JP5973728B2 - バッチ式熱処理装置及び該装置に適用されるヒータ - Google Patents

バッチ式熱処理装置及び該装置に適用されるヒータ Download PDF

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Publication number
JP5973728B2
JP5973728B2 JP2011518650A JP2011518650A JP5973728B2 JP 5973728 B2 JP5973728 B2 JP 5973728B2 JP 2011518650 A JP2011518650 A JP 2011518650A JP 2011518650 A JP2011518650 A JP 2011518650A JP 5973728 B2 JP5973728 B2 JP 5973728B2
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Japan
Prior art keywords
heat treatment
tube
heater
pipe
substrate
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JP2011518650A
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Japanese (ja)
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JP2011528501A (ja
JP2011528501A5 (enExample
Inventor
ホ、クワンサン
カン、ホヨン
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Tera Semicon Corp
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Tera Semicon Corp
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Priority claimed from KR1020080069330A external-priority patent/KR101016058B1/ko
Priority claimed from KR1020080069331A external-priority patent/KR101016061B1/ko
Priority claimed from KR1020080069329A external-priority patent/KR101016048B1/ko
Priority claimed from KR1020080110813A external-priority patent/KR101016064B1/ko
Priority claimed from KR1020080110814A external-priority patent/KR101009990B1/ko
Application filed by Tera Semicon Corp filed Critical Tera Semicon Corp
Publication of JP2011528501A publication Critical patent/JP2011528501A/ja
Publication of JP2011528501A5 publication Critical patent/JP2011528501A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Furnace Details (AREA)
  • Photovoltaic Devices (AREA)
  • Resistance Heating (AREA)
JP2011518650A 2008-07-16 2009-07-16 バッチ式熱処理装置及び該装置に適用されるヒータ Active JP5973728B2 (ja)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
KR1020080069330A KR101016058B1 (ko) 2008-07-16 2008-07-16 열처리 장치용 히터
KR10-2008-0069330 2008-07-16
KR10-2008-0069329 2008-07-16
KR1020080069331A KR101016061B1 (ko) 2008-07-16 2008-07-16 열처리 장치용 히터
KR10-2008-0069331 2008-07-16
KR1020080069329A KR101016048B1 (ko) 2008-07-16 2008-07-16 배치식 열처리 장치
KR1020080110813A KR101016064B1 (ko) 2008-11-10 2008-11-10 히터
KR10-2008-0110813 2008-11-10
KR1020080110814A KR101009990B1 (ko) 2008-11-10 2008-11-10 히터
KR10-2008-0110814 2008-11-10
PCT/KR2009/003909 WO2010008211A2 (ko) 2008-07-16 2009-07-16 배치식 열처리 장치 및 이에 적용되는 히터

Related Child Applications (1)

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JP2014043704A Division JP2014146815A (ja) 2008-07-16 2014-03-06 バッチ式熱処理装置及び該装置に適用されるヒータ

Publications (3)

Publication Number Publication Date
JP2011528501A JP2011528501A (ja) 2011-11-17
JP2011528501A5 JP2011528501A5 (enExample) 2012-07-26
JP5973728B2 true JP5973728B2 (ja) 2016-08-23

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ID=41550851

Family Applications (2)

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JP2011518650A Active JP5973728B2 (ja) 2008-07-16 2009-07-16 バッチ式熱処理装置及び該装置に適用されるヒータ
JP2014043704A Pending JP2014146815A (ja) 2008-07-16 2014-03-06 バッチ式熱処理装置及び該装置に適用されるヒータ

Family Applications After (1)

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JP2014043704A Pending JP2014146815A (ja) 2008-07-16 2014-03-06 バッチ式熱処理装置及び該装置に適用されるヒータ

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Country Link
JP (2) JP5973728B2 (enExample)
CN (3) CN105140157B (enExample)
TW (1) TWI508178B (enExample)
WO (1) WO2010008211A2 (enExample)

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KR101306751B1 (ko) * 2011-04-29 2013-09-10 주식회사 테라세미콘 기판 지지용 홀더 및 이를 사용한 기판 처리 장치
KR101155813B1 (ko) * 2011-08-24 2012-06-12 (주)써모니크 그라파이트 히터로
KR101435454B1 (ko) * 2012-04-27 2014-08-28 주식회사 테라세미콘 기판 처리 장치
KR101982724B1 (ko) * 2012-12-26 2019-05-27 주식회사 탑 엔지니어링 기판 열처리 장치
KR101982725B1 (ko) * 2012-12-26 2019-05-27 주식회사 탑 엔지니어링 기판 열처리 장치용 발열 조립체
KR101557037B1 (ko) * 2013-08-14 2015-10-02 (주) 예스티 대면적 유리기판 열처리장치
KR101527158B1 (ko) * 2013-10-24 2015-06-09 주식회사 테라세미콘 배치식 기판처리 장치
KR101479224B1 (ko) 2013-12-09 2015-01-05 포스코에너지 주식회사 박판형 운모 히터
TWI698944B (zh) * 2013-12-23 2020-07-11 南韓商圓益Ｉｐｓ股份有限公司 批量式基板處理裝置
KR102117421B1 (ko) * 2014-05-12 2020-06-02 주식회사 제우스 히터 체결장치 및 이를 이용한 기판 열처리장치
KR101753376B1 (ko) 2015-08-24 2017-07-04 주식회사 하이원시스 4방향 상부 슬라이딩 도어가 설치된 프리히터
JP2019027623A (ja) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス 加熱装置および加熱方法
JP2019029102A (ja) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス 加熱装置
JP6826166B2 (ja) * 2018-08-16 2021-02-03 ウォニク アイピーエス カンパニー リミテッドＷｏｎｉｋ Ｉｐｓ Ｃｏ．，Ｌｔｄ． 熱処理システム及び熱処理装置
TWI709203B (zh) * 2018-09-11 2020-11-01 大陸商北京北方華創微電子裝備有限公司 腔室冷卻裝置及半導體加工設備
CN110890262B (zh) * 2018-09-11 2025-05-23 北京北方华创微电子装备有限公司 腔室冷却装置及半导体加工设备
CN113169109B (zh) * 2018-11-30 2025-07-01 朗姆研究公司 用于增进热均匀性的具有多层加热器的陶瓷基座
JP7079042B2 (ja) * 2019-05-31 2022-06-01 株式会社九州日昌 加熱装置および加熱方法
WO2020241490A1 (ja) * 2019-05-31 2020-12-03 株式会社九州日昌 加熱装置および加熱方法
JP2021197448A (ja) * 2020-06-15 2021-12-27 光洋サーモシステム株式会社 熱処理装置
KR102559562B1 (ko) * 2021-03-11 2023-07-27 주식회사 한국제이텍트써모시스템 열처리 오븐의 배기 덕트 일체형 히터 유닛
EP4352780A1 (en) * 2021-06-09 2024-04-17 Watlow Electric Manufacturing Company Cold conduit insulation device
CN114485170B (zh) * 2021-12-27 2024-04-30 江苏邑文微电子科技有限公司 快速退火炉加热系统以及温度控制方法
KR102508123B1 (ko) * 2022-10-28 2023-03-10 (주)삼양세라텍 열처리 장치
CN118919461A (zh) * 2024-10-12 2024-11-08 苏州芯默科技有限公司 一种晶圆退火设备
CN118969680A (zh) * 2024-10-12 2024-11-15 苏州芯默科技有限公司 一种晶圆退火设备

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Also Published As

Publication number Publication date
CN102067294A (zh) 2011-05-18
CN105140157A (zh) 2015-12-09
JP2011528501A (ja) 2011-11-17
WO2010008211A3 (ko) 2010-03-25
CN105140157B (zh) 2018-05-29
TWI508178B (zh) 2015-11-11
WO2010008211A2 (ko) 2010-01-21
JP2014146815A (ja) 2014-08-14
CN102067294B (zh) 2016-10-19
TW201007847A (en) 2010-02-16
CN102983091A (zh) 2013-03-20

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