JP5938904B2 - 基板支持部材、基板搬送装置、基板搬送方法、露光装置及びデバイス製造方法 - Google Patents

基板支持部材、基板搬送装置、基板搬送方法、露光装置及びデバイス製造方法 Download PDF

Info

Publication number
JP5938904B2
JP5938904B2 JP2011546081A JP2011546081A JP5938904B2 JP 5938904 B2 JP5938904 B2 JP 5938904B2 JP 2011546081 A JP2011546081 A JP 2011546081A JP 2011546081 A JP2011546081 A JP 2011546081A JP 5938904 B2 JP5938904 B2 JP 5938904B2
Authority
JP
Japan
Prior art keywords
substrate
support
support member
tray
supported
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011546081A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2011074474A1 (ja
Inventor
加藤　正紀
正紀 加藤
学 戸口
学 戸口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of JPWO2011074474A1 publication Critical patent/JPWO2011074474A1/ja
Application granted granted Critical
Publication of JP5938904B2 publication Critical patent/JP5938904B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electroluminescent Light Sources (AREA)
JP2011546081A 2009-12-16 2010-12-09 基板支持部材、基板搬送装置、基板搬送方法、露光装置及びデバイス製造方法 Active JP5938904B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2009285413 2009-12-16
JP2009285412 2009-12-16
JP2009285413 2009-12-16
JP2009285412 2009-12-16
PCT/JP2010/072135 WO2011074474A1 (ja) 2009-12-16 2010-12-09 基板支持部材、基板搬送装置、基板搬送方法、露光装置及びデバイス製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016099531A Division JP6245308B2 (ja) 2009-12-16 2016-05-18 基板搬送方法、デバイス製造方法、基板搬送装置および露光装置

Publications (2)

Publication Number Publication Date
JPWO2011074474A1 JPWO2011074474A1 (ja) 2013-04-25
JP5938904B2 true JP5938904B2 (ja) 2016-06-22

Family

ID=44167230

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011546081A Active JP5938904B2 (ja) 2009-12-16 2010-12-09 基板支持部材、基板搬送装置、基板搬送方法、露光装置及びデバイス製造方法
JP2016099531A Active JP6245308B2 (ja) 2009-12-16 2016-05-18 基板搬送方法、デバイス製造方法、基板搬送装置および露光装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016099531A Active JP6245308B2 (ja) 2009-12-16 2016-05-18 基板搬送方法、デバイス製造方法、基板搬送装置および露光装置

Country Status (5)

Country Link
JP (2) JP5938904B2 (zh)
CN (1) CN102741993B (zh)
HK (1) HK1171866A1 (zh)
TW (1) TW201145439A (zh)
WO (1) WO2011074474A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5821395B2 (ja) * 2011-08-16 2015-11-24 大日本印刷株式会社 基板の基板保持用枠体への受け渡し方法と移載用架台への受け取り方法、および基板の移載用架台
KR102242065B1 (ko) * 2015-01-26 2021-04-19 가부시키가이샤 니콘 마스크 케이스, 보관 장치 및 방법, 반송 장치 및 방법, 그리고 노광 장치
CN106486409A (zh) * 2015-08-25 2017-03-08 英属开曼群岛商精曜有限公司 基板载具
JP6685213B2 (ja) * 2016-09-29 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板整列装置、基板処理装置、基板配列装置、基板整列方法、基板処理方法および基板配列方法
CN107010417B (zh) * 2017-03-20 2020-03-06 京东方科技集团股份有限公司 用于显示屏基板的存放装置及取放显示屏基板的控制方法
JP6468540B2 (ja) * 2017-05-22 2019-02-13 キヤノントッキ株式会社 基板搬送機構、基板載置機構、成膜装置及びそれらの方法
JP7033303B2 (ja) * 2018-01-31 2022-03-10 三星ダイヤモンド工業株式会社 基板搬送装置
CN109433999A (zh) * 2018-12-03 2019-03-08 广东盛茂达自动控制科技有限公司 伸缩架自动铆压系统
CN110730611B (zh) * 2019-09-30 2020-12-08 云谷（固安）科技有限公司 曲面显示屏绑定装置及曲面显示屏绑定方法
KR20220167376A (ko) * 2020-06-29 2022-12-20 에베 그룹 에. 탈너 게엠베하 기판 접합 방법 및 장치
JP7433181B2 (ja) * 2020-09-23 2024-02-19 株式会社Ｓｃｒｅｅｎホールディングス 描画装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1064982A (ja) * 1996-08-14 1998-03-06 Dainippon Screen Mfg Co Ltd 基板保持機構及び基板処理装置
JP2001100169A (ja) * 1999-07-26 2001-04-13 Nikon Corp 基板支持装置および基板処理装置
JP2004273702A (ja) * 2003-03-07 2004-09-30 Nikon Corp 搬送装置及び搬送方法、露光装置
JP2007114570A (ja) * 2005-10-21 2007-05-10 Nikon Corp 基板ホルダ、露光装置及びデバイスの製造方法
JP2008081269A (ja) * 2006-09-28 2008-04-10 Dainippon Printing Co Ltd 板状物の受け取り方法および板状物の受け取り装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT399867B (de) * 1990-01-11 1995-08-25 Lisec Peter Anlage zur herstellung von isolierglasscheiben
CN1787954A (zh) * 2003-06-19 2006-06-14 日商乐华股份有限公司 薄板支撑体
JP2006312511A (ja) * 2005-05-06 2006-11-16 Kyokuhei Glass Kako Kk ガラス支持枠体
JP4873895B2 (ja) * 2005-07-04 2012-02-08 東芝機械株式会社 平板状搬送物の搬送方法及びその装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1064982A (ja) * 1996-08-14 1998-03-06 Dainippon Screen Mfg Co Ltd 基板保持機構及び基板処理装置
JP2001100169A (ja) * 1999-07-26 2001-04-13 Nikon Corp 基板支持装置および基板処理装置
JP2004273702A (ja) * 2003-03-07 2004-09-30 Nikon Corp 搬送装置及び搬送方法、露光装置
JP2007114570A (ja) * 2005-10-21 2007-05-10 Nikon Corp 基板ホルダ、露光装置及びデバイスの製造方法
JP2008081269A (ja) * 2006-09-28 2008-04-10 Dainippon Printing Co Ltd 板状物の受け取り方法および板状物の受け取り装置

Also Published As

Publication number Publication date
JP2016154266A (ja) 2016-08-25
TW201145439A (en) 2011-12-16
CN102741993B (zh) 2016-06-22
HK1171866A1 (zh) 2013-04-05
WO2011074474A1 (ja) 2011-06-23
CN102741993A (zh) 2012-10-17
JP6245308B2 (ja) 2017-12-13
JPWO2011074474A1 (ja) 2013-04-25

Similar Documents

Publication Publication Date Title
JP6245308B2 (ja) 基板搬送方法、デバイス製造方法、基板搬送装置および露光装置
JP6780732B2 (ja) 搬送装置、露光装置、及びデバイス製造方法
JP6409897B2 (ja) 物体搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体搬送方法、及び露光方法
CN109791370B (zh) 曝光装置、平板显示器的制造方法、元件制造方法、及曝光方法
JP5469852B2 (ja) 搬送装置、搬送方法、露光装置、露光方法、及びデバイス製造方法
CN110114725B (zh) 搬运装置、曝光装置、平板显示器的制造方法、以及元件制造方法
JP2004273702A (ja) 搬送装置及び搬送方法、露光装置
JP5471088B2 (ja) 基板保持部材、基板搬送装置、基板搬送方法、ステージ装置、露光装置及びデバイス製造方法
WO2011049133A1 (ja) 基板支持装置、基板支持部材、基板搬送装置、露光装置、及びデバイス製造方法
KR101982454B1 (ko) 기판 반송 장치, 노광 장치, 기판 지지 장치 및 디바이스 제조 방법
JP2010267807A (ja) 基板保持装置、ステージ装置、露光装置、及びデバイス製造方法
JP2011113086A (ja) 受け渡し機構、ステージ装置、搬送装置、露光装置、及びデバイス製造方法
JP2011086764A (ja) 基板支持部材、搬送装置、露光装置、及びデバイス製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20131126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140715

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140908

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150210

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150409

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160105

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160307

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160419

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160502

R150 Certificate of patent or registration of utility model

Ref document number: 5938904

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250