KR20120109757A - Method of aligning led chip and apparatus for aligning led chip - Google Patents

Method of aligning led chip and apparatus for aligning led chip Download PDF

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Publication number
KR20120109757A
KR20120109757A KR1020110027228A KR20110027228A KR20120109757A KR 20120109757 A KR20120109757 A KR 20120109757A KR 1020110027228 A KR1020110027228 A KR 1020110027228A KR 20110027228 A KR20110027228 A KR 20110027228A KR 20120109757 A KR20120109757 A KR 20120109757A
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South Korea
Prior art keywords
led chip
cassette
sheet
wafer
unit
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KR1020110027228A
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Korean (ko)
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KR101217825B1 (en
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조희중
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주식회사 프로텍
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

PURPOSE: An LED chip aligning method and apparatus are provided to improve yield of a manufacturing process of an LED chip by aligning the location and posture of the LED chip with high accuracy and precision. CONSTITUTION: A wafer cassette unit(10) stores a plurality of wafer cassettes(100). The plurality of wafer cassettes is drawn by a wafer cassette transport unit(30) and is transferred to a wafer cassette standby unit(50). The wafer cassette standby unit adjusts location and posture of the plurality of wafer cassettes. A first camera(80) takes a photograph of an LED chip(L) attached to the plurality of wafer cassettes. A controller(400) controls the wafer cassette standby unit using an image provided from the first camera.

Description

LED chip alignment method and LED chip alignment device {Method of aligning LED chip and Apparatus for aligning LED chip}

The present invention relates to an LED chip alignment method and an LED chip alignment device, and more particularly, a plurality of LED chips arranged by cutting a wafer can be attached to the adhesive sheet by aligning at a precise and constant interval and posture to the adhesive sheet And an LED chip alignment device.

In order to manufacture an LED device using a plurality of LED chips formed through a semiconductor process on a wafer, the wafer is cut and various processes are performed for each LED chip.

In particular, recently, various processes for coating and bonding fluorescent materials in the state of LED chips have been developed to manufacture high power, high brightness, and high light emitting LED devices.

In order to perform various post precesses such as coating fluorescent materials on the LED chips cut from the wafer, the intervals and directions of the LED chips are accurately and precisely aligned within an error range of several μm. It is very important to.

Conventionally, the following method was used as a method of aligning such LED chips and attaching them to a BIN cassette. First, the next LED chip is aligned and attached at a position separated by a predetermined interval based on the LED chip attached to the empty cassette. That is, it was attached to the empty cassette first and then attached after aligning the position of the next LED chip based on the LED chip in the adjacent position.

However, due to the characteristics of the process of dividing the wafer into units of LED chips, the outer dimensions and shapes of the LED chips are not constant and have an error range of several micrometers. Therefore, since an error is inherently included in the size and shape of the LED chip as described above, when the LED chips are aligned and attached as described above, tolerances of the LED chip accumulate and the error of the position and angle of the LED chip gradually increases. There is a problem.

In addition, since there is a positional tolerance of the device itself for attaching the LED chip to the empty cassette, if the next LED chip is attached based on other LED chips aligned and attached as described above, the positional tolerance of the previous LED chip becomes There is a problem that affects location.

As such, when the fluorescent cassette is coated in a state where the LED chips are arranged in close proximity to each other, and the saw chips are cut between the LED chips, the fluorescent material is coated on the side as well as the top surface of the LED chip. However, if the alignment interval and direction of the LED chip are not accurate as described above, an error occurs in the thickness of the fluorescent material coated on the surface of the LED chip. Since the thickness of the fluorescent material has a very important effect on the optical characteristics of the LED chip, when the alignment accuracy of the LED chip decreases, the defect rate due to the optical characteristics of the LED chip increases.

In addition, the LED chips are bonded in an empty cassette, or the LED chips are clamped and transferred to the next process. If the LED chips are not aligned at a predetermined position and angle, the LED is performed in the next process. There is a problem that the chip is broken or the yield of the next process is reduced.

The present invention is to solve the above problems, in order to align and attach the LED chip provided by dividing the wafer, to provide an LED chip alignment method and LED chip alignment device that can improve the position accuracy and posture accuracy of the LED chip. It aims to do it.

In order to solve the problems described above, the present invention, in the LED chip alignment method for aligning a plurality of LED chips attached to the first sheet at regular intervals and directions to attach to the second sheet, (a) in the wafer Supplying a wafer cassette with a plurality of cut LED chips attached to the first sheet; (b) disposing a BIN cassette in which the second sheet of transparent or translucent material and adhesive material is bonded to a ring-shaped frame on a base block on which a guide pattern for aligning the LED chips is displayed; (c) measuring the position and attitude of the LED chip attached to the first sheet of the wafer cassette by using a camera; (d) absorbing and detaching the LED chip from the first sheet of the wafer cassette and transferring it to the upper side of the empty cassette; And (e) photographing the guide pattern reflected under the second sheet of the empty cassette with a camera, and adjusting the relative position and posture of the LED chip with respect to the second sheet of the LED chip by using the image data. It is characterized in that it comprises a; attaching to the second sheet.

In addition, the present invention is an LED chip aligning device for aligning a plurality of LED chips attached to the first sheet at a predetermined interval and direction and attached to the second sheet, a plurality of LED chips cut from the wafer is the first sheet A wafer cassette unit for storing a plurality of wafer cassettes attached to the wafer cassette; A wafer cassette transfer unit for taking out the wafer cassette from the wafer cassette unit; A wafer cassette waiter configured to receive and fix the wafer cassette from the wafer cassette transfer part; A first camera photographing a position and a posture of each LED chip attached to a first sheet of a wafer cassette fixed to the wafer cassette standby part; An empty cassette unit for storing a plurality of empty cassettes in which the second sheet, which is transparent or translucent and is an adhesive material, is coupled to a ring-shaped frame; An empty cassette transfer unit for feeding in and out of the empty cassette from the empty cassette unit; An empty cassette waiting unit having a base block on which a guide pattern for aligning the LED chips is displayed on an upper surface thereof, and receiving the empty cassette from the empty cassette transfer unit and fixing the second sheet to contact an upper surface of the base block; A second camera for photographing the guide pattern reflected by the LED chip under the second sheet of the empty cassette fixed to the empty cassette waiting portion to align the empty cassette with the second sheet; A chip transfer unit which sequentially adsorbs the LED chip from the wafer cassette fixed to the wafer cassette standby unit and attaches the second chip to the second sheet of the empty cassette fixed to the empty cassette standby unit; And a controller for adjusting the position and posture of at least one of the wafer cassette standby unit, the chip transfer unit, and the empty cassette standby unit by using the images of the first camera and the second camera.

The present invention provides an LED chip alignment method and an LED chip alignment device that can align positions and postures of LED chips prepared by dividing a wafer with very high accuracy and precision, thereby improving the yield of the overall LED device manufacturing process and improving productivity. The height is effective.

1 is a plan view of an LED chip alignment device according to an embodiment of the present invention.
FIG. 2 is a plan view of a wafer cassette used in the LED chip alignment device shown in FIG. 1.
3 is a plan view of an empty cassette used in the LED chip alignment device shown in FIG.
4 is a cross-sectional view of the empty cassette shown in FIG. 4.
5 is a flow chart of the LED chip alignment method according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, it will be described in detail with respect to the LED chip alignment apparatus according to an embodiment of the present invention.

In describing the present invention, the sizes and shapes of the components shown in the drawings may be exaggerated or simplified for clarity and convenience of explanation.

1 is a plan view of an LED chip aligning apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of a wafer cassette used in the LED chip aligning apparatus shown in FIG. 1, and FIG. 3 is an LED chip shown in FIG. A top view of an empty cassette used in the alignment device.

1 to 3, an LED chip alignment apparatus according to an exemplary embodiment of the present invention may include a wafer cassette unit 10, an empty cassette unit 20, a wafer cassette standby unit 50, and an empty cassette standby unit 60. ) The wafer cassette unit 10, the empty cassette unit 20, the wafer cassette standby unit 50, and the empty cassette standby unit 60 are provided on the base 301.

The wafer cassette unit 10 stores a plurality of wafer cassettes 100. The wafer cassette 100 has a form in which a first sheet 102 of a tacky material is bonded to a circular frame 101, and a plurality of LED chips L are attached to the first sheet 102. As the first sheet 102, an adhesive film called a blue sheet is used. A plurality of LED chips L prepared by cutting the wafer are arranged and attached to the first sheet 102. When the classification is completed by checking whether each LED chip L is defective or various characteristics with respect to such a plurality of LED chips L, each LED chip L is classified according to a predetermined criterion to empty the cassette 200. ) Will be attached with high precision alignment.

The wafer cassettes 100 stored in the wafer cassette unit 10 are drawn out one by one by the wafer cassette transfer unit 30 and transferred to the wafer cassette standby unit 50. The wafer cassette 100, which has been completed in the wafer cassette standby unit 50, is transferred to the wafer cassette 100 by the wafer cassette transfer unit 30 again. Wafer cassette transfer section 30 is constructed using mechanical elements such as ball screws and pneumatic actuators.

The wafer cassette standby unit 50 receives and fixes the wafer cassette 100 from the wafer cassette transfer unit 30. The wafer cassette waiting unit 50 is configured to be able to be moved back, front, left, and right in a state in which the frame 101 of the wafer cassette 100 is clamped, and rotatable in the horizontal direction. By such a configuration, the wafer cassette standby unit 50 can adjust the position and attitude of the wafer cassette 100.

The first camera 80 is installed above the wafer cassette standby part 50. The first camera 80 photographs the LED chip L attached to the wafer cassette 100 and transmits the image to the controller 400, and the controller 400 receives the image received from the first camera 80. By controlling the wafer cassette standby unit 50 by using the above, the position and attitude of the LED chip L are adjusted.

In the empty cassette standby section 60, a plurality of empty cassettes (BIN cassette) 200 are stored. Referring to FIG. 3, the empty cassette 200 is configured in a form in which the adhesive second sheet 202 is coupled to the rectangular frame 201. In addition, the second sheet 202 is composed of a film of transparent or translucent material. As for the second sheet 202, an adhesive film called a blue sheet is used in the same manner as the first sheet 102.

The empty cassette transfer unit 40 draws out the empty cassette 200 from the empty cassette unit 20 and transfers the empty cassette 200 to the empty cassette standby unit 60. In addition, the empty cassette transfer unit 40 delivers and stores the empty cassette 200 which has been completed in the empty cassette standby unit 60 to the empty cassette unit 20 again.

The empty cassette standby unit 60, which has received the empty cassette 200 from the empty cassette transfer unit 40, transfers and rotates back and forth, left and right while clamping the frame 201 of the empty cassette 200, and rotates the empty cassette 200. It is configured to adjust its position and posture. The empty cassette transfer section 40 further includes a base block 61. The base block 61 is preferably made of a glass material in consideration of the coefficient of thermal expansion. 3 and 4, the guide pattern 62 is displayed on the top surface of the base block 61. The guide pattern 62 is a reference mark that can be referred to for attaching the LED chip L at the correct angle to the correct position of the second sheet 202 on the upper surface of the base block 61. As shown in FIG. 4, the second sheet 202 is fixed to the empty cassette standby part 60 while being in contact with the upper surface of the base block 61, by the operation of the empty cassette standby part 60. The base block 61 and the empty cassette 200 move forward, backward, left and right together and rotate horizontally. As described above, since the second sheet 202 is made of a transparent or translucent material, the LED chip L may be attached to the correct position by referring to the guide pattern 62 reflected below the second sheet 202. .

As shown in FIG. 1, the second camera 90 is provided above the empty cassette standby part 60, so that the correct position and the position of the guide pattern 62 reflected below the second sheet 202 may be checked. Help to attach LED chip (L) at an angle.

The guide pattern 62 may be displayed in various ways as needed. In the present exemplary embodiment, a case in which the guide pattern 62 in which the edges of the positions to be attached to the second sheet 202 are formed in a cross shape for each LED chip L is formed in the base block 61 will be described as an example. That is, the case where the guide pattern 62 is formed according to the shape of the LED chip L is demonstrated as an example.

The chip transfer unit 70 sequentially adsorbs the LED chips L from the wafer cassette 100 fixed to the wafer cassette standby unit 50, and thus the second portion of the empty cassette 200 fixed to the empty cassette standby unit 60. Attach to sheet 202. Referring to FIG. 1, in the present embodiment, the chip conveying unit 70 includes an elastic arm 72 rotatably installed at the base 301, and the pickup head 71 is lifted at the end of the arm 72. It is possible and configured to be rotatable at the same time. After the pickup head 71 of the chip transfer part 70 moves to the wafer cassette waiting part 50, the LED chip L is absorbed and separated from the first sheet 102, and then moved back to the empty cassette waiting part 60. By pressing the LED chip (L) on the second sheet 202 to attach.

The controller 400 operates the wafer cassette standby unit 50 and the empty cassette standby unit 60 by using the images of the first camera 80 and the second camera 90, respectively. In addition, the control unit 400 operates the chip transfer unit 70 to sequentially move the LED chip L from the wafer cassette standby unit 50 to the empty cassette standby unit 60.

Hereinafter, an embodiment of implementing the LED chip alignment method using the LED chip alignment device configured as described above will be described.

5 is a flowchart of the LED chip alignment method according to the present embodiment.

First, a step of supplying a wafer cassette 100 in which a plurality of LED chips L cut from a wafer is attached to the first sheet 102 is performed ((a) step; S100). Step (a) is performed by a method in which one of the plurality of wafer cassettes 100 stored in the wafer cassette unit 10 is extracted by the wafer cassette transfer unit 30 and transferred to the wafer cassette standby unit 50. The wafer cassette waiting unit 50 receives the wafer cassette 100 and waits in a clamped state.

Next, the empty cassette transfer unit 40 draws out the empty cassette 200 from the empty cassette unit 20 and transfers the empty cassette 200 to the empty cassette standby unit, and the empty cassette standby unit 60 includes the empty cassette 200 as the base block 61. It is fixed in a state of being placed in contact with the above (step (b); S200).

In this state, the first camera 80 is used to photograph the LED chip L attached to the first sheet 102 of the wafer cassette 100 disposed on the wafer cassette standby unit 50 and control the image. Transfer to 400 to measure the position and attitude of the LED chip (L (step c; S300)).

The chip transfer unit 70 adsorbs and detaches the LED chip L from the first sheet 102 and transfers it to the upper side of the empty cassette 200 located in the empty cassette standby unit 60 ((d); S400 step).

When the second camera 90 photographs the guide pattern 62 reflected under the second sheet 202 of the empty cassette 200 and transmits the image data to the control unit 400, the control unit 400 controls the guide pattern ( In consideration of the position and direction of 62, the relative position of the LED chip L and the second sheet 202 is adjusted by manipulating the empty cassette standby part 60 and the chip transfer part 70, respectively, and then the LED chip L. Is attached to the second sheet 202 (step (e); S500). At this time, the controller 400 takes the LED chip L in consideration of the position and angle of the LED chip L photographed using the first camera 80 when the LED chip L is detached from the first sheet 102. ) And the relative position of the second sheet 202.

By repeating the above process sequentially, all of the LED chip (L) to be aligned and moved to the second sheet 202 of the LED chip (L) attached to the first sheet 102, the bin at a constant interval and direction It is attached to the cassette 200.

When the process of attaching the LED chips (L) to the empty cassette 200 is completed, the empty cassette transfer unit 40 transfers the empty cassette 200 from the empty cassette standby unit 60 to the empty cassette unit 20, Next, the empty cassette 200 is transferred to the empty cassette standby unit 60.

The wafer cassette transfer unit 30 also transfers the wafer cassette 100, which has been completed in the wafer cassette standby unit 50, to the wafer cassette unit 10, and withdraws the wafer cassette 100 from the wafer cassette unit 10. Deliver to cassette standby 50.

As described above, the LED chip L is attached to the empty cassette 200 by using the guide pattern 62 of the base block 61, so that each LED chip L can be attached to the correct position in the correct direction. have. In addition, since the guide pattern 62 mark is displayed at a position very close to the position where the LED chip L is to be attached, the LED chip L can be easily taken by simply taking an image of a small area using a high resolution camera. There is a vertex to align position and posture. In addition, instead of calculating the position and angle with respect to the reference point located far from the LED chip (L), the LED chip (L) is the second sheet by adjusting the position while checking the guide pattern (62) at a very close position with a camera. Since it can be attached to (202), it is possible to drastically improve the work speed and lower the cost of manufacturing the LED chip alignment device. In addition, in aligning the position and posture of each LED chip (L), the alignment of the guide pattern 62 having a very accurate position tolerance each time, so that the advantage of the position and posture does not accumulate unlike the conventional method. have.

In addition, by forming the base block 61 as a glass material as a constant, there is an advantage that can be provided as a guide between the precise LED chip (L) while being relatively less affected by changes in temperature.

While the present invention has been described with reference to preferred embodiments, the scope of the present invention is not limited to the forms described and illustrated above.

For example, the guide pattern 62 has been described in the case of being displayed in the cross-shaped portion of the LED chip (L) in the above, it is also possible to use a guide pattern formed in the form of a grid or grid displayed at a predetermined interval. In this case, step (e) may be performed by adjusting the position and attitude of the LED chip in consideration of the relative position between the grid or grid of the guide pattern and the LED chip.

In addition, the wafer cassette standby part 50, the empty cassette standby part 60, and the chip transfer part 70 have been described in terms of the positions and directions of the configurations that can be adjusted, respectively. Instead, the LED chip alignment device can be configured so that at least one of them can be adjusted in position and angle. As such a configuration is changed, the LED chip alignment method using the same may also be appropriately changed.

In addition, the LED chip aligning device having the first camera 80 and the second camera 90 has been described above, but one that can simultaneously perform the roles of the first camera 80 and the second camera 90. It is also possible to configure an LED chip aligning device having only a camera of the camera, such a camera is installed to the chip conveying unit to be configured to perform the operation while checking the position to remove the chip from the first sheet and the position attached to the second sheet. It may be.

In addition, the structure of the chip transfer unit in the LED chip aligning device is not limited to the form as described above and illustrated in FIG. 1, and various configurations are possible to adsorb or clamp the LED chip to the second sheet.

In addition, in the step (e) of the LED chip alignment method, when adjusting the relative position and posture of the LED chip (L) and the empty cassette 200, fixing either one of the empty cassette 200 and the LED chip (L). And the relative position and posture can be adjusted while moving the other one, it is also possible to adjust the relative position and posture while moving the empty cassette 200 and the LED chip (L), respectively.

The embodiments of the present invention described above and illustrated in the drawings should not be construed as limiting the technical spirit of the present invention, and the protection scope of the present invention is limited only by the matters described in the claims. Those skilled in the art can improve or change the technical spirit of the present invention in various forms, and such improvements and modifications will fall within the protection scope of the present invention.

10: wafer cassette unit 20: empty cassette unit
30: wafer cassette transfer part 40: empty cassette transfer part
50: wafer cassette waiting part 60: empty cassette waiting part
70: chip transfer unit 80: first camera
90: second camera 400: control unit
301: base 61: base block
62: guide pattern

Claims (9)

In the LED chip alignment method for aligning the plurality of LED chips attached to the first sheet at regular intervals and directions attached to the second sheet,
(a) supplying a wafer cassette with a plurality of LED chips cut from the wafer attached to the first sheet;
(b) disposing a BIN cassette in which the second sheet of transparent or translucent material and adhesive material is bonded to a ring-shaped frame on a base block on which a guide pattern for aligning the LED chips is displayed;
(c) measuring the position and attitude of the LED chip attached to the first sheet of the wafer cassette by using a camera;
(d) adsorbing and detaching the LED chip from the first sheet of the wafer cassette and transferring the upper side of the empty cassette; And
(e) photographing the guide pattern reflected under the second sheet of the empty cassette with a camera, and adjusting the relative position and attitude of the LED chip with respect to the second sheet using the image data to remove the LED chip from the second sheet; Attaching to the sheet; LED chip alignment method comprising a. The method of claim 1,
In the step (b), the upper surface of the base block on which the guide pattern is formed LED chip alignment method, characterized in that the glass material. The method of claim 1,
In the step (b), the guide pattern displayed on the base block is formed according to the size of each LED chip LED chip alignment method. The method of claim 1,
In the step (e), the relative position and posture of the LED chip alignment method is characterized by adjusting one of the empty cassette and the LED chip or moving the empty cassette and the LED chip, respectively. The method of claim 1,
In the step (b), the guide pattern is displayed on the upper surface of the base block at regular intervals,
In the step (e), the position and attitude of the LED chip alignment method is adjusted in consideration of the relative position of the LED chip adjacent to the guide pattern. In the LED chip aligning apparatus for attaching a plurality of LED chips attached to the first sheet at a predetermined interval and direction and attached to the second sheet,
A wafer cassette unit for storing a plurality of wafer cassettes in which a plurality of LED chips cut from a wafer are attached to the first sheet;
A wafer cassette transfer unit for taking out the wafer cassette from the wafer cassette unit;
A wafer cassette waiter configured to receive and fix the wafer cassette from the wafer cassette transfer part;
A first camera photographing a position and a posture of each LED chip attached to a first sheet of a wafer cassette fixed to the wafer cassette standby part;
An empty cassette unit for storing a plurality of empty cassettes in which the second sheet, which is transparent or translucent and is an adhesive material, is coupled to a ring-shaped frame;
An empty cassette transfer unit for feeding in and out of the empty cassette from the empty cassette unit;
An empty cassette waiting unit having a base block on which a guide pattern for aligning the LED chips is displayed on an upper surface thereof, and receiving the empty cassette from the empty cassette transfer unit and fixing the second sheet to be in contact with an upper surface of the base block;
A second camera for photographing the guide pattern reflected by the LED chip under the second sheet of the empty cassette fixed to the empty cassette waiting portion to align the empty cassette with the second sheet;
A chip transfer unit which sequentially adsorbs the LED chip from the wafer cassette fixed to the wafer cassette standby unit and attaches the second chip to the second sheet of the empty cassette fixed to the empty cassette standby unit; And
And controlling the position and attitude of at least one of the wafer cassette standby unit, the chip transfer unit, and the empty cassette standby unit by using the images of the first camera and the second camera. Device. The method according to claim 6,
And an upper surface of the base block on which the guide pattern is formed in the empty cassette standby part. The method according to claim 6,
The wafer cassette standby unit is configured to adjust the position and direction of the wafer cassette by the control unit,
And the empty cassette standby unit is configured to adjust the position and direction of the empty cassette by the control unit. The method according to claim 6,
And the second camera is coupled to the chip transfer unit and moves together with the LED chip moving by the chip transfer unit.
KR1020110027228A 2011-03-25 2011-03-25 Method of aligning LED chip and Apparatus for aligning LED chip KR101217825B1 (en)

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KR101941541B1 (en) * 2018-05-10 2019-04-12 주식회사 팀즈 A Method of Carrying and Aligning Micro LEDs to the Substrates of the LED Display Panels, A Method of producing the Display Panels thereof, and a System of Carrying and Aligning Micro LEDs to the Substrates of LED Display panes
CN112018015A (en) * 2019-05-31 2020-12-01 昆山扬明光学有限公司 Automatic LED assembling device, automatic LED assembling and manufacturing method and LED

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KR20020026585A (en) * 2000-06-20 2002-04-10 나노넥서스, 인코포레이티드 Systems for testing and packaging integraged circuits
KR100542725B1 (en) * 2000-07-25 2006-01-11 삼성전자주식회사 Apparatus for aligning of a wafer in semiconductor processing
JP3818146B2 (en) * 2001-12-18 2006-09-06 松下電器産業株式会社 Electronic component mounting apparatus and electronic component mounting method
KR100926652B1 (en) * 2007-11-08 2009-11-16 세크론 주식회사 Wafer alignment method and flip chip manufacturing method

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KR101941541B1 (en) * 2018-05-10 2019-04-12 주식회사 팀즈 A Method of Carrying and Aligning Micro LEDs to the Substrates of the LED Display Panels, A Method of producing the Display Panels thereof, and a System of Carrying and Aligning Micro LEDs to the Substrates of LED Display panes
CN112018015A (en) * 2019-05-31 2020-12-01 昆山扬明光学有限公司 Automatic LED assembling device, automatic LED assembling and manufacturing method and LED

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