μg / dm ² .

  The release layer 24 is preferably composed of two layers, a Ni-containing layer and a Cr-containing layer. In this case, the Ni-containing layer is laminated so as to be in contact with the interface with the metal carrier 22 and the Cr-containing layer is in contact with the interface with the metal foil 23 (for example, a copper foil or an ultrathin copper layer).

  The release layer 24 can be obtained by wet plating such as electroplating, electroless plating, and immersion plating, or dry plating such as sputtering, CVD, and PDV. Electroplating is preferable from the viewpoint of cost.

Further, for example, the release layer 24 can be configured by laminating a nickel layer, a nickel-phosphorus alloy layer or a nickel-cobalt alloy layer, and a chromium layer or a chromium-containing layer in this order on a carrier. Since the adhesive strength between nickel and copper is higher than the adhesive strength between chrome and copper, when the metal foil 23 is an ultrathin copper layer of a copper foil with a carrier, the ultrathin copper layer is peeled off when the ultrathin copper layer is peeled off. Peeling occurs at the interface between the layer and the chromium layer or the chromium-containing layer. In addition, the nickel layer of the release layer 24 is expected to have a barrier effect that prevents components that are constituent elements of the carrier from diffusing into the metal foil 23 (for example, copper foil or ultrathin copper layer). Adhesion amount of nickel in the release layer 24 is preferably 100 [mu] g / dm ² or more 40000μg / dm ² or less, more preferably 100 [mu] g / dm ² or more 4000μg / dm ² or less, more preferably 100 [mu] g / dm ² or more 2500 g / dm ² or less More preferably, it is 100 μg / dm ² or more and less than 1000 μg / dm ² , and the amount of chromium deposited on the release layer 24 is preferably 5 μg / dm ² or more and 100 μg / dm ² or less. When the release layer 24 is provided only on one side of the metal carrier 22, it is preferable to provide a rust prevention layer such as a Ni plating layer on the opposite side of the metal carrier 22. The chromium-containing layer may be a chromate treatment layer or a chromium alloy plating layer. The chromium layer may be a chromium plating layer.
The release layer may be formed with an adhesive.
Moreover, contacting metal foil and a carrier so that peeling is possible includes joining metal foil and a carrier using the joining methods mentioned later, such as ultrasonic welding.

Furthermore, as shown in FIG. 6, the laminated body 40 may have an opening 42 when viewed in plan on at least one surface, and the metal foil 23 may be exposed in this opening. In FIG. 6, the case where an opening part is provided in both surfaces of a laminated body is shown.
This opening is a normal photolithography technique, a technique in which only the opening is etched after laminating a masking tape or masking sheet, or a laminate obtained by bringing two metal layers into contact with a resin by pressing. The object can be formed by pressure bonding or thermocompression bonding. The opening may be formed inside the end (outer periphery) of the metal layer when viewed in plan, or at least a part of the end of the metal layer or the outer periphery of the stacked portion of the two metal layers. You may have reached.

  Further, as shown in FIG. 7, with the metal foil 23 exposed, only the laminated surface of the metal carrier 22 and the metal foil 23, that is, the end portion of the release layer 24 on the outer periphery of the metal foil 23 is covered with the resin 51. May be. Even in such a laminated body 50, the chemical solution can be prevented from entering the release layer 24 in the laminating process, which is an application of the laminated body as described later.

  The production method according to the present invention is as described above. However, in carrying out the present invention, other steps may be included between or before and after each step within a range that does not adversely affect each step. . For example, a cleaning step of cleaning the surface of the metal carrier may be performed before forming the release layer.

  In the production process of a multilayer printed wiring board, heat treatment is often performed in a lamination press process or a desmear process. Therefore, the thermal history received by the laminate becomes more severe as the number of layers increases. Therefore, when considering application to a multilayer printed wiring board in particular, it is desirable that the peel strength between the metal carrier and the metal foil be in the above-described range even after passing through a required thermal history.

  Accordingly, in a further preferred embodiment of the present invention, the metal after assuming at least one of heating for 3 hours, 6 hours or 9 hours at 220 ° C., assuming heating conditions in the production process of the multilayer printed wiring board. The peel strength between the carrier and the metal foil is preferably 0.5 gf / cm or more, preferably 1 gf / cm or more, preferably 2 gf / cm or more, and 3 gf / cm or more. It is preferably 5 gf / cm or more, preferably 10 gf / cm or more, preferably 30 gf / cm or more, and more preferably 50 gf / cm or more. The peel strength is preferably 200 gf / cm or less, more preferably 150 gf / cm or less, and even more preferably 80 gf / cm or less.

  Regarding the peel strength after heating at 220 ° C., the peel strength was described above in both 3 hours and 6 hours, or both 6 hours and 9 hours from the viewpoint of being able to cope with various lamination numbers. It is preferable to satisfy the range, and it is further preferable that all peel strengths after 3 hours, 6 hours, and 9 hours satisfy the above-described range.

  In this invention, peel strength is measured based on the 90 degree peel strength measuring method prescribed | regulated to JISC6481.

  Hereinafter, specific constituent requirements of each material for realizing such peel strength will be described.

  The metal carrier or metal foil is typically a copper or copper alloy plate or foil, but a plate or foil of aluminum, nickel, zinc or the like can also be used. In particular, in the case of copper or copper alloy foil, electrolytic foil or rolled foil can be used. The metal foil is not limited, but considering use as a wiring of a printed circuit board, it is 0.1 μm or more, preferably 0.3 μm or more, preferably 0.5 μm or more, preferably 1 μm or more, preferably 1. 5 μm or more, preferably 2 μm or more, and 400 μm or less, preferably 120 μm or less, preferably 50 μm or less, preferably 35 μm or less, preferably 25 μm or less, preferably 15 μm or less, preferably 10 μm or less, preferably 7 μm or less, preferably 5 μm In general, the thickness is preferably 4 μm or less. As metal foil used for metal foil with a carrier, the thing of the same thickness may be used, and the thing of different thickness may be used.

Here, the thickness of the metal carrier is typically about 3 to 900 μm, or about 3 to 500 μm, or 3 when considering the use as a printed circuit board wiring or a core material for manufacturing a printed circuit board. It is about ˜300 μm, or about 3 to 125 μm, and is preferably thinner than a conventional resin substrate such as a prepreg. Moreover, the laminated body of this invention laminates | stacks two such metal foils with a carrier so that metal carriers may contact. This makes it possible to make the laminate thinner than conventional laminates using a carrier-attached metal foil, while handling properties from the viewpoint of reducing the occurrence of quality defects due to the strength of the laminate and dents, deformation, etc. Makes it possible to maintain Furthermore, since it is possible to form a thin laminated body, it can be used for conventional manufacturing equipment, and can cope with higher density and multi-layered wiring circuits.
From such a viewpoint, the thickness of the laminate of the present invention as shown in FIG. 2 is typically 6 to 1800 μm, preferably 6 to 1500 μm, preferably 6 to 1000 μm, preferably 6 to 800 μm, preferably 8 to 500 μm, preferably 8 to 250 μm, preferably 10 to 200 μm, preferably 10 to 180 μm, preferably 10 to 160 μm, preferably 10 to 150 μm, preferably 10 to 120 μm, preferably 10 to 100 μm, preferably 10 to 10 μm 80 μm.

  Various surface treatments may be applied to the metal carrier or metal foil to be used. For example, metal plating for the purpose of imparting heat resistance (Ni plating, Ni—Zn alloy plating, Cu—Ni alloy plating, Cu—Zn alloy plating, Zn plating, Cu—Ni—Zn alloy plating, Co—Ni alloy plating, etc. ), Chromate treatment (including the case where one or more alloy elements such as Zn, P, Ni, Mo, Zr, Ti, etc. are contained in the chromate treatment liquid) for imparting rust prevention and discoloration resistance, surface roughness Roughening treatment for adjusting the degree (eg: copper electrodeposited grains, Cu—Ni—Co alloy plating, Cu—Ni—P alloy plating, Cu—Co alloy plating, Cu—Ni alloy plating, Cu—W alloy plating, And Cu-As alloy plating, Cu-As-W alloy plating and other copper alloy plating). Of course, the roughening treatment affects the peel strength between the metal foil and the metal carrier, and the chromate treatment also has a great influence. Chromate treatment is important from the viewpoint of rust prevention and discoloration resistance, but since it tends to significantly increase the peel strength, it is also meaningful as a means for adjusting the peel strength.

In addition, the metal carriers can be stacked by, for example, the following method in addition to simply overlapping. The metal carriers may be bonded to each other before the metal foil is brought into contact with the metal carrier, or after the metal foils with a carrier are overlapped with each other. In the case of joining by a method in which the metal foil is generated, the metal carriers may be laminated so that the metal foil is not applied to the joined portion after the metal carriers are joined together.
(A) Metallurgical joining method: fusion welding (arc welding, TIG (tungsten inert gas) welding, MIG (metal inert gas) welding, resistance welding, seam welding, spot welding), pressure welding (ultrasonic welding, Friction stir welding), brazing;
(B) Mechanical joining method: caulking, joining with rivets (joining with self-piercing rivets, joining with rivets), stitcher;
(C) Physical joining method: adhesive, (double-sided) pressure-sensitive adhesive tape, by joining a part or all of one metal layer and a part or all of the other metal layer using the joining method, The metal layer and the other metal layer can be laminated, and a laminate formed by bringing the metal layers into contact with each other in a separable manner can be produced. When one metal layer and the other metal layer are weakly joined and one metal layer and the other metal layer are laminated, the joint between one metal layer and the other metal layer is removed. However, one metal layer and the other metal layer can be separated. In addition, when one metal layer and the other metal layer are strongly bonded, the portion where one metal layer and the other metal layer are bonded is cut, chemically polished (etching, etc.), or mechanically polished. By removing by, for example, one metal layer and the other metal layer can be separated.

  In the present invention, when the resin is bonded to the surface of the metal foil, it may be desired that the peel strength is high. In this case, for example, a matte surface (M surface) of a metal layer (for example, electrolytic copper foil) is used as an adhesive surface with a resin, and a surface treatment such as a roughening treatment is performed to bond by a chemical and physical anchor effect. It is preferable to improve the strength.

  When the laminate is covered with a resin, a suitable resin is not particularly limited, but a thermosetting resin such as phenol resin, polyimide resin, epoxy resin, polyethylene, polypropylene, polystyrene, polyurethane, styrene butadiene resin emulsion, acrylonitrile. Butadiene resin emulsion, carboxy-modified styrene-butadiene copolymer resin emulsion, acrylic resin emulsion, natural rubber, pine resin, fluorine resin (polytetrafluoroethylene, polyvinylidene fluoride, etc.), silicone resin, silicone or thermoplastic resin such as polyethylene, polypropylene, Polystyrene, acrylic resin, thermoplastic polyurethane, thermoplastic natural rubber, or the like can be used. More typically, the resin does not melt even at 250 ° C. and / or has a glass transition temperature of 200 ° C. or higher, such as a fluororesin (polytetrafluoroethylene, polyvinylidene fluoride, etc.), preferably does not melt even at 250 ° C. In addition, a heat resistant resin having a glass transition temperature of 200 ° C. or higher, for example, a polyimide resin or a liquid crystal polymer resin (LCP resin) can be used. The resin preferably has chemical resistance, particularly acid resistance and desmear resistance. Here, “desmear treatment” means that after a hole is made in the resin with a laser and / or a drill, or after a metal foil is bonded to the resin surface, the metal foil is removed by etching or the like, and then the resin or metal Foil, for example, residue of copper foil or the like is removed with a treatment liquid, and “desmear liquid” refers to a treatment liquid used at that time. Furthermore, the viscosity of the resin may be 0.5 Pa · s or more, 1 Pa · s or more, 5 Pa · s or more, 10 Pa · s or more, 10000 Pa · s or less, 5000 Pa · s or less, 3000 Pa · s or less. The range of 100 Pa · s or less is measured using “6 Viscosity measuring method 6.2.3 Ubbelohde viscometer” of JIS Z 8803 (2011) according to JIS Z 8803 (2011), The range higher than 100 Pa · s is measured using the same “7 Viscosity Measuring Method with Falling Ball Viscometer”.

A prepreg can also be used. The prepreg before being bonded to the metal foil is preferably in a B-stage state. The linear expansion coefficient of the prepreg (C stage) is 12 to 18 (× 10 ⁻⁶ / ° C.), 16.5 (× 10 ⁻⁶ / ° C.) of the copper foil as the constituent material of the substrate, or 17 of the SUS press plate .3 (× 10 ⁻⁶ / ° C.) is advantageous in that it is difficult to cause circuit misalignment due to a phenomenon (scaling change) in which the substrate size before and after pressing differs from that at the time of design. Furthermore, as a synergistic effect of these merits, it becomes possible to produce a multilayer ultra-thin coreless substrate. The prepreg used here may be the same as or different from the prepreg constituting the circuit board.

  When using the prepreg, it is preferable from the viewpoint of effectively suppressing the penetration of the chemical liquid into the side surface of the laminate when the metal foil with a carrier is viewed in plan from the metal foil side. Laminating a metal foil or metal carrier that is one size larger on this B-stage prepreg prevents the prepreg from spreading out when pressed and effectively contaminates other layers. From the viewpoint of prevention, it is preferable.

  The thermal expansion coefficient of the resin is preferably within + 10% and −30% of the thermal expansion coefficient of the metal foil and the metal carrier. As a result, it is possible to effectively prevent circuit misalignment due to the difference in thermal expansion between the metal foil and the metal carrier and the resin, reduce the generation of defective products, and improve the yield.

  The thickness of the resin is not particularly limited and may be rigid or flexible, but if it is too thick it will adversely affect the heat distribution during hot pressing, but if it is too thin it will bend and will not flow through the printed wiring board manufacturing process, Usually, it is 5 to 1000 μm, preferably 50 to 900 μm, and more preferably 100 to 400 μm.

  Further, in an aspect in which at least a part of the surface of the metal foil is covered with a resin when viewed in plan, the thickness of the resin layer is preferably as small as possible, but typically 50 μm or less, preferably 40 μm or less, more preferably 30 μm or less, And typically 1 μm or more, preferably 2 μm or more, more preferably 5 μm or more. In addition, the thickness of the resin layer here refers to a thickness t of a portion covering the metal foil 23 of the resin 41 when the laminated body 40 is viewed in plan, for example, as shown in FIG.

  In addition, it is preferable to provide an opening when the laminate is viewed in plan from the viewpoint of yield, and a tangent is drawn to the end of the metal foil 23, the direction is perpendicular to the tangent, and the metal when viewed in plan The width of the resin in the direction perpendicular to the tangent at the layer end, for example, the width of the resin 41 from the end of the opening 42 of the resin 41 to the end of the metal foil 23 in the embodiment shown in FIG. w is typically 10 mm or less, preferably 5 mm or less, more preferably 3 mm or less, and typically 0.1 mm or more, preferably 0.2 mm or more, more preferably 0.5 mm or more. . If the width of the resin layer is too large, it is not preferable from the viewpoint of yield. Conversely, if the width of the resin layer is too small, the effect of effectively suppressing the penetration of the chemical solution from the end of the opening becomes small.

  Therefore, when covering the surface of the metal foil of the laminate according to the present invention with a resin, in a preferred embodiment, the peel strength between the surface of the resin and the metal foil is adjusted to a preferable range (for example, 800 gf / cm or more). Therefore, it is preferable that the surface roughness of the bonded surface is expressed by a ten-point average roughness (Rz cis) of the metal foil surface measured in accordance with JIS B 0601: 2001, and is set to 0.4 μm or more. 0.5 μm or more, preferably 0.8 μm or more, preferably 1.0 μm or more, preferably 1.2 μm or more, and preferably 1.5 μm or more. It is preferable that the thickness is 0.0 μm or more. The upper limit is not particularly required to be set, but is preferably 10.0 μm or less, preferably 8.0 μm or less, preferably 7.0 μm or less, and 6.0 μm or less. Is preferably 5.0 μm or less.

  In a preferred embodiment of the laminate according to the present invention, when a circuit or wiring is provided on a metal foil in order to form a circuit by an embedding method (embedded method), the metal foil and the circuit or wiring are provided. In order to adjust the peel strength between the resin in which the circuit or the wiring is embedded to the above-mentioned preferable range, the surface roughness of the surface of the metal foil opposite to the surface on which the metal carrier exists is determined according to JIS B Expressed by ten-point average roughness (Rz jis) measured according to 0601: 2001, it is preferably 3.5 μm or less, more preferably 3.0 μm or less. However, reducing the surface roughness indefinitely takes time and increases costs, so it is preferably 0.1 μm or more, and more preferably 0.3 μm or more.

A laminated body in which at least a part of the outer periphery of the laminated portion is covered with a resin when the metal foil with a carrier configured by bringing the metal foil into contact with the metal carrier in a separable manner is embedded in the resin when viewed in plan As a condition of hot pressing for producing the prepreg, when using a prepreg (for example, a plate-shaped prepreg) as a resin, it is preferable to hot press at a pressure of 30 to 40 kg / cm ² and a temperature higher than the glass transition temperature of the prepreg. .

Moreover, an inorganic substrate and / or a metal plate can be interposed between the metal carriers of the laminate shown in FIGS. An example in which an inorganic substrate or a metal plate is used for the laminate shown in FIG. 6 is shown in FIG.
In FIG. 11, a laminated body 60 includes an inorganic substrate and / or a metal plate 61 in which two metal foils with a carrier formed by bringing a metal foil 23 into contact with the surface of the metal carrier 22 are peeled between the metal carrier 22. It is obtained by laminating with a gap. The inorganic substrate or metal plate 61 serves as a core material described later.
Examples of such an inorganic substrate include ceramics, aluminum nitride, and alumina. Examples of the metal plate include an aluminum plate, an aluminum alloy plate, a nickel plate, a nickel alloy plate, a stainless steel plate, a copper alloy plate, a copper plate, an iron plate, an iron alloy plate, a zinc plate, and a zinc alloy plate. The thickness of the inorganic substrate and / or the metal plate is not particularly limited, but is, for example, 1 μm or more, preferably 2 μm or more, more preferably 5 μm or more, further preferably 10 μm or more, particularly preferably 15 μm or more, and It is 10,000 μm or less, preferably 5000 μm or less, more preferably 1000 μm or less, further preferably 300 μm or less, and particularly preferably 200 μm or less.
Further, the inorganic substrate or metal plate and the metal carrier can be laminated using an adhesive, welding, the above-described various joining methods, or the like, and may be adhered in a peelable manner.
Further, by cutting the laminate 60 shown in FIG. 11 along line B (or line C), for example, a laminate as shown in FIG. 10 can be obtained.

Furthermore, from another viewpoint, this invention provides the use of the laminated body mentioned above.
First, the resin or the metal layer is laminated at least once, for example, 1 to 10 times in the surface direction of at least one metal foil of the above-described laminate, that is, the direction substantially perpendicular to the surface of the metal foil. The manufacturing method of the multilayer metal-clad laminate including this is provided. Here, the metal layer includes a metal foil and a layer made of the metal mentioned as the metal carrier as described above, and is typically in the form of a foil or a plate.

  Second, with respect to the surface direction of at least one metal foil of the laminate described above, a resin, a single-sided or double-sided metal-clad laminate, or a laminate of the present invention, that is, a laminate as shown in FIG. 2 or FIG. Or a laminate obtained by cutting a laminate covered with a resin as shown in FIG. 3 to FIG. 7 or a metal carrier as shown in FIG. The manufacturing method of the multilayer metal-clad laminated board including laminating | stacking a laminated body, a metal layer with a resin substrate, or laminating | stacking a metal layer once or more is mentioned. In addition, this lamination is performed as many times as desired, and each lamination can be arbitrarily selected from the group consisting of a resin, a single-sided or double-sided metal-clad laminate, the laminate of the present invention, and a metal layer. Moreover, as a metal layer with a resin substrate, the metal foil with a carrier etc. which have the conventional resin carrier or a metal carrier etc. can be used conveniently.

The manufacturing method of the multilayer metal-clad laminate may include a step of peeling and separating the metal foil from the metal carrier at a portion of the metal foil that is in a peelable state. Here, the part of the metal foil in a peelable state is not a laminate covered with a resin as shown in FIGS. 3 to 7 but a metal foil of a laminate as shown in FIG. However, even if it is a laminated body as shown in FIG. 2, for example, what is joined from above a metal foil, such as a metallurgical joining method or a mechanical joining method, undergoes a cutting process as described later. Thus, the metal foil can be peeled from the metal carrier.
Moreover, when the said laminated body is planarly viewed on the surface of a metal layer, it includes the process of cut | disconnecting on the metal foil of the said laminated body, for example in at least one of the lamination | stacking surfaces of metal foil and a metal carrier. it can. In this case as well, a step of peeling and separating the metal foil of the cut laminate from the metal carrier can be further included. The method for producing a multilayer metal-clad laminate further includes a step of cutting at least one of the laminate surfaces of the metal foil and the metal carrier when the laminate is viewed in plan on the surface of the metal foil. be able to.

  Furthermore, after peeling and separating the metal foil from the metal carrier, it may further include a step of removing a part or all of the metal foil by etching.

  Third, with respect to the surface direction of at least one metal foil of the above-described laminate, the resin, single-sided or double-sided wiring board, single-sided or double-sided metal-clad laminate, the laminate of the present invention, that is, FIG. 2 or FIG. An inorganic substrate and / or a metal between a laminate obtained by cutting a laminate as shown in FIG. 3 or a laminate covered with a resin as shown in FIGS. 3 to 7 or a metal carrier as shown in FIG. There is provided a method for producing a build-up substrate including laminating a laminate with a plate, a metal layer with a resin substrate, a wiring, a circuit, or a metal layer at least once, for example, 1 to 10 times. This lamination is performed as many times as desired, and each lamination is arbitrarily selected from the group consisting of resin, single-sided or double-sided wiring board, single-sided or double-sided metal-clad laminate, laminate of the present invention, and metal layer. can do. Moreover, the conventional metal foil with a carrier etc. can be used suitably as a metal layer with a resin substrate similarly to the above-mentioned.

  Fourthly, there is provided a method for manufacturing a buildup board including a step of laminating one or more buildup wiring layers with respect to the surface direction of at least one metal foil of the laminate. At this time, the build-up wiring layer can be formed using at least one of a subtractive method, a full additive method, or a semi-additive method.

  Here, the fourth use of the laminate, that is, the subtractive method in the manufacturing method of the build-up board, is that the metal layer on the metal-clad laminate or the wiring board (including the printed wiring board and the printed circuit board) is unnecessary. This refers to a method in which a portion is selectively removed by etching or the like to form a conductor pattern. The full additive method is a method of forming a conductor pattern by electroless plating and / or electrolytic plating without using a metal layer as a conductor layer. The semi-additive method is an electroless method on a seed layer made of a metal layer, for example. In this method, a conductor pattern is formed by using metal deposition and electrolytic plating, etching, or a combination thereof, and then an unnecessary seed layer is removed by etching.

  In the above manufacturing method of the build-up substrate, single-sided or double-sided wiring board, single-sided or double-sided metal-clad laminate, laminated metal foil, laminated metal carrier, metal layer, resin of metal layer with resin substrate, resin substrate The method may further include a step of forming a hole in the metal layer of the attached metal layer or the resin and conducting plating on the side surface and the bottom surface of the hole. Further, at least one of the metal layer constituting the single-sided or double-sided wiring board, the metal layer constituting the single-sided or double-sided metal-clad laminate, the metal foil constituting the laminate, the metal layer of the metal layer with a resin substrate, and the metal layer. It may further include performing the step of forming the wiring in one or more times.

  In the above build-up board manufacturing method, the laminate of the present invention, that is, the laminate as shown in FIG. 2 or FIG. 10 or as shown in FIG. 3 to FIG. A step of laminating a laminate obtained by cutting a laminate covered with a resin or a laminate having an inorganic substrate and / or a metal plate interposed between metal carriers as shown in FIG. 11 may be further included. .

  The “surface on which the wiring is formed” means a portion where wiring is formed on the surface that appears every time a buildup is performed, and the buildup substrate includes both a final product and an intermediate product.

The method for manufacturing the build-up substrate may include a step of peeling and separating the metal foil from the metal carrier at a portion of the metal foil that is in a peelable state. Here, the part of the metal foil in a peelable state is not a laminate covered with a resin as shown in FIGS. 3 to 7 but a metal foil of a laminate as shown in FIG. However, even if it is a laminated body as shown in FIG. 2, for example, what is joined from above a metal foil, such as a metallurgical joining method or a mechanical joining method, undergoes a cutting process as described later. Thus, the metal foil can be peeled from the metal carrier.
Moreover, when the said laminated body is planarly viewed on the surface of a metal layer, it includes the process of cut | disconnecting on the metal foil of the said laminated body, for example in at least one of the lamination | stacking surfaces of metal foil and a metal carrier. it can. In this case as well, a step of peeling and separating the metal foil of the cut laminate from the metal carrier can be further included. The manufacturing method of the build-up substrate may further include a step of cutting at least one of the laminated surfaces of the metal foil and the metal carrier when the laminate is viewed in plan on the surface of the metal foil. it can. Alternatively, when the metal carriers are joined, welded, or bonded, when the laminate is viewed in plan, it may be cut inside the bonded, welded, or bonded part. Moreover, the joint part between metal carriers can also be removed by chemical polishing such as cutting, grinding, mechanical polishing, and etching.

  Furthermore, after peeling and separating the metal foil from the metal carrier, it may further include a step of removing a part or all of the metal foil by etching.

  In addition, in the manufacturing method of the above-mentioned multilayer metal-clad laminate and the manufacturing method of a buildup board | substrate, each layer can be laminated | stacked by performing thermocompression bonding. This thermocompression bonding may be performed every time one layer is stacked, may be performed after being laminated to some extent, or may be performed collectively at the end.

  In particular, the present invention provides a method for manufacturing a build-up board as described above, comprising a single-sided or double-sided wiring board, a single-sided or double-sided copper-clad laminate, a laminate according to the present invention, that is, a laminate as shown in FIG. A laminate obtained by cutting a laminate covered with a resin as shown in FIGS. 3 to 7, or a laminate having an inorganic substrate and / or a metal plate interposed between metal carriers as shown in FIG. A hole in the metal foil, the metal carrier of the laminate, the metal layer, the resin of the metal layer with the resin substrate, the metal layer of the resin layer with the resin substrate, or the resin, and conductive plating on the side and bottom of the hole, Furthermore, the metal foil and circuit portion constituting the single-sided or double-sided wiring board, the metal foil constituting the single-sided or double-sided copper-clad laminate, the metal foil constituting the laminate, the metal layer of the metal layer with a resin substrate, or the metal layer Times Method of manufacturing a build-up substrate for performing at least once the steps of forming a provide.

  Hereinafter, as a specific example of the above-described application, a method for producing a four-layer CCL using the laminate according to the present invention will be described. The laminated body used here is configured by bringing a metal carrier 11c and a metal foil 11a as shown in FIG. 2 into contact with each other through a release layer 11b so as to be separable. A laminate of a desired number of prepregs 12, then a two-layer printed circuit board or two-layer metal-clad laminate called an inner core 13, and then a prepreg 12 and then a metal layer with resin are sequentially stacked to form a set of four layers. The CCL assembly unit is completed. Next, this unit 14 (commonly called “page”) is repeated about 10 times to form a press assembly 15 (commonly called “book”) (FIG. 8). Thereafter, the book 15 is sandwiched between the laminated molds 10 and set in a hot press machine, and a large number of four-layer CCLs can be manufactured simultaneously by press molding at a predetermined temperature and pressure. As the laminated mold 10, for example, a stainless plate can be used. Although a plate is not limited, For example, a thick board about 1-10 mm can be used. In general, CCL having four or more layers can be produced in the same process by increasing the number of inner core layers.

  Hereinafter, as a specific example of the above-described use, two metal foils with a carrier constituted by bringing the metal foil 11a into contact with the metal carrier 11c through the release layer 11b in a separable manner are brought into contact with each other. A method of manufacturing a coreless buildup substrate using the laminated body 11 configured as described above will be exemplarily described. In this method, a required number of buildup layers 16 are laminated on both sides of the laminate 11, and finally the two metal foils 11a are peeled from the metal carrier 11c (see FIG. 9).

  In addition, for example, a resin as an insulating layer, a two-layer circuit board, and a resin as an insulating layer are sequentially stacked on the laminate of the present invention, and the laminate of the present invention is sequentially stacked thereon. A build-up substrate can be manufactured by cutting on the laminated surface of the metal foil and the metal carrier in the laminate.

As another method, a resin as an insulating layer and a metal layer as a conductor layer are sequentially laminated on the laminate of the present invention. Next, if necessary, a step of adjusting the thickness by half-etching the entire surface of the metal layer may be included. Next, laser processing is performed on a predetermined position of the laminated metal layer to form a via hole penetrating the metal layer and the resin, and after applying a desmear process for removing smear in the via hole, the bottom of the via hole, the side surface, and the metal layer Electroless plating is performed on the entire surface or a part of the substrate to form an interlayer connection, and further electrolytic plating is performed as necessary. A plating resist may be formed in advance on each part of the metal layer where electroless plating or electrolytic plating is unnecessary before performing each plating. Further, when the adhesion between electroless plating, electrolytic plating, plating resist and metal layer is insufficient, the surface of the metal layer may be chemically roughened in advance. When a plating resist is used, the plating resist is removed after plating. Next, a circuit is formed by removing unnecessary portions of the metal layer and the electroless plating portion and the electrolytic plating portion by etching. Then, a buildup board | substrate can be manufactured by cutting in the laminated surface of the metal foil and metal carrier in a laminated body. The process from the lamination of the resin and copper foil to the circuit formation may be performed a plurality of times to form a multilayer build-up substrate.
Furthermore, on the outermost surface of the build-up substrate, the laminate of the present invention, that is, the laminate as shown in FIG. 2 or FIG. 10 or the laminate covered with the resin as shown in FIG. 3 to FIG. A laminate obtained by cutting a laminate in which an inorganic substrate and / or a metal plate is interposed between metal carriers as shown in FIG. In addition, when the laminated body is brought into close contact at the end, the cut may be made on the laminated surface of the metal foil and the metal carrier in the laminated body laminated up to the preceding stage. It may cut at once so that the laminated surface of the metal foil and the metal carrier of all the laminated bodies may be cut so as to be included in the cut surface.

  Here, a prepreg containing a thermosetting resin can be suitably used as the resin substrate used for manufacturing the build-up substrate.

As another method, a resin, for example, a prepreg or a photosensitive resin as an insulating layer is laminated on the exposed surface of the metal foil that is exposed by providing an opening in the resin covering the laminate of the present invention. Thereafter, a via hole is formed at a predetermined position of the resin. For example, when a prepreg is used as the resin, the via hole can be formed by laser processing. After the laser processing, desmear treatment for removing smear in the via hole is preferably performed. Further, when a photosensitive resin is used as the resin, the resin in the via hole forming portion can be removed by a photolithography method. Next, electroless plating is performed on the bottom and side surfaces of the via holes, the entire surface or a part of the resin to form interlayer connections, and further electrolytic plating is performed as necessary. A plating resist may be formed in advance on each portion of the resin where electroless plating or electrolytic plating is unnecessary before performing each plating. Further, when the adhesion between electroless plating, electrolytic plating, plating resist and resin is insufficient, the surface of the resin may be chemically roughened in advance. When a plating resist is used, the plating resist is removed after plating. Next, an unnecessary portion of the electroless plating portion or the electrolytic plating portion is removed by etching to form a circuit. Then, a buildup board | substrate can be manufactured by cutting in the laminated surface of the metal foil and metal carrier in a laminated body. The steps from resin lamination to circuit formation may be performed a plurality of times to form a multilayer build-up substrate.
Furthermore, on the outermost surface of the build-up substrate, the laminate of the present invention, that is, the laminate as shown in FIG. 2 or FIG. 10 or the laminate covered with the resin as shown in FIG. 3 to FIG. A laminate obtained by cutting a laminate in which an inorganic substrate and / or a metal plate is interposed between metal carriers as shown in FIG. In addition, when the laminated body is brought into close contact at the end, the cut may be made on the laminated surface of the metal foil and the metal carrier in the laminated body laminated up to the preceding stage. It may cut at once so that the laminated surface of the metal foil and the metal carrier of all the laminated bodies may be cut so as to be included in the cut surface.

Another method is a build-up method as shown in FIGS.
That is, in FIG. 13, the prepregs 115 and 116 are laminated on the respective metal foils 23 of the laminate in which the metal foils with carriers shown in FIG. 12 are stacked on the metal carrier side, and further, the metal layer 117 for circuit formation, 118 is laminated. After lamination, cut at the cut line B. During this series of operations, the hole 114 functions as an alignment hole. Even if a prepreg or a metal layer is laminated on the upper surface of the hole 114, ultrasonic waves, radiation (electromagnetic radiation (X-rays and gamma rays) or particle radiation (α ), Β rays, neutron rays, electron beams, meson rays, proton rays, etc.)) or electromagnetic waves can be used to detect the position. In consideration of the degree of spread of the apparatus and ease of use, X-rays or gamma rays are preferably used, and X-rays are more preferably used.

  Subsequently, in FIG. 14, a hole 124 penetrating in the stacking direction is formed inside the hole 114 of the stacked body obtained in FIG. 13. As a result, the hole is also visualized by humans. Further, by making the hole 124 inside the hole 114, it is possible to prevent the chemical solution from being infiltrated between the metal layers of the laminate.

  In FIG. 15, a circuit is formed on the outermost metal layers 117 and 118 of the laminate obtained in FIG. 14, and circuit regions 122 and 123 are provided to obtain a buildup substrate 121. Thereafter, as shown in FIG. 16, a build-up layer 132 is further formed on the build-up substrate 121 obtained in FIG. 15, and the build-up layer is further formed as necessary. Sometimes, it may be cut along a predetermined cut line B set inside the hole 124 and divided into two substrates 133 and 134 along the arrow D at the interface of the metal layer. Further, as shown in FIG. 15, when viewed in plan, cut along a predetermined cut line B set inside the hole 124, and divide at the interface between the metal carriers 23 to obtain two build-up substrates. As shown in FIG. 17, the buildup layer 142 may be continuously formed on both surfaces of each buildup substrate 141, or the buildup layer may be formed only on one surface.

  For the coreless build-up substrate manufactured in this way, the wiring is formed on the surface through the plating process and / or the etching process, and the build-up is performed by separating and separating between the metal foil and the metal carrier. The wiring board is completed. Wiring may be formed on the peeled surface after peeling and separation, or the metal foil may be removed by etching to form a multilayer build-up wiring board. Furthermore, a printed circuit board is completed by mounting electronic components on the build-up wiring board. Also, a printed circuit board can be obtained by mounting electronic components directly on the coreless buildup substrate before peeling.

  Examples of the present invention will be described below together with comparative examples, but these examples are provided for better understanding of the present invention and its advantages, and are not intended to limit the invention.

<Experimental example 1>
The laminated body which has two ultra-thin copper foils with a carrier of the structure shown in FIG. 2 with the following procedures was produced.
A long electrolytic copper foil (JTC made by JX Nippon Mining & Metals) having a thickness of 35 μm was prepared as a carrier. A Ni layer having an adhesion amount of 4000 μm / dm ² was formed on the glossy surface (shiny surface) of the copper foil by electroplating on a roll-to-roll continuous plating line under the following conditions.

(1) Ni layer (Ni-containing layer, release layer: base plating 1)
An Ni layer having an adhesion amount of 1000 μg / dm ² was formed on the S surface of the copper foil carrier by electroplating with a roll-to-roll type continuous plating line under the following conditions. Specific plating conditions are described below.

Nickel sulfate: 270-280 g / L
Nickel chloride: 35 to 45 g / L
Nickel acetate: 10-20g / L
Boric acid: 30-40 g / L
Brightener: Saccharin, butynediol, etc. Sodium dodecyl sulfate: 55-75 ppm
pH: 4-6
Bath temperature: 55-65 ° C
Current density: 10 A / dm ²

(2) Cr layer (Cr-containing layer, release layer: base plating 2)
Next, after the surface of the Ni layer formed in (1) is washed with water and pickled, a Cr layer having an adhesion amount of 11 μg / dm ² is continuously formed on the Ni layer on a roll-to-roll-type continuous plating line. It was made to adhere by carrying out the electrolytic chromate process on the following conditions.
Potassium dichromate 1-10g / L, zinc 0g / L
pH: 7-10
Liquid temperature: 40-60 degreeC
Current density: 2 A / dm ²

(3) Ultra-thin copper layer Next, the surface of the Cr layer formed in (2) was washed with water and pickled, and then continuously on a roll-to-roll-type continuous plating line with a thickness of 2 μm on the Cr layer. An ultrathin copper layer was formed by electroplating under the following conditions to produce an ultrathin copper foil with a carrier.
Copper concentration: 80-120 g / L
Sulfuric acid concentration: 80-120 g / L
Electrolyte temperature: 50-80 ° C
Current density: 100 A / dm ²

  Using the ultrathin copper foil with carrier (ultrathin copper layer thickness 2 μm, ultrathin copper layer roughening formation surface roughness: Rz 0.6 μm) by the above treatment, the rough surface (matte surface: matte surface: The following roughening plating was performed on the (M surface). The processing conditions are shown below. These are all steps for forming a roughened layer on the ultrathin copper foil constituting the ultrathin copper foil with carrier in the laminate of the present invention. The ratio of the limiting current density during the formation of roughened particles was 2.50.

(Liquid composition 1)
Cu: 15 g / L
H ₂ SO ₄ : 100 g / L
W: 3 mg / L
Sodium dodecyl sulfate addition amount: 10ppm
(Electroplating temperature 1) 50 ° C

After the roughening treatment, normal plating shown below was performed. The processing conditions are shown below.
(Liquid composition 2)
Cu: 40 g / L
H ₂ SO ₄ : 100 g / L
(Electroplating temperature 1) 40 ° C
(Current condition 1)
Current density: 30 A / dm ²
Coulomb amount: 150 As / dm ²

Next, electrolytic chromate treatment was performed on the heat-resistant / rust-proof layer.
Electrolytic chromate treatment (chromium / zinc treatment (acid bath))
CrO ₃ : 1.5 g / L
ZnSO ₄ .7H2O: 2.0 g / L
Na ₂ SO ₄ : 18 g / L
pH: 4.6
Bath temperature: 37 ° C
Current density: 2.0 A / dm ²
Time: 1 to 30 seconds (pH adjustment is performed with sulfuric acid or potassium hydroxide)

Next, silane treatment (by coating) was performed on the chromate film layer. The conditions for the silane treatment are as follows.
0.2% 3-Glycidoxypropyltrimethoxysilane Regarding the ultrathin copper foil with each carrier, the peel strength between each ultrathin copper foil and the metal carrier was 13 gf / cm and 10 gf / cm.
The metal carriers of the two ultrathin copper foils with carriers thus obtained are brought into contact with each other, and an ultrasonic welding machine is used to form an ultrasonic frequency of 20 kHz, an output of 100 to 450 W, and an amplitude of 65 μm. Then, two ultrathin copper foils with a carrier were joined under the condition of a pressure of 100 to 400 kgf / cm ² to obtain a laminate having the structure shown in FIG.

<Experimental example 2>
The laminated body which has two ultra-thin copper foils with a carrier of the structure shown in FIG. 2 with the following procedures was produced.
Under the following conditions, the same procedure as in Experimental Example 1 was performed except for the treatment after the formation of the release layer and the roughening treatment of the ultrathin copper foil. The ultrathin copper layer laminated after the chromate treatment had a thickness of 3 μm.

(Formation of release layer)
(1) “Ni—Zn”: nickel zinc alloy plating In the above nickel plating formation conditions, zinc in the form of zinc sulfate (ZnSO ₄ ) is added to the nickel plating solution, and the zinc concentration is 0.05 to 5 g / L. In this range, the nickel zinc alloy plating was formed.
The amount of Ni deposited was 3000 μg / dm ² , and the amount of Zn deposited was 250 μg / dm ² .

(2) “Organic”: Organic layer forming treatment An aqueous solution having a liquid temperature of 40 ° C. and a pH of 5 containing carboxybenzotriazole (CBTA) having a concentration of 1 to 30 g / L on the nickel zinc alloy plating layer formed above. It was performed by showering for 20 to 120 seconds and spraying. The organic layer thickness was 25 μm.

(Roughening treatment)
Under the following conditions, roughening treatment 1, roughening treatment 2, rust prevention treatment, chromate treatment, and silane coupling treatment were performed in this order. The thickness of the ultrathin copper foil was 3 μm.
・ Roughening 1
Liquid composition: Copper 10-20 g / L, sulfuric acid 50-100 g / L
Liquid temperature: 25-50 degreeC
Current density: 1 to 58 A / dm ²
Coulomb amount: 4 to 81 As / dm ²
・ Roughening 2
Liquid composition: Copper 10-20 g / L, nickel 5-15 g / L, cobalt 5-15 g / L
pH: 2-3
Liquid temperature: 30-50 degreeC
Current density: 24 to 50 A / dm ²
Coulomb amount: 34 to 48 As / dm ²
・ Rust prevention treatment Liquid composition: Nickel 5-20g / L, Cobalt 1-8g / L
pH: 2-3
Liquid temperature: 40-60 degreeC
Current density: 5 to 20 A / dm ²
Coulomb amount: 10-20 As / dm ²
-Chromate treatment Liquid composition: Potassium dichromate 1-10 g / L, Zinc 0-5 g / L
pH: 3-4
Liquid temperature: 50-60 degreeC
Current density: 0 to ^{2 A} / dm ²
Coulomb amount: 0 to ^{2 As} / dm ²
Silane coupling treatment Application of diaminosilane aqueous solution (diaminosilane concentration: 0.1 to 0.5 wt%)

In addition, regarding the ultrathin copper foil with each carrier, the peel strength between each ultrathin copper foil and the metal carrier was 5 gf / cm and 8 gf / cm.
The metal carriers of the two ultrathin copper foils with carriers thus obtained are brought into contact with each other, friction stir welding is performed from above the ultrathin copper foil layer, the rotation speed of the tool (star rod) is 200 to 1000 rpm, and the tool load is 100. Two laminated ultra thin copper foils with a carrier were joined at ˜2000 N to obtain a laminate having the structure shown in FIG.

<Experimental example 3>
The laminated body which has two ultra-thin copper foils with a carrier of the structure shown in FIG. 2 with the following procedures was produced.
Two ultra-thin copper foils with a carrier were obtained in the same manner as in Experimental Example 2. In addition, regarding the ultrathin copper foil with each carrier, the peel strength between each ultrathin copper foil and the metal carrier was 5 gf / cm and 8 gf / cm.
And the metal carriers of the two ultra-thin copper foils with carriers are brought into close contact with each other through an adhesive,
A laminate having the structure shown in FIG. 2 was obtained.

<Experimental example 4>
In the procedure of Experimental Example 1, instead of performing ultrasonic welding to join the metal carriers of the two ultra-thin copper foils with carriers, the procedure is the same as that of Experimental Example 1 except that it is performed by seam welding. A laminate having two ultrathin copper foils with a carrier having the structure shown in FIG. 2 was produced.
In addition, before covering a laminated surface with resin, when the peeling strength of each ultrathin copper foil and a metal carrier was measured regarding each ultrathin copper foil with a carrier, they were 13 gf / cm and 10 gf / cm.

<Experimental example 5>
In the procedure of Experimental Example 2, instead of performing friction stir welding to join metal carriers of two ultrathin copper foils with a carrier, the same procedure as in Experimental Example 2 except that TIG welding was performed, A laminate having two ultrathin copper foils with a carrier having the structure shown in FIG. 2 was produced.
In addition, before covering a laminated surface with resin, about each ultrathin copper foil with a carrier, when the peeling strength of each ultrathin copper foil and a metal carrier was measured, they were 5 gf / cm and 8 gf / cm.

<Experimental example 6>
In the procedure of Experimental Example 3, except that the thickness of the metal carrier is 100 μm and the metal carriers of two ultrathin copper foils with a carrier are bonded together by an adhesive, they are joined by caulking. In this procedure, a laminate having two ultrathin copper foils with a carrier having the structure shown in FIG. 2 was produced.
In addition, before covering a laminated surface with resin, about each ultrathin copper foil with a carrier, when the peeling strength of each ultrathin copper foil and a metal carrier was measured, they were 5 gf / cm and 8 gf / cm.

<Experimental example 7>
In the procedure of Experimental Example 1, except that the thickness of the metal carrier is 70 μm and the metal carriers of the two ultra-thin copper foils with a carrier are joined by ultrasonic welding instead of joining by self-piercing rivets. In the same procedure as Example 1, a laminate having two ultrathin copper foils with a carrier having the structure shown in FIG. 2 was produced.
In addition, before covering a laminated surface with resin, when the peeling strength of each ultrathin copper foil and a metal carrier was measured regarding each ultrathin copper foil with a carrier, they were 13 gf / cm and 10 gf / cm.

<Experimental Example 8>
An aluminum plate is brought into contact with the surfaces of both copper foils of the laminate obtained in Experimental Example 2, and this aluminum plate is used as a mask in one side direction of the laminate, that is, from one side with respect to the lamination direction. An epoxy resin (viscosity: 2.0 Pa · s) was applied from the direction and the opposite direction.
In addition, the aluminum plate has a shape that covers the surface of the ultrathin copper foil while exposing at least one pair of opposite sides when the laminate is viewed in plan with respect to the ultrathin copper foil. Used for foil. Moreover, application | coating of resin was performed with respect to the one side of the side by which the aluminum plate was covered to the outer side of the ultra-thin copper foil, and the surface facing the said one side.
That is, a laminate having the cross-sectional structure shown in FIG. 6 was obtained in a direction including a pair of opposing end sides on the side covered with the resin.

<Experimental Example 9>
An aluminum plate is brought into contact with the surfaces of both copper foils of the laminate obtained in Experimental Example 3, and this aluminum plate is used as a mask in one side direction of the laminate, that is, from one side with respect to the lamination direction. An epoxy resin (viscosity: 0.5 Pa · s) was applied from the direction and the opposite direction.
In addition, when the said laminated body was planarly viewed about the ultra-thin copper foil, what has a shape which covers to the outer side of a pair of at least one opposing edge was used about the both ultra-thin copper foil. Moreover, application | coating of resin was performed with respect to the one side of the side by which the aluminum plate was covered to the outer side of the ultra-thin copper foil, and the surface facing the said one side.
That is, a laminated body having the cross-sectional structure shown in FIG. 7 was obtained in a direction including a pair of opposing end sides on the side covered with the resin.

<Experimental example 10>
An aluminum plate is brought into contact with the surfaces of both copper foils of the laminate obtained in Experimental Example 4, and this aluminum plate is used as a mask in one side direction of the laminate, that is, from one side with respect to the lamination direction. The epoxy resin (viscosity: 300 Pa · s) was applied from the direction and the opposite direction.
In addition, the aluminum plate has a shape that covers the surface of the ultrathin copper foil while exposing at least one pair of opposite sides when the laminate is viewed in plan with respect to the ultrathin copper foil. Used for foil. Moreover, application | coating of resin was performed with respect to the one side of the side by which the aluminum plate was covered to the outer side of the ultra-thin copper foil, and the surface facing the said one side.
That is, a laminate having the cross-sectional structure shown in FIG. 6 was obtained in a direction including a pair of opposing end sides on the side covered with the resin.

<Experimental example 11>
An aluminum plate is brought into contact with the surfaces of both copper foils of the laminate obtained in Experimental Example 5, and this aluminum plate is used as a mask in all lateral directions of the laminate, that is, from the side with respect to the lamination direction. From the direction, an epoxy resin (viscosity: 1 Pa · s) was applied.
In addition, when the said laminated body was planarly viewed about the ultra-thin copper foil, what has a shape which covers to the outer side about each pair of opposing edges was used about both ultra-thin copper foils.
That is, a laminate having the cross-sectional structure shown in FIG. 7 was obtained in the direction including each pair of opposing edges.

<Experimental example 12>
An aluminum plate is brought into contact with the surfaces of both copper foils of the laminate obtained in Experimental Example 6, and this aluminum plate is used as a mask in all lateral directions of the laminate, that is, from the side with respect to the lamination direction. From the direction, an epoxy resin (viscosity: 3000 Pa · s) was applied.
The aluminum plate is a double-thin copper foil having a shape that covers the surface of the ultra-thin copper foil while exposing a pair of opposing edges when the laminate is viewed in plan with respect to the ultra-thin copper foil. Used for.
That is, a laminate having the cross-sectional structure shown in FIG. 6 was obtained in both directions including a pair of opposing sides.

<Experimental example 13>
An aluminum plate is brought into contact with the surfaces of both copper foils of the laminate obtained in Experimental Example 7, and this aluminum plate is used as a mask in all lateral directions of the laminate, that is, from the side with respect to the lamination direction. From the direction, an epoxy resin (viscosity: 5 Pa · s) was applied.
In addition, when the said laminated body was planarly viewed about the ultra-thin copper foil, what has a shape which covers to the outer side about each pair of opposing edges was used about both ultra-thin copper foils.
That is, a laminate having the cross-sectional structure shown in FIG. 7 was obtained in the direction including each pair of opposing edges.

<Experimental Example 14>
An aluminum plate is brought into contact with the surfaces of both copper foils of the laminate obtained in Experimental Example 1, and this aluminum plate is used as a mask in one side direction of the laminate, that is, from one side with respect to the lamination direction. An epoxy resin (viscosity: 15 Pa · s) was applied from the direction and the opposite direction.
The aluminum plate covers the laminated body to the outside of one end side when viewed in plan with respect to the ultrathin copper foil, exposes the end side opposite to the end side, and is orthogonal to the both end sides. As for the second direction, a double-thin copper foil having a shape covering a quarter length toward the both ends from the center is used. Moreover, application | coating of resin was performed with respect to the surface which the aluminum plate was covered to the outer side of ultra-thin copper foil, and the surface facing the said side surface.
That is, when the ultra-thin copper foil is viewed in plan, the resin wraps around the surface of the ultra-thin copper foil on the exposed side edge on the side covered with the resin (see FIG. 6), and the opposite edge. A laminate having a structure (see FIG. 7) covering the laminated surface with the metal carrier without the resin wrapping around to the surface of the ultrathin copper foil was obtained.

<Experimental Example 15>
A plate-shaped prepreg having a size larger than that of the copper foil was brought into contact with the surfaces of both copper foils of the laminate obtained in Experimental Example 1, respectively.
In addition, the plate-shaped prepreg used the shape which covers the perimeter of an ultra-thin copper foil, when the said laminated body is planarly viewed about an ultra-thin copper foil. Thereafter, thermocompression bonding was performed by hot pressing to laminate a plate-like prepreg on the laminate. The laminate has a structure in which two metal foils with a carrier formed by bringing a metal foil into contact with the surface of a metal carrier so as to be peeled are covered with a resin in the laminate obtained by laminating the metal carriers (see FIG. 3 and FIG. 4).

<Experimental Example 16>
A laminate having two ultrathin copper foils with a carrier having the structure shown in FIG. 10 was produced by the following procedure.
An aluminum plate having a thickness of 100 μm is provided between the metal carrier of the ultrathin copper foil with one carrier and the metal carrier of the other ultrathin copper foil with the carrier, and is ultrasonically welded from above the ultrathin copper foil layer. The ultrathin copper foil with one carrier, the aluminum plate, and the ultrathin copper foil with the other carrier are joined under the conditions of an ultrasonic frequency of 20 kHz, an output of 300 to 450 W, an amplitude of 65 μm, and a pressing force of 250 to 400 kgf / cm ^2. The procedure was the same as in Experimental Example 1 except that the laminate having the structure shown in FIG. The ultrathin copper layer laminated after the chromate treatment had a thickness of 3 μm.

<Experimental Example 17>
A plate-shaped prepreg having a size larger than that of the copper foil was brought into contact with the surfaces of both copper foils of the laminate obtained in Experimental Example 1, respectively. Then, another copper foil larger in size than the plate-shaped prepreg was brought into contact with the surface of the plate-shaped prepreg opposite to the surface in contact with the copper foil.
In addition, the plate-shaped prepreg used the shape which covers the perimeter of an ultra-thin copper foil, when the said laminated body is planarly viewed about an ultra-thin copper foil. Moreover, another copper foil used the shape which covers the perimeter of a plate-like prepreg, when the said laminated body is planarly viewed about ultra-thin copper foil. Thereafter, thermocompression bonding was performed by hot pressing to laminate a plate-shaped prepreg and another copper foil on the laminate. The laminate has a structure in which the two metal foils with a carrier formed by bringing a metal foil into contact with the surface of the metal carrier so as to be peeled are covered with a resin in the laminate obtained by laminating the metal carriers. In addition, another metal foil was provided on the surface opposite to the surface in contact with the laminate of the plate-like prepreg.
<Experimental example 18>
Instead of an aluminum plate having a thickness of 100 μm, a brass plate having a thickness of 50 μm (JIS H3100 alloy number C2680) is used, and between the metal carrier of the ultrathin copper foil with one carrier and the metal carrier of the ultrathin copper foil with the other carrier A laminate was manufactured in the same manner as in Experimental Example 16 except that a brass plate having a thickness of 50 μm was provided and each metal carrier and the brass plate were bonded with an epoxy resin (viscosity: 50 Pa · s).

  FR-4 prepreg (manufactured by Nanya Plastic Co., Ltd.), copper foil (JX Nippon Mining & Metals Co., Ltd.) are exposed on both sides of the laminate thus produced, with the metal layer (copper foil) exposed on the surface. ), JTC12 μm (product name)) in order, and on the side where the resin is exposed on the surface, copper foil (manufactured by JX Nippon Mining & Metals Co., Ltd., JTC12 μm (product name)), FR-4 prepreg ( Nanya Plastic Co., Ltd.), copper foil (JX Nippon Mining & Metals Co., Ltd., JTC 12 μm (product name)) are stacked in order, and hot pressing is performed at 170 ° C. for 100 minutes at a pressure of 3 MPa. A tension laminate was produced.

  Next, a 100 μm diameter hole penetrating the copper foil on the surface of the 4-layer or 6-layer copper-clad laminate and the insulating layer (cured prepreg) thereunder was drilled using a laser processing machine. Subsequently, the surface of the copper foil present in the inner layer exposed at the bottom of the hole, the side surface of the hole, and the copper foil on the surface of the 4-layer to 6-layer copper-clad laminate are electrolessly plated with copper and electroplated with copper. Plating was performed to form an electrical connection between the copper foil present in the inner layer and the copper foil on the surface of the 4-6 layer copper clad laminate. Next, a part of the copper foil on the surface of the 4-6 layer copper-clad laminate was etched using a ferric chloride-based etchant to form a circuit. Thus, a 4-6 layer buildup board | substrate can be produced.

  Subsequently, after cutting the 4- or 6-layer build-up board at a position on the metal layer, the metal layer and the metal layer constituting the laminate are peeled and separated to form two sets of 2 or 3 A layer build-up wiring board was obtained.

Subsequently, the copper foil which is the metal layer in contact with the metal layer (copper foil) on the two sets of two or three-layer build-up wiring boards is etched to form a wiring, and two sets of two or two A three-layer build-up wiring board was obtained.
In this way, when manufacturing a build-up board, for example, when a through hole is provided, for example, wrinkles and burrs are often observed in a thin ultra-thin copper foil, which may cause poor quality. Since the foil is supported by the metal carrier, generation of wrinkles and burrs can be suppressed during the lamination process.

DESCRIPTION OF SYMBOLS 10 Laminated metal mold 11 Laminated body 11a Metal foil 11b Release layer 11c Metal carrier 11d Inorganic substrate and / or metal plate 12 Prepreg 13 Inner core core 14 Page 15 Book 16 Build-up layer 20 Laminated body 21 Resin 22 Metal carrier 23 Metal foil 24 Release layer 30 Laminate 31 Resin 32 Metal foil 40 Laminate 41 Resin 42 Opening 50 Laminate 51 Resin 52 Opening 60 Laminate 61 Inorganic substrate and / or metal plate

Claims (42)

  In a laminate obtained by laminating the metal carriers with each other, the two metal foils with a carrier in which the metal foil is brought into contact with the surface of the metal carrier in a peelable manner, when viewed in plan on the surface of the metal foil, At least a part of the outer periphery of the laminated portion of the metal carrier and the metal foil and the surface of the metal foil when viewed in plan are covered with a resin, and the thickness of the resin covering the surface of the metal foil is 5 μm. The laminated body which is the above. It is a laminated body of Claim 1 obtained by laminating | stacking the said metal carriers through an inorganic board | substrate or a metal plate, Comprising: Lamination | stacking which satisfy | fills any one or more of the following items (3)-(10). body:
(3) The metal carrier and the metal foil are bonded using a release layer;
(4) In at least one metal foil with a carrier, the peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less;
(5) In at least one of the metal foils with a carrier, a ten-point average roughness (Rz jis) of a side surface in contact with the metal foil in the metal carrier is 3.5 μm or less;
(6) The peel strength between the metal foil and the metal carrier after heating at least one of 3 hours, 6 hours, or 9 hours at 220 ° C. in the metal foil with carrier is 0.5 gf / cm to 200 gf / cm;
(7) The thickness is 8 to 500 μm;
(8) holes are provided;
(9) 1 to 10 holes having a diameter of 0.01 mm to 10 mm are provided;
(10) At least one of the metal foils is a copper foil or a copper alloy foil. It is a laminated body of Claim 1 , Comprising: The laminated body which satisfy | fills any one or more of the following items (1)- (10) :
(1) The metal carriers are directly laminated with an adhesive as necessary;
(2) The metal carriers are joined together;
(3) The metal carrier and the metal foil are bonded using a release layer;
(4) In at least one metal foil with a carrier, the peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less;
(5) In at least one of the metal foils with a carrier, a ten-point average roughness (Rz jis) of a side surface in contact with the metal foil in the metal carrier is 3.5 μm or less;
(6) The peel strength between the metal foil and the metal carrier after heating at least one of 3 hours, 6 hours, or 9 hours at 220 ° C. in the metal foil with carrier is 0.5 gf / cm to 200 gf / cm;
(7) The thickness is 8 to 500 μm;
(8) holes are provided;
(9) 1 to 10 holes having a diameter of 0.01 mm to 10 mm are provided;
(10) At least one of the metal foils is a copper foil or a copper alloy foil. In the laminated body as described in any one of Claims 1-3 , when it planarly views on the surface of the said metal foil, it is covered with resin over the whole outer periphery of the laminated part of the said metal carrier and the said metal foil. Laminated body. The laminated body as described in any one of Claims 1-4 in which resin contains a thermosetting resin. The laminate according to any one of claims 1 to 5 , wherein the resin contains a thermoplastic resin. The laminated body as described in any one of Claims 1-6 WHEREIN : The laminated body in which the hole was provided in the outer side of the said metal foil or the said metal carrier of the said resin. The laminate according to claim 7 , wherein the hole has a diameter of 0.01 mm to 10 mm and is provided at 1 to 10 locations. The laminated body cut | disconnected by the laminated surface of the said metal carrier and the said metal foil, when the laminated body as described in any one of Claims 1-8 is planarly viewed in the surface of the said metal foil. The multilayer body according to any one of claims 1 to 9 , wherein a resin is laminated on the surface of each metal foil. A multilayer laminate which is cut at a laminate surface of the metal carrier and the metal foil when the multilayer laminate according to claim 10 is viewed in plan on the surface of the metal foil. The multilayer laminate according to claim 10 or 11 , wherein a metal layer is further laminated on the surface of each resin. The multilayer body according to claim 12 , wherein an area of the metal layer is larger than an area of a laminated surface of the metal carrier and the metal foil in a plan view. The multilayer laminate according to claim 12 or 13, in a plan view at the surface of the metal layer, prior Symbol resin and, multilayer laminate that is cut at the laminated surface of the metal layer. The multilayer laminate according to claim 12 or 13 , wherein a hole penetrating through the laminate is provided. The multilayer laminate according to claim 15, in a plan view at the surface of the metal layer, prior Symbol resin and, multilayer laminate that is cut at the laminated surface of the metal layer. The multilayer laminate according to claim 16 , wherein a hole penetrating the entire multilayer laminate is provided inside the hole. A resin or a metal layer is provided with respect to the surface direction of at least one metal foil of the laminate according to any one of claims 1 to 9 or the multilayer laminate according to any one of claims 10 to 17. A method for producing a multilayer metal-clad laminate comprising laminating at least once. Resin, single-sided or double-sided with respect to the surface direction of at least one metal foil of the laminate according to any one of claims 1 to 9 or the multilayer laminate according to any one of claims 10 to 17. A metal-clad laminate, the laminate according to any one of claims 1 to 9 , the multilayer laminate according to any one of claims 10 to 17 , a metal layer with a resin substrate , a metal layer , or the following: One or more times a laminate satisfying any one or more of items (A-1) to (A-15) or a multilayer laminate satisfying any one or more of the following items (A-26) to (A-30) A method for producing a multilayer metal-clad laminate comprising laminating.
(A-1)
At least one of the two metal foils with a carrier, which is a laminate obtained by laminating the metal carriers with two of the metal foils with a carrier in which the metal foil is brought into contact with the surface of the metal carrier in a peelable manner. A laminate in which the peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less.
(A-2)
At least one of the two metal foils with a carrier, which is a laminate obtained by laminating the metal carriers with two of the metal foils with a carrier in which the metal foil is brought into contact with the surface of the metal carrier in a peelable manner. The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 0.5 gf / cm or more and 200 gf / cm or less.
(A-3)
Two metal foils with a carrier formed by bringing the metal foil into contact with the surface of the metal carrier so as to be peeled off, is a laminate obtained by laminating the metal carriers, and the metal carrier and the metal foil are Bonding using a release layer, the release layer is Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, or alloys thereof, or hydrates thereof, or these Or a layer containing at least one of an oxide and an organic substance, or the release layer is formed of Cr, Ni, Co, Fe, Mo, Ti from the metal carrier side. From a single metal layer made of any one of elements of W, P, Cu, Al, or from elements of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al An alloy layer composed of one or more selected elements; And a layer made of hydrate or oxide or organic substance of one or more elements selected from the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al laminated on Configured or
The release layer is a single metal layer made of any one element of the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn from the metal carrier side, or Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, an alloy layer made of one or more elements selected from the element group, and then Cr, Ni, Co, Fe, Mo, A single metal layer composed of any one element of Ti, W, P, Cu, Al, Zn, or Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn A laminated body composed of an alloy layer made of one or more elements selected from the group of elements.
(A-4)
The laminate according to any one of (A-1) to (A-3), which is obtained by directly laminating the metal carriers with an adhesive as necessary.
(A-5)
The laminate according to any one of (A-1) to (A-4), in which the metal carriers are bonded to each other.
(A-6)
The laminate according to any one of (A-1) to (A-3), which is obtained by laminating the metal carriers via an inorganic substrate or a metal plate.
(A-7)
The laminate according to any one of (A-1) to (A-6), wherein the metal carrier and the metal foil are bonded together using a release layer.
(A-8)
The laminate according to (A-7), wherein a peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less.
(A-9)
The laminate according to (A-7) or (A-8), wherein the ten-point average roughness (Rz cis) of the side surface in contact with the metal foil in the metal carrier is 3.5 μm or less.
(A-10)
The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 0.5 gf / cm or more and 200 gf / cm or less (A-7) to The laminated body as described in any one of (A-9).
(A-11)
The laminate according to any one of (A-1) to (A-10), which has a thickness of 8 to 500 μm.
(A-12)
It is a laminated body as described in any one of (A-1)-(A-11), Comprising: The laminated body in which the hole was provided.
(A-13)
It is a laminated body as described in (A-12), Comprising: The said hole is 0.01 mm-10 mm in diameter, and the laminated body provided in 1-10 places.
(A-14)
The laminate according to any one of (A-1) to (A-13), wherein at least one of the metal foils is a copper foil or a copper alloy foil.
(A-15)
In the laminate according to any one of (A-1) to (A-14), when viewed in plan on the surface of the metal foil, at least the outer periphery of the laminate portion of the metal carrier and the metal foil A laminate that is partially covered with resin.
(A-26)
In a laminate obtained by laminating the metal carriers with two metal foils with a metal foil in contact with the surface of the metal carrier in a peelable manner, a plate-like resin is applied to the surface of each metal foil. A multilayer laminate formed by laminating, where Sa is the area of the metal foil when viewed in plan, and Sb is the area of the plate resin having a large area when viewed in plan, of the two plate resins. A multilayer laminate having Sa / Sb of less than 1.0.
(A-27)
In the multilayer laminate according to (A-26), the area where the two plate-like resins are bonded to each other when viewed in plan is Sp, and the area of the two plate-shaped resins when viewed in plan A multilayer laminate in which the ratio Sp / Sq of Sp to Sq is 0.001 or more, where Sq is the area of the plate-like resin having a larger A.
(A-28)
In a laminate obtained by laminating the metal carriers with two metal foils with a metal foil in contact with the surface of the metal carrier in a peelable manner, a plate-like resin is applied to the surface of each metal foil. A multilayer laminate formed by stacking, where Sp is an area where the two plate-like resins are bonded to each other when viewed in plan, and the area of the two plate-shaped resins when viewed in plan is large A multilayer laminate in which the ratio Sp / Sq of Sp and Sq is 0.001 or more, where Sq is the area of the plate-like resin.
(A-29)
The multilayer laminate according to any one of (A-26) to (A-28), wherein the multilayer laminate satisfies any one or more of the following items (B-11) to (B-21):
(B-11) The laminate is obtained by directly laminating the metal carriers with an adhesive as necessary;
(B-12) In the laminate, the metal carriers are bonded to each other;
(B-13) The laminate is obtained by laminating the metal carriers via an inorganic substrate or a metal plate;
(B-14) In the laminate, the metal carrier and the metal foil are bonded together using a release layer;
(B-15) In the laminate, the peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less;
(B-16) The ten-point average roughness (Rz jis) of the side surface in contact with the metal foil in the metal carrier in the laminate is 3.5 μm or less;
(B-17) The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for at least one of 3 hours, 6 hours, or 9 hours is 0.5 gf / cm to 200 gf / cm. Is:
(B-18) The laminate has a thickness of 8 to 500 μm;
(B-19) holes are provided in the laminate;
(B-20) 1 to 10 holes having a diameter of 0.01 mm to 10 mm are provided in the laminate.
(B-21) In the laminate, at least one of the metal foils is a copper foil or a copper alloy foil.
(A-30)
In the multilayer laminate according to any one of (A-26) to (A-28), a multilayer laminate satisfying any one or more of the following items (B-31) to (B-36):
(B-31) When the laminate is viewed in plan on the surface of the metal foil, at least a part of the outer periphery of the laminate portion of the metal carrier and the metal foil is covered with a resin;
(B-32) When the laminate is viewed in plan on the surface of the metal foil, the entire outer periphery of the laminate portion of the metal carrier and the metal foil is covered with a resin;
(B-33) In the laminate, the resin contains a thermosetting resin;
(B-34) In the laminate, the resin contains a thermoplastic resin;
(B-35) In the laminate, a hole is provided outside the metal foil or the metal carrier of the resin;
(B-36) In the laminate, 1 to 10 holes having a diameter of 0.01 mm to 10 mm are provided. 20. The method for producing a multilayer metal-clad laminate according to claim 18 or 19 , wherein the laminate is cut at at least one of the laminate surfaces of the metal carrier and the metal foil when viewed in plan on the surface of the metal layer. The manufacturing method of the multilayer metal-clad laminated board including the process to do. The method for producing a multilayer metal-clad laminate according to any one of claims 18 to 20 , further comprising a step of separating and separating the metal foil of the laminate from a metal carrier. . The method for producing a multilayer metal-clad laminate according to claim 20 or 21 , further comprising a step of peeling and separating the metal foil of the cut portion of the laminate from the metal carrier. The manufacturing method according to claim 21 or 22 , comprising a step of removing a part or all of the separated and separated metal foil by etching. The laminate according to any one of claims 1 to 9 , or the multilayer laminate according to any one of claims 10 to 17 , and the surface side of at least one metal foil of the laminate or the multilayer laminate. A resin, a single-sided or double-sided metal-clad laminate, a laminate according to any one of claims 1 to 9 , a multilayer laminate according to any one of claims 10 to 17 , and a resin substrate. Any one of the attached metal layer , the metal layer , or the laminate satisfying any one or more of the following items (A-1) to (A-15) or the following items (A-26) to (A-30): A multilayer metal-clad laminate including a layer having at least one layer selected from a multilayer laminate satisfying one or more .
(A-1)
At least one of the two metal foils with a carrier, which is a laminate obtained by laminating the metal carriers with two of the metal foils with a carrier in which the metal foil is brought into contact with the surface of the metal carrier in a peelable manner. A laminate in which the peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less.
(A-2)
At least one of the two metal foils with a carrier, which is a laminate obtained by laminating the metal carriers with two of the metal foils with a carrier in which the metal foil is brought into contact with the surface of the metal carrier in a peelable manner. The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 0.5 gf / cm or more and 200 gf / cm or less.
(A-3)
Two metal foils with a carrier formed by bringing the metal foil into contact with the surface of the metal carrier so as to be peeled off, is a laminate obtained by laminating the metal carriers, and the metal carrier and the metal foil are Bonding using a release layer, the release layer is Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, or alloys thereof, or hydrates thereof, or these Or a layer containing at least one of an oxide and an organic substance, or the release layer is formed of Cr, Ni, Co, Fe, Mo, Ti from the metal carrier side. From a single metal layer made of any one of elements of W, P, Cu, Al, or from elements of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al An alloy layer composed of one or more selected elements; And a layer made of hydrate or oxide or organic substance of one or more elements selected from the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al laminated on Configured or
The release layer is a single metal layer made of any one element of the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn from the metal carrier side, or Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, an alloy layer made of one or more elements selected from the element group, and then Cr, Ni, Co, Fe, Mo, A single metal layer composed of any one element of Ti, W, P, Cu, Al, Zn, or Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn A laminated body composed of an alloy layer made of one or more elements selected from the group of elements.
(A-4)
The laminate according to any one of (A-1) to (A-3), which is obtained by directly laminating the metal carriers with an adhesive as necessary.
(A-5)
The laminate according to any one of (A-1) to (A-4), in which the metal carriers are bonded to each other.
(A-6)
The laminate according to any one of (A-1) to (A-3), which is obtained by laminating the metal carriers via an inorganic substrate or a metal plate.
(A-7)
The laminate according to any one of (A-1) to (A-6), wherein the metal carrier and the metal foil are bonded together using a release layer.
(A-8)
The laminate according to (A-7), wherein a peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less.
(A-9)
The laminate according to (A-7) or (A-8), wherein the ten-point average roughness (Rz cis) of the side surface in contact with the metal foil in the metal carrier is 3.5 μm or less.
(A-10)
The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 0.5 gf / cm or more and 200 gf / cm or less (A-7) to The laminated body as described in any one of (A-9).
(A-11)
The laminate according to any one of (A-1) to (A-10), which has a thickness of 8 to 500 μm.
(A-12)
It is a laminated body as described in any one of (A-1)-(A-11), Comprising: The laminated body in which the hole was provided.
(A-13)
It is a laminated body as described in (A-12), Comprising: The said hole is 0.01 mm-10 mm in diameter, and the laminated body provided in 1-10 places.
(A-14)
The laminate according to any one of (A-1) to (A-13), wherein at least one of the metal foils is a copper foil or a copper alloy foil.
(A-15)
In the laminate according to any one of (A-1) to (A-14), when viewed in plan on the surface of the metal foil, at least the outer periphery of the laminate portion of the metal carrier and the metal foil A laminate that is partially covered with resin.
(A-26)
In a laminate obtained by laminating the metal carriers with two metal foils with a metal foil in contact with the surface of the metal carrier in a peelable manner, a plate-like resin is applied to the surface of each metal foil. A multilayer laminate formed by laminating, where Sa is the area of the metal foil when viewed in plan, and Sb is the area of the plate resin having a large area when viewed in plan, of the two plate resins. A multilayer laminate having Sa / Sb of less than 1.0.
(A-27)
In the multilayer laminate according to (A-26), the area where the two plate-like resins are bonded to each other when viewed in plan is Sp, and the area of the two plate-shaped resins when viewed in plan A multilayer laminate in which the ratio Sp / Sq of Sp to Sq is 0.001 or more, where Sq is the area of the plate-like resin having a larger A.
(A-28)
In a laminate obtained by laminating the metal carriers with two metal foils with a metal foil in contact with the surface of the metal carrier in a peelable manner, a plate-like resin is applied to the surface of each metal foil. A multilayer laminate formed by stacking, where Sp is an area where the two plate-like resins are bonded to each other when viewed in plan, and the area of the two plate-shaped resins when viewed in plan is large A multilayer laminate in which the ratio Sp / Sq of Sp and Sq is 0.001 or more, where Sq is the area of the plate-like resin.
(A-29)
The multilayer laminate according to any one of (A-26) to (A-28), wherein the multilayer laminate satisfies any one or more of the following items (B-11) to (B-21):
(B-11) The laminate is obtained by directly laminating the metal carriers with an adhesive as necessary;
(B-12) In the laminate, the metal carriers are bonded to each other;
(B-13) The laminate is obtained by laminating the metal carriers via an inorganic substrate or a metal plate;
(B-14) In the laminate, the metal carrier and the metal foil are bonded together using a release layer;
(B-15) In the laminate, the peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less;
(B-16) The ten-point average roughness (Rz jis) of the side surface in contact with the metal foil in the metal carrier in the laminate is 3.5 μm or less;
(B-17) The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for at least one of 3 hours, 6 hours, or 9 hours is 0.5 gf / cm to 200 gf / cm. Is:
(B-18) The laminate has a thickness of 8 to 500 μm;
(B-19) holes are provided in the laminate;
(B-20) 1 to 10 holes having a diameter of 0.01 mm to 10 mm are provided in the laminate.
(B-21) In the laminate, at least one of the metal foils is a copper foil or a copper alloy foil.
(A-30)
In the multilayer laminate according to any one of (A-26) to (A-28), a multilayer laminate satisfying any one or more of the following items (B-31) to (B-36):
(B-31) When the laminate is viewed in plan on the surface of the metal foil, at least a part of the outer periphery of the laminate portion of the metal carrier and the metal foil is covered with a resin;
(B-32) When the laminate is viewed in plan on the surface of the metal foil, the entire outer periphery of the laminate portion of the metal carrier and the metal foil is covered with a resin;
(B-33) In the laminate, the resin contains a thermosetting resin;
(B-34) In the laminate, the resin contains a thermoplastic resin;
(B-35) In the laminate, a hole is provided outside the metal foil or the metal carrier of the resin;
(B-36) In the laminate, 1 to 10 holes having a diameter of 0.01 mm to 10 mm are provided. 25. The multilayer metal-clad laminate according to claim 24 , wherein at least one of the laminate surfaces of the metal layers is cut when viewed in plan on the surface of the metal layer of the multilayer metal-clad laminate. Laminated board. A build-up wiring layer is formed with respect to the surface direction of at least one metal foil of the laminate according to any one of claims 1 to 9 or the multilayer laminate according to any one of claims 10 to 17. A method for manufacturing a build-up substrate including a step of forming one or more layers. Resin, single-sided or double-sided with respect to the surface direction of at least one metal foil of the laminate according to any one of claims 1 to 9 or the multilayer laminate according to any one of claims 10 to 17. A wiring substrate, a single-sided or double-sided metal-clad laminate, a laminate according to any one of claims 1 to 9 , a multilayer laminate according to any one of claims 10 to 17, a metal layer with a resin substrate, A wiring, a circuit , a metal layer , or a laminate satisfying any one or more of the following items (A-1) to (A-15) or any of the following items (A-26) to (A-30): A method for manufacturing a build-up substrate, comprising laminating at least one multilayer laminate satisfying one or more .
(A-1)
At least one of the two metal foils with a carrier, which is a laminate obtained by laminating the metal carriers with two of the metal foils with a carrier in which the metal foil is brought into contact with the surface of the metal carrier in a peelable manner. A laminate in which the peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less.
(A-2)
At least one of the two metal foils with a carrier, which is a laminate obtained by laminating the metal carriers with two of the metal foils with a carrier in which the metal foil is brought into contact with the surface of the metal carrier in a peelable manner. The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 0.5 gf / cm or more and 200 gf / cm or less.
(A-3)
Two metal foils with a carrier formed by bringing the metal foil into contact with the surface of the metal carrier so as to be peeled off, is a laminate obtained by laminating the metal carriers, and the metal carrier and the metal foil are Bonding using a release layer, the release layer is Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, or alloys thereof, or hydrates thereof, or these Or a layer containing at least one of an oxide and an organic substance, or the release layer is formed of Cr, Ni, Co, Fe, Mo, Ti from the metal carrier side. From a single metal layer made of any one of elements of W, P, Cu, Al, or from elements of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al An alloy layer composed of one or more selected elements; And a layer made of hydrate or oxide or organic substance of one or more elements selected from the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al laminated on Configured or
The release layer is a single metal layer made of any one element of the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn from the metal carrier side, or Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, an alloy layer made of one or more elements selected from the element group, and then Cr, Ni, Co, Fe, Mo, A single metal layer composed of any one element of Ti, W, P, Cu, Al, Zn, or Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn A laminated body composed of an alloy layer made of one or more elements selected from the group of elements.
(A-4)
The laminate according to any one of (A-1) to (A-3), which is obtained by directly laminating the metal carriers with an adhesive as necessary.
(A-5)
The laminate according to any one of (A-1) to (A-4), in which the metal carriers are bonded to each other.
(A-6)
The laminate according to any one of (A-1) to (A-3), which is obtained by laminating the metal carriers via an inorganic substrate or a metal plate.
(A-7)
The laminate according to any one of (A-1) to (A-6), wherein the metal carrier and the metal foil are bonded together using a release layer.
(A-8)
The laminate according to (A-7), wherein a peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less.
(A-9)
The laminate according to (A-7) or (A-8), wherein the ten-point average roughness (Rz cis) of the side surface in contact with the metal foil in the metal carrier is 3.5 μm or less.
(A-10)
The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 0.5 gf / cm or more and 200 gf / cm or less (A-7) to The laminated body as described in any one of (A-9).
(A-11)
The laminate according to any one of (A-1) to (A-10), which has a thickness of 8 to 500 μm.
(A-12)
It is a laminated body as described in any one of (A-1)-(A-11), Comprising: The laminated body in which the hole was provided.
(A-13)
It is a laminated body as described in (A-12), Comprising: The said hole is 0.01 mm-10 mm in diameter, and the laminated body provided in 1-10 places.
(A-14)
The laminate according to any one of (A-1) to (A-13), wherein at least one of the metal foils is a copper foil or a copper alloy foil.
(A-15)
In the laminate according to any one of (A-1) to (A-14), when viewed in plan on the surface of the metal foil, at least the outer periphery of the laminate portion of the metal carrier and the metal foil A laminate that is partially covered with resin.
(A-26)
In a laminate obtained by laminating the metal carriers with two metal foils with a metal foil in contact with the surface of the metal carrier in a peelable manner, a plate-like resin is applied to the surface of each metal foil. A multilayer laminate formed by laminating, where Sa is the area of the metal foil when viewed in plan, and Sb is the area of the plate resin having a large area when viewed in plan, of the two plate resins. A multilayer laminate having Sa / Sb of less than 1.0.
(A-27)
In the multilayer laminate according to (A-26), the area where the two plate-like resins are bonded to each other when viewed in plan is Sp, and the area of the two plate-shaped resins when viewed in plan A multilayer laminate in which the ratio Sp / Sq of Sp to Sq is 0.001 or more, where Sq is the area of the plate-like resin having a larger A.
(A-28)
In a laminate obtained by laminating the metal carriers with two metal foils with a metal foil in contact with the surface of the metal carrier in a peelable manner, a plate-like resin is applied to the surface of each metal foil. A multilayer laminate formed by stacking, where Sp is an area where the two plate-like resins are bonded to each other when viewed in plan, and the area of the two plate-shaped resins when viewed in plan is large A multilayer laminate in which the ratio Sp / Sq of Sp and Sq is 0.001 or more, where Sq is the area of the plate-like resin.
(A-29)
The multilayer laminate according to any one of (A-26) to (A-28), wherein the multilayer laminate satisfies any one or more of the following items (B-11) to (B-21):
(B-11) The laminate is obtained by directly laminating the metal carriers with an adhesive as necessary;
(B-12) In the laminate, the metal carriers are bonded to each other;
(B-13) The laminate is obtained by laminating the metal carriers via an inorganic substrate or a metal plate;
(B-14) In the laminate, the metal carrier and the metal foil are bonded together using a release layer;
(B-15) In the laminate, the peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less;
(B-16) The ten-point average roughness (Rz jis) of the side surface in contact with the metal foil in the metal carrier in the laminate is 3.5 μm or less;
(B-17) The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for at least one of 3 hours, 6 hours, or 9 hours is 0.5 gf / cm to 200 gf / cm. Is:
(B-18) The laminate has a thickness of 8 to 500 μm;
(B-19) holes are provided in the laminate;
(B-20) 1 to 10 holes having a diameter of 0.01 mm to 10 mm are provided in the laminate.
(B-21) In the laminate, at least one of the metal foils is a copper foil or a copper alloy foil.
(A-30)
In the multilayer laminate according to any one of (A-26) to (A-28), a multilayer laminate satisfying any one or more of the following items (B-31) to (B-36):
(B-31) When the laminate is viewed in plan on the surface of the metal foil, at least a part of the outer periphery of the laminate portion of the metal carrier and the metal foil is covered with a resin;
(B-32) When the laminate is viewed in plan on the surface of the metal foil, the entire outer periphery of the laminate portion of the metal carrier and the metal foil is covered with a resin;
(B-33) In the laminate, the resin contains a thermosetting resin;
(B-34) In the laminate, the resin contains a thermoplastic resin;
(B-35) In the laminate, a hole is provided outside the metal foil or the metal carrier of the resin;
(B-36) In the laminate, 1 to 10 holes having a diameter of 0.01 mm to 10 mm are provided. 28. The method of manufacturing a buildup substrate according to claim 26 or 27 , wherein the laminate is cut at at least one of the laminated surfaces of the metal carrier and the metal foil when viewed in plan on the surface of the metal foil. A method for manufacturing a build-up board including 28. The method for manufacturing a build-up wiring board according to claim 26 or 27 , further comprising a step of separating and separating the metal foil of the laminate from a metal carrier. 29. The method for manufacturing a build-up wiring board according to claim 28 , further comprising a step of separating and separating the metal foil of the cut portion of the laminate from the metal carrier. 31. The method for manufacturing a build-up wiring board according to claim 29 or 30 , further comprising a step of removing a part or all of the separated and separated metal foil by etching. The manufacturing method of a printed circuit board including the process of manufacturing a buildup wiring board by the manufacturing method as described in any one of Claims 29-31 . A method for manufacturing a printed circuit board, comprising a step of manufacturing a build-up board by the manufacturing method according to claim 26 . It is provided in the surface side of the laminated body as described in any one of Claims 1-9 , or the multilayer laminated body as described in any one of Claims 10-17 , and the at least 1 metal foil of the said multilayer laminated body. Resin, single-sided or double-sided wiring board, single-sided or double-sided metal-clad laminate, laminate according to any one of claims 1 to 9 , multilayer laminate according to any one of claims 10 to 17 , Metal layer with resin substrate, wiring, circuit , metal layer , or laminate satisfying any one or more of the following items (A-1) to (A-15) or the following items (A-26) to (A And a layer having one or more layers selected from a multilayer laminate satisfying any one or more of -30) .
(A-1)
At least one of the two metal foils with a carrier, which is a laminate obtained by laminating the metal carriers with two of the metal foils with a carrier in which the metal foil is brought into contact with the surface of the metal carrier in a peelable manner. A laminate in which the peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less.
(A-2)
At least one of the two metal foils with a carrier, which is a laminate obtained by laminating the metal carriers with two of the metal foils with a carrier in which the metal foil is brought into contact with the surface of the metal carrier in a peelable manner. The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 0.5 gf / cm or more and 200 gf / cm or less.
(A-3)
Two metal foils with a carrier formed by bringing the metal foil into contact with the surface of the metal carrier so as to be peeled off, is a laminate obtained by laminating the metal carriers, and the metal carrier and the metal foil are Bonding using a release layer, the release layer is Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, or alloys thereof, or hydrates thereof, or these Or a layer containing at least one of an oxide and an organic substance, or the release layer is formed of Cr, Ni, Co, Fe, Mo, Ti from the metal carrier side. From a single metal layer made of any one of elements of W, P, Cu, Al, or from elements of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al An alloy layer composed of one or more selected elements; And a layer made of hydrate or oxide or organic substance of one or more elements selected from the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al laminated on Configured or
The release layer is a single metal layer made of any one element of the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn from the metal carrier side, or Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, an alloy layer made of one or more elements selected from the element group, and then Cr, Ni, Co, Fe, Mo, A single metal layer composed of any one element of Ti, W, P, Cu, Al, Zn, or Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn A laminated body composed of an alloy layer made of one or more elements selected from the group of elements.
(A-4)
The laminate according to any one of (A-1) to (A-3), which is obtained by directly laminating the metal carriers with an adhesive as necessary.
(A-5)
The laminate according to any one of (A-1) to (A-4), in which the metal carriers are bonded to each other.
(A-6)
The laminate according to any one of (A-1) to (A-3), which is obtained by laminating the metal carriers via an inorganic substrate or a metal plate.
(A-7)
The laminate according to any one of (A-1) to (A-6), wherein the metal carrier and the metal foil are bonded together using a release layer.
(A-8)
The laminate according to (A-7), wherein a peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less.
(A-9)
The laminate according to (A-7) or (A-8), wherein the ten-point average roughness (Rz cis) of the side surface in contact with the metal foil in the metal carrier is 3.5 μm or less.
(A-10)
The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 0.5 gf / cm or more and 200 gf / cm or less (A-7) to The laminated body as described in any one of (A-9).
(A-11)
The laminate according to any one of (A-1) to (A-10), which has a thickness of 8 to 500 μm.
(A-12)
It is a laminated body as described in any one of (A-1)-(A-11), Comprising: The laminated body in which the hole was provided.
(A-13)
It is a laminated body as described in (A-12), Comprising: The said hole is 0.01 mm-10 mm in diameter, and the laminated body provided in 1-10 places.
(A-14)
The laminate according to any one of (A-1) to (A-13), wherein at least one of the metal foils is a copper foil or a copper alloy foil.
(A-15)
In the laminate according to any one of (A-1) to (A-14), when viewed in plan on the surface of the metal foil, at least the outer periphery of the laminate portion of the metal carrier and the metal foil A laminate that is partially covered with resin.
(A-26)
In a laminate obtained by laminating the metal carriers with two metal foils with a metal foil in contact with the surface of the metal carrier in a peelable manner, a plate-like resin is applied to the surface of each metal foil. A multilayer laminate formed by laminating, where Sa is the area of the metal foil when viewed in plan, and Sb is the area of the plate resin having a large area when viewed in plan, of the two plate resins. A multilayer laminate having Sa / Sb of less than 1.0.
(A-27)
In the multilayer laminate according to (A-26), the area where the two plate-like resins are bonded to each other when viewed in plan is Sp, and the area of the two plate-shaped resins when viewed in plan A multilayer laminate in which the ratio Sp / Sq of Sp to Sq is 0.001 or more, where Sq is the area of the plate-like resin having a larger A.
(A-28)
In a laminate obtained by laminating the metal carriers with two metal foils with a metal foil in contact with the surface of the metal carrier in a peelable manner, a plate-like resin is applied to the surface of each metal foil. A multilayer laminate formed by stacking, where Sp is an area where the two plate-like resins are bonded to each other when viewed in plan, and the area of the two plate-shaped resins when viewed in plan is large A multilayer laminate in which the ratio Sp / Sq of Sp and Sq is 0.001 or more, where Sq is the area of the plate-like resin.
(A-29)
The multilayer laminate according to any one of (A-26) to (A-28), wherein the multilayer laminate satisfies any one or more of the following items (B-11) to (B-21):
(B-11) The laminate is obtained by directly laminating the metal carriers with an adhesive as necessary;
(B-12) In the laminate, the metal carriers are bonded to each other;
(B-13) The laminate is obtained by laminating the metal carriers via an inorganic substrate or a metal plate;
(B-14) In the laminate, the metal carrier and the metal foil are bonded together using a release layer;
(B-15) In the laminate, the peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less;
(B-16) The ten-point average roughness (Rz jis) of the side surface in contact with the metal foil in the metal carrier in the laminate is 3.5 μm or less;
(B-17) The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for at least one of 3 hours, 6 hours, or 9 hours is 0.5 gf / cm to 200 gf / cm. Is:
(B-18) The laminate has a thickness of 8 to 500 μm;
(B-19) holes are provided in the laminate;
(B-20) 1 to 10 holes having a diameter of 0.01 mm to 10 mm are provided in the laminate.
(B-21) In the laminate, at least one of the metal foils is a copper foil or a copper alloy foil.
(A-30)
In the multilayer laminate according to any one of (A-26) to (A-28), a multilayer laminate satisfying any one or more of the following items (B-31) to (B-36):
(B-31) When the laminate is viewed in plan on the surface of the metal foil, at least a part of the outer periphery of the laminate portion of the metal carrier and the metal foil is covered with a resin;
(B-32) When the laminate is viewed in plan on the surface of the metal foil, the entire outer periphery of the laminate portion of the metal carrier and the metal foil is covered with a resin;
(B-33) In the laminate, the resin contains a thermosetting resin;
(B-34) In the laminate, the resin contains a thermoplastic resin;
(B-35) In the laminate, a hole is provided outside the metal foil or the metal carrier of the resin;
(B-36) In the laminate, 1 to 10 holes having a diameter of 0.01 mm to 10 mm are provided. 35. The buildup substrate according to claim 34 , wherein when viewed in plan on the surface of the metal layer of the buildup substrate, at least one of the laminated surfaces of the metal layers is cut. A multilayer metal-clad laminate comprising the laminate according to any one of claims 1 to 9 and one or more layers of resin provided on the surface side of two metal foils of the laminate. 37. The multilayer metal-clad laminate according to claim 36 , further comprising one or more metal layers provided on the surface of each resin. The buildup board | substrate containing the laminated body as described in any one of Claims 1-9 , and the layer which contains one or more resin and a metal layer in this order on the surface side of the two metal foils of the said laminated body. 39. The build-up board according to claim 38 , wherein conductive plating is provided on a side surface and a bottom surface of the hole formed in the metal layer and the resin. 40. The build-up board according to claim 38 or 39 , wherein the build-up board has one or more layers having wiring formed on at least one surface of the metal layer. The laminated body according to any one of claims 1 to 9 , the multilayer laminated body according to any one of claims 10 to 17 , or the following item (A-1 ) on the formed wiring : 41) The build according to claim 40 , comprising a laminate satisfying any one or more of (A) to (A-15) or a multilayer laminate satisfying any one or more of the following items (A-26) to (A-30). Up board.
(A-1)
At least one of the two metal foils with a carrier, which is a laminate obtained by laminating the metal carriers with two of the metal foils with a carrier in which the metal foil is brought into contact with the surface of the metal carrier in a peelable manner. A laminate in which the peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less.
(A-2)
At least one of the two metal foils with a carrier, which is a laminate obtained by laminating the metal carriers with two of the metal foils with a carrier in which the metal foil is brought into contact with the surface of the metal carrier in a peelable manner. The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 0.5 gf / cm or more and 200 gf / cm or less.
(A-3)
Two metal foils with a carrier formed by bringing the metal foil into contact with the surface of the metal carrier so as to be peeled off, is a laminate obtained by laminating the metal carriers, and the metal carrier and the metal foil are Bonding using a release layer, the release layer is Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, or alloys thereof, or hydrates thereof, or these Or a layer containing at least one of an oxide and an organic substance, or the release layer is formed of Cr, Ni, Co, Fe, Mo, Ti from the metal carrier side. From a single metal layer made of any one of elements of W, P, Cu, Al, or from elements of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al An alloy layer composed of one or more selected elements; And a layer made of hydrate or oxide or organic substance of one or more elements selected from the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al laminated on Configured or
The release layer is a single metal layer made of any one element of the element group of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn from the metal carrier side, or Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, an alloy layer made of one or more elements selected from the element group, and then Cr, Ni, Co, Fe, Mo, A single metal layer composed of any one element of Ti, W, P, Cu, Al, Zn, or Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn A laminated body composed of an alloy layer made of one or more elements selected from the group of elements.
(A-4)
The laminate according to any one of (A-1) to (A-3), which is obtained by directly laminating the metal carriers with an adhesive as necessary.
(A-5)
The laminate according to any one of (A-1) to (A-4), in which the metal carriers are bonded to each other.
(A-6)
The laminate according to any one of (A-1) to (A-3), which is obtained by laminating the metal carriers via an inorganic substrate or a metal plate.
(A-7)
The laminate according to any one of (A-1) to (A-6), wherein the metal carrier and the metal foil are bonded together using a release layer.
(A-8)
The laminate according to (A-7), wherein a peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less.
(A-9)
The laminate according to (A-7) or (A-8), wherein the ten-point average roughness (Rz cis) of the side surface in contact with the metal foil in the metal carrier is 3.5 μm or less.
(A-10)
The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 0.5 gf / cm or more and 200 gf / cm or less (A-7) to The laminated body as described in any one of (A-9).
(A-11)
The laminate according to any one of (A-1) to (A-10), which has a thickness of 8 to 500 μm.
(A-12)
It is a laminated body as described in any one of (A-1)-(A-11), Comprising: The laminated body in which the hole was provided.
(A-13)
It is a laminated body as described in (A-12), Comprising: The said hole is 0.01 mm-10 mm in diameter, and the laminated body provided in 1-10 places.
(A-14)
The laminate according to any one of (A-1) to (A-13), wherein at least one of the metal foils is a copper foil or a copper alloy foil.
(A-15)
In the laminate according to any one of (A-1) to (A-14), when viewed in plan on the surface of the metal foil, at least the outer periphery of the laminate portion of the metal carrier and the metal foil A laminate that is partially covered with resin.
(A-26)
In a laminate obtained by laminating the metal carriers with two metal foils with a metal foil in contact with the surface of the metal carrier in a peelable manner, a plate-like resin is applied to the surface of each metal foil. A multilayer laminate formed by laminating, where Sa is the area of the metal foil when viewed in plan, and Sb is the area of the plate resin having a large area when viewed in plan, of the two plate resins. A multilayer laminate having Sa / Sb of less than 1.0.
(A-27)
In the multilayer laminate according to (A-26), the area where the two plate-like resins are bonded to each other when viewed in plan is Sp, and the area of the two plate-shaped resins when viewed in plan A multilayer laminate in which the ratio Sp / Sq of Sp to Sq is 0.001 or more, where Sq is the area of the plate-like resin having a larger A.
(A-28)
In a laminate obtained by laminating the metal carriers with two metal foils with a metal foil in contact with the surface of the metal carrier in a peelable manner, a plate-like resin is applied to the surface of each metal foil. A multilayer laminate formed by stacking, where Sp is an area where the two plate-like resins are bonded to each other when viewed in plan, and the area of the two plate-shaped resins when viewed in plan is large A multilayer laminate in which the ratio Sp / Sq of Sp and Sq is 0.001 or more, where Sq is the area of the plate-like resin.
(A-29)
The multilayer laminate according to any one of (A-26) to (A-28), wherein the multilayer laminate satisfies any one or more of the following items (B-11) to (B-21):
(B-11) The laminate is obtained by directly laminating the metal carriers with an adhesive as necessary;
(B-12) In the laminate, the metal carriers are bonded to each other;
(B-13) The laminate is obtained by laminating the metal carriers via an inorganic substrate or a metal plate;
(B-14) In the laminate, the metal carrier and the metal foil are bonded together using a release layer;
(B-15) In the laminate, the peel strength between the metal carrier and the metal foil is 0.5 gf / cm or more and 200 gf / cm or less;
(B-16) The ten-point average roughness (Rz jis) of the side surface in contact with the metal foil in the metal carrier in the laminate is 3.5 μm or less;
(B-17) The peel strength between the metal foil and the metal carrier after heating at 220 ° C. for at least one of 3 hours, 6 hours, or 9 hours is 0.5 gf / cm to 200 gf / cm. Is:
(B-18) The laminate has a thickness of 8 to 500 μm;
(B-19) holes are provided in the laminate;
(B-20) 1 to 10 holes having a diameter of 0.01 mm to 10 mm are provided in the laminate.
(B-21) In the laminate, at least one of the metal foils is a copper foil or a copper alloy foil.
(A-30)
In the multilayer laminate according to any one of (A-26) to (A-28), a multilayer laminate satisfying any one or more of the following items (B-31) to (B-36):
(B-31) When the laminate is viewed in plan on the surface of the metal foil, at least a part of the outer periphery of the laminate portion of the metal carrier and the metal foil is covered with a resin;
(B-32) When the laminate is viewed in plan on the surface of the metal foil, the entire outer periphery of the laminate portion of the metal carrier and the metal foil is covered with a resin;
(B-33) In the laminate, the resin contains a thermosetting resin;
(B-34) In the laminate, the resin contains a thermoplastic resin;
(B-35) In the laminate, a hole is provided outside the metal foil or the metal carrier of the resin;
(B-36) In the laminate, 1 to 10 holes having a diameter of 0.01 mm to 10 mm are provided. 42. The buildup substrate according to any one of claims 38 to 41 , wherein at least one of the laminated surfaces of the metal layers is cut when viewed in plan on the surface of the metal layer of the buildup substrate. Build-up board.