JP5971242B2 - 導電性塗膜の製造方法及び導電性塗膜 - Google Patents
導電性塗膜の製造方法及び導電性塗膜 Download PDFInfo
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- JP5971242B2 JP5971242B2 JP2013515191A JP2013515191A JP5971242B2 JP 5971242 B2 JP5971242 B2 JP 5971242B2 JP 2013515191 A JP2013515191 A JP 2013515191A JP 2013515191 A JP2013515191 A JP 2013515191A JP 5971242 B2 JP5971242 B2 JP 5971242B2
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- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 description 1
- KOQDZLJGORGLNW-UHFFFAOYSA-N 5-phenylcyclohexa-2,4-diene-1,1-diamine Chemical group C1=CC(N)(N)CC(C=2C=CC=CC=2)=C1 KOQDZLJGORGLNW-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241001147149 Lucina Species 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- 238000002479 acid--base titration Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 1
- 150000007942 carboxylates Chemical group 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229960001031 glucose Drugs 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N hydrochloric acid Substances Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000007603 infrared drying Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- KADGVXXDDWDKBX-UHFFFAOYSA-N naphthalene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C21 KADGVXXDDWDKBX-UHFFFAOYSA-N 0.000 description 1
- WRYWBRATLBWSSG-UHFFFAOYSA-N naphthalene-1,2,4-tricarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C21 WRYWBRATLBWSSG-UHFFFAOYSA-N 0.000 description 1
- OLAPPGSPBNVTRF-UHFFFAOYSA-N naphthalene-1,4,5,8-tetracarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1C(O)=O OLAPPGSPBNVTRF-UHFFFAOYSA-N 0.000 description 1
- OKBVMLGZPNDWJK-UHFFFAOYSA-N naphthalene-1,4-diamine Chemical compound C1=CC=C2C(N)=CC=C(N)C2=C1 OKBVMLGZPNDWJK-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- GOGZBMRXLADNEV-UHFFFAOYSA-N naphthalene-2,6-diamine Chemical compound C1=C(N)C=CC2=CC(N)=CC=C21 GOGZBMRXLADNEV-UHFFFAOYSA-N 0.000 description 1
- HBJPJUGOYJOSLR-UHFFFAOYSA-N naphthalene-2,7-diamine Chemical compound C1=CC(N)=CC2=CC(N)=CC=C21 HBJPJUGOYJOSLR-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229940045845 sodium myristate Drugs 0.000 description 1
- JUQGWKYSEXPRGL-UHFFFAOYSA-M sodium;tetradecanoate Chemical compound [Na+].CCCCCCCCCCCCCC([O-])=O JUQGWKYSEXPRGL-UHFFFAOYSA-M 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
- C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Insulated Conductors (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
Description
[溶剤可溶分の測定法]
得られた樹脂硬化層付きポリイミド系フィルムから一定面積を切り出し、樹脂硬化層に用いる樹脂の溶解に使用したものと同じ溶剤中に25℃で1時間浸漬後、乾燥し、溶剤可溶分を下式により求める。
溶剤可溶分=(W1−W2)/(W1−W0)×100(%)
W0:樹脂硬化層付きポリイミドフィルムから樹脂硬化層を完全にこすり取ったポリイミドフィルムの重量
W1:溶剤浸漬前の樹脂硬化層付きポリイミドフィルム
W2:溶剤浸漬後の樹脂硬化層付きポリイミドフィルム
溶剤可溶分=(W1−W2)/(W1−W0)×100(%)
W0:樹脂硬化層付きポリイミドフィルムから樹脂硬化層を完全にこすり取ったポリイミドフィルムの重量
W1:溶剤浸漬前の樹脂硬化層付きポリイミドフィルム
W2:溶剤浸漬後の樹脂硬化層付きポリイミドフィルム
○−−−絶縁基板と導電性塗膜間に剥離を生じない。
△−−−剥離が認められるが、剥離はセロハンテープ張り合わせ部の10%未満。
×−−−剥離が認められ、剥離はセロハンテープ張り合わせ部の10%以上。
銅粉末1:水中にて、硫酸銅(II)水溶液を水酸化ナトリウムによりpH12.5に調整し無水ブドウ糖で亜酸化銅に還元後、さらに水和ヒドラジンにより銅粉末まで還元した。透過型電子顕微鏡により観察したところ、平均粒径0.07μmの球状の粒子である。
銅粉末2:酒石酸を含有する水に亜酸化銅を懸濁させ、水和ヒドラジンにより銅粉末まで還元した。透過型電子顕微鏡により観察したところ、平均粒径1.5μmの球状の粒子である。
銀粉末1:硝酸銀水溶液に水酸化ナトリウム水溶液を加え、酸化銀スラリーを得た後、ミリスチン酸ナトリウムを有機保護剤として加えた後、ホルマリンにより銀粉末まで還元した。透過型電子顕微鏡により観察したところ、平均粒径0.12μmの球状の粒子である。
銀粒子2:三井金属鉱業社製 湿式銀粉末「SPN10J」平均粒径2μmの球状粒子。
AC−1、2:使用したポリエステル(Pes−1)は次のようにして重合した。ポリエステル重合用のオートクレーブに、エチレングリコール49.6部、ネオペンチルグリコール125部、ジメチルテレフタレート97部、ジメチルイソフタレート97部、テトラブトキシチタン0.068部を仕込み150℃〜230℃で60分間エステル交換反応させた。更に30分間かけて260℃まで昇温をしながら、系内を徐々に減圧し脱グリコールを開始した。最終的に260℃、0.1mmHgまで到達した後、30分間高温高真空を維持した。引き続き窒素を導入し常圧に戻し、230℃で系内に無水トリメリット酸9.6部を投入し酸末端ポリエステル(Pes−1)を得た。組成をNMR、官能基の価数を酸塩基滴定、分子量をGPC分析によって分析した結果を表―1に示す。
AC−14〜18:表3に記載したように、AC−1で用いたポリエステル(Pes−1)あるいはAC−3で用いたポリエステル(Pes −2)と硬化剤としてエポキシ樹脂、反応触媒としてトリフェニルフォスフィン(TPP)を配合し、カネカ社製ポリイミドフィルム「アピカルNPI厚み25μm」に塗布した後、乾燥硬化させ、樹脂硬化層を形成した。評価結果を表3に示す。
下記の配合割合の組成物をサンドミルにいれ、800rpmで、2時間分散した。メディアは半径0.2mmのジルコニアビーズを用いた。得られた銅ペーストをアプリケーターにより、樹脂硬化層(AC−1)付きポリイミドフィルの樹脂硬化層上に、乾燥後の厚みが2μmになるように塗布し、120℃で5分熱風乾燥して銅粉末含有塗膜を得た。
分散液組成
共重合ポリエステルの溶液 2.5部
(トルエン/シクロヘキサノン=1/1(重量比)の40重量%溶液)
銅粉末1(平均粒径0.07μm) 9部
γ−ブチロラクトン(希釈溶剤) 3.5部
メチルエチルケトン(希釈溶剤) 5部
ブロックイソシアネート 0.2部
(共重合ポリエステル:東洋紡積社製「バイロン300」
ブロックイソシアネート:日本ポリウレタン社製「コロネート2546」)
絶縁基板にAC−2を用い、過熱水蒸気処理条件を表4に記載したものに変更した以外は実施例1と同様にして導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
絶縁基板を表4に記載したものに変更した以外は実施例1と同様にして導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
絶縁基板を表4に記載したものに変更し銅粉末を銅粉末−2に変更した以外は実施例1と同様にして導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
絶縁基板を表4に記載したものに、銅粉末を銀粉末−1に変更し、さらに、過熱処理条件を表4に記載したように変更した以外は実施例1と同様にして導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
絶縁基板を表4に記載したものに、銅粉末を銀粉末−2に変更し、さらに、過熱処理条件を表4に記載したように変更した以外は実施例1と同様にして導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
絶縁基板を表4に記載したものに変更した以外は実施例1と同様にして導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
また、実施例14、15で得られた導電性塗膜を130℃の乾燥器中に10日間放置した。乾燥器から取り出したサンプルは、黒青色に変色し、カールが発生していたが、実施例1と同様に接着性を調べとところ、実施例14、15共にテープ剥離テストは初期と同様に合格した。
下記の配合割合の組成物をサンドミルにいれ、800rpmで、2時間分散した。メディアは半径0.2mmのジルコニアビーズを用いた。得られた銅ペーストをアプリケーターにより、樹脂硬化層(AC−2)付きポリイミドフィルの樹脂硬化層上に、乾燥後の厚みが2μmになるように塗布し、120℃で5分熱風乾燥して銅粉末含有塗膜を得た。
分散液組成
共重合ポリエステルの溶液 2.5部
(トルエン/シクロヘキサノン=1/1(重量比)の40重量%溶液)
銅粉末1(平均粒径0.07μm) 9部
γ−ブチロラクトン(希釈溶剤) 3.5部
メチルエチルケトン(希釈溶剤) 5部
オキセタン化合物 0.3部
(共重合ポリエステル:東洋紡積社製「バイロン300」
オキセタン化合物:東亜合成社製「OXT−221」
硫酸銅めっき浴
硫酸銅5水和物 70部
硫酸 200部
食塩 0.1部
水 800部
光沢剤 5部
(光沢剤:奥野製薬社製トップルチナ)
銅ペースト中の添加化合物として表5に記載したものに変更した以外は実施例16と同様にして銅めっき層付き導電性塗膜を得た。実施例16と同様に評価した。評価結果を表5に示す。
下記の配合割合の組成物をサンドミルにいれ、800rpmで、2時間分散した。メディアは半径0.2mmのジルコニアビーズを用いた。得られた銅ペーストをアプリケーターにより、カネカ社製ポリイミドフィルム「アピカルNPI厚み25μm」に乾燥後の厚みが2μmになるように塗布し、120℃で5分熱風乾燥して銅粉末含有塗膜を得た。
分散液組成
共重合ポリエステルの溶液 2.5部
(トルエン/シクロヘキサノン=1/1(重量比)の40重量%溶液)
銅粉末1(平均粒径0.07μm) 9部
γ−ブチロラクトン(希釈溶剤) 3.5部
メチルエチルケトン(希釈溶剤) 5部
ブロックイソシアネート 0.2部
(共重合ポリエステル:東洋紡積社製「バイロン300」
ブロックイソシアネート:日本ポリウレタン社製「コロネート2546」)
また、実施例14、15と同様に、導電性塗膜を130℃で10日間、乾燥器中に放置した。乾燥器から取り出したサンプルは、黒青色に変色し、カールが発生しており、実施例1と同様に接着性を調べたところ、テープ剥離は全面に起こり、不良であった。
比較例1と同様に、但し比較例1での過熱水蒸気処理条件を変更して導電性塗膜を得た。評価結果を表6に示す。
比較例1と同様に、但し、銅粉末−1を表6に記載の金属粉末に変更して導電性塗膜を得た。評価結果を表6に示す。
実施例1と同様に、ただし、樹脂硬化層付きポリイミドフィルムを表6に記載のものに変更した。得られた導電性塗膜の評価結果を表6に示す。
下記の配合割合の組成物をサンドミルにいれ、800rpmで、2時間分散した。メディアは半径0.2mmのジルコニアビーズを用いた。得られた銅ペーストをアプリケーターにより、カネカ社製ポリイミドフィルム「アピカルNPI厚み25μm」に乾燥後の厚みが2μmになるように塗布し、120℃で5分熱風乾燥して銅粉末含有塗膜を得た。
分散液組成
共重合ポリエステルの溶液 2.5部
(トルエン/シクロヘキサノン=1/1(重量比)の40重量%溶液)
銅粉末1(平均粒径0.07μm) 9部
γ−ブチロラクトン(希釈溶剤) 3.5部
メチルエチルケトン(希釈溶剤) 5部
オキセタン化合物 0.3部
(共重合ポリエステル:東洋紡積社製「バイロン300」
オキセタン化合物:東亜合成社製「OXT−221」
硫酸銅めっき浴
硫酸銅5水和物 70部
硫酸 200部
食塩 0.1部
水 800部
光沢剤 5部
(光沢剤:奥野製薬社製トップルチナM)
実施例16と同様に、ただし、樹脂硬化層付きポリイミドフィルムと配合剤を表7に記載のものに変更した。得られた導電性塗膜及びめっき層含有導電性塗膜の評価結果を表7に示す。
Claims (9)
- ポリイミド系絶縁基板上に、樹脂の有機溶剤溶液の塗布・乾燥により、溶剤可溶分が20重量%以下かつ厚みが5μm以下である樹脂硬化層を設け、該樹脂硬化層上に金属粉ペーストを用いて金属粉末含有塗膜を形成した後、過熱水蒸気による加熱処理を施すことを特徴とする導電性塗膜の製造方法(但し、溶剤可溶分の測定は以下の測定法によるものとする)。
[溶剤可溶分の測定法]
得られた樹脂硬化層付きポリイミド系フィルムから一定面積を切り出し、樹脂硬化層に用いる樹脂の溶解に使用したものと同じ溶剤中に25℃で1時間浸漬後、乾燥し、溶剤可溶分を下式により求める。
溶剤可溶分=(W1−W2)/(W1−W0)×100(%)
W0:樹脂硬化層付きポリイミドフィルムから樹脂硬化層を完全にこすり取ったポリイミドフィルムの重量
W1:溶剤浸漬前の樹脂硬化層付きポリイミドフィルム
W2:溶剤浸漬後の樹脂硬化層付きポリイミドフィルム - 金属粉ペーストが金属粉末と有機バインダーとを溶剤中に分散させたものである請求項1に記載の導電性塗膜の製造方法。
- 金属粉ペーストがフェノール樹脂、アミノ樹脂、イソシアネート化合物、エポキシ化合物、オキセタン化合物、酸無水物の少なくとも1種類以上を含有する請求項1又は2に記載の導電性塗膜の製造方法。
- 金属粉ペーストが分子量が500未満のエポキシ化合物、オキセタン化合物、酸無水物の少なくとも1種類以上を含有する請求項1〜3の何れかに記載の導電性塗膜の製造方法。
- 金属粉末が、銅、ニッケル、コバルト、銀、白金、金、モリブデン、チタンから選択される請求項1〜4の何れかに記載の導電性塗膜の製造方法。
- 樹脂硬化層が、樹脂と硬化剤の反応物、反応性官能基を樹脂中に含有する樹脂の自己硬化物および光架橋物のいずれかから成り、樹脂が、ポリエステル、ポリウレタン、ポリカーボネート、ポリエ−テル、ポリアミド、ポリアミドイミド、ポリイミド及びアクリルから選択させる請求項1〜5の何れかに記載の導電性塗膜の製造方法。
- 過熱水蒸気の温度が150〜450℃である請求項1〜6の何れかに記載の導電性塗膜の製造方法。
- 樹脂硬化層が、樹脂と硬化剤の反応物、反応性官能基を樹脂中に含有する樹脂の自己硬化物および光架橋物のいずれかから成り、樹脂硬化層に用いる樹脂が、ポリエステル、ポリウレタン、ポリアミド、ポリアミドイミド、ポリイミドから選択される請求項1〜7の何れかに記載の導電性塗膜の製造方法。
- 請求項1〜8の何れかに記載の製造方法によって製造される導電性塗膜上にめっき層を形成するめっき層含有導電性塗膜の製造方法。
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JP2004171658A (ja) * | 2002-11-19 | 2004-06-17 | Fuji Electric Holdings Co Ltd | 垂直磁気記録媒体用基板および垂直磁気記録媒体並びにそれらの製造方法 |
JP2006062135A (ja) * | 2004-08-25 | 2006-03-09 | Asahi Kasei Corp | 積層体およびその製造方法 |
JP2011082145A (ja) * | 2009-09-11 | 2011-04-21 | Toyobo Co Ltd | 銅薄膜および銅薄膜積層体 |
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GB8814789D0 (en) * | 1988-06-22 | 1988-07-27 | Ici Plc | Polymeric films |
US5025086A (en) * | 1990-11-13 | 1991-06-18 | Eastman Kodak Company | Trifunctional monomer compounds, polyesters derived therefrom and thermosetting coating compositions containing the polyesters |
US5326643A (en) * | 1991-10-07 | 1994-07-05 | International Business Machines Corporation | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier |
CN1091790C (zh) * | 1995-03-15 | 2002-10-02 | 日东电工株式会社 | 压敏粘合剂组合物及其压敏粘合剂片材以及使用该组合物的密封材料、增强片材和用于印刷的压敏粘合剂片材 |
WO2006076603A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electrical conductors |
JP5141249B2 (ja) * | 2005-05-30 | 2013-02-13 | 住友電気工業株式会社 | 導電性ペースト及びそれを用いた多層プリント配線板 |
JP2010199285A (ja) * | 2009-02-25 | 2010-09-09 | Ricoh Co Ltd | 配線基板の製造方法、電子素子および表示装置 |
JP2011018636A (ja) * | 2009-06-09 | 2011-01-27 | Fujifilm Corp | 導電性組成物、並びに透明導電膜、表示素子及び集積型太陽電池 |
KR20110014034A (ko) * | 2009-08-04 | 2011-02-10 | 삼성전기주식회사 | 유기접착층이 있는 금속 회로 배선 및 그 제조방법 |
JP5632176B2 (ja) | 2009-09-30 | 2014-11-26 | 三ツ星ベルト株式会社 | 積層体、この積層体を用いた導電性基材及びその製造方法 |
CN103189930B (zh) * | 2010-11-02 | 2016-07-20 | 日立化成株式会社 | 导电性粒子及其制造方法 |
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2012
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- 2012-05-17 CN CN201710897482.9A patent/CN107622833A/zh active Pending
- 2012-05-17 KR KR1020137029818A patent/KR20140025450A/ko active IP Right Grant
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JPH07242833A (ja) * | 1994-03-08 | 1995-09-19 | Nippon Parkerizing Co Ltd | 耐食性及び耐溶剤性に優れた水系塗料組成物 |
JPH0873812A (ja) * | 1994-09-09 | 1996-03-19 | Toyo Ink Mfg Co Ltd | 貯蔵安定性良好な被覆用水性樹脂組成物 |
JP2004171658A (ja) * | 2002-11-19 | 2004-06-17 | Fuji Electric Holdings Co Ltd | 垂直磁気記録媒体用基板および垂直磁気記録媒体並びにそれらの製造方法 |
JP2006062135A (ja) * | 2004-08-25 | 2006-03-09 | Asahi Kasei Corp | 積層体およびその製造方法 |
JP2011082145A (ja) * | 2009-09-11 | 2011-04-21 | Toyobo Co Ltd | 銅薄膜および銅薄膜積層体 |
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JPWO2012157701A1 (ja) | 2014-07-31 |
TWI613681B (zh) | 2018-02-01 |
CN103732704A (zh) | 2014-04-16 |
US20140141238A1 (en) | 2014-05-22 |
WO2012157701A1 (ja) | 2012-11-22 |
TW201312598A (zh) | 2013-03-16 |
US10154585B2 (en) | 2018-12-11 |
CN107622833A (zh) | 2018-01-23 |
KR20140025450A (ko) | 2014-03-04 |
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