TW201145439A - Substrate support member, substrate conveyance apparatus, substrate conveyance method, exposure apparatus, and device manufacturing method - Google Patents

Substrate support member, substrate conveyance apparatus, substrate conveyance method, exposure apparatus, and device manufacturing method Download PDF

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Publication number
TW201145439A
TW201145439A TW099143865A TW99143865A TW201145439A TW 201145439 A TW201145439 A TW 201145439A TW 099143865 A TW099143865 A TW 099143865A TW 99143865 A TW99143865 A TW 99143865A TW 201145439 A TW201145439 A TW 201145439A
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TW
Taiwan
Prior art keywords
substrate
support
supporting member
supported
holder
Prior art date
Application number
TW099143865A
Other languages
Chinese (zh)
Inventor
Masaki Kato
Manabu Toguchi
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Nikon Corp
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Publication of TW201145439A publication Critical patent/TW201145439A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

A substrate support member is provided with a placement section (20) on which a substrate (P) is placed, and also with support sections (20b) which are provided to the placement section (20) and support a part of the substrate (P) placed on the placement section (20). Among the support sections (20b), a support section (20b) of a first portion and a support section (20b) of a second portion have different heights, relative to the placement section (20), which correspond to the amount of the deflection of the placement section (20) in a state in which the substrate (P) is placed on the placement section (20).

Description

201145439 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種基板支承構件、基板搬送裝置、基 板搬送方法、曝光裝置及元件製造方法。 本申請根據2009年12月16日在日本申請之日本特願 2009— 285412號及日本特願2009— 285413號主張優先權， 並將其内容援引於此。 【先前技術】 在平板顯示器等之電子元件之製程中，係使用曝光裝 置或檢查裝置等大型基板之處理裝置。在使用此等處理裝 置之曝光步驟、檢查步驟，係使用將大型基板（例如玻璃基 板）搬送至處理裝置之下述專利文獻所揭示之搬送裝置。 專利文獻1 :日本特開2004- 273702號公報 【發明内容】 例如在專利文獻1所揭示之上述大型基板之搬送裝 置，在將基板載置於基板支承構件並藉由基板支承構件支 承基板後，藉由搬送臂等保持並搬送基板支承構件。因此， 依基板支承構件之支承方法會有在搬送時使基板支承構件 因本身重量而向下方彎曲之情形。又，在藉由基板支承構 件支承基板時’會有基板與基板支承構件密合，成為在該 等之間不易產生滑動之狀態之情形。此情形，若基板支承 構件向下方彎曲，則會有在基板產生應力而使基板變形之 情形。 例如在曝光裝置’若將呈如上述變形狀態之基板交接 3 201145439 至曝光用之基板保持具’則會產生無法在基板上之適當位 置進行既定曝光等之曝光不良之問題。 本發明之形態之目的在於提供—種可抑制在基板交接 之基板之變形之基板支承構件、基板搬送裝置、基 板搬送方法、曝光裝置及元件製造方法β 本發明第1形態之基板支承構件，係用以支承基板， ”寺徵在於’具備.載置部，載置該基板；以及複數個支 承郤係没於該載置部，支承載置於該載置部之該基板； 該複數個支承部之中第1部分之支承部㈣2部分之支承 部相對於該載置部之高度彼此不同。 本發明帛2形態、之基板搬送裝置，係用以搬送基板， 其特徵在於’具備：上述基板支承構件，用以支承該基板; 以及搬送部’保持該基板支承構件並移動。 本發明帛3形態'之基板搬送方法，包含：支承上述基 板支承構件之動作；使該基板載置於該基板支承構件之該 載置邛之動作，以及將該基板從該載置部交接至基板保持 具之動作。 本發明第4形態之曝光裝置，係對基板保持具保持之 基板照射曝光用光以使該基板曝光，其特徵在於：具備將 該基板搬送至該基板保持具之上述基板搬送裝置。 本發明帛5形態之元件製造彳法，包含：使用上述曝 光裝置使該基板曝光之動作；以及根據曝光結果處理曝光 後之該基板之動作。 本發明第6形態之基板搬送方法，係將載置於基板支 201145439 承構件之基板與該基板支承構件一起搬送，其特徵在於， 包含.支承該基板支承構件之既定被支承部之動作；將該 基板載置於支承有該被支承部之該基板支承構件之動作； 以及保持載置有該基板之該基板支承構件之該被支承部或 該被支承部之附近並使該基板支承構件移動之動作。 本發明第7形態之基板搬送裝置，係將載置於基板支 承構件之基板與該基板支承構件一起搬送，其特徵在於， 具備：支承機構，支承該基板支承構件之既定被支承部； 載置機構，將該基板載置於支承有該被支承部之該基板支 承構件；以及搬送機構，保持載置有該基板之該基板支承 構件之該被支承部或該被支承部之附近並使該基板支承構 件移動。 本發明第8形態之曝光裝置，係對基板保持具保持之 基板照射曝光用光以使該基板曝光，其特徵在於：具備將 該基板搬送至該基板保持具之上述基板搬送裝置。 本發明第9形態之元件製造方法，包含：使用上述曝 光裝置使該基板曝光之動作；以及根據曝光結果處理曝光 後之該基板之動作。 本發明第10形態之元件製造方法，包含：使用上述基 板搬送方法搬送該基板之動作；使該基板曝光之動作；以 及根據曝光結果處理曝光後之該基板之動作。 根據本發明之形態，可抑制在基板交接時產生之基板 之變形。 【實施方式] 5 201145439 參照圖式說明本發明之第丨實施形態。又，本發明並 不限於此。以下’針對具備本發明之基板搬送裝置、對塗 布有感光劑之基板進行使液晶顯示元件用圖案曝光之曝光 處理之曝光裝置進行說明，且針對本發明之基板支承構 件、元件製造方法、及基板搬送方法之一實施形態亦進行 說明。 圖1係顯示本實施形態之曝光裝置之概略構成的剖面 俯視圖。曝光裝置1具備使液晶顯示元件用圖案曝光於基 板之曝光裝置本體3、搬送機器手（搬送部、搬送機構）4、 搬出入部（搬送部）5、及具有托盤（基板支承構件）τ之基板搬 送裝置7，該等係收納於被高度潔淨化、且調整至既定溫度 之腔室2内。本實施形態中’基板係大型玻璃板，其一邊 之尺寸為例如500mm以上。 圖2係曝光裝置本體3、及將基板P搬送至此曝光裝置 本體3之搬送機器手4的外觀立體圖。曝光裝置本體3具 備以曝光用光IL照明光罩Μ之未圖示之照明系統、保持形 成有液Ba顯不元件用圖案之光罩Μ之未圖示之光罩載a、 配置於此光罩載台下方之投影光學系統PL、設成可在配置 於投影光學系統PL下方之基座8上二維移動之基板保持具 9、及保持基板保持具9且使該基板保持具9移動之移動機 構33。亦即，曝光裝置本體3,設有具備基板保持具9與 移動機構33之載台裝置。 此外，以下說明中，設基板保持具9相對基座8之二 准移動係在水平面内進行’在此水平面内彼此正交之方勹 6 201145439 =軸及Yl基板保持具9對基板p之保持 準狀態（例如，進行基板？之交接時之狀態）下設與水平面; 行。又’在與X轴及Y軸正交之方向設定2軸： 糸統PL之光轴設與ζ軸平行。此外，將繞X軸、γ軸及千ζ 轴之各方向分別稱為Α γ 士 J稱為Θχ方向、ΘΥ方向及以方向。 本體：動：構二具有移動機構本體35,及配置於移動機構 w二1?板保持具9之板台34。移動機構本體 藉由乳體轴承以非接觸方式支承於導引面8a(基座8之 ^面可在導引面8a上移動於灯方向。曝光跋置本體3, 在保持基板p之妝能..,[Technical Field] The present invention relates to a substrate supporting member, a substrate conveying apparatus, a substrate conveying method, an exposure apparatus, and a component manufacturing method. Priority is claimed on Japanese Patent Application No. 2009-285412, filed on Jan. [Prior Art] In the process of electronic components such as flat panel displays, a processing device for a large substrate such as an exposure device or an inspection device is used. In the exposure step and the inspection step using these processing apparatuses, a transfer apparatus disclosed in the following patent document which transports a large substrate (for example, a glass substrate) to a processing apparatus is used. In the above-described large-sized substrate transfer apparatus disclosed in Patent Document 1, after the substrate is placed on the substrate supporting member and the substrate is supported by the substrate supporting member, The substrate supporting member is held and conveyed by a transfer arm or the like. Therefore, depending on the method of supporting the substrate supporting member, the substrate supporting member may be bent downward due to its own weight during transportation. Further, when the substrate is supported by the substrate supporting member, the substrate and the substrate supporting member are in close contact with each other, and the sliding state is less likely to occur therebetween. In this case, if the substrate supporting member is bent downward, stress may be generated on the substrate to deform the substrate. For example, when the exposure apparatus </ RTI> attaches the substrate in the above-described deformed state 3 201145439 to the substrate holder for exposure, there is a problem that exposure failure such as predetermined exposure cannot be performed at an appropriate position on the substrate. An object of the present invention is to provide a substrate supporting member, a substrate transfer device, a substrate transfer method, an exposure device, and a device manufacturing method, which are capable of suppressing deformation of a substrate which is transferred to a substrate, and a substrate supporting member according to the first aspect of the present invention. For supporting the substrate, the temple is provided with a mounting portion for mounting the substrate, and a plurality of supports are absent from the mounting portion, and supporting the substrate placed on the mounting portion; the plurality of supports The support portion (four) of the first portion of the first portion is different from the height of the support portion. The substrate transfer device according to the second aspect of the present invention is for transporting a substrate, and is characterized in that: the substrate is provided a supporting member for supporting the substrate; and a conveying unit that holds and moves the substrate supporting member. The substrate transfer method of the present invention includes: an operation of supporting the substrate supporting member; and placing the substrate on the substrate The operation of the mounting member on the mounting member and the operation of transferring the substrate from the mounting portion to the substrate holder. The exposure device according to the fourth aspect of the present invention A substrate transport apparatus that irradiates the substrate with the exposure light for exposing the substrate to the substrate holder, and the substrate transport apparatus that transports the substrate to the substrate holder is provided. The operation of exposing the substrate by using the exposure apparatus described above, and the operation of the substrate after the exposure is processed according to the exposure result. The substrate transfer method according to the sixth aspect of the present invention is a substrate placed on the substrate member 201145439 and the substrate. The substrate supporting member is transported together, and includes an operation of supporting a predetermined supported portion of the substrate supporting member, an operation of placing the substrate on the substrate supporting member supporting the supported portion, and holding and mounting In the substrate supporting member of the substrate supporting member or the vicinity of the supported portion, the substrate supporting member is moved. The substrate transfer device according to the seventh aspect of the present invention is a substrate placed on the substrate supporting member. The substrate supporting member is transported together, and is characterized in that: a support mechanism is provided to support the substrate supporting member a mounting portion; the substrate is placed on the substrate supporting member that supports the supported portion; and a conveying mechanism that holds the supported portion of the substrate supporting member on which the substrate is placed or the In the vicinity of the support portion, the substrate supporting member is moved. The exposure apparatus according to the eighth aspect of the present invention is characterized in that the substrate held by the substrate holder is irradiated with exposure light to expose the substrate, and the substrate is transported to the substrate. The substrate transfer device according to the ninth aspect of the present invention includes the operation of exposing the substrate by using the exposure device, and the operation of the substrate after the exposure is processed according to the exposure result. The device manufacturing method includes an operation of transporting the substrate by the substrate transfer method, an operation of exposing the substrate, and an operation of the substrate after exposure according to an exposure result. According to the aspect of the invention, it is possible to suppress the substrate transfer. The deformation of the resulting substrate. [Embodiment] 5 201145439 A third embodiment of the present invention will be described with reference to the drawings. Further, the present invention is not limited to this. In the following, an exposure apparatus for performing exposure processing for exposing a liquid crystal display element pattern to a substrate on which a photosensitive agent is applied is provided, and a substrate supporting member, a device manufacturing method, and a substrate according to the present invention are described. One embodiment of the transport method will also be described. Fig. 1 is a cross-sectional plan view showing a schematic configuration of an exposure apparatus of the embodiment. The exposure apparatus 1 includes an exposure apparatus main body 3 that exposes a liquid crystal display element pattern to a substrate, a transport robot hand (transport unit, transport mechanism) 4, a carry-in/out unit (transport unit) 5, and a substrate having a tray (substrate support member) τ. The conveying device 7 is housed in the chamber 2 which is highly cleaned and adjusted to a predetermined temperature. In the present embodiment, the substrate-based large glass plate has a size of one side of, for example, 500 mm or more. Fig. 2 is an external perspective view of the exposure apparatus main body 3 and the transport robot 4 that transports the substrate P to the exposure apparatus main body 3. The exposure apparatus main body 3 is provided with an illumination system (not shown) that illuminates the mask 以 with the exposure light IL, and a mask cover a (not shown) that holds the mask for forming the liquid Ba display element, and is disposed in the light. The projection optical system PL under the cover stage is provided with a substrate holder 9 that is two-dimensionally movable on the susceptor 8 disposed under the projection optical system PL, and the substrate holder 9 is held and the substrate holder 9 is moved. Movement mechanism 33. That is, the exposure apparatus main body 3 is provided with a stage device including the substrate holder 9 and the moving mechanism 33. In addition, in the following description, it is assumed that the two quasi-movements of the substrate holder 9 with respect to the susceptor 8 are carried out in a horizontal plane in a horizontal plane. 6 201145439 = Axis and Yl substrate holder 9 are held against the substrate p. The quasi-state (for example, the state when the substrate is handed over) is set to the horizontal plane; Further, two axes are set in the direction orthogonal to the X-axis and the Y-axis: The optical axis of the system PL is parallel to the x-axis. Further, each direction around the X-axis, the γ-axis, and the Millennium axis is referred to as Α γ 士 J, which is referred to as the Θχ direction, the ΘΥ direction, and the direction. The main body: the movable body has a moving mechanism body 35, and a plate table 34 disposed on the moving mechanism w2 1 plate holder 9. The moving mechanism body is supported by the breast bearing in a non-contact manner on the guiding surface 8a (the surface of the base 8 can be moved on the guiding surface 8a in the direction of the lamp. Exposing the mounting body 3, maintaining the makeup of the substrate p ..,

狀心下，於光射出側（投影光學系統PL 像面側），可在導弓丨面8a之既定區域内移動。 移動機構本體35係藉由包含例如線性馬達等致動器之 粗動系統(移動機構)之作動，可在導引® 8a上移動於χγ 平面内板0 34係藉由包含例如音圈馬達等致動器之微動 系統之作動’可相對移動機構本體35在ζ軸、θχ、θγ 方向移動；fe台34係藉由包含粗動系統及微動系統之基板 載台驅動系統之作動，在保持基板P之狀態下，可在X軸、 Y 軸、Z 軸、βγ、 , ΘΥ、及ΘΖ方向之六個方向移動。 ,搬运機$手4係用以對曝光裝置本體3及搬出入部5 搬运基板？者。搬送機器手4保持托盤τ，使裝载於托盤Τ 之基板Ρ與托盤Τ—起移動以搬送基板Ρ，對曝光裝置本體 3及搬出入部5交接基板ρ。 曝光4置1’在長方形基板ρ載置於上述基板保持且9 上之狀態下’進行步進掃描方式之曝光，形成於光罩Μ之 201145439 圖案依序轉印至基板P上之複數個、例如4個曝光區域（圖 案轉印區域）。亦即，在此曝光裝置1，進行下述掃描曝光， 亦即藉由來自照明系統之曝光用光IL照明光罩μ上之狹縫 狀之照明區域之狀態下，藉由未圖示之控制器透過未圖示 之驅動系統，使保持光罩Μ之光罩載台與保持基板ρ之基 板保持具9同步移動於既定掃描方向（此處設為γ軸方向）， 藉此將光罩Μ之圖案轉印至基板ρ上之丨個曝光區域。此 外，本實施形態之曝光裝置丨構成投影光學系統PL具有複 數個投影光學模組、上述照明系統包含與複數個投影光學 模組對應之複數個照明模組之所謂多透鏡型掃描曝光裝 置》 在此1個曝光區域之掃描曝光結束後，進行使基板保 寺-9以既量在X方向移動至下_個曝光區域之掃插開 始位置之步進動作。接著，在曝光裝置本體3，藉由反覆進 行此種掃描曝光與步進動作，將光罩M之圖案依序轉印至 4個曝光區域。 &amp;如圖2所示，搬送機器手4係具有例如水平關節^ 造者，具備由透過垂直關節軸連結之複數個部分構成之」 =〇、連結於此臂部1〇前端之搬送手(保持臂叩、及驅， 、置13。臂部1〇可藉由動 勒裝置13例如在上下方向（Z 4 方向）移動。驅動裝置13俜藉由 糸藉由未圖不之控制裝置控制其，辱Under the center of the heart, the light exiting side (the image plane side of the projection optical system PL) is movable in a predetermined area of the guide bow face 8a. The moving mechanism body 35 is actuated by a coarse motion system (moving mechanism) including an actuator such as a linear motor, and is movable on the guide® 8a in the χγ plane inner plate 0 34 by including, for example, a voice coil motor. The actuation of the actuator's micro-motion system can be moved relative to the moving mechanism body 35 in the x-axis, θχ, θγ directions; the fe-station 34 is actuated by the substrate stage driving system including the coarse motion system and the micro-motion system. In the state of P, it can move in six directions of the X-axis, Y-axis, Z-axis, βγ, ΘΥ, and ΘΖ directions. The transporter $4 is used to transport the substrate to the exposure apparatus main body 3 and the carry-in/out part 5. By. The transport robot 4 holds the tray τ, moves the substrate 装载 loaded on the tray Ρ and the tray 以 to transport the substrate Ρ, and transfers the substrate ρ to the exposure apparatus main body 3 and the carry-in/out unit 5. The exposure 4 is set to 1', and the stepwise scanning method is performed in a state where the rectangular substrate ρ is placed on the substrate holding surface 9 and the pattern is sequentially transferred to the substrate P by the 201145439 pattern formed in the mask. For example, four exposure areas (pattern transfer areas). That is, in the exposure apparatus 1, the following scanning exposure is performed, that is, in a state where the slit-shaped illumination region on the mask μ is illuminated by the exposure light IL from the illumination system, the control is not shown. The reticle stage holding the mask 与 is moved in the predetermined scanning direction (herein, the γ-axis direction) in synchronization with the substrate holder 9 holding the substrate ρ by a driving system (not shown), whereby the mask is Μ The pattern is transferred to one exposure area on the substrate ρ. Further, the exposure apparatus according to the present embodiment constitutes a so-called multi-lens type scanning exposure apparatus in which the projection optical system PL has a plurality of projection optical modules, and the illumination system includes a plurality of illumination modules corresponding to a plurality of projection optical modules. After the scanning exposure of the one exposure region is completed, a stepping operation of moving the substrate to the sweep start position in the X direction to the next exposure region is performed. Next, in the exposure apparatus main body 3, by repeating such scanning exposure and stepping operation, the pattern of the mask M is sequentially transferred to the four exposure areas. As shown in Fig. 2, the transport robot 4 has, for example, a horizontal joint manufacturer, and includes a plurality of portions connected by a vertical joint axis. The arm arm, the drive, and the cover 13 are held. The arm portion 1 can be moved by, for example, the vertical direction (Z4 direction) by the moving device 13. The drive device 13 is controlled by the control device not shown. ,disgrace

S 201145439 Ρ之長邊方向）之兩側部（被保持 之長邊平行之支承方向，藉此可 將托盤τ之+ 邊方向（基板 °P)18，18支承於與托盤τ 透過托盤Τ保持基板Ρ。 你用以說明搬送機器 1勒1卞的立體圖。如圖2 及圖3所示，搬送機器手4能以使搬送手12之長邊方向（基 板Ρ之長邊方向）朝向曝光裝置本體3之基板保持具9側之 :式改變搬送手12之方向。藉此，搬送機器手4將基板Ρ 交接至基板保持具9。 此外，此搬送機器手4,在圖2及圖3為了方便起見並 未圖不，但係具備設於搬送手12下方、具有與此搬送手12 相同之機構且可獨立驅動之搬送手之雙臂構造。又，搬送 機器手4並不限於水平關節型構造之機器手，可適當採用 公知之機器手（一般而言為搬送機構）或組合來實現。 圖4 Α係顯示搬出入部5之概略構成的側視圖^搬出入 部5被交接在與曝光裝置丨相鄰配置之塗布顯影機（未圖示） 塗布感光劑並搬送而來之基板P。搬出入部5具備支承基板 P之基板支承部51、及支承托盤T之托盤支承部52。基板 支承部51具備平板狀之第丨支承部5U、及豎設於此第工 支承部5 1 a上並分別支承基板ρ下面之不同部位之複數個 基板支承銷（支承銷）51b。 本實施形態中’基板支承銷5 lb係設置例如3〇個，在 L者大致水平面之狀態下支承基板ρ。此處，沿著大致水平 面之狀態’係指在忽視例如支承於基板支承銷5 lb導致之 基板P之彎曲、基板支承銷51 b之定位誤差、基板ρ之容 9 201145439 許公差等時，基板p之基板面成為與水平面平行。 各基板支承銷5 1 b係設成下端部固定於第1支承部 51a、上端部（上端面）可支承基板P ^在基板支承銷“卜之 上端面設有連接於未圖示之真空泵之吸附孔，可吸附保持 基板P。又，在基板支承銷5 lb之上端部設有檢測基板p是 否裝載於基板支承銷5 1 b之未圖示之基板檢測部。 基板支承部51係透過連結構件53連接於驅動部54。 驅動部54例如藉由包含粗動系統及微動系統之驅動系統之 作動’在基座部55上可移動於XY平面及方向。藉此， 搬出入部5可進行支承於基板支承銷51b之基板p之位置 修正、或使基板P旋轉90度。 托盤支承部52具備框狀之第2支承部52a、及暨設於 此第2支承部52a上並分別支承托盤τ下面之不同部位之 複數個托盤支承銷（第2支承銷）52b。 各托盤支承銷52b係設成下端部固定於第2支承部 52a、上端部可支承托盤Τβ托盤支承銷52b係配置在較基 板支承部51之第丨支承部5U外側。又，在托盤支承銷52b 之上端部設有檢測托盤Τ是否裝載於托盤支承銷52b之未 圖示之托盤檢測部。 托盤支承部5 2係設成藉由未圖示之驅動部之作動可沿 著導引。P 5 6移動於z軸方向。導引部5 6係設在基板支承 部51之驅動部54及基座部55之外側。又，基板支承部η 第1支承。卩5 1 a '連結構件53及驅動部54係配置於框狀 之第2支承。[j 52a之内側。藉由此等托盤支承部η、導引 201145439 部5 6及未圖示之驅動部構成支承托盤τ並使托盤τ相對基 板Ρ移動之支承機構。 托盤支承部52能與基板支承部51之第1支承部51a、 連結構件5 3及驅動部5 4不產生干涉地在z轴方向移動。 又’托盤支承部52’藉由往Z軸正方向上昇，能使支承於 托盤支承銷52b之托盤T往Z軸正方向上昇，使支承於基 板支承部51之基板支承銷51b上之基板ρ裝載於托盤τ。 又，托盤支承部52，將藉由托盤支承銷52b支承之托盤τ 交接至搬送機器手4之搬送手12。 圖4B係顯示搬送機器手4、搬出入部5及托盤τ之關 係的立體圖。搬送機器手4之搬送手12，如圖4Β所示，在 保持托盤τ之托盤保持部12a具有供複數個托盤支承銷5几 插通之複數個缺口部12b。缺口部12b係形成為托盤保持部 12a之端緣側開放之矩形。藉此，在將搬送手12沿著兩側 部18, 18配置在托盤T側方之下侧後，使搬送手12移動將 托盤保持部12a配置在托盤τ之兩側部18，18之下方時， 搬送手12與托盤支承銷52b不會干涉。 接著，詳細說明托盤T之構造。圖5A係顯示托盤7之 平面構造的俯視圖。如圖5A所示，托盤Μ備藉由在縱橫 以既定間隔交織之複數條線狀構件19形成格子狀之載置部 20。亦即，載置部2〇之未配置線狀構件19之部分成為矩 形之開口部2卜托盤Τ’載置部20之兩側部18二係芦 二送手η支承之被支承部。此處，托盤Τ之被保持部；兩 貝18, 18係藉由配置在托盤Τ之短邊方向之端部、在托 11 201145439 盤T之長邊方向延伸之線狀構件1 9設置。 托盤Τ ’在搬送基板ρ時，在兩側部18，18或其附近 被支承之狀態下，將基板？戴置於載置部2〇之既定位置， 從下方支承基板Ρ。又’托盤Τ之形狀並不限於圖5Α所示 之形狀’為例如僅形成一個開口部21之僅支承基板ρ之周 緣部之框狀之單一框架亦可。 圖5Β係托盤Τ之載置部2〇之載置基板ρ之載置面⑽ 附近的放大剖面圖。在載置部2〇設置支承載置於載置部汕 之基板Ρ之-部分之複數個支承部鳥。支承部鳥係設成 從載置部20之載置面20a突出，相對於載置部⑼之高度η 在例如載置部20之中央部與周邊部彼此不同。複數個支承 部20b分別之高度Η，係、與在支承托盤τ之兩側部18 18、 將基板P載置於載置部2G之狀態下之載置部Μ之彎曲量 對應設定》 亦即，在載置部20之彎曲量大之卹八 丄 罝穴之邛分，支承部20b 4S 201145439 Both sides of the long side direction of the crucible (the supported long sides are supported in parallel), whereby the + side direction (substrate °P) 18, 18 of the tray τ can be supported and held by the tray τ through the tray The substrate Ρ. The three-dimensional view of the transporting machine is used. As shown in Fig. 2 and Fig. 3, the transport robot 4 can face the longitudinal direction of the transporting hand 12 (longitudinal direction of the substrate )) toward the exposure device. The substrate holder 9 of the main body 3 is configured to change the direction of the transfer hand 12. Thereby, the transfer robot 4 transfers the substrate 至 to the substrate holder 9. Further, the transfer robot 4 is shown in Figs. 2 and 3 in Fig. 2 and Fig. 3 For convenience, it is not shown, but it has a double-armed structure that is disposed below the transporting hand 12 and that has the same mechanism as the transporting hand 12 and that can be driven independently. Further, the transport robot 4 is not limited to the horizontal joint. The robot hand of the type structure can be suitably realized by a known robot hand (generally a transport mechanism) or a combination. Fig. 4 is a side view showing a schematic configuration of the carry-in/out portion 5, and the carry-in/out portion 5 is handed over to the exposure device.涂布Adjacent coating applicator A substrate P that is coated with a sensitizer and conveyed is provided. The carry-in/out unit 5 includes a substrate support portion 51 that supports the substrate P and a tray support portion 52 that supports the tray T. The substrate support portion 51 includes a flat second support portion. 5U and a plurality of substrate supporting pins (support pins) 51b vertically erected on the first supporting portion 5 1 a and supporting different portions of the lower surface of the substrate ρ. In the present embodiment, the substrate supporting pins 5 lb are provided, for example, 3 In other words, the substrate ρ is supported in a state in which the L is substantially horizontal. Here, the state along the substantially horizontal plane means that the substrate P is supported by the substrate supporting pin 5 lb, for example, and the substrate supporting pin 51 b is omitted. Positioning error, capacity of the substrate ρ 9 201145439 When the tolerance is equal, the substrate surface of the substrate p is parallel to the horizontal plane. Each of the substrate supporting pins 5 1 b is fixed such that the lower end portion is fixed to the first support portion 51a and the upper end portion (upper end surface) The support substrate P ^ is provided with an adsorption hole connected to a vacuum pump (not shown) on the end surface of the substrate support pin, and can hold and hold the substrate P. Further, whether or not the detection substrate p is provided at the upper end of the substrate support pin 5 lb The substrate detecting portion (not shown) is mounted on the substrate supporting pin 51b. The substrate supporting portion 51 is connected to the driving portion 54 via the transmission connecting member 53. The driving portion 54 is actuated by, for example, a driving system including a coarse motion system and a fine motion system. The base portion 55 is movable in the XY plane and the direction. Thereby, the loading/unloading portion 5 can correct the position of the substrate p supported by the substrate supporting pin 51b or rotate the substrate P by 90 degrees. The tray supporting portion 52 is provided with a frame. The second support portion 52a and the plurality of tray support pins (second support pins) 52b provided on the second support portion 52a and supporting different portions of the lower surface of the tray τ are provided. The lower end portion is fixed to the second support portion 52a, and the upper end portion supports the tray. The tray support pin 52b is disposed outside the second support portion 5U of the substrate support portion 51. Further, at the upper end portion of the tray supporting pin 52b, a tray detecting portion (not shown) for detecting whether or not the tray 装载 is loaded on the tray supporting pin 52b is provided. The tray support portion 52 is slidably guided by an operation of a drive unit (not shown). P 5 6 moves in the z-axis direction. The guide portion 56 is provided on the outer side of the drive portion 54 of the substrate support portion 51 and the base portion 55. Further, the substrate supporting portion η is first supported.卩5 1 a 'The connecting member 53 and the driving portion 54 are disposed in a frame-shaped second support. [j 52a inside. The tray support portion η, the guide 201145439 portion 56, and the drive portion (not shown) constitute a support mechanism for supporting the tray τ and moving the tray τ relative to the substrate Ρ. The tray support portion 52 can move in the z-axis direction without interfering with the first support portion 51a of the substrate support portion 51, the connection member 53 and the drive portion 54. Further, the tray support portion 52' is raised in the positive direction of the Z-axis, so that the tray T supported by the tray support pin 52b can be raised in the positive direction of the Z-axis, and the substrate ρ supported on the substrate support pin 51b of the substrate support portion 51 can be ρ. Loaded on the tray τ. Further, the tray support portion 52 transfers the tray τ supported by the tray support pin 52b to the transport hand 12 of the transport robot hand 4. Fig. 4B is a perspective view showing the relationship between the transport robot 4, the carry-in/out portion 5, and the tray τ. As shown in Fig. 4A, the transporting hand 12 of the transport robot 4 has a plurality of notch portions 12b into which the plurality of tray support pins 5 are inserted, in the tray holding portion 12a holding the tray τ. The notch portion 12b is formed in a rectangular shape in which the end edge side of the tray holding portion 12a is open. By placing the transporting hand 12 on the lower side of the side of the tray T along the both side portions 18 and 18, the transporting hand 12 is moved to arrange the tray holding portion 12a under the side portions 18, 18 of the tray τ. At this time, the conveyance hand 12 does not interfere with the tray support pin 52b. Next, the configuration of the tray T will be described in detail. Fig. 5A is a plan view showing the planar configuration of the tray 7. As shown in Fig. 5A, the tray tray is formed into a lattice-like placing portion 20 by a plurality of linear members 19 which are interlaced at a predetermined interval in the longitudinal and lateral directions. In other words, the portion of the mounting portion 2 that is not disposed with the linear member 19 serves as a rectangular opening portion 2, and the both side portions 18 of the tray Τ 'mounting portion 20 are supported by the second ligaments η. Here, the holding portion of the tray is placed; the two shells 18, 18 are provided by the linear member 19 which is disposed at the end portion of the tray 短 in the short side direction and extends in the longitudinal direction of the tray 11 201145439. When the tray 搬 is transported to the substrate ρ, the substrate is supported while being supported by the both side portions 18, 18 or the vicinity thereof. The substrate is placed at a predetermined position on the mounting portion 2, and the substrate 支承 is supported from below. Further, the shape of the tray 并不 is not limited to the shape shown in Fig. 5A. For example, a single frame having only one frame portion of the opening portion 21 and only the peripheral edge portion of the support substrate ρ may be formed. Fig. 5 is an enlarged cross-sectional view showing the vicinity of the mounting surface (10) of the mounting substrate ρ of the mounting portion 2 of the tray. The mounting portion 2 is provided with a plurality of support portion birds that support a portion of the substrate that is placed on the mounting portion 汕. The support portion bird is provided to protrude from the mounting surface 20a of the mounting portion 20, and the height η with respect to the mounting portion (9) is different between, for example, the central portion and the peripheral portion of the mounting portion 20. The height Η of each of the plurality of support portions 20b is set corresponding to the amount of bending of the mounting portion 状态 in the state in which the substrate P is placed on the mounting portion 2G on both side portions 18 18 of the support tray τ, that is, , in the top of the mounting portion 20, the bending amount of the shirt is eight points, the support portion 20b 4

高度Η設定較高’在載置部2〇之蠻曲吾,a A &lt;芩曲量小之部分，支承名 20b之高度Η設定較低。一般而言，杯般 叫。托盤τ之兩側部18, 1 被支承時之載置部20之彎曲量’具有在兩側部％ 18旧 較小、在兩伤Η&quot;8, 18之中間部分附近成為最大之傾向 因此，一般而言，配置在托盤Τ之兩側部 列砟18, 18(載置部2 之周緣部）附近之支承部20b之高度η，&amp; W相較於配置在其+ 部分之支承部20b之高度η較低。亦 1 相較於配置在 曲量較少之兩側部1 8，1 8附近之支承部 1 2〇b之高度η，g 置在彎曲量較多之部分、例如托盤T之雨相丨 &lt;兩側部18，18之t 12 201145439 間部附近之支承部20b之高度Η較高。 然而，會有托盤Τ因载置部2〇之構造或搬送基板ρ時 被支承之被支承部之位置，存在有與上述弯曲量之傾向相 反部为之情形。在此種情形，預先測量兩側部％ Η被保 持、載置有基板Ρ之載置部2G之各部分之彎曲量，與载置 部20之各部分之彎曲量之大小對應，設^配置在各部分之 支承部20b之尚度η。亦即，複數個支承部2〇b分別之高度 Η及配置’係考量載置部2〇之材質、形狀及被支承部之位 置決定。藉此，複數個支承部2〇b，在托盤τ之被支承部即 兩側部18, 18被支承、在載置部2〇載置有基板ρ之狀態下， 將基板Ρ支承成基板Ρ之彎曲量小於載置部2〇之彎曲量。 作為托盤Τ之形成材料，較佳為使用在托盤τ支承基 板Ρ時可抑制基板Ρ之本身重量導致之彎曲之材料，例如 可使用各種合成樹脂或金屬。具體而言，可舉出尼龍、聚 丙烯、AS(丙烯腈-苯乙烯共聚物）樹脂、ABS(丙烯腈-丁二烯 -苯乙烯共聚物）樹脂、聚碳酸酯、纖維強化塑膠、不鏽鋼等。 作為纖維強化塑膠，可舉出GFRp(Glass FiberThe height Η is set to be higher. 'The height of the support name 20b is lower in the portion where the load portion 2 is abbreviated, a A &lt; In general, the cup is called. Therefore, the amount of bending of the mounting portion 20 when the both side portions 18, 1 of the tray τ are supported has a tendency to be the largest in the vicinity of the middle portion of the two scars &quot;8, 18; In general, the height η of the support portion 20b disposed in the vicinity of the side sills 18, 18 (the peripheral portion of the mounting portion 2) of the tray , is compared with the support portion 20b disposed at the + portion thereof. The height η is low. Also, 1 is compared with the height η of the support portion 1 2〇b disposed in the vicinity of the side portions 18, 1 8 having a small amount of curvature, and g is placed in a portion where the amount of bending is large, for example, the rain of the tray T is &lt; The height of the support portion 20b near the portion between the two sides 18, 18 t 12 201145439 is relatively high. However, there is a case where the tray is placed at the position of the mounting portion 2 or the supported portion is supported when the substrate ρ is conveyed, and there is a case where the bending amount is opposite to the above. In this case, the amount of bending of each portion of the mounting portion 2G on which the both sides are held and the substrate Ρ is placed is measured in advance, and corresponds to the amount of bending of each portion of the placing portion 20, and is arranged. The degree η of the support portion 20b of each portion. That is, the height Η and the arrangement of the plurality of support portions 2〇b are determined by the material, shape, and position of the supported portion. In this way, the plurality of support portions 2b are supported by the side portions 18, 18 which are the supported portions of the tray τ, and the substrate Ρ is supported as the substrate in the state where the substrate ρ is placed on the mounting portion 2'. The amount of bending is smaller than the amount of bending of the mounting portion 2〇. As the material for forming the tray, it is preferable to use a material which can suppress the bending caused by the weight of the substrate itself when the tray τ supports the substrate, and for example, various synthetic resins or metals can be used. Specific examples thereof include nylon, polypropylene, AS (acrylonitrile-styrene copolymer) resin, ABS (acrylonitrile-butadiene-styrene copolymer) resin, polycarbonate, fiber reinforced plastic, stainless steel, and the like. . As a fiber reinforced plastic, GFRp (Glass Fiber)

Plastic:玻璃纖維強化熱硬化性塑膠）或CFRp(Carb〇nF^aPlastic: glass fiber reinforced thermosetting plastic) or CFRp (Carb〇nF^a

Reirif0rced piastic :碳纖維強化熱硬化性塑膠）。又交織 成格子狀之線狀構件19，係使用引線等柔軟性優異之構件 形成亦可。 又，本實施形態中，相對於托盤τ之載置部2〇之支承 部20b之高度Η，係以不僅補償載置部2〇之彎曲量、亦補 償載置部20之載置面20a之凹凸等形狀或公差等之方式進 13 201145439 行S周整。此外’複數個支承部2〇b分別之高度Η，在支承托 盤Τ之兩側部18, 18、在載置部2〇載置有基板ρ時，係調 整成與基板Ρ抵接之支承部2〇b之上端分別配置在與水平 面平行之相同假想平面上。此處，支承部2〇b之與基板p 抵接之面’為了防止基板P與支承部2〇b之密合導致之吸 附狀態，基板P側以成為凸之凸面曲狀為佳。 又’複數個支承部20b，在與托盤τ之兩側部18，18 之延伸方向（圖5A之上下方向）例如垂直交叉之方向（圖5A 及圖5B之左右方向），相對於兩側部i 8，1 8之中間部呈對 稱配置。此配置在例如托盤τ之兩側部18，18被支承時， 與托盤T相對兩側部丨8，丨8之中間部對稱彎曲對應。 藉由以上構成，複數個支承部20b，在支承托盤T之兩 側αΡ 18’ 18、在載置部20載置有基板ρ之狀態下，將基板 Ρ…著水平面支承成大致平坦。此處，大致平坦係在忽視基 板Ρ被複數個支承部20b及載置面2〇a支承導致之微小彎 曲時基板ρ成為沿著水平面之無起伏之平板狀。 基板P係配置成長邊與托盤T之兩側部18，18平行。 托盤τ在兩側部18，18被搬送機器手4之搬送手12從下方 支承之狀態下’將基板ρ載置於載置部2Q並搬送（參 及圖3)。 如上述，本實施形態之搬送機器手4之搬送手12作用 為支承托盤τ之被支承部即兩側部18, 18之支承機構 搬送機器手4,藉由搬送手12料托盤了之兩側部％ u 並使其移動’亦作用為將基板P載置於托盤τ之兩側部18 201145439 18被支承之托盤T之載置機構。又，搬送機器手4，亦作 用為保持載置有基板P之托盤τ之兩側部18，18或其附近 並使托盤Τ移動之搬送機構。 托盤Τ ’載置部20之下面係藉由圖4Α所示之搬出入 部5之托盤支承部52之複數個牦盤支承銷5几支承。又， 托盤T，如圖4A所示在載置部2〇之下面係藉由托盤支承 銷52b支承之狀態下，使基板支承部51之複數個基板支承 銷5 lb插通於圖5 A所示之複數個開口部2 i。 搬送機器手4 ’如圖4B所示，在將搬送手1 2沿著托盤 T之兩側部1 8’ 1 8配置在托盤τ之側方之下側後，使搬送 手12移動將托盤保持部⑵配置在托盤τ之兩側部18, 18 之下方。 圖2所示在基板保持具9之上面形成有保持托盤τ H 30。㈣3G係與托盤τ之框架構造對應設成格子 狀。又，藉由在基板保持具9之上面形成槽部3〇，島狀設 置複數個基板1&gt;之保持部（保持具部）31。亦即，槽部^係 槽狀設置於基板保持具9之保持部3卜保持部31具有與托 盤Τ之開口部21對應之尺寸。 保持部3 1之上面係加卫成基板保持具9對基板ρ之 質保持面具有良好平面度。再者，在保持部31之上面設置 複數個用以使基板ρ仿效此面密合之吸引孔κ(參照 各吸引孔Κ係連接於未圖示之真空泵。 糸.4不托盤Τ收容於基板保持具 - ^ .…工…队㈧、d穴7心價部之 -的部分側剖面圖。如圖6所示，托盤，之厚度小於槽部 15 201145439 托盤T插入陷入槽部3 〇Reirif0rced piastic : carbon fiber reinforced thermosetting plastic). Further, the linear member 19 which is interlaced in a lattice shape may be formed by using a member having excellent flexibility such as a lead. Further, in the present embodiment, the height Η of the support portion 20b of the mounting portion 2 of the tray τ is compensated not only for the amount of bending of the mounting portion 2 but also for the mounting surface 20a of the mounting portion 20. Shapes such as bumps or tolerances, etc. are entered in 13 201145439. Further, the height Η of the plurality of support portions 2〇b is adjusted to a support portion that abuts against the substrate 在 when the substrate ρ is placed on the side portions 18 and 18 of the support tray 〇. The upper ends of 2〇b are respectively arranged on the same imaginary plane parallel to the horizontal plane. Here, the surface of the support portion 2b that abuts on the substrate p is preferably in a convex state in order to prevent the substrate P from being adhered to the support portion 2b, and the substrate P side is preferably convex. Further, the plurality of support portions 20b are perpendicularly intersecting with each other in the extending direction of the both side portions 18, 18 of the tray τ (the upper and lower directions in FIG. 5A) (the left and right directions in FIGS. 5A and 5B) with respect to both sides The middle part of i 8,1 8 is symmetrically arranged. This arrangement corresponds to a symmetrical bending of the intermediate portions of the opposite side portions 丨8 and 丨8 of the tray T when, for example, the side portions 18, 18 of the tray τ are supported. According to the above configuration, the plurality of support portions 20b support the substrate Ρ in the horizontal plane on the both sides αb 18' 18 of the support tray T and the substrate ρ on the mounting portion 20 to be substantially flat. Here, the substantially flat plate is formed into a flat plate shape having no undulations along the horizontal plane when the substrate Ρ is neglected by the support of the plurality of support portions 20b and the mounting surface 2〇a. The substrate P is arranged to have a growing edge parallel to the side portions 18, 18 of the tray T. The tray τ is placed on the mounting portion 2Q and transported (in Fig. 3) in a state where the transporting hands 12 of the transport robot 4 are supported by the transporting hand 12 of the transport robot 4 from both sides. As described above, the transfer hand 12 of the transport robot 4 of the present embodiment functions as a support mechanism that supports the support portions of the tray τ, that is, the support mechanisms of the both side portions 18, 18, and the both sides of the tray are transported by the hand 12 The portion % u and the movement 'also acts as a mounting mechanism for placing the substrate P on the tray T supported by the two sides 18 of the tray τ 18 201145439 18 . Further, the transport robot 4 is also used as a transport mechanism for holding the side portions 18, 18 of the tray τ on which the substrate P is placed or the vicinity thereof and moving the tray. The lower surface of the tray ’ 'mounting portion 20 is supported by a plurality of disk support pins 5 of the tray supporting portion 52 of the carry-in/out portion 5 shown in Fig. 4A. Further, as shown in FIG. 4A, the tray T is supported by the tray support pin 52b under the mounting portion 2, and a plurality of substrate support pins 5 lb of the substrate support portion 51 are inserted into FIG. 5A. A plurality of openings 2 i are shown. As shown in FIG. 4B, the transport robot 4' is placed on the lower side of the side of the tray τ along the both side portions 18'8 of the tray T, and the transporter 12 is moved to hold the tray. The portion (2) is disposed below the side portions 18, 18 of the tray τ. A holding tray τ H 30 is formed on the substrate holder 9 as shown in FIG. (4) The 3G system is arranged in a lattice shape corresponding to the frame structure of the tray τ. Further, by forming the groove portion 3 on the upper surface of the substrate holder 9, a holding portion (holder portion) 31 of a plurality of substrates 1 &gt; That is, the groove portion is provided in the holder portion 3 of the substrate holder 9 and the holding portion 31 has a size corresponding to the opening portion 21 of the tray. The upper surface of the holding portion 3 1 is provided with a good flatness of the substrate holding member 9 with respect to the substrate ρ. Further, a plurality of suction holes κ for affixing the surface of the substrate ρ to the surface are provided on the upper surface of the holding portion 31 (see the respective suction holes for connection to a vacuum pump (not shown). 4.4 No trays are accommodated in the substrate. Part of the side profile of the holder - ^ .... work ... team (eight), d point 7 heart price section. As shown in Figure 6, the thickness of the tray is smaller than the groove portion 15 201145439 tray T insertion into the groove portion 3 〇

父接至保持部3 1。 30之深度。藉此， 31從開口部21穿 内’成為保持部 盤T上之基板pThe parent is connected to the holding unit 31. 30 depth. Thereby, 31 passes through the opening portion 21 to become the substrate p on the holding portion T.

防止收容於槽部30時之位置偏移。又 又，在搬送手 12之托盤保持部12a亦形成有與載置部20之凹部41卡合 之相同凸部12c(參照圖7A〜圖7C)。 之動作。具體而言，針對藉由 τ之基板P與托盤τ 一起搬送 接著，說明曝光裝置1 搬送機器手4將載置於托盤 以將基板P搬入及搬出之基板搬送方法進行說明。此處， 針對將基板P載置至托盤T，將載置於此托盤τ之基板p 搬入、搬出曝光裝置本體3之步驟進行說明。 塗布有感光劑之基板Ρ係從塗布顯影機搬送至圖丨所 示之搬出入部5，定位載置於圖4Α所示之基板支承部5 i 之基板支承銷51b上之既定位置，吸附保持於基板支承銷 51b之上面。藉此，基板P係支承成與水平面大致平行之狀 態。若基板P吸附保持於基板支承銷5 1 b之上面，則基板 支承部51在基板P吸附保持於基板支承銷51b之上面之狀 態下，使驅動部54作動，使基板p對準於托盤τ。藉此， 托盤T係支承成在基板P下方與基板p對向與水平面大致 平行之狀態。 201145439 圖7A〜圖7C及圖8Λ〜圖8B係顯示將基板P載置於 托盤T之步驟的步驟圖。 基板搬送裝置7’在基板P與托盤τ之對準結束後，使 搬送機器手4驅動，如圖4Β所示，將搬送+ 12沿著兩側 部18, 18配置在托盤τ之側方之下側。接著，如圖7α所示， 使設在搬送手12之托盤保持部12a之凸部12c與設在托盤 T之載置部20之凹部4 1對準。 接著，基板搬送裝置7,使搬送機器手4驅動，如圖 7B所示’使搬送手12沿著錯垂方向上昇移動，使搬送手 12之凸部12C與托盤T之凹部41卡合。之後使搬送手 12進-步沿著鉛垂方向上昇移動，如圖所示，藉由搬送 手12支承托盤T之被支承部即兩側部18，18將托盤τ舉起。 於是，托盤τ被往上舉起至載置部2〇之兩側部％ 18 及其附近’兩側部18, 18之中間部分成為相對向下方彎曲 之狀態’從兩側部18, 18之附近與托盤支承銷⑽分離。 若使搬送手12進一步沿著鉛垂方向上昇移動，則托盤τ之 兩側部之令間部分最後從托盤支承銷似分離。藉 此，托盤τ與複數個托盤支承銷52b完全離開，托盤τ ^ 為兩側部18, 18被搬送手12支承之狀態。 在此狀態下，載置部20自托盤T支承成沿著水平面大 致平坦之狀態向下方之彎曲量，在兩側部18, 18之附近較 小，在兩側部18, 18之中間部分之附近大致最大。在此狀 態下，若使搬送手12進一步沿著船垂方向上昇移動，則如 圖8A所示，托盤T之複數個支承部勘與基板p下面抵接。 17 201145439 此處，複數個支承部20b分別之高度H，在配置複數個 支承部20b之各位置，係設定成與支承托盤τ之兩側部18, ^8時之托盤τ之變形量（覺曲之大小）對應之高度。具體而 言，在支承托盤T之兩側部丨8, 18、將基板p載置於載置 4 20時’與基板p抵接之支承部2〇b之上端，係調整成分 別配置在與水平面平行之相同假想平面上。是以，在基板p 未載置於載置部20之狀態下，托盤T成為稍微向上方彎曲 之狀態（位於托盤T之兩側部18, 18之中間部分之支承部 20b較配置在其他部分之支承部更突出至稍微上方之狀 態）。又’在基板P未載置於載置部2G之狀態下，以圖5B 之視點觀察’在以平滑假想曲線連結支承# 20b分別之上 端時，在該曲線上托盤T之中間部分成為向上方彎曲(在上 方具有凸之形狀）之拱狀（弧狀）。 因此右使搬送手12沿著鉛垂方向上昇移動，首先托 兩側。卩18，18之令間部分或配置在其附近之支承部 20b與基板p之下面之—部分抵接。接著，配置在該支承部 2一〇b之兩側部18，18側之支承部島依序與基板p之下面之 #刀抵接。接著’基板p載置於托盤T之載置部，如 圖8B所示，基板p從基板支承銷川交接至托盤了。 此夺托盤T之載置部2〇 ’兩側部i 8, i 8之中間部分 因基板P之本昙.仓 jU . 重1進一步向下方彎曲若干之彎曲量。藉 此’與基板P之下面之一部分抵接之複數個支承部之 上端分別配置在與水平面平行之相同假想平面上。此外， 載置於托盤T之載置部20之基板&quot;藉由複數個支承部 18 201145439 2〇b支承成與水平面大致平行且大致平坦。此處在支承部 2〇b之與基板P抵接之面形成為凸曲面狀之情形可防止支 承部20b與基板P成為吸附狀態，可更確實地防止在基板p 產生托盤T之彎曲導致之應力。 如上述，本實施形態中，首先，在將基板p載置於托 盤T之前，支承載置有MP之㈣τ之搬送時之被支承 部即兩側部18, 18’托盤τ之形狀在載置有基板p之狀態 下成為與搬送時之托盤T之形狀相同之形狀。此外，在使 托盤T彎曲成該形狀後，將基板p載置於托盤τ。 接著，如圖3所#，搬送機器手4從_ 2所示之狀態 改變搬送手12之方向以使搬送手12之長邊方向（基板卩之 長邊方向）朝向曝光裝置本體3之基板保持具9側。之後， 使搬送手12移動，將載置有基板p之托盤τ …方搬送。搬送…基板以面與基板保持= 保持部31成為大致平行之方式搬送基板p。此處，大致平 行係意指排除因本身重量導致之基板p之彎曲時平行或接 近平行之狀態。具體而言，搬送手12以托盤τ之基板p之 被保持部分與保持部31之基板載置面成為大致平行之方式 搬送基板Ρ 〇 》 圖9Α〜圖9D係說明從托盤τ將基板ρ交接至曝光裝 置1之基板保持具9之步驟的步驟圖。 搬送機器手4’如圖9Α所示，藉由搬送手12將基板ρ 向基板保持具9上方搬送，進行托盤Τ與槽部30之對準後’ 使圖2所示之驅動裝置13驅動以使搬送手12下降。於是， 201145439 如圖9B及圖9C所示，托盤T收容於基板保持具9之槽部 基板Ρ載置於基板保持具9之保持部^上。此時，: 盤Τ之載置部20成為兩側部18,⑴皮支承、兩側部“Μ 之中間部向下方青曲之狀態，但基板？在藉由支承部鳩 支承成與水平面大致平行且平坦之狀態下交接至保持部31 上0 如圓9D所示’進一步使搬送手12下降後，托盤τ之 凹部41與基板保持具9之槽部3〇之&amp;部42卡合，托盤τ 從搬送手12交接至基板保持具9之槽部3卜對基板保持具 9之基板Ρ之交接完成後，基板搬送裝置7驅動搬送機器手 4使搬送手12從基板保持具9上退開^在基板ρ載置至基 板保持” 9後’藉由照明系統以曝光用光照明圖2所示 之光罩Μ以曝光用光IL照明之光罩μ之圖案，係透過投 影光學系統PL投影曝光於載置於基板保持具9之基板ρ。 在本實施形態之曝光裝置丨，如上述在基板交接時 基板Ρ邊乎不..f曲，可將基板ρ良好地（亦即，在抑制變形 產生之狀態下）載置於基板保持具9上。因此可在基板ρ上 之適s位置南精度進行既定曝光，可實現可靠性高之曝光 處理。又’在曝光裝置1，如上述可順利進行對托盤T及基 板保持具9之基板ρ之交接，因此可無延遲地進行對基板ρ 之曝光處理。 另方面，在習知基板搬送方法，具有圖及圖π 所示之下述問題。圖10(a)〜圖1〇((〇係顯示藉由搬送手保持 載置有基板之托盤之兩側部之步驟的步驟圖。圖n(a)〜圖 20 201145439 11(c)係顯示將基板及托盤交接至基板保持具之步驟的步驟 圖。 在習知基板搬送方法，首先，如圖i 0(a)所示，在將基 板載置於托盤之狀態下，藉由複數個支承銷從下方支承托 盤。接著，iu圖10(b)所示，使搬送手上昇移動，藉由搬送 手保持托盤之兩側部。接著，如圖1〇(c)所示，使搬送手進 一步上昇移動，使托盤從複數個支承銷離開後，使搬送手 朝向基板保持具移動以搬送基板。 然而’如圖10(a)所示，若將基板載置於托盤，則會有 基板與托盤密合而成為彼此不易產生滑動之狀態之情形。 在此狀態下，如圖10(b)所示，若保持托盤之兩側部舉起托 盤，則托盤之彎曲逐漸增加，另一方面，基板無法相對托 盤往箭頭方向移動，基板成為朝向兩側部之中間部被壓縮 之狀態。於是，如圖10(c)所示，基板之兩側部之中間部膨 脹般地變形。將此種變形狀態之基板交接至基板保持具 時’在基板保持具之保持部與基板之間不會產生充分滑 動’在基板保持具上無法消除基板之變形之情形，有可能 會對曝光處理造成不良影響。 又’假設’在藉由搬送手保持載置有基板之托盤之兩 側°卩時，即使在托盤與基板之間產生滑動而消除基板之變 形之情形，如圖11 (a)所示，由於基板沿著托盤彎曲’因此 以圖之虛線所示之基板端部彼此之距離小於平坦狀態之基 板端部彼此之距離。在此狀態下，如圖i 1(b)所示，在使托 盤下降將基板交接至基板保持具之保持部時，在基板保持 21 201145439 具之保持部與基板之間不會產生充分滑動之情形，會有基 板無法相對基板保持具之保持部往箭頭方向移動之情形。 於是，如® η⑷所*，交接至基板保持具之保持部之基板 端部彼此之距離與圊11(3)般管曲狀態之基板端部間之距離 大致相等，基板成為朝向兩側部之中間部被壓、而縮小之 狀態。如上述，在基板被壓縮而縮小之狀態下，有可能會 對曝光處理造成不良影響。 然而，根據本實施形態之具備托盤τ之基板搬送裝置7 之基板搬送方法，如圖8Α〜圖8Β所示，在藉由搬送手a 保持載置有基板ρ之托盤了並搬送時，基板ρ係藉由複數 個支承部20b支承，不會如以往般變形。又，如圖9α〜圖 9D所示，可將與水平面大致平行且平坦狀態之基Μ交接 至基板保持具9之保持部3卜是以，可消除所有圖10⑷ 〜圖10(c)所示之以往基板Ρ之變形產生之問題、圆 〜圖11(c)所示之基板P之壓縮產生之問題、或此等之組合 產生之問題。 ”。 接著，針對曝光處理結束後之從基板保持具9之基板p 之搬出動作進行說明。此外’以下之說明中雖說明搬送手 12進行基板P之搬出’但雙手構造中之另_個搬送 搬出亦可。 丁 曝光處理結束後，搬送機器手4驅動搬送手12，在載 置於基板保持具9上之托盤τ之下方將搬送手12從〜γ方 向側插入至基板保持具9之χ軸方向兩側。與此同時，夢 由未圖示之控制裝置解除真空泵之吸引，解除基板保持具： 22 201145439 進行之基板p之吸附。 接著，搬送手12被驅動裝置13往上方驅動既定量後， 搬送手12之托盤保持部12a之凸部12c卡合於托盤τ之載 置部20之兩側部18，18之下面之凹部41。搬送手a進一 步被往上方驅動後，載置於基板保持具9之保持部3 1之基 板P父接至托盤T。此外，真空泵之吸引（基板保持具9進 行之基板p之吸附）之解除只要在凸部12c卡合於凹部41 之前進行即可。此時，根據本實施形態，如上述，由於基 板p之一部分被設在載置部20之複數個支承部2〇b支承， 因此可在較以往平坦之狀態下將基板p載置於托盤τ之載 置部20上。搬送手12進一步被往上方驅動後，支承基板ρ 之托盤Τ往基板保持具9之上方被舉起，載置部2〇從基板 保持具9離開。 在托盤Τ被舉起至此載置部2〇與基板保持具ρ離開之 位置之時點，保持基板ρ之托盤τ係藉由搬送手12而從基 板保持具9上退開。以此方式，完成對曝光裝置本體3之 基板Ρ之搬出動作。 接著’援引圖1〜圖6及圖9Α〜圖9D，使用圖12Α〜 圖12C及圖13Α〜圖13Β說明本發明之第2實施形態。本 實施形態之基板搬送裝置7Α，在搬出入部5Α支承托盤Τ 之複數個托盤支承銷（第2支承銷）52b係設成僅支承托盤Τ 之兩側部18，1 8或其附近之點與上述第1實施形態之基板 搬送裝置7不同。其他點則與第1實施形態之基板搬送裝 置7相同’因此對相同部分賦予相同符號以省略說明。 23 201145439 圖12A〜圖12C及圖13A〜圖ι3Β係顯示將基板？载 置於托盤T之步驟的步驟圖。以下，說明本實施形態之曝 光裝置1之動作。具體而言，針對藉由搬送機器手4將载 置於托盤T之基板p與托盤τ 一起搬送以將基板p搬入及 搬出之基板搬送方法進行說明。此處，針對將基板p載置 至托盤T，將載置於此托盤τ之基板p搬入、搬出曝光裝置 本體3之步驟進行說明。 與第1貫施形態相同，塗布有感光劑之基板p係從塗 布顯影機搬送至與圖1所示之搬出入部5相同之搬出入部 5 A，定位載置於圖4A所示之基板支承部5丨之基板支承銷 5 lb上之既定位置，吸附保持於基板支承銷5 lb之上面。若 基板P吸附保持於基板支承銷51b之上面，則基板支承部 51在基板P吸附保持於基板支承銷51b之上面之狀態下， 使驅動部54作動，使基板p對準於托盤τ。 此處，本實施形態中’如圖4B所示，支承托盤τ之複 數個托盤支承銷52b係沿著托盤τ之兩側部1 8，1 8配置。 此外’各托盤支承銷52b僅支承托盤τ之兩側部1 8，1 8或 其附近°藉此’托盤T在與基板p載置於載置部2〇並藉由 搬送手12支承兩側部丨8,丨8時之托盤τ之形狀相同之形狀 且因托盤T之本身重量而彎曲之狀態下，與基板p對向支 承於基板P之下方。 基板搬送裝置7A，在基板p與托盤τ之對準結束後， 藉由未圖示之驅動部使圖4A所示之托盤支承部（支承機 構）52沿著導引部56上昇移動。藉此，如圖12A所示，藉 24 201145439 由托盤支承銷52b支承之托盤τ以接近基板p之方式上昇 移動。接著，如圖12B所示，設在托盤τ之載置部2〇之複 數個支承部20b與基板ρ之下面抵接。 在此狀態下，若使托盤τ進一步上昇移動，則如圖i2c 所示，基板P從複數個基板支承銷5 lb分離並載置於托盤τ 之載置部20。藉由上述，基板ρ從基板支承銷51b交接至 托盤τ。如上述，本實施形態中，搬出入部5A作用為支承 托盤T之既定被保持部即兩側部18，18之支承機構且作 用為將基板P載置於兩側部18，18被支承之托盤τ之載置 機構。 此處，托盤τ ,複數個支承部20b分別之高度Η，在支 承托盤Τ之兩側部18, 18、將基板ρ載置於載置部2〇時， 與基板Ρ抵接之複數個支承部2〇b之上端，係調整成分別 配置在與水平面平行之相同假想平面上。藉此，與第〖實 施形態相同，載置於托盤T之載置部2〇之基板p係藉由複 數個支承部20b支承成與水平面大致平行且大致平坦。 如上述，本實施形態中，與第丨實施形態相同，在將 基板P載置於托盤T之前，支承載置有基板ρ之托盤丁之 搬送時之被支承部即兩側部18, 18，使載置有基板p前之托 盤τ之形狀成為與載置有基板卩之狀態下搬送時之托盤τ 之形狀相同之形狀。此外，在使托盤T彎曲成該形狀後， 將基板P載置於托盤τ。 接著，基板搬送裝置7A，使搬送機器手4驅動，如圖 12C所不，將搬送手i 2沿著兩側部i 8,丨8配置在托盤丁之 25 201145439 側方下側，’如圖13A所示，使搬送手12移動，使設 在«手12之托盤保持部12a之凸# 12c與設在托盤了之 載置部20之凹部41對準。 接著，基板搬送裝置7八，使搬送機器手4驅動，如圖 13B所示’使搬送手12上昇移動，使搬送手12之凸部… 與托盤T之凹部41卡合。之後，使搬送手12進一步沿著 鉛垂方向上昇移動’藉由搬送手12支承托盤τ之被 即兩側部18, 18將托盤τ舉起。 接著如圖3所示，與第i實施形態相同，搬送機_ 手4從® 2所示之狀態改變搬送手12之方向以使搬送手12 之長邊方向朝向曝光裝置本體3之基板保持具9側。之後， 使搬送手12移動，將載置有基板p之托盤τ朝向基板保持 具9上方搬送。接著，與圖9A〜圖9D所示之第1實施形 態相同’將基板P從托盤T交接至曝光裝置i之基板保持 具9。 如以上說明’根據具備本實施形態之托盤T之基板搬 送裝置7A之基板搬送方法，如圖l2A〜圖12(：及圖i3A〜 圖^所71&quot; ’藉由搬送手持載置有基板P之托盤T並 搬送時’基板ρ不會如以往般變形。又，如圖9Α〜圖9D 所不’可將與水平面大致平行且平坦狀態下之基板P交接 至基板保持具9之保持部3丨。是以，可消除所有圖1〇(幻 〜圖10(c)所不之以往基板p之變形產生之問題、圖^⑷ 圖11 (c)所不之基板ρ之壓縮產生之問題、或此等之組合 產生之問題。 26 201145439 此外，上述實施形態中，雖說明托盤之被保持部設在 兩側部之構成，但被支承部設在例如兩側部之中間部等兩 側部以外之部分亦可。又，上述各實施形態中，雖說明將 基板載置於托盤時使配置在基板下方之托盤相對基板上昇 移動之情形，但使配置在托盤上方之基板相對托盤下降移 動以載置於托盤亦可。 又’作為上述實施形態之基板P，不僅適用顯示器元件 用之玻璃基板，亦適用於半導體元件製造用之半導體晶 圓、溥膜磁頭用之陶瓷晶圓' 或曝光裝置所使用之光罩或 標線片之原版（合成石英、矽晶圓）等。 又’作為曝光裝置，除了適用使光罩Μ與基板P同步 移動以經由光罩Μ之圖案之曝光用光IL使基板ρ掃描曝光 之步進掃描方式之掃描型曝光裝置（掃描步進器）外，亦可適 用於在光罩Μ與基板ρ靜止之狀態下使光罩M之圖案一次 曝光、使基板P依序步進移動之步進重複方式之投影曝光 裝置（步進器）。 又，本發明亦可適用於美國專利第6341〇〇7號說明書、 美國專利第6208術號說明書、美國專利第咖而號說 明書等所揭示之具備複數個基板載台之雙載台型曝光裝 置。 歐洲專利申請公開…13號說明書 = :::之基板載台及不保持基板、裝載形j基St: 土率構件及/或各種光電感測器之測量載台之曝光裝置。 27 201145439 又’可採用具備複數個基板載台及測量載台之曝光裝置。 此外，上述實施形態令，雖使用在光透射性基板上形 成既定遮光圖案（或相位圖案、減光圖案）之光透射型光罩， 但替代此光罩，使用例如美國專利第6778257號說明書所 揭示之根據待曝光圖案之電子資料形成透射圖案或反射圖 案、或發光圖案之可變成形光罩（亦稱為電子光罩、主動光 罩、或影像產生器）亦可。又，替代具備非發光型影像顯示 兀件之可變成形光罩’具備包含自發光型影像顯示元件之 圓案形成裝置亦可。 上述實施形態之曝光裝置，係以保持既定機械精度、 電氣精度精度之方式組裝包含本案巾請專利範圍記 載之各構成要素之各種子系統來製造。為了確保該等各種 精度在該組裝削後對各種光學系統進行用以達成光學精 度之調整’料種機械系統進行用以達成機械精度之調 整’對各種電氣系統進行用以達成電氣精度之調整。 從各種子系統至曝光裝置之組裝步驟，包含各種子系 統相互之機械連接、電路之配線連接、氣壓迴路之配管連 等在從各種子系統至曝光裝置之組裝步驟之前，當然 有各子系統個別之組裝步驟。在各種子系統至曝光裝置之 組裝步驟結束後，進行综合調整以確保曝光裝置整體之各 種精度。此外，曝光裝置之製造以在溫度及真空度等受到 管理之無塵室進行為佳。 半導體元件等之微元件，如圖i 4所示，係經由下述步 驟製造，即進行微元件之功能/性能設計之步驟2〇ι、根據 28 201145439 該設計步驟製作光罩（標線片）之步驟202、製造元件之基材 即基板之步驟203、包含基板處理（曝光處理）（包含根據上述 實施形態使用光罩之圖案以曝光用光使基板曝光之動作、 及使曝光後基板（感光劑）顯影之動作）之基板處理步驟 204、το件組裝步驟（包含切割步驟、接合步驟、封裝步驟等 之加工程序）205、以及檢查步驟2〇6等。此外，在步驟2〇4， 包含藉由使感光劑顯影，形成與光罩之圖案對應之曝光圖 案層（顯影後感光劑之層）’透過該曝光圖案層對基板加工之 動作。 此外，上述實施形態之要件可適當加以組合。又，亦 有未使用-部分之構成要素之情形。χ，在法令容許之範 圍内援引在上述貫施形態引用之關於曝光裝置等之所有 么開公報及4目4利之揭示作為本說明書記載之一部分。 【圖式簡單說明】 圖1係顯示曝光裝置之整體概略的剖面俯視圖。 圖2係搬送機器手的外觀立體圖。 圖3係用以說明搬送機器手之動作的立體圖。 圖4Α係顯示搬出入部之概略構成的側視圖。 圖4Β係顯示搬出入部與搬送機器手之關係的立體圖 圖5Α係顯示托盤之平面構造的俯視圖。 圖5B係載置部之載置面附近的放大剖面圖 之狀態的部 圖6係顯示托盤收容於基板保持具之槽部 分側剖面圖》 圖7A係說明第 1實施形態之基板交接步驟的示意圖。 29 201145439 圖7B係說明第丨實施形態之基板交接步驟的示意圖。 圖7C係說明第丨實施形態之基板交接步驟的示意圖。 圖8A係說明第丨實施形態之基板交接步驟的示意圖。 圖8B係說明第丨實施形態之基板交接步驟的示意圖。 圖9A係說明第1實施形態之基板交接步驟的示意圖。 圖9B係說明第1實施形態之基板交接步驟的示意圖。 圖9C係說明第1實施形態之基板交接步驟的示意圖。 圖9D係說明第1實施形態之基板交接步驟的示意圖。 圖10(a)〜（c)係說明習知基板交接步驟的示意圖。 圖11(a)〜（c)係說明習知基板交接步驟的示意圖。 圖12A係說明第2實施形態之基板交接步驟的示意圖。 圖12B係說明第2實施形態之基板交接步驟的示意圖。 圖12C係說明第2實施形態之基板交接步驟的示意圖。 圖1 3 A係說明第2實施形態之基板交接步驟的示意圖。 圖1 3B係說明第2實施形態之基板交接步驟的示意圖。 圖14係說明本發明實施形態之元件製造方法的流程 【主要元件符號說明】 1 曝光裝置 4 搬送機器手（搬送部、載置機構、搬送機構） 5, 5A 搬出入部（搬送部） 7，7A 基板搬送裝置 9 基板保持具 12 搬送手（保持臂） 30 201145439 12b 缺口部 18 兩側部（被保持部、被支承部） 20 載置部 20b 支承部 21 開口部（插通孔） 30 槽部 31 保持部 33 移動機構 51 基板支承部（載置機構） 51b 基板支承銷（支承銷） 52 托盤支承部（支承機構） 52b 托盤支承銷（第2支承銷） 53 連結構件（載置機構） 54 驅動部（載置機構） 56 導引部（支承機構） Η 高度 IL 曝光用光 Ρ 基板 Τ 托盤（基板支承構件） 31The position at the time of being accommodated in the groove portion 30 is prevented from shifting. Further, the tray holding portion 12a of the transporting hand 12 is also formed with the same convex portion 12c (see Figs. 7A to 7C) that engages with the concave portion 41 of the mounting portion 20. The action. Specifically, the substrate P is transported together with the tray τ by the substrate τ. Next, the substrate transfer method in which the transfer device 1 transporting the robot 4 is placed on the tray to carry in and out the substrate P will be described. Here, a description will be given of a procedure in which the substrate P is placed on the tray T, and the substrate p placed on the tray τ is carried in and out of the exposure apparatus main body 3. The substrate coated with the photosensitive agent is transported from the coating and developing machine to the loading/unloading portion 5 shown in FIG. 4, and is placed at a predetermined position on the substrate supporting pin 51b of the substrate supporting portion 5 i shown in FIG. The upper surface of the substrate supporting pin 51b. Thereby, the substrate P is supported in a state substantially parallel to the horizontal plane. When the substrate P is adsorbed and held on the upper surface of the substrate supporting pin 51b, the substrate supporting portion 51 moves the driving portion 54 while the substrate P is adsorbed and held on the upper surface of the substrate supporting pin 51b, and the substrate p is aligned with the tray τ. . Thereby, the tray T is supported so as to be substantially parallel to the horizontal direction of the substrate p under the substrate P. 201145439 Figs. 7A to 7C and Figs. 8A to 8B are process diagrams showing the steps of placing the substrate P on the tray T. After the alignment of the substrate P and the tray τ is completed, the substrate transfer device 7' drives the transport robot 4, and as shown in FIG. 4A, the transport + 12 is disposed along the side portions 18 and 18 on the side of the tray τ. Lower side. Next, as shown in Fig. 7α, the convex portion 12c of the tray holding portion 12a provided in the transporting hand 12 is aligned with the concave portion 4 1 provided in the placing portion 20 of the tray T. Then, the substrate conveyance device 7 drives the conveyance robot 4 to move the conveyance hand 12 in the wrong direction as shown in Fig. 7B, and the convex portion 12C of the conveyance hand 12 is engaged with the concave portion 41 of the tray T. Thereafter, the transporting hand 12 is moved up and down in the vertical direction, and as shown in the figure, the transporter 12 supports the two side portions 18, 18, which are supported portions of the tray T, to lift the tray τ. Then, the tray τ is lifted up to the side portions % 18 of the mounting portion 2 及其 and the vicinity of the 'side portions 18, 18 are in a state of being bent downward relative to each other' from the both side portions 18, 18 It is separated from the tray support pin (10) nearby. When the transporting hand 12 is further moved upward in the vertical direction, the inter-part portion of the both sides of the tray τ is finally separated from the tray supporting pin. Thereby, the tray τ is completely separated from the plurality of tray support pins 52b, and the tray τ^ is in a state in which the both side portions 18, 18 are supported by the transport hand 12. In this state, the mounting portion 20 is supported by the tray T so as to be bent downward in a state in which the horizontal plane is substantially flat, and is smaller in the vicinity of the both side portions 18, 18, and is located in the middle portion of the both side portions 18, 18. It is roughly the largest nearby. In this state, when the transporting hand 12 is further moved upward in the ship's vertical direction, as shown in Fig. 8A, the plurality of support portions of the tray T are brought into contact with the lower surface of the substrate p. 17 201145439 Here, the height H of each of the plurality of support portions 20b is set at each position of the plurality of support portions 20b to be set to a deformation amount of the tray τ at the two sides 18 of the support tray τ, ^8 The size of the song) corresponds to the height. Specifically, the upper end portions 8 and 18 of the support tray T are placed on the upper end of the support portion 2〇b that is in contact with the substrate p when the substrate p is placed on the mounting portion 40, and are arranged to be respectively arranged and The water plane is parallel to the same imaginary plane. In a state in which the substrate p is not placed on the placing portion 20, the tray T is slightly bent upward (the supporting portion 20b located at the intermediate portion between the both side portions 18, 18 of the tray T is disposed in other portions). The support portion protrudes to a slightly upward state). Further, when the substrate P is not placed on the placing portion 2G, the upper end of the support #20b is connected by the smooth imaginary curve when viewed from the viewpoint of FIG. 5B, and the middle portion of the tray T is upward on the curved line. An arch (arc) that is curved (having a convex shape on the upper side). Therefore, the transporting hand 12 is moved up and down in the vertical direction, and the two sides are first supported. The inter portion of the crucible 18, 18 or the support portion 20b disposed in the vicinity thereof abuts against the portion of the lower surface of the substrate p. Next, the support islands disposed on the side portions 18 and 18 of the support portion 2b are sequentially abutted against the underside of the substrate p. Next, the substrate p is placed on the mounting portion of the tray T, and as shown in Fig. 8B, the substrate p is transferred from the substrate supporting pin to the tray. In the middle portion of the mounting portion 2'' of the tray T, the two sides of the two sides i8, i8, the weight of the substrate P is further bent downward by a certain amount. The upper ends of the plurality of support portions which are in contact with one of the lower portions of the substrate P are disposed on the same imaginary plane parallel to the horizontal plane. Further, the substrate placed on the mounting portion 20 of the tray T is supported by a plurality of support portions 18 201145439 2〇b so as to be substantially parallel to the horizontal plane and substantially flat. Here, when the surface of the support portion 2b that abuts on the substrate P is formed in a convex curved shape, the support portion 20b and the substrate P can be prevented from being in an adsorbed state, and the bending of the tray T can be prevented more reliably in the substrate p. stress. As described above, in the present embodiment, first, before the substrate p is placed on the tray T, the two sides 18, 18' of the supported portions at the time of transporting the (4) τ on which the MP is placed are placed, and the shape of the tray τ is placed. In the state in which the substrate p is present, it has the same shape as the shape of the tray T at the time of conveyance. Further, after the tray T is bent into the shape, the substrate p is placed on the tray τ. Then, as shown in FIG. 3, the transport robot 4 changes the direction of the transport hand 12 from the state indicated by _2 so that the longitudinal direction of the transport hand 12 (longitudinal direction of the substrate )) is maintained toward the substrate of the exposure apparatus body 3. With 9 sides. Thereafter, the transporting hand 12 is moved, and the tray τ on which the substrate p is placed is transported. The substrate is conveyed so that the substrate and the substrate are held. The substrate p is transferred so that the holding portion 31 is substantially parallel. Here, the substantially parallel system means a state in which the parallel or near parallel of the bending of the substrate p due to its own weight is excluded. Specifically, the transporting hand 12 transports the substrate so that the held portion of the substrate p of the tray τ and the substrate mounting surface of the holding portion 31 are substantially parallel. FIG. 9A to FIG. 9D illustrate the transfer of the substrate ρ from the tray τ. A step diagram of the steps to the substrate holder 9 of the exposure apparatus 1. As shown in FIG. 9A, the transport robot 4' transports the substrate ρ to the upper side of the substrate holder 9 by the transport hand 12, and aligns the tray Τ with the groove portion 30, and drives the drive device 13 shown in FIG. The transporting hand 12 is lowered. Then, as shown in FIG. 9B and FIG. 9C, the tray T is housed in the groove portion of the substrate holder 9 and the substrate is placed on the holding portion of the substrate holder 9. At this time, the mounting portion 20 of the cartridge becomes the both side portions 18, and (1) the skin is supported, and the intermediate portions of the both sides are in a state of being bent downward, but the substrate is supported by the support portion so as to be substantially horizontal. When it is parallel and flat, it is delivered to the holding portion 31. As shown by the circle 9D, the recessed portion 41 of the tray τ is engaged with the groove portion 3 of the substrate holder 9 and the portion 42 of the substrate holder 9 is closed. The tray τ is transferred from the transfer hand 12 to the groove portion 3 of the substrate holder 9 and after the transfer of the substrate 对 of the substrate holder 9 is completed, the substrate transfer device 7 drives the transfer robot 4 to lift the transfer hand 12 from the substrate holder 9 After the substrate ρ is placed on the substrate holding "9", the pattern shown in FIG. 2 is illuminated by the illumination system, and the pattern of the mask μ illuminated by the exposure light IL is transmitted through the projection optical system PL. The projection is exposed to the substrate ρ placed on the substrate holder 9. In the exposure apparatus of the present embodiment, the substrate ρ can be placed on the substrate holder 9 satisfactorily (that is, in a state in which deformation is suppressed) as described above when the substrate is transferred. on. Therefore, a predetermined exposure can be performed with a south precision on the substrate ρ, and a highly reliable exposure process can be realized. Further, in the exposure apparatus 1, since the substrate ρ of the tray T and the substrate holder 9 can be smoothly transferred as described above, the exposure processing of the substrate ρ can be performed without delay. On the other hand, in the conventional substrate transfer method, there are the following problems shown in the figure and the diagram π. Fig. 10 (a) to Fig. 1 ((the figure shows a step of the step of holding the both sides of the tray on which the substrate is placed by the transfer hand. Fig. n (a) to Fig. 20 201145439 11 (c) shows A step of the step of transferring the substrate and the tray to the substrate holder. In the conventional substrate transfer method, first, as shown in Fig. 0 (a), in the state where the substrate is placed on the tray, by a plurality of branches The underwriter supports the tray from below. Next, as shown in Fig. 10(b), the transporter is moved up and the both sides of the tray are held by the transporter. Then, as shown in Fig. 1(c), the transporter is further moved. Ascending the movement, after the tray is separated from the plurality of support pins, the transfer hand is moved toward the substrate holder to transport the substrate. However, as shown in FIG. 10(a), if the substrate is placed on the tray, the substrate and the tray are provided. In this state, as shown in FIG. 10(b), if the tray is lifted on both sides of the tray, the bending of the tray is gradually increased, and on the other hand, the substrate is lifted. Cannot move in the direction of the arrow with respect to the tray, and the substrate becomes toward the sides The portion is compressed. Then, as shown in Fig. 10(c), the intermediate portions of the both side portions of the substrate are expanded and deformed. When the substrate in such a deformed state is transferred to the substrate holder, the substrate holder is held. There is no sufficient sliding between the portion and the substrate. The deformation of the substrate cannot be eliminated on the substrate holder, which may adversely affect the exposure process. It is also assumed that the tray on which the substrate is placed is held by the transfer hand. When both sides are inclined, even if the sliding between the tray and the substrate is eliminated to eliminate the deformation of the substrate, as shown in FIG. 11(a), since the substrate is bent along the tray, the substrate end shown by the broken line in the figure is shown. The distance between the portions is smaller than the distance between the end portions of the substrate in a flat state. In this state, as shown in FIG. 1(b), when the tray is lowered to transfer the substrate to the holding portion of the substrate holder, the substrate is held 21 201145439 There is no possibility of sufficient sliding between the holding portion and the substrate, and the substrate cannot be moved in the direction of the arrow with respect to the holding portion of the substrate holder. Thus, as the η(4)*, The distance between the end portions of the substrate to the holding portion of the substrate holder is substantially equal to the distance between the end portions of the substrate in the state of the 管11 (3), and the substrate is pressed toward the intermediate portion of the both side portions to be reduced. As described above, in the state where the substrate is compressed and reduced, there is a possibility that the exposure process is adversely affected. However, the substrate transfer method of the substrate transfer device 7 including the tray τ according to the present embodiment is as shown in Figs. 8A to 8B. As shown in the figure, when the tray on which the substrate ρ is placed is held by the transport hand a and transported, the substrate ρ is supported by the plurality of support portions 20b, and is not deformed as in the prior art. Further, as shown in FIGS. 9α to 9D It can be shown that the substrate which is substantially parallel to the horizontal plane and in a flat state can be transferred to the holding portion 3 of the substrate holder 9 to eliminate the problem of deformation of the conventional substrate 所示 shown in all of Figs. 10(4) to 10(c). The problem arises from the compression of the substrate P shown in Figure 11(c), or the combination of these. Next, the unloading operation of the substrate p from the substrate holder 9 after the completion of the exposure processing will be described. In the following description, the transfer of the substrate P by the transfer hand 12 will be described, but another one of the two-hand structure is used. After the butyl exposure process is completed, the transport robot 4 drives the transport hand 12, and the transport hand 12 is inserted from the γ-direction side to the substrate holder 9 below the tray τ placed on the substrate holder 9. At the same time, the control device (not shown) releases the vacuum pump and releases the substrate holder: 22 201145439 The substrate p is adsorbed. Next, the transport hand 12 is driven upward by the drive unit 13. After the amount, the convex portion 12c of the tray holding portion 12a of the transporting hand 12 is engaged with the concave portion 41 on the lower side of the side portions 18, 18 of the mounting portion 20 of the tray τ. The transporting hand a is further driven upward, and then placed. The substrate P of the holding portion 31 of the substrate holder 9 is attached to the tray T. Further, the suction of the vacuum pump (the adsorption of the substrate p by the substrate holder 9) is released before the convex portion 12c is engaged with the concave portion 41. According to the present embodiment, as described above, since one portion of the substrate p is supported by the plurality of support portions 2〇b provided in the mounting portion 20, the substrate p can be placed in a state of being flattened in the past. After the transporting hand 12 is further driven upward, the tray Τ of the support substrate ρ is lifted above the substrate holder 9 and the placing unit 2 离开 is separated from the substrate holder 9 in the tray. When the Τ is lifted to a position where the mounting portion 2 is separated from the substrate holder ρ, the tray τ holding the substrate ρ is retracted from the substrate holder 9 by the transfer hand 12. In this manner, the exposure is completed. The second embodiment of the present invention will be described with reference to Figs. 1 to 6 and Figs. 9A to 9D, with reference to Figs. 1 to 6 and Figs. 9A to 9D. In the substrate transfer device 7A, a plurality of tray support pins (second support pins) 52b supporting the trays 搬 in the carry-in/out portion 5 are provided so as to support only the side portions 18, 18 or the vicinity of the tray 与 and the first embodiment. The substrate transfer device 7 of the form is different. Other points are The same components as those of the substrate transfer device 7 of the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted. 23 201145439 FIGS. 12A to 12C and FIGS. 13A to 13B show the steps of the step of placing the substrate on the tray T. In the following, the operation of the exposure apparatus 1 of the present embodiment will be described. Specifically, the substrate p placed on the tray T and the tray τ are transported by the transport robot 4 to transport the substrate p into and out of the substrate. In the above description, the substrate p is placed on the tray T, and the substrate p placed on the tray τ is carried in and out of the exposure apparatus main body 3. The photosensitive application is applied in the same manner as in the first embodiment. The substrate p of the agent is transported from the coating and developing machine to the loading/unloading portion 5A which is the same as the loading and unloading portion 5 shown in Fig. 1, and is positioned to be placed on the substrate supporting pin 5 lb of the substrate supporting portion 5 shown in Fig. 4A. The position is adsorbed and held on the substrate support pin 5 lb. When the substrate P is adsorbed and held on the upper surface of the substrate supporting pin 51b, the substrate supporting portion 51 moves the driving portion 54 while the substrate P is adsorbed and held on the upper surface of the substrate supporting pin 51b, and the substrate p is aligned with the tray τ. Here, in the present embodiment, as shown in Fig. 4B, a plurality of tray support pins 52b supporting the tray τ are disposed along both side portions 1, 8 and 18 of the tray τ. Further, each of the tray support pins 52b supports only the both side portions 1, 8, 18 or the vicinity of the tray τ. Thus, the tray T is placed on the mounting portion 2 with the substrate p and supported on both sides by the transporting hand 12 In a state in which the shape of the tray τ at the same time is 8 and the shape of the tray τ is bent by the weight of the tray T, it is supported by the substrate p opposite to the substrate P. In the substrate transfer apparatus 7A, after the alignment of the substrate p and the tray τ is completed, the tray support portion (support mechanism) 52 shown in Fig. 4A is moved up along the guide portion 56 by a drive unit (not shown). Thereby, as shown in Fig. 12A, the tray τ supported by the tray support pin 52b is lifted up to approach the substrate p by 24 201145439. Next, as shown in Fig. 12B, a plurality of support portions 20b provided on the mounting portion 2' of the tray τ are in contact with the lower surface of the substrate ρ. In this state, when the tray τ is further moved upward, as shown in Fig. i2c, the substrate P is separated from the plurality of substrate supporting pins 5 lb and placed on the placing portion 20 of the tray τ. By the above, the substrate ρ is transferred from the substrate supporting pin 51b to the tray τ. As described above, in the present embodiment, the loading/unloading portion 5A functions as a supporting mechanism for supporting the both side portions 18, 18 of the predetermined holding portion of the tray T, and functions as a tray on which the substrate P is placed on the both side portions 18, 18 τ placement mechanism. Here, the height Η of the tray τ and the plurality of support portions 20b, the plurality of supports that abut against the substrate 在 when the substrate ρ is placed on the mounting portion 2〇 on the side portions 18 and 18 of the support tray Τ The upper ends of the portions 2〇b are adjusted to be respectively disposed on the same imaginary plane parallel to the horizontal plane. As a result, in the same manner as in the first embodiment, the substrate p placed on the mounting portion 2 of the tray T is supported by a plurality of support portions 20b so as to be substantially parallel to the horizontal plane and substantially flat. As described above, in the present embodiment, as in the third embodiment, before the substrate P is placed on the tray T, the supported portions, that is, the supported portions at the time of transporting the trays on which the substrates ρ are placed, are supported. The shape of the tray τ before the substrate p is placed is the same shape as the shape of the tray τ when the substrate is placed. Further, after the tray T is bent into the shape, the substrate P is placed on the tray τ. Next, the substrate transfer device 7A drives the transport robot 4, and as shown in Fig. 12C, the transport hand i 2 is placed along the two sides i 8, 8 on the lower side of the tray 25, 201145439, as shown in Fig. 12 As shown in FIG. 13A, the transporting hand 12 is moved, and the convex #12c of the tray holding portion 12a provided in the «hand 12 is aligned with the concave portion 41 of the mounting portion 20 provided on the tray. Then, the substrate transfer device 7 drives the transport robot 4 to move the transport hand 12 upward as shown in Fig. 13B, and the convex portion of the transport hand 12 is engaged with the concave portion 41 of the tray T. Thereafter, the transporting hand 12 is further moved up in the vertical direction. The two sides 18, 18 which support the pallet τ by the transporting hand 12 lift the tray τ. Next, as shown in FIG. 3, in the same manner as the i-th embodiment, the conveyor_hand 4 changes the direction of the conveyance hand 12 from the state indicated by ® 2 so that the longitudinal direction of the conveyance hand 12 faces the substrate holder of the exposure apparatus main body 3. 9 sides. Thereafter, the transporting hand 12 is moved, and the tray τ on which the substrate p is placed is transported toward the upper side of the substrate holder 9. Next, the substrate P is transferred from the tray T to the substrate holder 9 of the exposure device i in the same manner as the first embodiment shown in Figs. 9A to 9D. As described above, the substrate transfer method according to the substrate transfer apparatus 7A having the tray T of the present embodiment is as shown in FIGS. 12A to 12 (and FIG. i3A to FIG. 71 &quot; 'the substrate P is placed by hand transfer. When the tray T is conveyed, the substrate ρ is not deformed as in the past. Further, as shown in FIGS. 9A to 9D, the substrate P which is substantially parallel to the horizontal plane and in a flat state can be transferred to the holding portion 3 of the substrate holder 9. Therefore, it is possible to eliminate all the problems caused by the deformation of the substrate p which is not shown in Fig. 1 (the phantom to Fig. 10(c), the compression of the substrate ρ which is not shown in Fig. 11 (c), Fig. 11 (c), or In addition, in the above-described embodiment, the configuration in which the tray holding portion is provided on both side portions is described. However, the supported portion is provided, for example, on both sides of the intermediate portion of the both side portions. In the above embodiments, the case where the tray disposed under the substrate is moved upward relative to the substrate when the substrate is placed on the tray is described. However, the substrate disposed above the tray is moved downward relative to the tray to carry the load. It can also be placed on the tray. Further, the substrate P of the above-described embodiment is applicable not only to a glass substrate for a display element but also to a semiconductor wafer for semiconductor element manufacturing, a ceramic wafer for a germanium magnetic head, or a mask or a label used for an exposure apparatus. The original version of the wire (synthetic quartz, silicon wafer), etc. Also as the exposure device, in addition to the step of scanning the substrate p by exposing the mask Μ to the substrate P in synchronization with the exposure light IL of the pattern of the mask Μ In addition to the scanning type scanning device (scanning stepper) of the scanning mode, it is also applicable to the step of sequentially exposing the pattern of the mask M in a state where the mask Μ and the substrate ρ are stationary, and sequentially moving the substrate P step by step. A projection exposure apparatus (stepper) of a repeating type. Further, the present invention is also applicable to the disclosure of the specification of US Pat. No. 6,431, No. 7, the specification of the US Patent No. 6208, the specification of the US Patent No. A dual-stage type exposure apparatus having a plurality of substrate stages. The European Patent Application Publication No. 13 specification =:: substrate carrier and non-holding substrate, loading type j base: soil rate member and/or Or an exposure apparatus for a measurement stage of various photodetectors. 27 201145439 Further, an exposure apparatus having a plurality of substrate stages and a measurement stage can be used. Further, the above embodiment is formed on a light-transmitting substrate. a light-transmitting type reticle having a predetermined light-shielding pattern (or a phase pattern, a light-reducing pattern), but instead of the reticle, a transmission pattern or a reflection pattern is formed according to an electronic material according to a pattern to be exposed, as disclosed in the specification of US Pat. No. 6,778,257, Alternatively, a variable shaping mask (also referred to as an electronic mask, an active mask, or an image generator) of a light-emitting pattern may be used. Alternatively, instead of a variable-shaped mask having a non-light-emitting image display element, The round form forming device of the light-emitting image display element may also be used. The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements of the patented scope of the present invention so as to maintain the predetermined mechanical precision and electrical precision. In order to ensure these various precisions, various optical systems are used to achieve optical precision adjustments after the assembly is cut. The seed mechanical system is used to achieve mechanical precision adjustments. Various electrical systems are used to achieve electrical precision adjustment. The assembly steps from various subsystems to the exposure device include the mechanical connection of various subsystems, the wiring connection of the circuit, the piping connection of the pneumatic circuit, etc., before the assembly steps from various subsystems to the exposure device, of course, each subsystem individually Assembly steps. After the assembly steps of the various subsystems to the exposure apparatus are completed, comprehensive adjustments are made to ensure various precisions of the entire exposure apparatus. Further, the production of the exposure apparatus is preferably carried out in a clean room in which temperature and vacuum are managed. A micro-element such as a semiconductor element, as shown in FIG. 4, is manufactured by the following steps: a step of performing a function/performance design of the micro-element 2, and a photomask (reticle) according to the design procedure of 28 201145439 Step 202, a step 203 of manufacturing a substrate as a substrate, and a substrate processing (exposure treatment) (including an operation of exposing the substrate by exposure light using a pattern of the photomask according to the above embodiment, and a substrate after exposure (photosensitive) The substrate processing step 204 of the developing operation), the step of assembling the workpiece (the processing program including the cutting step, the bonding step, the packaging step, and the like) 205, and the inspection step 2〇6 and the like. Further, in the step 2, 4, the exposure of the photosensitive agent is performed to form an exposure pattern layer (layer of the photosensitive agent after development) corresponding to the pattern of the mask, and the substrate is processed by the exposure pattern layer. Further, the requirements of the above embodiments can be combined as appropriate. Also, there are cases where the components of the unused-parts are not used. χ χ 援 援 援 援 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional plan view showing an overall schematic view of an exposure apparatus. Fig. 2 is a perspective view showing the appearance of a transport robot. Fig. 3 is a perspective view for explaining the operation of transporting the robot hand. Fig. 4 is a side view showing a schematic configuration of a carry-in/out portion. Fig. 4 is a perspective view showing the relationship between the carry-in/out portion and the transport robot. Fig. 5 is a plan view showing the planar structure of the tray. Fig. 5B is a cross-sectional view showing a state in which the tray is housed in the groove portion of the substrate holder. Fig. 7A is a schematic view showing the substrate transfer step of the first embodiment. . 29 201145439 FIG. 7B is a schematic view showing a substrate transfer step of the second embodiment. Fig. 7C is a schematic view showing the substrate transfer step of the second embodiment. Fig. 8A is a schematic view showing a substrate transfer step of the second embodiment. Fig. 8B is a schematic view showing the substrate transfer step of the second embodiment. Fig. 9A is a schematic view showing a substrate transfer step in the first embodiment; Fig. 9B is a schematic view showing a substrate transfer step in the first embodiment. Fig. 9C is a schematic view showing a substrate transfer step in the first embodiment. Fig. 9D is a schematic view showing a substrate transfer step in the first embodiment. 10(a) to (c) are schematic views illustrating a conventional substrate transfer step. 11(a) to (c) are schematic views illustrating a conventional substrate transfer step. Fig. 12A is a schematic view showing a substrate transfer step in the second embodiment. Fig. 12B is a schematic view showing a substrate transfer step in the second embodiment. Fig. 12C is a schematic view showing a substrate transfer step in the second embodiment. Fig. 13 is a schematic view showing a substrate transfer step in the second embodiment. Fig. 1 is a schematic view showing a substrate transfer step in the second embodiment. Fig. 14 is a flow chart showing the method of manufacturing a component according to the embodiment of the present invention. [Description of main components and symbols] 1 Exposure device 4 Transport robot (transporting unit, mounting mechanism, transport mechanism) 5, 5A Carrying in and out (transporting unit) 7, 7A Substrate transfer device 9 Substrate holder 12 Transfer hand (holding arm) 30 201145439 12b Notch portion 18 Both side portions (retained portion, supported portion) 20 Mounting portion 20b Support portion 21 Opening portion (insertion hole) 30 Groove portion 31 holding portion 33 moving mechanism 51 substrate supporting portion (mounting mechanism) 51b substrate supporting pin (support pin) 52 tray supporting portion (supporting mechanism) 52b tray supporting pin (second supporting pin) 53 connecting member (mounting mechanism) 54 Drive unit (mounting mechanism) 56 Guide (support mechanism) 高度 Height IL Exposure diaphragm Τ Pallet (substrate support member) 31

Claims (1)

201145439 七、申請專利範圍： 1 · 一種基板支承構件，係用以支承基板，其特徵在於， 具備： 載置部，載置該基板；以及 複數個支承部，係設於該載置部，支承載置於該載置 部之該基板； 該複數個支承部之中第1部分之支承部與第2部分之 支承部相對於該載置部之高度彼此不同。 2. 如申請專利範圍第丨項之基板支承構件，其中，該複 數個支承部，，在該基板載置於該載置部之狀態下，將該基 板支承成該基板之彎曲量小於該載置部之彎曲量。 3. 如申請專利範圍第2項之基板支承構件，其中，該複 數個支承部，在該基板載置於該載置部之狀態下，將該基 板支承成大致平坦。 4. 如申凊專利範圍第1至3項中任一項之基板支承構 件，其中’該第1部分之支承部與該第2部分之支承部， 與載置有該基板之狀態下之該載置部之彎曲量對應，相對 於該載置部之高度彼此不同。 5. 如申請專利範圍第1至4項中任一項之基板支承構 件，其中，該第1部分之支承部’相較於該第2部分之支 承部，係設在該載置部之f曲量大之位置； 該第1部分之支承部之該高度較該第2部分之支承部 之該高度高。 6. 如申請專利範圍第1至5項中任一項之基板支承$ 32 201145439 件，其中，配置在該載置部之被支承部附近之該支承部之 該高度較配置在其他位置之該支承部之該高度低。 7.如申請專利範圍第i i 6項中任一項之基板支承構 件，其中，該複數個支承部，相對於該载置部之兩側部之 中間部呈對稱配置。 8. 如申請專利！請第丨i 7項巾任—項之基板支承構 件，其中，該複數個支承部相對該載置部之配置及該高度， 係根據該載置部之材質、形狀及被支承部 9. 如申請專利範圍第丨…十任一項之置基:疋支承構 件，其中，该支承部之與該基板抵接之面為凸曲面。 10. 一種基板搬送裝置，係用以搬送基板，其特徵在於， 具備： 申請專利範圍第1至9項中任—項之基板支承構件， 用以支承該基板；以及 搬送部，保持該基板支承構件並移動。 11. 如申請專利範圍第10項之基板搬送裝置，其中，該 搬送部保持該载置部之兩側部。 ’、 12. 如申請專利範圍第10或11項之基板搬送裝置，其 中’該搬送部，使該基板支承構件朝向保持該基板之基板 保持具移動，將該基板支承構件支承之該基板交接至該基 板保持具。 13_如申請專利範圍第12項之基板搬送農置，其中，該 搬送部將該基板支承構件交接至該基板保持具。 如申請專利範圍帛13工員之基板搬送裝置，其中，該 33 201145439 搬送。P，將s亥基板交接至該基板保持具之十用以載置該基 板之保持具部，將該基板支承構件交接至該基板保持具之 中與5玄保持具部不同之部分。 I5·如申請專利範圍第14項之基板搬送裝置，其中，該 搬送部將該基板支承構件交接至對該基板保持具之中該保 持具部槽狀設置之槽部。 ^ 〃 16·如申請專利範圍第1()至15項中任_項之基板搬送 裝置，其具備支承該基板之複數個支承銷； 該基板支承構件具有供該複數個支承銷插通之複數個 插通孔； 該搬送部，使該複數個支承銷之中至少一部分支承銷 插通於該複數個插通孔之該基板支承構件上昇移動，以使 該複數個支承_支承之該基板支承於該基板支承構件。 17.如申請專利範圍第16項之基板搬送裝置，其中，該 複數個支承銷將該基板以大致沿著水平面之狀態支承丨μ ▲該搬送部，使該基板以大致沿著水平面之狀態支承於 該基板支承構件之該支承部。 18.—種基板搬送方法，包含： 支承申請專利範圍第1 1 9項中任-項之基板支承構 件之動作； 使該基板載置於該基板支承構件之該載置部之動作； 以及 將該基板從該載置部交接至基板保持具之動作。 19.如申請專利範圍第18項之基板搬送方法其中在 34 201145439 支承該基板支承構件之後’使該基板載置於該載置部，藉 由該支承部將該基板之一部分支承成該基板之彎曲量小於 該載置部之彎曲量。 20. 如申請專利範圍第19項之基板搬送方法，其中，在 支承該基板支承構件之兩側部之後，使該基板載置於該載 置部，藉由該支承部將該基板以大致沿著水平面之狀態支 承。 21. —種曝光裝置，係對基板保持具保持之基板照射曝 光用光以使該基板曝光，其特徵在於： 具備將該基板搬送至該基板保持具之申請專利範圍第 10至17項中任一項之基板搬送裝置。 22. —種元件製造方法，包含： 使用申請專利範圍第2丨項之曝光裝置使該基板曝光之 動作；以及 根據曝光結果處理曝光後之該基板之動作。 23. —種基板搬送方法，係將載置於基板支承構件之基 板與該基板支承構件一起搬送，其特徵在於，包含： 支承該基板支承構件之既定被支承部之動作； 將該基板載置於支承有該被支承部之該基板支承構件 之動作；以及 保持載置有該基板之該基板支承構件之該被支承部或 該被支承部之附近並使該基板支承構件移動之動作。 24. -種基板搬送方法，係將載置於基板支承構件之基 板與該基板支承構件一起搬送，其特徵在於： 35 201145439 在以該基板支承構件之形狀'與在支承該基板之狀態 下搬送時之該基板支承構件之形狀成為相同形狀之方式支 承該基板支承構件之後，將該基板載置於該基板支承構件 並搬送該基板。 25. 如申請專利範圍第23或24項之基板搬送方法，其 中，在使該基板與該基板支承構件對向之狀態下支承該基 板支承構件，使該基板支承構件相對該基板移動以將該基 板載置於該基板支承構件。 26. 如申請專利範圍第25項之基板搬送方法，其中，在 以大致沿著水平面之狀態支承之該基板之下方支承該基板 支承構件，使該基板支承構件相對該基板往沿著大致鉛垂 方向之方向移動以將該基板載置於該基板支承構件。 27. 如申請專利範圍第23至26項中任一項之基板搬送 方法，其中，在將該基板載置於該基板支承構件時，藉由 設在該基板支承構件之支承部支承該基板之一部分。 28·如申請專利範圍第27項之基板搬送方法，其中，在 將名基板載置於该基板支承構件時，藉由該支承部將該基 板以大致沿著水平面之狀態支承。 29.如申請專利範圍第23項之基板搬送方法其中該 被支承部係設在至少該基板支承構件之兩側部。 3〇.如申請專利範圍第23至29項中任一項之基板搬送 方法，其中，將支承該基板之狀態之該基板支承構件往保 持該基板之基板保持具搬送，將該基板支承構件支承之該 基板交接至該基板保持具。 36 201145439 31.如申請專利範圍第3〇項之基板搬送方法，其 該基板支承構件交接至該基板保持具。 32·如申請專利範圍第31項之基板搬送方法，其中， 該基板交接至該基板保持具之中用以載置該基板之保 部’將該基板支承構件交接至該基板保持具之中騎早^ 具部不同之部分。 、/保持 33.如申請專利範圍第32項之基板搬送方法直中將 該f板支承構件交接至對該基板保持具之中該保持具部槽 狀設置之槽部。 34. -種基板搬送裝置，係將載置於基板支承構件之基 板與該基板支承構件一起搬送，其特徵在於，具備： 支承機構，支承該基板支承構件之既定被支承部· 載置機構，將該基板載置於支承有該被支承部之該美 板支承構件；以及 κ 土 ，搬送_，載置有該基板之該基板支承構件之該 被支承部或該#支承部之附近並使該基板支承構件移動。 35. 如申請專利範圍第34項之基板搬送裝置，其中，嗜 支承機構’以該基板支承構件之彎㈣狀、與藉由該搬送 機構保持時之該基板支承構件之料形狀成為相同形狀之 方式支承該基板支承構件之該被支承部。 36·如申請專利範圍第34或35項之基板搬送裝置，其 卜該被支承部係設在至少該基板支承構件之兩側部。’、 37.如申請專利範㈣34至36項中任項之基板搬送 裝置其中，6亥搬送機構，使該基板支承構件往保持該其 37 201145439 板之基板保持具移動，將該基板支承構件支承之該基板交 接至該基板保持具。 38. 如申請專利範圍第37項之基板搬送裴置，其中，該 搬送機構，將該基板支承構件交接至該基板保持具。 39. 如申請專利範圍第38項之基板搬送裝置，其中，該 搬送機構，將該基板交接至該基板保持具之中用以載置該 基板之保持具部，將該基板支承構件交接至該基板保持具 之中與該保持具部不同之部分。 40. 如申請專利範圍第39項之基板搬送裝置，其中，該 搬送機構，將該基板支承構件交接至對該基板保持具之中 該保持具部槽狀設置之槽部。 41·如申請專利範圍第34至4〇項中任一項之基板搬送 裝置，其具備支承該基板之複數個支承銷； 該基板支承構件具有供該複數個支承銷插通之複數個 插通孔； 該載置機構，使該支承機構以該複數個支承銷之中至 少一部分支承銷插通於該複數個插通孔之狀態支承之該基 板支承構件上昇移動，以使該複數個支承銷所支承之該基 板載置於該基板支承構件。 42·如申請專利範圍第41項之基板搬送裝置，其中，該 複數個支承銷將該基板以大致沿著水平面之狀態支承； 該載置機構’在使該基板支承於該基板支承構件時， 使該基板以大致沿著水平面之狀態支承於設在該基板支承 構件、支承該基板之一部分之支承部。 38 201145439 43.如申請專利範圍第34至42項中任一項之基板搬&amp; 裝置，其中’該支承機構具備支承該基板支承構件之該被 支承部之保持臂； 該載置機構使該複數個支承銷支承之該基板與該保持 臂相對移動，以使該基板載置於該基板支承構件； 該搬送機構使保持該基板支承構件之該保持臂移動。 44·如申請專利範圍第34至42項中任一項之基板搬送 裝置，其中，該支承機構具備支承該基板支承構件之該被 支承部之複數個第2支承銷； 該載置機構使該複數個支承銷支承之該基板與該複數 個第2支承銷相對移動，以使該基板載置於該基板支 件； 該搬送機構具備搬送臂，該搬送臂保持該複數個第2 支承銷支承之該基板支承構件之該被支承部或該被支承 之附近並移動。 45. 如申請專利範圍第44項之基板搬送裝置，豆中，該 複數個第2支承銷使該基板支承構件上昇移動，將該基： 載置於该基板支承構件。 46. 如申請專利範圍第44項之基板搬送震置，其中，該 搬送臂具有供該複數個第2支承 ^ ^ ^ 7 通之缺口部，在該基 :載置亥基板支承構件之後，保持該被支承部並上昇移 47.—種曝光裝置， 光用光以使該基板曝光 係對基板料W持之基板照射曝 ’其特徵在於： 39 201145439 具備將該基板搬送至該纟板保持具之申請專利範圍第 34至46項中任一項之基板搬送裝置。 48. —種元件製造方法，包含： 使用申請專利範圍第47項之曝光裝置使該基板曝光之 動作；以及 根據曝光結果處理曝光後之該基板之動作。 49. 一種元件製造方法，包含： 使用申請專利範圍第23至33項中住一 員之基板搬送 方法搬送該基板之動作； 使該基板曝光之動作；以及 根據曝光結果處理曝光後之該基板之動作 、圖式· (如次頁） 40201145439 VII. Patent Application Range: 1 . A substrate supporting member for supporting a substrate, comprising: a placing portion on which the substrate is placed; and a plurality of supporting portions attached to the mounting portion The substrate placed on the mounting portion; the support portion of the first portion and the support portion of the second portion of the plurality of support portions are different from each other with respect to the height of the mounting portion. 2. The substrate supporting member according to claim 2, wherein the plurality of supporting portions support the substrate such that the bending amount of the substrate is smaller than the load when the substrate is placed on the mounting portion The amount of bending of the part. 3. The substrate supporting member according to claim 2, wherein the plurality of supporting portions support the substrate so as to be substantially flat while the substrate is placed on the mounting portion. 4. The substrate supporting member according to any one of claims 1 to 3, wherein the support portion of the first portion and the support portion of the second portion are in a state in which the substrate is placed The amount of bending of the placing portion corresponds to the height of the placing portion. 5. The substrate supporting member according to any one of claims 1 to 4, wherein the support portion of the first portion is attached to the support portion of the second portion. The position of the curvature is large; the height of the support portion of the first portion is higher than the height of the support portion of the second portion. 6. The substrate support of US Pat. No. 1 to 5, wherein the height of the support portion disposed in the vicinity of the supported portion of the mounting portion is higher than the other position. This height of the support portion is low. 7. The substrate supporting member according to any one of the preceding claims, wherein the plurality of supporting portions are symmetrically arranged with respect to an intermediate portion of both side portions of the placing portion. 8. If you apply for a patent! The substrate support member of the seventh item, wherein the arrangement of the plurality of support portions with respect to the mounting portion and the height are based on the material, shape and supported portion of the mounting portion. The scope of the patent application is ... The foundation of any one of ten: the crucible supporting member, wherein the surface of the supporting portion that abuts against the substrate is a convex curved surface. A substrate transfer device for transporting a substrate, comprising: a substrate supporting member according to any one of claims 1 to 9 for supporting the substrate; and a conveying portion for holding the substrate Components and move. 11. The substrate transfer device of claim 10, wherein the transfer portion holds both side portions of the mounting portion. The substrate transfer device of claim 10, wherein the transfer portion moves the substrate support member toward the substrate holder holding the substrate, and the substrate supported by the substrate support member is transferred to The substrate holder. The substrate transfer apparatus according to claim 12, wherein the transfer unit transfers the substrate support member to the substrate holder. For example, the substrate transfer device of the patent application scope 13 worker, wherein the 33 201145439 is transported. P, the substrate is transferred to the holder of the substrate holder for placing the substrate, and the substrate supporting member is delivered to a portion of the substrate holder that is different from the portion of the substrate holder. The substrate transfer device according to claim 14, wherein the transfer unit delivers the substrate support member to a groove portion of the substrate holder in which the retainer portion is grooved. The substrate transfer device according to any one of claims 1 to 15 wherein the plurality of support pins support the substrate; the substrate support member has a plurality of support pins for inserting the plurality of support pins The insertion portion, wherein the at least one of the plurality of support pins is inserted into the plurality of insertion holes, and the substrate supporting member is moved upward to support the plurality of support-supporting substrates The substrate supporting member. [17] The substrate transfer device of claim 16, wherein the plurality of support pins support the substrate in a state substantially along a horizontal plane, and the substrate is supported in a state substantially along a horizontal plane. The support portion of the substrate supporting member. 18. The method of transferring a substrate, comprising: supporting an operation of a substrate supporting member according to any one of the above-mentioned claims; and placing the substrate on the mounting portion of the substrate supporting member; The substrate is transferred from the mounting portion to the operation of the substrate holder. 19. The substrate transfer method of claim 18, wherein after the substrate supporting member is supported at 34 201145439, the substrate is placed on the mounting portion, and the support portion supports one of the substrates as the substrate. The amount of bending is smaller than the amount of bending of the mounting portion. [20] The substrate transfer method of claim 19, wherein after supporting both side portions of the substrate supporting member, the substrate is placed on the mounting portion, and the substrate is substantially along the support portion Supported by the state of the horizontal plane. 21. An exposure apparatus for exposing exposure light to a substrate held by a substrate holder to expose the substrate, wherein the substrate is provided with any of claims 10 to 17 of the substrate holder for transporting the substrate to the substrate holder A substrate transfer device. 22. A method of manufacturing a component, comprising: exposing the substrate using an exposure apparatus of the second aspect of the patent application; and processing the exposure of the substrate according to an exposure result. A substrate transfer method for transporting a substrate placed on a substrate supporting member together with the substrate supporting member, comprising: supporting a predetermined supported portion of the substrate supporting member; and mounting the substrate The operation of the substrate supporting member that supports the supported portion, and the operation of holding the substrate supporting member in the vicinity of the supported portion or the supported portion of the substrate supporting member on which the substrate is placed. 24. A substrate transfer method in which a substrate placed on a substrate supporting member is transported together with the substrate supporting member, wherein: 35 201145439 is conveyed in a state of supporting the substrate by the shape of the substrate supporting member After the substrate supporting member is supported in the same shape as the substrate supporting member, the substrate is placed on the substrate supporting member and the substrate is transferred. [25] The substrate transfer method of claim 23, wherein the substrate supporting member is supported while the substrate is opposed to the substrate supporting member, and the substrate supporting member is moved relative to the substrate to The substrate is placed on the substrate supporting member. [26] The substrate transfer method of claim 25, wherein the substrate supporting member is supported under the substrate supported substantially in a horizontal direction such that the substrate supporting member is substantially vertically inclined with respect to the substrate The direction is moved to place the substrate on the substrate supporting member. The substrate transfer method according to any one of claims 23 to 26, wherein when the substrate is placed on the substrate supporting member, the substrate is supported by a support portion provided on the substrate supporting member portion. The substrate transfer method according to claim 27, wherein when the substrate is placed on the substrate supporting member, the substrate is supported by the support portion substantially along a horizontal plane. The substrate transfer method according to claim 23, wherein the supported portion is provided on at least both side portions of the substrate supporting member. The substrate transfer method according to any one of claims 23 to 29, wherein the substrate supporting member that supports the substrate is transported to a substrate holder holding the substrate, and the substrate supporting member is supported The substrate is transferred to the substrate holder. The substrate transfer method of claim 3, wherein the substrate supporting member is transferred to the substrate holder. The substrate transfer method of claim 31, wherein the substrate is transferred to the substrate holder for placing the substrate, and the substrate supporting member is transferred to the substrate holder Early ^ has a different part. 33. The substrate transfer method of claim 32, wherein the f-plate supporting member is directly transferred to a groove portion of the substrate holder in which the holder portion is groove-shaped. A substrate transfer device that transports a substrate placed on a substrate supporting member together with the substrate supporting member, and includes: a support mechanism that supports a predetermined supported portion and a mounting mechanism of the substrate supporting member; The substrate is placed on the sheet supporting member that supports the supported portion; and the κ soil is transported, and the supported portion of the substrate supporting member on which the substrate is placed or the vicinity of the #support portion is placed The substrate supporting member moves. The substrate transfer device according to claim 34, wherein the object supporting mechanism has the same shape as the material of the substrate supporting member when the substrate supporting member is bent (four) and held by the conveying mechanism. The supported portion of the substrate supporting member is supported. The substrate transfer apparatus according to claim 34 or 35, wherein the supported portion is attached to at least both side portions of the substrate supporting member. The substrate transfer device according to any one of the items (4), wherein the substrate transfer member moves the substrate support member to the substrate holder holding the 37 201145439 plate, and the substrate support member is supported. The substrate is transferred to the substrate holder. 38. The substrate transfer device of claim 37, wherein the transfer mechanism transfers the substrate support member to the substrate holder. The substrate transfer device of claim 38, wherein the transfer mechanism transfers the substrate to a holder portion of the substrate holder on which the substrate is placed, and the substrate support member is transferred to the substrate support member A portion of the substrate holder that is different from the holder portion. The substrate transfer apparatus according to claim 39, wherein the transfer mechanism transfers the substrate support member to a groove portion of the substrate holder in which the holder portion is groove-shaped. The substrate transfer apparatus according to any one of claims 34 to 4, further comprising: a plurality of support pins supporting the substrate; the substrate support member having a plurality of insertions through which the plurality of support pins are inserted The mounting mechanism causes the support mechanism to move up and down by the substrate supporting member supported by the at least one of the plurality of support pins inserted through the plurality of insertion holes, so that the plurality of support pins The supported substrate is placed on the substrate supporting member. [42] The substrate transfer device of claim 41, wherein the plurality of support pins support the substrate substantially along a horizontal plane; and the mounting mechanism 'when the substrate is supported by the substrate support member The substrate is supported by a support portion provided on the substrate supporting member and supporting one of the substrates in a state substantially along a horizontal plane. The substrate moving device according to any one of claims 34 to 42, wherein the supporting mechanism includes a holding arm that supports the supported portion of the substrate supporting member; the mounting mechanism makes the substrate The substrate supported by the plurality of support pins is moved relative to the holding arm such that the substrate is placed on the substrate supporting member; and the conveying mechanism moves the holding arm holding the substrate supporting member. The substrate transfer device according to any one of claims 34 to 42, wherein the support mechanism includes a plurality of second support pins that support the supported portion of the substrate support member; a plurality of second support pins supported by the plurality of support pins are moved relative to the plurality of second support pins to mount the substrate on the substrate support; the transport mechanism includes a transfer arm that holds the plurality of second support pin supports The supported portion of the substrate supporting member or the vicinity of the supported portion moves. 45. The substrate transfer apparatus of claim 44, wherein the plurality of second support pins move the substrate supporting member upward, and the substrate is placed on the substrate supporting member. 46. The substrate transfer shock according to claim 44, wherein the transfer arm has a notch portion for the plurality of second supports, and the substrate is held after the substrate support member is placed The supported portion is moved up to 47. The exposure device is configured to irradiate the substrate with the substrate exposed to the substrate material W. The feature is: 39 201145439 Having the substrate transferred to the slab holder A substrate transfer apparatus according to any one of claims 34 to 46. 48. A method of manufacturing a component, comprising: an act of exposing the substrate using an exposure device of claim 47; and processing the exposed substrate after the exposure according to the exposure result. 49. A method of manufacturing a component, comprising: an operation of transporting the substrate by using a substrate transfer method of a member of claims 23 to 33; an operation of exposing the substrate; and processing the exposed substrate after the exposure according to the exposure result , schema · (such as the next page) 40
TW099143865A 2009-12-16 2010-12-15 Substrate support member, substrate conveyance apparatus, substrate conveyance method, exposure apparatus, and device manufacturing method TW201145439A (en)

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